Minisforum has unveiled a game-changing device that blurs the lines between tablets and laptops: the Minisforum V3. Today, the V3 laptop has hit the Minisforum store. This innovative 3-in-1 tablet is powered by the high-performance AMD Ryzen 7 8840U processor, offering a unique blend of portability and computing power. Unlike its traditional Mini PC design, Minisforum has adopted the popular form factor of Microsoft Surface and Lenovo Yoga tablet PCs with the V3. This versatile device can be a handheld tablet, a laptop with an included magnetic attachable keyboard, or a solo kickstand. At the heart of the Minisforum V3 lies the 8-core, 16-thread Ryzen 7 8840U processor, capable of delivering exceptional performance for demanding tasks. The tablet features a stunning 14-inch 2560 x 1600 IPS screen with a 165 Hz refresh rate and 100% DCI-P3 color gamut coverage, making it an ideal choice for creative professionals and content creators.

The V3's standout feature is its advanced cooling system, which allows the Ryzen 7 8840U and onboard Radeon 780M iGPU to operate at a stable 28 watts. This ensures smooth and efficient performance even under heavy workloads, making it a reliable device for all your tasks. The tablet's screen boasts a remarkable 500 nits of brightness, and its high color gamut coverage makes it perfect for professionals who require accurate color representation. Minisforum has priced the V3 competitively at $1199 at the pre-sale offering, making it an attractive option for those seeking a powerful and versatile device that can adapt to various scenarios. This primary option includes 32 GB of RAM and 1 TB SSD for storage. For early birds, Minisforum offers a V Pen, tempered glass screen protector, and laptop sleeve as a gift. Here is the link to the Minisforum V3 store.

NVIDIA's next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA's own Grace Arm CPU in models such as the GB200, represents a significant development. TrendForce points out that the GB200 and its predecessor, the GH200, both feature a combined CPU+GPU solution, primarily equipped with the NVIDIA Grace CPU and H200 GPU. However, the GH200 accounted for only approximately 5% of NVIDIA's high-end GPU shipments. The supply chain has high expectations for the GB200, with projections suggesting that its shipments could exceed millions of units by 2025, potentially making up nearly 40 to 50% of NVIDIA's high-end GPU market.

Although NVIDIA plans to launch products such as the GB200 and B100 in the second half of this year, upstream wafer packaging will need to adopt more complex and high-precision CoWoS-L technology, making the validation and testing process time-consuming. Additionally, more time will be required to optimize the B-series for AI server systems in aspects such as network communication and cooling performance. It is anticipated that the GB200 and B100 products will not see significant production volumes until 4Q24 or 1Q25.

MSI, a leading global server provider, is showcasing its latest GPU servers powered by AMD processors at the 2024 NAB Show, Booth #SL9137 in the Las Vegas Convention Center from April 14-17. These servers are designed to meet the evolving needs of modern creative projects in Media and Entertainment industry. "As AI continues to reshape the Media and Entertainment industry, it brings unprecedented speed and performance to tasks such as animation, visual effects, video editing, and rendering," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's GPU platforms empower content creators to execute every project with efficiency, speed, and uncompromising quality."

The G4101 is a 4U 4GPU server platform, purpose-built to unleash the full potential of creative professionals in the Media and Entertainment industry. It supports a single AMD EPYC 9004 Series processor equipped with a liquid cooling module, along with twelve DDR5 RDIMM slots. Additionally, it features four PCIe 5.0 x16 slots tailored for triple-slot graphic cards with coolers, ensuring increased airflow and sustained performance. With twelve front 2.5-inch U.2 NVMe/SATA drive bays, it offers high-speed and flexible storage options, catering to the diverse needs of AI workloads. The G4101 combines air flow spacing and liquid closed-loop cooling, making it the optimal thermal management solution for even the most demanding tasks.

In yet another clear sign that we could see some action from AMD on the next-gen desktop processor front this Computex, motherboard maker MSI released its first beta UEFI firmware update that packs an AGESA microcode that reportedly supports the upcoming AMD Ryzen 9000 "Granite Ridge" processors. The "7D74v1D2 beta" firmware update for the MSI MPG B650 Carbon Wi-Fi motherboard encapsulates AGESA ComboPI 1.1.7.0 patch-A, with the description that it supports a "next-gen CPU," a reference to the Ryzen 9000 "Granite Ridge."

A successor to the Ryzen 7000 Raphael, the Ryzen 9000 Granite Ridge introduces the new "Zen 5" microarchitecture to the desktop platform, with CPU core counts remaining up to 16-core/32-thread. The new microarchitecture is expected to introduce generational increase in IPC, as well as improve performance of certain exotic workloads such as AVX-512. The processors are said to be launching alongside the new AMD 800-series motherboard chipset. If AMD is using Computex as a platform to showcase these processors, it's likely we might see the first of these motherboards as well.

Over a year ago, EK Water Blocks introduced its first mainstream CPU water block, designed explicitly for delidded Intel CPUs. Since its debut, there has been a significant increase in users opting to delid their CPUs to enhance performance. Building on this trend, EK just recently released the market's first-ever All-In-One CPU cooler tailored for delidded Intel CPUs, a product that has received highly positive feedback and reception. EK, as the market leader in high-performance PC liquid cooling, is committed to constant innovation and bringing the best user experience on the market. They're reaffirming this commitment by announcing several upcoming products designed for direct die cooling. For those unfamiliar with delidding and direct die cooling, we recommend checking out EK's blog post on the topic.

First up is the highly anticipated EK Direct Die solution for Socket AM5 AMD Ryzen CPUs. Countless hours of engineering and testing were invested into these products to ensure consistent performance results and a user-friendly installation process. Unlike other solutions that require modifying an existing cold plate, this water block features a cold plate specifically designed for delidded AM5 Ryzen 7000 Series CPUs. The mounting mechanism differs from the Velocity² Direct Die water block, as it relies on standoffs at the four corners of the water block instead of the cold plate making contact with the die guard. The entire fin structure has been adjusted to direct 100% of the flow over the chiplets themselves, but more details on this topic will be available in the following days when these AMD-specific Direct Die CPU water blocks become available for order.

The RDNA 3+ graphics architecture will power integrated graphics solutions of AMD processors for the foreseeable future, a reliable source with AMD leaks says. The company is planning to debut RDNA 3+, a feature update to RDNA 3, with the upcoming Ryzen "Strix Point" mobile processor. A scaled-up version will power the "Strix Halo" processor meant for notebooks with powerful integrated graphics. Given that AMD is able to scale between a certain number of compute units for its "Strix Point" and "Strix Halo" processors, it could stick with the graphics architecture for iGPUs with its upcoming processor microarchitectures even 3 years into the future.

This isn't new for AMD, the company's Vega graphics architecture debuted in 2017, but powered the iGPUs of its "Cezanne" mobile processor that came out as recently as 2021. The RDNA 3-based iGPU powering the current "Hawk Point" processor trades blows with the Arc "Alchemist" Xe-LPG iGPU powering Intel's "Meteor Lake" processor. Intel is expected to make a generational jump in iGPU performance with its upcoming "Lunar Lake" processor that debuts the Xe2 "Battlemage" graphics architecture for its iGPU, to which AMD is responding with a new iGPU based on the updated RDNA 3+.

During the Vision 2024 event, Intel announced that its upcoming Xeon processors will be branded under the new "Xeon 6" moniker. This rebranding effort aims to simplify the company's product stack and align with the recent changes made to its consumer CPU naming scheme. In contrast to the previous "x Generation Xeon Scalable", the new branding aims to simplify the product family. The highly anticipated Sierra Forest and Granite Ridge chips will be the first processors to bear the Xeon 6 branding, and they are set to launch in the coming months. Intel has confirmed that Sierra Forest, designed entirely with efficiency cores (E-cores), remains on track for release this quarter. Supermicro has already announced early availability and remote testing programs for these chips. Intel's Sierra Forest is set to deliver a substantial leap in performance. According to the company, it will offer a 2.4X improvement in performance per watt and a staggering 2.7X better performance per rack compared to the previous generation. This means that 72 Sierra Forest server racks will provide the same performance as 200 racks equipped with older second-gen Xeon CPUs, leading to significant power savings and a boost in overall efficiency for data centers upgrading their system.

Intel has also teased an exciting feature in its forthcoming Granite Ridge processors-support for the MXFP4 data format. This new precision format, backed by the Open Compute Project (OCP) and major industry players like NVIDIA, AMD, and Arm, promises to revolutionize performance. It could reduce next-token latency by up to 6.5X compared to fourth-gen Xeons using FP16. Additionally, Intel stated that Granite Ridge will be capable of running 70 billion parameter Llama-2 models, a capability that could open up new possibilities in data processing. Intel claims that 70 billion 4-bit models run entirely on Xeon in just 86 milliseconds. While Sierra Forest is slated for this quarter, Intel has not provided a specific launch timeline for Granite Ridge, stating only that it will arrive "soon after" its E-core counterpart. The Xeon 6 branding aims to simplify the product stack and clarify customer performance tiers as the company gears up for these major releases.

Acer today announced the new Nitro 14 and Nitro 16 gaming laptops, powered by AMD Ryzen 8040 Series processors with Ryzen AI[1]. With up to NVIDIA GeForce RTX 4060[2] Laptop GPUs supported by DLSS 3.5 technology, both are backed by NVIDIA's RTX AI platform, providing an array of capabilities in over 500 games and applications, enhanced by AI. Gamers are immersed in their 14- and 16-inch NVIDIA G-SYNC compatible panels with up to WQXGA (2560x1600) resolution.

Whether in call or streaming in-game, Acer PurifiedVoice 2.0 harnesses the power of AI to block out external noises, while Acer PurifiedView keeps users always front and center of all the action. Microsoft Copilot in Windows (with a dedicated Copilot key) helps accelerate everyday tasks on these AI laptops, and with one month of Xbox Game Pass Ultimate included with every device, players will enjoy hundreds of high-quality PC games. To seamlessly take command of device performance and customizations, one click of the NitroSense key directs users to the control center and the library of available AI-related functions through the new Experience Zone.

AMD today announced the expansion of the AMD Versal adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

These initial devices in the Versal Series Gen 2 portfolio build on the first generation with powerful new AI Engines expected to deliver up to 3x higher TOPs-per-watt than first generation Versal AI Edge Series devicesi, while new high-performance integrated Arm CPUs are expected to offer up to 10x more scalar compute than first gen Versal AI Edge and Prime series devicesii.

On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

At Embedded World 2024, Enclustra will showcase limitless potential to innovate the next big thing with over 20 FPGA (Field Programmable Gate Array) embedded system on module (SoM) technology solutions. Starting with unveiling Pluto, its tiny titan at 30 x 30 mm, the new coin-sized SoM with the strength of AMD Zynq UltraScale+ MPSoC, features ultra-compact embedded intelligence and portability, accelerating development of compact and portable low-power applications in industrial, healthcare, and security. Pluto's miniature form factor and high processing power are ideal for real-time video processing in medical smart glasses, VR, environmental monitoring, drones, autonomous navigation, and artificial intelligence inference.

"Enclustra leverages strategic partnerships with AMD, Altera and Microchip to provide customers with a comprehensive ecosystem of cutting-edge FPGA solutions optimized for performance and cost. We integrated their technology into our Pluto SoM, enabling unparalleled processing power and efficiency in a compact form factor," said Philipp Baechtold, CEO of Enclustra GmbH. "The future is bright for innovation with FPGA embedded chip technologies, creating life-saving, life-changing, and dream-making solutions."

AMD "Zen 5" CPU microarchitecture will introduce a significant performance increase for AVX-512 workloads, with some sources reported as high as 40% performance increases over "Zen 4" in benchmarks that use AVX-512. A Moore's Law is Dead report detailing the execution engine of "Zen 5" holds the answer to how the company managed this—using a true 512-bit FPU. Currently, AMD uses a dual-pumped 256-bit FPU to execute AVX-512 workloads on "Zen 4." The updated FPU should significantly improve the core's performance in workloads that take advantage of 512-bit AVX or VNNI instructions, such as AI.

Giving "Zen 5" a 512-bit FPU meant that AMD also had to scale up the ancillaries—all the components that keep the FPU fed with data and instructions. The company therefore increased the capacity of the L1 DTLB. The load-store queues have been widened to meet the needs of the new FPU. The L1 Data cache has been doubled in bandwidth, and increased in size by 50%. The L1D is now 48 KB in size, up from 32 KB in "Zen 4." FPU MADD latency has been reduced by 1 cycle. Besides the FPU, AMD also increased the number of Integer execution pipes to 10, from 8 on "Zen 4." The exclusive L2 cache per core remains 1 MB in size.Update 07:02 UTC: Moore's Law is Dead reached out to us and said that the slide previously posted by them, which we had used in an earlier version of this article, is fake, but said that the information contained in that slide is correct, and that they stand by the information.

PowerColor, a leader in graphics card innovation, is thrilled to unveil its latest creation - the PowerColor Hellhound RX 7800 XT Sakura Edition. Leveraging the advanced AMD RDNA architecture and building on the Hellhound series' acclaim, this edition introduces a fresh aesthetic twist to the graphics card world.

Sakura Edition - Grace and Performance
The market has seen its share of themed graphics cards, but the Hellhound RX 7800 XT Sakura Edition stands apart with its all-white design accented by subtle pink details. This design choice not only maintains the card's sleek and unified appearance but also introduces a touch of grace, reminiscent of cherry blossoms. PowerColor's dedication to this theme is evident in every aspect of the card, from an all white PCB to the uniquely white heatsink and cooler design with adorned with pink accents.

AMD has introduced the Ryzen Embedded 8000 Series processors, the first AMD embedded devices to combine NPUs based on the AMD XDNA architecture with traditional CPU and GPU elements, optimized for workload versatility and adaptability targeting industrial AI applications. Embedded solution engineers and developers can harness the processing power and leadership features for a variety of industrial AI applications including machine vision, robotics, and industrial automation. AI is widely used in machine vision applications today to enhance quality control and inspection processes.

AI can also help robots make real-time, route-planning decisions and adapt to dynamic environments. In industrial automation, AI processing helps intelligent edge devices perform complex analysis and decision-making without relying on cloud connectivity. This allows for real-time monitoring, predictive maintenance, and autonomous control of industrial processes, enhancing operational efficiency and reducing downtime.

AMD (NASDAQ: AMD) was notified on March 27, 2024, of an unsolicited "mini-tender" offer by Tutanota LLC ("Tutanota"). Pursuant to the offer, which is dated March 18, 2024, Tutanota is offering to purchase up to 150,000 shares of AMD common stock at $200.00 per share, which represents approximately 0.009283% of AMD's outstanding shares. The offer price of $200.00 per share is conditioned on, among other things, the closing price per share of AMD common stock exceeding $200.00 per share on the last trading day before the offer expires. This means that unless this condition is waived by Tutanota, AMD stockholders who tender shares in the offer will receive a below-market price. Tutanota can extend the offer for successive periods of 45 to 180 days until the market price of AMD common stock exceeds the offer price, in which case payment would be delayed beyond the scheduled expiration date of Friday, April 19, 2024.

AMD does not in any way recommend or endorse the Tutanota offer because the offer requires that the closing price for AMD common stock exceed the offer price, and the offer price is subject to numerous additional conditions, including Tutanota obtaining financing for the offer. There is no guarantee the conditions of the offer will be satisfied. AMD is in no way associated with Tutanota, the "mini-tender" offer or the offer documentation. "Mini-tender" offers seek less than 5% of a company's outstanding shares thereby avoiding many procedural and disclosure requirements of the Securities and Exchange Commission ("SEC") because they are below the SEC's threshold to provide such disclosure and procedural protections for investors.

AMD's Instinct family has welcomed a new addition—the MI388X AI accelerator—as discovered in a lengthy regulatory 10K filing (submitted to the SEC). The document reveals that the unannounced SKU—along with the MI250, MI300X and MI300A integrated circuits—cannot be sold to Chinese customers due to updated US trade regulations (new requirements were issued around October 2023). Versal VC2802 and VE2802 FPGA products are also mentioned in the same section. Earlier this month, AMD's Chinese market-specific Instinct MI309 package was deemed to be too powerful for purpose by the US Department of Commerce.

AMD has not published anything about the Instinct MI388X's official specification, and technical details have not emerged via leaks. The "X" tag likely implies that it has been designed for AI and HPC applications, akin to the recently launched MI300X accelerator. The designation of a higher model number could (naturally) point to a potentially more potent spec sheet, although Tom's Hardware posits that MI388X is a semi-custom spinoff of an existing model.

AMD's entry-level Radeon RX 7600 GPU launched last May—critical reception was lukewarm, and Team Red enthusiasts found more compelling "budget" options within the preceding RDNA 2 generation. AMD's board partners rolled out customized Radeon RX 7600 8 GB cards—as planned—but the reference design was a scarcity around launch time. As pointed out by TPU's resident graphics card reviewer extraordinaire, W1zzard, a "Made by AMD" (MBA) model was lined up for direct sale via official AMD online stores, "as well as through its board partners, with minimal re-branding." Plans were (apparently) scuppered by a discovery of 8-pin power cable insertion issues—review outlets informed AMD about these problems prior to launch.

According to a fresh VideoCardz report, AMD has started to offer its Radeon RX 7600 reference design through official European channels: "despite the initial promise of offering the RX 7600 directly to gamers through their webstore, AMD has struggled to generate significant interest in the card nearly a year after its launch. Furthermore, there hasn't been a substantial change in pricing, with the card still retailing at $269 (in the US). Turns out, the Radeon RX 7600 MBA is now available in Germany." Several European shop portals display prices of €295 (~$318) and €300 (~$324)—at the time of writing. Potential customers will have to weigh up the benefit of AMD's extra time spent on ironing out the reference design's past issues, versus market-tested + custom-cooled partner models.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

Ryan McCurdy, President of Lenovo North America, revealed ambitious forward-thinking product roadmap during an interview with CRN magazine. A hybrid strategic approach will create an anticipated AI fast lane on future hardware—McCurdy, a former Intel veteran, stated: "there will be a steady stream of product development to add (AI PC) hardware capabilities in a chicken-and-egg scenario for the OS and for the (independent software vendor) community to develop their latest AI capabilities on top of that hardware...So we are really paving the AI autobahn from a hardware perspective so that we can get the AI software cars to go faster on them." Lenovo—as expected—is jumping on the AI-on-device train, but it will be diversifying its range of AI server systems with new AMD and Intel-powered options. The company has reacted to recent Team Green AI GPU supply issues—alternative units are now in the picture: "with NVIDIA, I think there's obviously lead times associated with it, and there's some end customer identification, to make sure that the products are going to certain identified end customers. As we showcased at Tech World with NVIDIA on stage, AMD on stage, Intel on stage and Microsoft on stage, those industry partnerships are critical to not only how we operate on a tactical supply chain question but also on a strategic what's our value proposition."

McCurdy did not go into detail about upcoming Intel-based server equipment, but seemed excited about AMD's Instinct MI300X accelerator—Lenovo was (previously) announced as one of the early OEM takers of Team Red's latest CDNA 3.0 tech. CRN asked about the firm's outlook for upcoming MI300X-based inventory—McCurdy responded with: "I won't comment on an unreleased product, but the partnership I think illustrates the larger point, which is the industry is looking for a broad array of options. Obviously, when you have any sort of lead times, especially six-month, nine-month and 12-month lead times, there is interest in this incredible technology to be more broadly available. I think you could say in a very generic sense, demand is as high as we've ever seen for the product. And then it comes down to getting the infrastructure launched, getting testing done, and getting workloads validated, and all that work is underway. So I think there is a very hungry end customer-partner user base when it comes to alternatives and a more broad, diverse set of solutions."

Two of AMD's upcoming mobile processors that implement the "Zen 5" microarchitecture, "Strix Point" and "Fire Range," were spotted in shipping manifests. These are prototypes moving between AMD and its OEM partners. The manifest explicitly mentions a "Fire Range" 16-core processor sample with 55 W TDP, another "Fire Range" chip with an 8-core configuration and the same 55 W power; and a trio of "Strix Point" processors with a 28 W power design. Two of these are Ryzen 9 SKUs, and one of them is a Ryzen 7.

VideoCardz has the OPN codes for the samples being moved. The Ryzen 7 "Strix Point" sample bears 100-0000001335. One of the two Ryzen 9 "Strix Point" chips bears 100-000000994. The 16-core "Fire Range" is marked 100-000001028, while the 8-core "Fire Range" is 100-000001029. "Strix Point" will be AMD's most imporant mobile processor silicon, as this will be the one with a "Zen 5" CPU core count relevant to the notebook market, pack an RDNA 3+ iGPU, and that alleged 40 TOPS+ XDNA 2 NPU that can run Microsoft Copilot locally. A step up from this will be "Strix Halo," with a higher CPU core count, a much larger iGPU designed for performance-segment gaming. "Fire Range" is essentially a low Z-height BGA version of the "Granite Ridge" chiplet processor that has up to two "Zen 5" CCDs and an I/O die.

Vastarmor's Radeon RX 7900 XTX Super Alloy custom model was revealed a while back (four months ago according to VideoCardz)—for whatever reason, it has taken a long time for finalized units to reach retail outlets in China. A newly discovered JD.com listing reveals an interesting price point of 6799 RMB (~$940)—given the Radeon RX 7900 XTX GPU's age at this point in time, Vastarmor has implemented quite a steep discount over the launch MSRP for Chinese markets (7999 RMB). The premium tier ARGB-appointed "Super Alloy" models sport substantial custom cooling solutions—clearly designed to temper higher boost clocks. VideoCardz has looked at the best Navi 31-based cards on the field: "(Vastarmor's latest) is actually among the fastest models on the market. Currently, the highest boost clock for RX 7900 XTX is 2680 MHz, and it can be found on models like ASRock Taichi, Aqua, PowerColor Liquid Devil, or Sapphire Nitro+."

The RX 7900 XTX Super Alloy is one of the largest high-end gaming graphics cards out there—it is a triple-slot, 330 mm x 134 mm x 69 mm design. Strangely, Vastarmor's reference specced RX 7900 XTX Starry Sky model also sports a similarly-proportioned cooling solution. ZOTAC's Prime Gamer Force (PGF) OC design remains triumphant in terms of stupendous dimensions—check out these digits: 381 mm (L) x 154 mm (W) x 74 mm (D)! ZOTAC PGF cards are Chinese market exclusives—much like Vastarmor's best offerings—only the most hardcore/deep-pocked enthusiasts outside of the PRC will be importing these vast gaming hardware delights.

ZOTAC TECHNOLOGY, a global company focused on innovation, announces three brand-new series of compact form-factor mini AI PCs powered by cutting-edge processors. These mini AI PCs, powered by Intel and AMD processors with dedicated Neural Processing Units (NPU), let users embrace the next generation of computing empowered by Artificial Intelligence.

Accelerated with embedded NPUs within Intel Core Ultra and AMD Ryzen Processors, the brand-new AI PC ZBOX lineup brings the power of Artificial Intelligence to the desk, allowing users to jumpstart their productivity or creativity with AI-powered acceleration. ZBOX's signature lightweight form factor chassis coupled with next-gen hardware create a new generation of versatile, capable personal computers that are smarter to use and even easier to set up.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents the CVN B650M GAMING FROZEN motherboard. This motherboard is our first AMD AM5 motherboard that supports the AMD Ryzen 7000 Series and the latest AMD Ryzen 8000 Series processors that feature the groundbreaking AMD Ryzen AI technology as well as support for AVX-512.

The CVN B650M GAMING FROZEN supports the latest AMD Ryzen 8000G Series APUs with AMD Ryzen AI technology. It also supports the AMD Ryzen 7000 and AMD Ryzen 7000 X3D Series processors with 3D V-Cache Technology, as well as support for the future AM5 processors. AMD Ryzen AI brings the power of personal computing closer to you on an AI PC, unlocking a whole new level of efficiencies for work, collaboration, and innovation so that you can stay connected better with the world around you.

Microsoft, Intel, and AMD are attempting to jumpstart demand in the PC industry again, under the aegis of the AI PC—devices with native acceleration for AI workloads. Both Intel and AMD have mobile processors with on-silicon NPUs (neural processing units), which are designed to accelerate the first wave of AI-enhanced client experiences on Windows 11 23H2. Microsoft's bulwark with democratizing AI has been Copilot, as a licensee of Open AI GPT-4, GPT-4 Turbo, Dali, and other generative AI tools from the Open AI stable. Copilot is currently Microsoft's most heavily invested application, with its most capital and best minds mobilized to making it the most popular AI assistant. Microsoft even pushed for the AI PC designator to PC OEMs, which requires them to have a dedicated Copilot key akin to the Start key (we'll see how anti-competition regulators deal with that).

The problem with Microsoft's tango with Intel and AMD to push AI PCs, is that Copilot doesn't really use an NPU, not even at the edge—you input a query or a prompt, and Copilot hands it over to a cloud-based AI service. This is about to change, with Microsoft announcing that Copilot will be able to run locally on AI PCs. Microsoft identified several kinds of Copilot use-cases that an NPU can handle on-device, which should speed up response times to Copilot queries, but this requires the NPU to have at least 40 TOPS of performance. This is a problem for the current crop of processors with NPUs. Intel's Core Ultra "Meteor Lake" has an AI Boost NPU with 10 TOPS on tap, while the Ryzen 8040 "Hawk Point" is only slightly faster, with a 16 TOPS Ryzen AI NPU. AMD has already revealed that the XDNA 2-based 2nd Generation Ryzen AI NPU in its upcoming "Strix Point" processors will come with over 40 TOPS of performance, and it stands to reason that the NPUs in Intel's "Arrow Lake" or "Lunar Lake" processors are comparable in performance; which should enable on-device Copilot.

AMD's next-gen EPYC Zen 5 processor family seems to be nearing launch status—late last week, momomo_us uncovered an unnamed motherboard's datasheet; this particular model will accommodate a single 9000-series CPU—with a maximum 400 W TDP—via an SP5 socket. 500 W and 600 W limits have been divulged (via leaks) in the past, so the 400 W spec could be an error or a: "legitimate compatibility issue with the motherboard, though 400 Watts would be in character with high-end Zen 4 SP5 motherboards," according to Tom's Hardware analysis.

AMD's current-gen "Zen 4" based EPYC "Genoa" processor family—sporting up to 96-cores/192-threads—is somewhat limited by its DDR5 support transfer rates of up to 4800 MT/s. The latest leak suggests that "Turin" is upgraded quite nicely in this area—when compared to predecessors—the SP5 board specs indicate DDR5 speeds of up to 6000 MT/s with 4 TB of RAM. December 2023 reports pointed to "Zen 5c" variants featuring (max.) 192-core/384-thread configurations, while larger "Zen 5" models are believed to be "modestly" specced with up to 128-cores and 256-threads. AMD has not settled on an official release date for its EPYC "Turin" 9000-series processors, but a loose launch window is expected "later in 2024" based on timeframes presented within product roadmaps.