Red Hat, the world's leading provider of open source solutions, and AMD today announced a strategic collaboration to propel AI capabilities and optimize virtualized infrastructure. With this deepened alliance, Red Hat and AMD will expand customer choice across the hybrid cloud, from deploying optimized, efficient AI models to more cost-effectively modernizing traditional virtual machines (VMs). As workload demand and diversity continue to rise with the introduction of AI, organizations must have the capacity and resources to meet these escalating requirements. The average datacenter, however, is dedicated primarily to traditional IT systems, leaving little room to support intensive workloads such as AI. To answer this need, Red Hat and AMD are bringing together the power of Red Hat's industry-leading open source solutions with the comprehensive portfolio of AMD high-performance computing architectures.

AMD and Red Hat: Driving to more efficient generative AI
Red Hat and AMD are combining the power of Red Hat AI with the AMD portfolio of x86-based processors and GPU architectures to support optimized, cost-efficient and production-ready environments for AI-enabled workloads. AMD Instinct GPUs are now fully enabled on Red Hat OpenShift AI, empowering customers with the high-performing processing power necessary for AI deployments across the hybrid cloud without extreme resource requirements. In addition, using AMD Instinct MI300X GPUs with Red Hat Enterprise Linux AI, Red Hat and AMD conducted testing on Microsoft Azure ND MI300X v5 to successfully demonstrate AI inferencing for scaling small language models (SLMs) as well as large language models (LLM) deployed across multiple GPUs on a single VM, reducing the need to deploy across multiple VMs and reducing performance costs.

Earlier today, the Sapphire Japan social media account shared an intriguing teaser photo. As expected, the Hong Kong-based manufacturer has (representative) feet on the ground in Taipei, Taiwan. Currently, their Computex booth's main purpose is to show off already launched custom AMD RDNA 4 products—namely Radeon RX 9070 XT and RX 9070 cards. According to Team Red's official schedule, new items will be debuted on-stage tomorrow—insiders believe that the oft-leaked Radeon RX 9060 XT model will be unveiled by Jack Huynh, and board partners.

The Japanese Sapphire office commented on pre-game conditions: "I received a very interesting image from the site. Um...It says something like "tomorrow, the 21st, from 12:01pm (1:01pm in Japan?)" I wonder what it could be." Their photo upload shows five placeholder placards; two with longer profiles—suggesting triple-fan configurations. The three other options seem to be dual-fan in nature. Printed material outlines an imminent "21 May, 12:01 PM" reveal. Despite fairly strict conditions, other AIBs have already presented designs (online). Yesterday, industry watchers noticed Acer's previewing of a Nitro Radeon RX 9060 XT OC 16 GB SKU. Given the total number of "temporary" wall-mounted items on display, Sapphire could be readying various mid-range (PURE) and budget (PULSE) models.

As we walked around the show floor earlier today, we walked past the USB-IF booth and spotted VLI showing off their new portable gaming dock concept. What the company has done, is to take its new VL605 USB-C DP to HDMI 2.1 PCON and combined it with the VL832 USB4 endpoint device, which under normal circumstances operate as a USB4 to USB 3.2 and DP 1.4 adapter and the VL109 which is a docking controller that also supports USB PD for up to three ports. The overall design supports up to 140 W USB PD 3.1 power passthrough as well.

The end result is a fairly small PCB that delivers an HDMI 2.1 port with VRR support, a first for a docking station solution as far as we're aware, as well as a USB Type-C with DP Alt-mode output, two USB Type-C ports with USB PD support and two USB Type-A ports. In itself it's not a unique product, but from our understanding, there aren't many docking stations out there that support VRR combined with USB ports that offer more than USB 2.0 speeds. VLI has tested it with AMD FreeSync as well as NVIDIA G-Sync compatible monitors without any problems and it's also been certified for FreeSync Premium Pro. Overall a neat little solution that could appeal to gamers that want a simple way of hooking up their peripherals to their gaming laptop when using an external monitor, keyboard and mouse.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

Acer's dedicated Computex 2025 preview landing page mostly concentrates on brand-new AI PC products, but eagle-eyed observers have noticed the inclusion of an NDA-busting item. The manufacturer's web marketing team has inadvertently unveiled their forthcoming Nitro Radeon RX 9060 XT OC 16 GB model; days in advance of AMD's official unveiling (May 21). Over a week ago, momomo_us shared a screenshot of an unnamed retailer's listing of not-yet-official Acer Nitro 16 GB and 8 GB SKUs. The keen tech industry watcher followed up with today's discovery; complete with a promotional render.

As expected, the Taiwanese brand has prepared a new dual-fan design—borrowing elements from semi-recently revealed Radeon RX 9070 Series cards. Despite rumors of leveraging lesser hardware—probably a "Navi 44 XT" GPU—Acer's pre-launch hype material has outlined an ambitious resolution target: "enjoy stunning 8K visuals and use AI tools to craft your next masterpiece based on RDNA 4 architecture." Acer acts as a board partner for Team Red and Team Blue—surprisingly, the firm's pre-game teaser does not outline an upcoming Intel Xe2 "Battlemage" desktop product line. Instead, a fresh-ish Nitro Arc "Alchemist" A380 LP 6 GB model was placed next to the aforementioned Radeon RX 9060 XT card. So far—during day zero booth inspections—the TechPowerUp has not stumbled upon any physical examples of cheaper RDNA 4 options.

AMD has announced a definitive agreement to sell ZT Systems' data center infrastructure manufacturing business to Sanmina for $3 billion in cash and stock, which includes a contingent payment of up to $450 million. This announcement follows earlier reports from April that AMD was looking to divest the facility it had acquired as part of its $4.9 billion purchase of ZT in March 2025. The deal set to wrap up around late 2025 shows AMD's plan to steer clear of making products that compete with its customers. At the same time, AMD will keep ZT Systems' design and customer support teams to speed up the rollout of AMD AI systems for cloud clients. Sanmina will also become a top choice for introducing new products in AMD's cloud rack and large-scale AI solutions. "By combining the deep experience of our AI systems design team with our new preferred NPI partnership with Sanmina, we expect to strengthen our U.S-based manufacturing capabilities for rack and cluster-scale AI systems and accelerate quality and time-to-market for our cloud customers," said Forrest Norrod, executive vice president and general manager, Data Center Solutions business unit at AMD.

The sale drew a lot of interest from different manufacturers, with early reports showing that Taiwanese OEM makers Compal and Wiwynn were the top choices, along with U.S. electronics firm Jabil. Inventec and Pegatron decided not to take part. Sanmina, the final buyer, is a U.S.-based company that provides integrated manufacturing solutions to the global Electronic Manufacturing Services field. Jure Sola, Chairman and CEO of Sanmina Corporation, said that ZT Systems' skills in liquid cooling, its manufacturing ability, and its know-how in cloud and AI setup will add to Sanmina's worldwide range and vertical integration skills. "Together, we will be better able to deliver a competitive advantage to our customers with solutions for the entire product lifecycle. We look forward to our ongoing partnership with AMD as we work together to set the standard for quality and flexibility to benefit the entire AI ecosystem." said Jure Sola, Chairman and CEO of Sanmina Corporation.

ASUS today announced that its flagship high-density AI server, ESC A8A-E12U, now supports the latest AMD Instinct MI350 series GPUs. This enhancement empowers enterprises, research institutions, and cloud providers to accelerate their AI and HPC workloads with next-generation performance and efficiency—while preserving compatibility with existing infrastructure.

Built on the 4th Gen AMD CDNA architecture, AMD Instinct MI350 series GPUs deliver powerful new capabilities, including 288 GB of HBM3E memory and up to 8 TB/s of bandwidth—enabling faster, more energy-efficient execution of large AI models and complex simulations. With expanded support for low-precision compute formats such as FP4 and FP6, the Instinct MI350 series significantly accelerates generative AI, inference, and machine-learning workloads. Importantly, Instinct MI350 series GPUs maintain drop-in compatibility with existing AMD Instinct MI300 series-based systems, such as those running Instinct MI325X—offering customers a cost-effective and seamless upgrade path. These innovations reduce server resource requirements and simplify scaling and workload management, making Instinct MI350 series GPUs an ideal choice for efficient, large-scale AI deployments.

Acer today unveiled its new ProCreator Series monitors, designed to enhance creative workflows with Calman-verified, high-resolution displays. These monitors feature wide color gamut coverage, up to Delta E<1 color accuracy levels, and the Acer Creator Hub software. Select models come with OLED and touchscreen panels, built-in webcams for conferencing and collaboration, and compatibility with AMD FreeSync Premium Pro and NVIDIA G-SYNC Compatible technologies.
In addition, Acer introduced a range of portable and dual-screen foldable monitors, as well as compact LED projectors, catering to diverse needs and use cases.

Acer ProCreator Monitors
Acer's new ProCreator Series monitors are tailored for professional creators such as animators, photographers, editors, and designers who demand precise color accuracy and stunning visual clarity for creative projects. All models are Calman-verified, ensuring they meet rigorous standards for reliable color performance and consistency across various workflows.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

Acer today announced new models in its Swift X laptop series, the Swift X 14 AI and Swift X 14, designed to offer professionals and content creators reliable performance and a suite of AI tools to enhance their creative endeavors. Powered by AMD Ryzen AI 300 Series processors, the Swift X 14 AI enables seamless on-device rendering, modeling, and real-time visualization. This new Copilot+ PC is equipped to handle demanding AI workloads and offers exclusive AI experiences such as Recall (preview), Click to Do (preview), and improved Windows search, Cocreator, Live Captions, Image Creator, and Windows Studio Effects. The new Swift X 14 creator laptop ensures responsive performance for demanding creative workflows and all-day battery life powered by Intel Core Ultra Processors (Series 2).

Both laptops are powered by NVIDIA GeForce RTX 5070 Laptop GPUs with NVIDIA Blackwell architecture and also feature Calman-verified 3K OLED touch displays that are calibrated to produce captivating and accurate colors right out of the box.

Acer today announced the expansion of its Aspire AI series laptops with six new Copilot+ PCs, showcasing intuitive AI capabilities and versatile features. Available in sleek 14- and 16-inch models, these laptops offer varied configuration options, combining powerful computing with modern designs at pocket-friendly prices. The new Aspire AI laptops cater to a diverse range of users, including students, professionals and families seeking reliable performance and multi-day battery life for their daily computing needs. As Copilot+ PCs, these laptops serve to streamline workflow with exclusive AI experiences, including Recall (preview), Click to Do (preview), and Improved Windows Search, making it easier to resume tasks and quickly find what users need. Acer's proprietary AI applications - AcerSense, Acer LiveArt 2.0, Acer PurifiedView 2.0 and Acer PurifiedVoice 2.0 - make it easy to manage settings, sift through files, produce stunning content instantly, and improve videoconferencing quality.

Featuring a durable, thin-and-light aluminium chassis, the Aspire 16 AI and Aspire 14 AI are perfect for travel, going to school and mobile work. Their versatile 180° hinge designs allow them to lay flat or be positioned in various ways, adjusting viewing angles based on the task at hand. With plenty of battery life, these devices can power through more than an entire day without needing to plug in. The Aspire range comes with 14- or 16-inch up to 120 Hz displays featuring slim bezels, and 16:10 aspect ratios for expansive viewing. Touchscreen models are available for more interactive use cases. Each device is equipped with up to 32 GB LPDDR5X memory, 1 TB PCIe Gen 4 storage, and offers ultra-fast, stable connectivity with up to Wi-Fi 7 and Bluetooth 5.4. Plus, they are equipped with a generous number of I/O ports, including a pair of USB Type-C and USB Type-A ports, HDMI 2.1, and MicroSD card slots. Each model is also EPEAT Gold registered and is encased in 100% recyclable packaging.

AMD is preparing the next-generation mobile processor based on Zen 6 "Medusa Point" APUs. According to industry leaker HXL, the new lineup will feature a surprisingly high core count, especially on the top-end Ryzen 9 model, which is expected to pack 22 CPU cores. Under the hood, the Ryzen 5 and Ryzen 7 Medusa Point APUs will use a hybrid layout that combines four high-performance classic cores, four dense cores optimized for efficiency, and two ultra-low‑power cores. On the graphics side, these chips will offer eight RDNA 3.5+ compute units, an upgrade from previous designs but still modest compared to some rivals. What really stands out is the Ryzen 9 variant, which reportedly adds a second Core Complex Die from AMD's desktop lineup. That extra 12‑core CCD joins the main ten-core die, bringing the total to 22 cores. While this pushes the CPU core count, AMD keeps the integrated graphics configuration unchanged, with just eight compute units.

Initial performance data hints that this trimmed-down GPU might run about 20 to 25 percent slower than the 12‑CU Radeon 890M used in earlier models. The eight CU GPU is half the power of current generation "Strix Point" with 16 CUs, but Medusa Point packs some RDNA 3.5+ upgrades. Even then, the raw CPU power should appeal to users who rely on heavily threaded applications, particularly in ultraportable laptops and mobile workstations. Medusa Point is built on the FP10 package, allowing for a slightly larger die size that houses the new core arrangement without sacrificing efficiency. Including dedicated low-power cores also marks AMD's first embrace of a heterogeneous x86 approach, similar to Intel's recent Core Ultra series. While more serious graphics work will mandate a combination of discrete GPUs for demanding workloads, Medusa Point will set new expectations for integrated CPU performance in thin, light notebooks.

On May 9, the South Korean Radio Agency (RRA) logged four unannounced ASRock Radeon RX 9060 XT SKUs. Since early Spring, harukaze5719 has kept a watchful eye on intriguing pre-launch registrations. For example, they discovered Gigabyte's Gaming OC 16 GB and 8 GB models over a month ago. AMD's board partners seem to be prepping custom options; well in advance of next week's teased unveiling (at Computex 2025). ASRock seems to be cutting things quite fine, with their registering of (allegedly) Navi 44 XT GPU-based Steel Legend and Challenger models. Rumors of a canceled AMD Radeon RX 9060 XT 8 GB (GDDR6) variant emerged a while back, but certain insiders have insisted that this cheaper option will arrive alongside a 16 GB sibling.

Recent RRA filings indicate an upcoming two-pronged approach, involving a good number of AIBs. Buoyed by harukaze5719's fresh findings, VideoCardz carried out additional detective work. They soon unearthed "in stock" ASRock Steel Legend and Challenger factory overclocked Radeon RX 9060 XT cards. Apparently, a Vietnamese store is already courting local client interest—prices are not visible on the unnamed shop's webstore, but staffers are reportedly "encouraging customers to inquire" about costs of ownership. Gaming GPU enthusiasts will recall the amusingly extra early arrival of custom Radeon RX 9070 XT and RX 9070 retail stock in Europe; in anticipation of a supposedly scuppered January launch window. Unlike its main rival, AMD seems to be running on schedule with its next wave of RDNA 4 gaming products.

AMD is already looking ahead to its Zen 7 generation and is planning the final details for its next generation of Zen IP. The first hints come from YouTuber "Moore's Law Is Dead," which points to a few interesting decisions. AMD plans to extend its multi‑class core strategy that began with Zen 4c and continued into Zen 5. Zen 7 will reportedly include three types of cores: the familiar performance cores, dense cores built for maximum throughput, and a new low‑power variant aimed at energy‑efficient tasks, just like Intel and its LP/E-Cores. There is even an unspecified "PT" and "3D" core. By swapping out pipeline modules and tweaking their internal libraries, AMD can fine‑tune each core so it performs best in its intended role, from running virtual machines in the cloud to handling AI workloads at the network edge.

On the manufacturing front, Zen 7 compute chiplets (CCDs) are expected to be made on TSMC's A14 process, which will now include a backside power delivery network. This was initially slated for the N2 node but got shifted to the A16/A14 line. The 3D V‑Cache SRAM chiplets underneath the CCDs will remain on TSMC's N4 node. It is a conservative choice, since TSMC has talked up using N2‑based chiplets for stacked memory in advanced packaging, but AMD appears to be playing it safe. Cache sizes should grow, too. Each core will get 2 MB of L2 cache instead of the current 1 MB, and L3 cache per core could expand to 7 MB through stacked V‑Cache slices. Standard CCDs without V‑Cache will still have around 32 MB of shared L3. A bold rumor suggests an EPYC model could feature 33 cores per CCD, totaling 264 cores across eight CCDs. Zen 7 tape‑out is planned for late 2026 or early 2027, and we probably won't see products on shelves until 2028 or later. As always with early-stage plans, take these details with a healthy dose of skepticism. The final Zen 7 lineup could look quite different once AMD locks down its roadmap.

Alphacool International GmbH, based in Braunschweig, has been a pioneer in PC water cooling technology for over 20 years. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its portfolio with the new Core RX 9070 XT graphics card water coolers with Backplate.

The GPU water coolers have been completely redesigned. Precise adjustments to the spacing between the cooler and the PCB, along with optimized water flow simulations and extensive practical testing, have resulted in significant improvements to the cooler base and jetplate. These enhancements ensure maximum cooling performance for the newest AMD Radeon RX 9070 XT generation. The GPU water coolers feature a precisely machined copper base with high-quality chrome plating for exceptional durability and a smooth surface. The design is further complemented by robust brass fittings with a nylon cover, ensuring maximum safety and reliability.

Late last month, data miners unearthed a wide variety of unannounced AMD Ryzen processor IPs. A "Sound Wave" product category received less attention, but Team Red's curious codename has reemerged in the middle of May. Thanks to fresh Kepler L2 theorizations, this mysterious mobile APU family has a potential end destination. Leaks from 2024 suggested that company engineers were working on an unusual Arm-based processor branch. AMD is cozily well-versed in all things x86, but an alleged present day diversification—into Arm (x64) territories—has confounded a fair few industry watchdogs.

In a tangential conversation—forking off from speculative "Zen 6" and PlayStation 6 APU chatter—Kepler L2 reckons that Team Red "Sound Wave" chips will be deployed in 2026, possibly within a refreshed Microsoft Surface lineup. Current-gen Arm-based offerings—leveraging Qualcomm Snapdragon X processors—have generated mixed user impressions (press and public alike). Microsoft and Qualcomm's "Windows on Arm" (WoA) platform partnership was elevated earlier on in May (with cheaper options), but troublesome hardware-to-software compatibility issues have reportedly caused some rifts in this relationship. As of last week, evaluators seemed to be poking around with NVIDIA's rumored Arm-based "N1" chip series on Windows. In theory, AMD's futuristic "Sound Wave" designs could do battle with (claimed) Team Green and MediaTek collaborative efforts.

In an almost uncanny case of recent history repeating itself, AMD has kicked off another RDNA 4 new product teaser campaign. Today's reminder—regarding Jack Huynh's upcoming Computex presentation—included a promotional render of a stubbier dual-fan Radeon RX 9000 Series card design. Casting our memories back to late January (2025), Team Red rolled out an ill-timed advertisement—not long after the official delay of Radeon RX 9070 XT and non-XT cards. Despite denying the existence of "Made-By-AMD" (MBA) reference designs, AMD staffers were likely enraged by Chinese black market channel offerings of alleged "real deal examples." Days after first wave RDNA 4's March 6 global launch, a triple-fan specimen was outed.

Throughout early Q2, insiders and members of the Chiphell forum have played around with Radeon RX 9070 XT and RX 9070 MBA cards. The latter unit (see photo below) seems to utilize a dual-fan configuration in a fairly long enclosure format. Team Red's latest promo post likely points to a forthcoming unveiling of Radeon RX 9060 XT partner models, but curious industry observers will be wondering whether the shorter reference design actually exists in real life. As per usual, a tiny disclaimer claims otherwise: "Artistic Render. Not Available For Purchase." So far, leaks have suggested the presence of Acer, ASUS, GIGABYTE, and XFX custom options during introductory proceedings. Today's refresher outlined upcoming new product categories and partner contributions: "join AMD on May 21 as we reveal what's next in gaming, AI PCs, and more. (Our) SVP and GM of Computing and Graphics Group, along with industry leaders and partners showcase what is built to power the next level."

AMD and HUMAIN, Saudi Arabia's new AI enterprise, today announced a landmark agreement to build the world's most open, scalable, resilient, and cost-efficient AI infrastructure, that will power the future of global intelligence through a network of AMD-based AI computing centers stretching from the Kingdom of Saudi Arabia to the United States. As part of the agreement, the parties will invest up to $10B to deploy 500 megawatts of AI compute capacity over the next five years. The AI superstructure built by AMD and HUMAIN will be open by design, accessible at scale, and optimized to power AI workloads across enterprise, start-up and sovereign markets. HUMAIN will oversee end-to-end delivery, including hyperscale data center, sustainable power systems, and global fiber interconnects, and AMD will provide the full spectrum of the AMD AI compute portfolio and the AMD ROCm open software ecosystem.

"At AMD, we have a bold vision to enable the future of AI everywhere—bringing open, high-performance computing to every developer, AI start-up and enterprise around the world," said Dr. Lisa Su, Chair and CEO, AMD. "Our investment with HUMAIN is a significant milestone in advancing global AI infrastructure. Together, we are building a globally significant AI platform that delivers performance, openness and reach at unprecedented levels." With initial deployments already underway across key global regions, the collaboration is on track to activate multi-exaflop capacity by early 2026, supported by next-gen AI silicon, modular data center zones, and a developer-enablement focused software platform stack built around open standards and interoperability.

Roughly a month ago, Vastarmor debuted its "Super-less" Radeon RX 9070 XT Alloy SKU. The Chinese manufacturer's barebones spin-off—derived from a triple-fan flagship design—was stripped of fancy ARGB trimmings. Additionally, this sober-looking alternative option was deemed unworthy of sporting 3.1 GHz boost clock credentials—instead, making do with a mere 3010 MHz setting. A brand-new "Super Alloy Ultra" model retains elite-tier membership; as demonstrated by a recently published specification sheet. The Vastarmor design team has opted into using a louder and wider color palette; clearly demonstrated by their fresh RX 9070 XT Super Alloy Ultra's zany pearlescent rainbow-spectrum shroud setup. Unfortunately, this bright aesthetic treatment did not extend to the new flagship's backplate. The AIB's Super Alloy White option was appropriately decorated; on the front and back. Vastarmor's latest offering is not expected to break retail barriers beyond Chinese markets. ASRock's premium Radeon RX 9070 XT Taichi OC card is—perhaps—the closest to being a visually "eccentric" option for global audiences. Fittingly, its factory overclocked talents include a 3.1 GHz boost clock.

Officially, AMD Ryzen AI Max "Strix Halo" mobile processors are only available in complete systems—e.g. laptops, notebooks, and mini desktop PCs. Upon learning about this release status, DIY enthusiasts were left disappointed. After all, these impressively potent all-in-one solutions have picked up considerable praise pre- and post-launch. Team Red's "Strix Halo" flagship—the Ryzen AI Max+ 395—is the subject of much online debate, but cost of entry is steep. Under normal circumstances (i.e. no leveraging of promotional discounts), potential buyers are looking at $2000+ pre-built systems.

Separate BGA packages have turned up for sale in China—specifically on Goofish; Alibaba's second-hand trading platform. A past weekend VideoCardz investigative piece covered these curiosities. At this stage in time, viable custom motherboard designs are not yet widely distributed—effectively making individual "Strix Halo" units expensive paperweights. At the time of writing, seller "The Eraser in My Mind" offers the best Ryzen AI Max+ 395 deal: 3998 RMB (~$555 USD). This Suzhou-based trader also lists Ryzen AI Max PRO 390, and 380 SKUs. Product descriptions indicate that some of these processors are already powering mysterious handheld gaming devices (likely regional exclusives). Four Goofish accounts are displaying the same set of images; distinctive Team Red branding and "Made in Taiwan" tags are clearly visible across specimens—mostly mounted on plastic transport trays.

MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. and a leading manufacturer in server platform design, introduced its latest offering featuring the AMD EPYC 4005 Series processors. These updated server solutions offer enhanced performance and energy efficiency to meet the growing demands of modern business workloads, including AI, cloud services, and data analytics.

"The new AMD EPYC 4005 Series processors deliver the performance and capabilities our customers need at a price point that makes ownership more attractive and attainable," said Derek Dicker, corporate vice president, Enterprise and HPC Business, AMD. "We're enabling businesses to own their computing infrastructure at an economical price, while providing the performance, security features and efficiency modern workloads demand."

AMD is gearing up to expand its Instinct MI family in the latter half of 2026 with two purpose‑built UDNA‑based accelerators. These new models, MI430X UL4 and MI450X, will cater respectively to high‑precision HPC tasks and large‑scale AI workloads. The MI430X UL4 is designed for applications that rely heavily on double‑precision FP64 floating‑point performance, such as scientific simulations, climate modeling, and others. It features a large array of FP64 tensor cores, ensuring consistent throughput for tightly coupled compute jobs. Because a dedicated UALink switch from partners like Astera Labs or Broadcom won't be available at launch, AMD has chosen a four‑GPU point‑to‑point mesh configuration for the MI430X UL4. This limited scale‑up approach keeps latency low and synchronization tight, making it ideal for small cluster deployments. On the AI side, the MI450X embraces Ethernet‑based Ultra Ethernet for scale‑out.

With UEC‑ready switches already on the market, this open‑standard networking solution lets users build expansive AI farms across dozens or even hundreds of nodes. By relying on established Ethernet technology instead of the new UALink ecosystem, AMD provides customers with immediate, hardware‑accelerated networking for both inference and training. While UALink promises an open, vendor‑neutral accelerator-to-accelerator fabric, its progress has been slow. Committee reviews and limited investment in switch silicon have delayed switch availability. Broadcom, viewed as the primary UALink switch supplier, has been cautious about its commitment, given expected lower volumes compared to Ethernet alternatives. AMD's acceleration segmentation addresses these realities. The MI430X UL4 delivers high‑precision compute in compact GPU meshes. The MI450X offers large‑scale AI connectivity via Ethernet. Should UALink switch development catch up in the future, AMD could revisit native GPU‑to‑GPU fabrics.

Closer to the start of 2025, Kepler L2 shared "PlayStation 6" inside track info. The venerable leaker—of mostly AMD behind-the-scenes details—theorized that Sony's sixth-gen home console was based around an early fork that branched off from a mysterious "GFX13" GPU architecture. Earlier today, this target identifier has appeared again. Kepler L2's latest investigations have pulled the "GFX13+" target from kernel-level codebase updates. Data miners have often pulled compelling pre-release tidbits from official repositories; AMD's software engineering team open-source developments are quite visible. Over a year ago, similar detective work connected the "GFX12" IP to RDNA 4—nowadays, better known as the Radeon RX 9000 graphics card family. Despite Team Red's official insistence that RDNA 4 was a priority on desktop platforms, supposed discrete mobile variants were leaked last month. In addition, RDNA 3.5 seems to be a mainstay for at least another generation of integrated graphics solutions.

Looking beyond these current-gen graphics architectures, AMD leadership has already previewed a "unified" path forward. Last September's announcement revealed the convergence of RDNA (gaming) and CDNA (enterprise) GPU technologies: dubbed "UDNA." Present day leaks do mention a far out "RDNA 5" line (also "Navi 5x"), but in the same sentence as "UDNA." Kepler L2 commented on the (screen captured) presence of "ENABLE_WAVEFRONT" and "ENABLE_WAVEGROUP" kernel code properties: "I think it's related to SWC (Streaming Wave Coalescer/pseudo out-of-order execution). Each SIMD takes multiple wave32/wave64 (a wavegroup) as inputs and reorders the work items of each wave to reduce execution divergence." Fresh rumors suggest the distant RDNA 5/UDNA avenue being good enough to expand into higher-end gaming card territories. So far, RDNA 4 has hit a ceiling with Navi 48 GPU-powered Radeon 9070 XT offerings.

Late last week, Amazon's prematurely published product pages provided an early insight into XFX's alleged implementation of a 3320 MHz boost clock—90 MHz above AMD's speculated reference setting for not-yet-official Radeon RX 9060 XT 16 GB and 8 GB graphics cards. A couple of hours ago, momomo_us shared a fresher set of leaked specifications. The tenured PC tech industry observer outlined two separate tranches of unnamed hardware clocks—presumably linked to factory overclocked Radeon RX 9060 XT variants: "up to 3320 MHz, Game: 2780 MHz" and "up to 3290 MHz, Game: 2700 MHz." As interpreted by VideoCardz, these numbers align with older RDNA 4 rumors—previously, insiders claimed that Team Red's Navi 44 GPU was capable of clocking higher than the larger "Navi 48" sibling. According to their investigative article: "new information (indicates) that the RX 9060 XT's game clock is actually higher than the boost clock of the RX 9070 (non-XT)...The highest boost clock reported for the RX 9060 XT so far is 3320 MHz, which significantly exceeds the RX 9070 XT's 3100 MHz found on its fastest variants."

The latest momomo_us bulletin contains mostly repeated information, but graphics card analysts were confounded by the mentioning of a PCIe 5.0 x16 bus Interface. Prior disclosures have theorized the utilization of PCIe 5.0 x8; as listed within TechPowerUp's GPU database entry. VideoCardz weighed in with some credence: "small GPUs like Navi 44 typically don't require wider interfaces, as performance gains are minimal. However, with PCIe 5.0, using only 8 lanes would result in slightly reduced performance on PCIe 4.0 systems, something already seen with the GeForce RTX 5060 Ti 8 GB variant. By choosing a wider interface, AMD may be attempting to avoid similar issues." Leading up to AMD's debuting of first wave RDNA 4 gaming cards, opposing speculators fought over the company's selection of PCIe 4.0 or PCIe 5.0 standards. A public delivery of finalized Radeon RX 9060 XT specifications is likely due on May 21, during Computex 2025.

ASRock Rack Inc., the leading innovative server company, today announced support for the newly launched AMD EPYC 4005 Series processors across its extensive lineup of AM5 socket server systems and motherboards. This announcement reinforces ASRock Rack's commitment to delivering cutting-edge performance, broad platform compatibility, and long-term value to customers in data centers, growing businesses, and edge computing environments.

Built on the AMD 'Zen 5' architecture, the AMD EPYC 4005 Series features up to 16 SMT-enabled cores and supports DDR5 memory speeds up to 5600 MT/s, delivering class-leading performance per watt within constrained IT budgets. As AI becomes embedded in everyday business software, AMD EPYC 4005 Series CPUs provide the performance headroom needed for AI-enhanced workloads such as automated customer service and data analytics while maintaining the affordability essential for small businesses. The series expands the proven AMD EPYC portfolio with solutions purpose-built for growing infrastructure demands.