A Chinese tech forum ChipHell user who goes by zcjzcj11111 sprung up a fascinating take on what the next-generation AMD "Navi 48" GPU could be, and put their imagination on a render. Apparently, the "Navi 48," which powers AMD's series-topping performance-segment graphics card, is a dual chiplet-based design, similar to the company's latest Instinct MI300 series AI GPUs. This won't be a disaggregated GPU such as the "Navi 31" and "Navi 32," but rather a scale-out multi-chip module of two GPU dies that can otherwise run on their own in single-die packages. You want to call this a multi-GPU-on-a-stick? Go ahead, but there are a couple of changes.

On AMD's Instinct AI GPUs, the chiplets have full cache coherence with each other, and can address memory controlled by each other. This cache coherence makes the chiplets work like one giant chip. In a multi-GPU-on-a-stick, there would be no cache coherence, the two dies would be mapped by the host machine as two separate devices, and then you'd be at the mercy of implicit or explicit multi-GPU technologies for performance to scale. This isn't what's happening on AI GPUs—despite multiple chiplets, the GPU is seen by the host as a single PCI device with all its cache and memory visible to software as a contiguously addressable block.

The upcoming AMD Ryzen 7 9800X3D processor is already in the hands of hardware modders, who have put the chip through de-lidding (removal of the integrated heatspreader or IHS), revealing what's underneath. In the 9800X3D de-lidded picture, the CCD appears plain, with no apparent L3D on top, unlike on the 7800X3D (second picture, below). We'd been hearing reports that with the 9000X3D series, AMD has redesigned the way the 3D V-cache die (L3D) and the CPU complex die (CCD) are stacked together, by inverting their arrangement, such that the CCD is on top, and the L3D below.

In past generations of X3D processors, such as the 7800X3D and the 5800X3D, the L3D is stacked on top of the CCD, with structural silicon handling the crucial task of transferring heat from the CPU cores to the IHS. This inversion in stacking should ensure better thermals for the CPU cores, the 9800X3D boosting behavior should be similar to that of non-X3D chips, such as the 9700X. AMD has given the 9800X3D a 120 W TDP and 5.20 GHz boost frequency. This inversion of the CCD and L3D stacking is probably what is behind the "X3D Reimagined" teaser blurb by AMD.

ASUS over the weekend introduced its third custom-design AMD Radeon RX 7600 graphics card, the RX 7600 DUAL EVO OC. This card is visually the largest, most spruced-up custom-design for this GPU from the company's DUAL series. It's positioned a notch below the premium ROG Strix RX 7600 OC, which remains the only ROG branded graphics card based on the RX 7000 series. The DUAL EVO OC is 22.9 cm in length, and 12.3 cm in height, and is 2.5 slots thick. Its cooling solution features an aluminium fin-stack heatsink, which is ventilated by a pair of 80 mm Axial-Tech fans. The cooler offers idle fan-stop.

Out of the box, the ASUS RX 7600 DUAL EVO OC comes with a 2280 MHz Game clock, and 2695 MHz maximum boost frequency, compared to AMD reference clock speeds of 2250 MHz Game clocks and 2655 MHz boost. The card draws power from a single 8-pin PCIe power connector, and puts out display outputs that include three DisplayPort 1.4a, and one HDMI 2.1. Based on the 6 nm "Navi 33" silicon and driven by the RDNA 3 graphics architecture, the RX 7600 features 2,048 stream processors across 32 CU, along with 64 AI accelerators, and 32 ray accelerators. It comes with 8 GB of 18 Gbps GDDR6 memory across a 128-bit wide memory bus. ASUS didn't reveal pricing.

Specifications of the upcoming AMD Ryzen 7 9800X3D processor were leaked to the web by a Geizhals listing. The chip comes with a processor base frequency of 4.70 GHz, and a maximum boost frequency of 5.20 GHz. The base frequency of 4.70 GHz is a significant increase from the 4.20 GHz of the current 7800X3D, while the maximum boost frequency has moved up a couple of notches from the 5.05 GHz of the 7800X3D. The TDP of the processor is set at 120 W, same as the 7800X3D, and higher than the 105 W revised-spec cTDP of the non-X3D Ryzen 7 9700X.

The specs sheet also confirms that the 3D V-cache size is unchanged generationally. The stacked 3D V-cache die adds 64 MB to the on-die 32 MB L3 cache, which is exposed to software as a 96 MB contiguously addressable L3 cache. The per-core L2 cache size remains 1 MB per core. The biggest contributor to generational gaming performance increases will rest on the increase in frequencies, the new "Zen 5" microarchitecture and any IPC improvements on offer, plus L3 cache performance improvements AMD introduced with "Zen 5." We recently reported a spectacular theory that AMD has designed the 9800X3D such that the stacked 3D V-cache is positioned below the 8-core CPU complex die chiplet, and not above it, which should significantly improve thermals, and clock speeds.

Much of the Ryzen 7 9800X3D teaser material from AMD had the recurring buzzwords "X3D Reimagined," causing us to speculate what it could be. 9550pro, a reliable source with hardware leaks, says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D is stacked on top of the CCD. It would stack above the central region of the CCD that has the on-die 32 MB L3 cache, while blocks of structural silicon would be placed on top of the edges of the CCD that have the CPU cores, with these structural silicon blocks performing the crucial task of transferring heat from the CPU cores to the IHS above. This is about to change.

If the leaks are right, AMD has inverted the CCD-L3D stack with the 9000X3D series such that the "Zen 5" CCD is now on top, the L3D is below it, under the central region of the CCD. The CPU cores now dissipate heat to the IHS as they do on regular 9000 series processors without the 3D V-cache technology. The way we imagine they achieved this is by enlarging the L3D to align with the size of the CCD, and serve as a kind of "base tile." The L3D would have to be peppered with TSVs that connect the CCD to the fiberglass substrate below. We know where AMD is going with this in the future. Right now, the L3D "base tile" contains the 64 MB 3D V-cache that gets appended to the 32 MB on-die L3 cache, but in the future (probably with "Zen 6"), AMD could design the CCDs with TSVs even for the per-core L2 caches.

AMD's answer to Intel's "Lunar Lake" is here. According to Olrak29, who discovered a strange entry on the OpenBenchmark benchmarking suite made by Phoronix, we have preliminary information on AMD's "Krackan / Kraken Point" APU. Spotted in the benchmark trials is the "100-000000713" model, which corresponds to an eight-core, sixteen-threaded CPU with four regular Zen 5 and four smaller (but not less potent) Zen 5c cores clocked at 3.95 GHz. Do note that this is just an engineering sample in the wild, so final clock speeds will depend mainly on AMD and its OEMs, given by TDP they plan to support with Kraken Point.

Accompanying the 8C/16T CPU configuration is the 32 GB of LPDDR5X memory from SK Hynix. According to the benchmark reading, four 8 GB modules were present, so we expect it to be on the system board, unlike on-chip like Intel does with Lunar Lake. The memory is running at 8000 MT/s, which is a 500 MT/s improvement over Strix Point and slower than its competitor, Lunar Lake, which has LPDDR5X running at 8533 MT/s. Lastly, the Krackan / Kraken Point APU has been spotted with eight RDNA 3.5 Compute Units. Where this exactly lands in AMD's product stack is still unclear. We expect to hear more about it as we enter 2025, so by then, remain patient until the next leak.

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.

Corsair is excited to announce the launch of the Corsair NAUTILUS RS and NAUTILUS RS ARGB family of liquid CPU Coolers. These innovative coolers deliver high-performance CPU cooling with easy installation and outstanding compatibility with modern CPU sockets. The NAUTILUS RS family is available in black in both 240 mm and 360 mm sizes, while the NAUTILUS RS ARGB is available in both black and white in the same sizes, with added ARGB lighting to enhance your build.

GET COOLER WITH A NEW COLD PLATE
The NAUTILUS RS series features an efficient, low-noise pump and a slightly convex cold plate pre-applied with thermal paste in an optimized pattern, improving contact with the processor's integrated heat spreader for superior thermal transfer. Available in 240 mm or 360 mm radiator sizes and equipped with RS120 fans, NAUTILUS RS coolers effectively maintain optimal temperatures for high-end CPUs.

Here is the first picture of the AMD Ryzen 7 9800X3D retail box up close. We've seen lower-res versions of this box in older leaks. A variation of the retail box-art of other Ryzen 9000 series "Granite Ridge" desktop processors, The 9800X3D box brightens up the silver background behind the AMD Arrow, as well as the Arrow's orange borders. One of the triangular background cutouts has the "7" brand extension, while the other mentions AMD 3D V-cache technology, which is all the confirmation we need that this indeed is the 9800X3D. AMD announced the 9000X3D series debut earlier this week, with product availability starting November 7, 2024.

The second generation of AMD Ryzen Z-series processors for handheld gaming consoles, will be led by the Ryzen Z2 Extreme. There will also be an affordable Ryzen Z2 (non-Extreme). We've known for some time that the Z2 Extreme is based on the 4 nm "Strix Point" monolithic silicon, with some optimization (the highest bins to facilitate the best energy efficiency); but now we have a few more details thanks to a leak by Golden Pig Upgrade. AMD's engineering effort with the Z2 Extreme will be to give the console the most generational performance uplift from the iGPU, rather than the CPU.

The "Strix Point" silicon features a significantly updated iGPU from the previous-generation "Phoenix." It's based on the more efficient RDNA 3.5 graphics architecture, which is better optimized for LPDDR5 memory; and comes with 16 compute units (CU), compared to 12 on the "Phoenix." The Ryzen Z2 Extreme will come with all 16 CU enabled. The CPU is where some interesting changes are planned. The "Strix Point" silicon features a dual-CCX CPU, one of these contains four "Zen 5" CPU cores sharing a 16 MB L3 cache, while the other features eight "Zen 5c" cores sharing an 8 MB L3 cache. For the Ryzen Z2 Extreme, AMD is going with an odd 3+5 core configuration. What this means is that the Ryzen Z2 Extreme will have 3 "Zen 5" cores, and 5 "Zen 5c" cores. The L3 cache on the CCX with "Zen 5" cores has been reduced to 8 MB in size. On paper, this is still an 8-core/16-thread CPU with 16 MB of L3 cache (same as "Phoenix,") but now you know that there's more going on.

AMD has unveiled its latest chipset driver update 6.10.17.152, bringing new features and improvements to enhance system performance and compatibility, along with support for X870E / X870 chipsets. The release introduces expanded program support and optimized Windows 11 integration through CETCOMPACT implementation across select drivers, a security feature that helps protect against certain types of malware attacks by enforcing Control-flow Enforcement Technology (CET) in a compatible mode for legacy software. This technology ensures better security while maintaining compatibility with existing applications.

The update comes with several bug fixes addressing previous version issues. However, users should be aware of certain limitations that are currently present in this release. Some driver names may appear in English when running on non-English operating systems, users might encounter instances where the uninstall summary incorrectly displays a "Failed" status despite successful removal, and some users may experience installation or upgrade issues related explicitly to Ryzen PPKG. AMD recommends users backup their systems before updating and follow the standard installation procedures, with the company maintaining dedicated technical support resources through their customer service portal for users requiring additional assistance.

DOWNLOAD: AMD Chipset Drivers 6.10.17.152

AMD today lifted the covers off its Ryzen 7 9800X3D Socket AM5 processor powered by the "Zen 5" microarchitecture and 3D V-cache technology. The company did not put out any product specs or other details, except announcing November 7, 2024, as the product availability date for this chip. This would put its launch exactly two weeks from that of Intel's Core Ultra Series 2 "Arrow Lake-S" processors, and give reviewers time to include the performance results of the new Intel chips in reviews of the 9800X3D. AMD is looking to extend its gaming performance leadership which it held with the 7800X3D. The switch to the newer "Zen 5" microarchitecture and higher clock speeds could push gaming performance up beyond the 7800X3D by a few percentage points. The 7800X3D is already faster than the Core i9-14900K in gaming workloads, so we're being set up for an exciting clash between the Core Ultra 9 285K and the Ryzen 7 9800X3D for gaming performance.

Next up, AMD announced official price cuts for all four current models in its Ryzen 9000 "Granite Ridge" desktop processor family. Buyers in the retail channel should be able to find the flagship Ryzen 9 9950X 16-core/32-thread processor up to $50 cheaper than its launch price, which should bring it down to $600. The Ryzen 9 9900X (12-core/24-thread), the Ryzen 7 9700X (8-core/16-thread), and the Ryzen 5 9600X (6-core/12-thread), each get a haircut of up to $30. You should be able to find the 9900X for as little as $470. The 9700X should be down to as low as $330. The 9600X, the most affordable "Zen 5" part, should go for as low as $250. The price-cuts should be effective immediately. Although all pre-launch info points to this being an 9800X3D-only launch, our AMD PR contacts used the plural term ("X3D processors") when referring to the November 7 date. Could we see more than one X3D processor model launch, especially given the $50 price cut given to the 9950X? Watch this space.

AMD continues to expand the AM4 platform with new processors, despite having already released 145 AM4 SKUs over the past nine years. According to Videocardz, citing a post from @momomo_us on the X platform, AMD plans to launch two new ones: the Ryzen 5 5600T and 5600XT. The leak was later confirmed on ASUS and MSI websites, with these 6-core CPUs appearing on lists of supported motherboards. The MSI page confirms that (at least) the 5600T is a Vermeer processor without integrated graphics. Additionally, AMD intends to make the Ryzen 3 5300G available to consumers as a boxed retail product; until now, this model has been available exclusively for OEM markets since its launch in 2021.

Going into more detail, these new SKUs have the following specifications: The Ryzen 5 5600XT features a 6-core design, 32 MB L3 cache, 65 W TDP, and a base frequency of 3.8 GHz. The Ryzen 5 5600T also has a 6-core design, 32 MB L3 cache, and 65 W TDP, but with a lower base frequency of 3.5 GHz. The Ryzen 3 5300G comes with a 4-core design, 8 MB L3 cache, 65 W TDP, a base frequency of 4 GHz, and is equipped with 6CU scale core graphics (no information regarding turbo clocks for any of these SKUs yet). As mentioned, the current lineup for the AM4 platform includes 145 SKUs, with the Ryzen 5000 series alone already having 20 models. While AMD's dedication to supporting the AM4 platform is admirable, a simple question arises: who will buy or distinguish these new AM4 SKUs from such a vast offering?

AMD today released the latest version of AMD Software Adrenalin drivers for its Radeon RX graphics cards. Version 24.10.1 WHQL comes with optimization for "Unknown 9: Awakening" and "Call of Duty: Black Ops 6." AMD HYPR-Tune support has been expanded to include "Call of Duty: Black Ops 6," "7 Days to Die," and "Once Human." The drivers address intermittent performance drops when playing certain areas of "DayZ." It also corrects a game crash seen with "DOOM Eternal" with Metrics Overlay enabled.

DOWNLOAD: AMD Software Adrenalin 24.10.1 WHQL

During the Open Compute Project (OCP) Summit 2024, Meta, one of the prime members of the OCP project, showed its NVIDIA "Blackwell" GB200 systems for its massive data centers. We previously covered Microsoft's Azure server rack with GB200 GPUs featuring one-third of the rack space for computing and two-thirds for cooling. A few days later, Google showed off its smaller GB200 system, and today, Meta is showing off its GB200 system—the smallest of the bunch. To train a dense transformer large language model with 405B parameters and a context window of up to 128k tokens, like the Llama 3.1 405B, Meta must redesign its data center infrastructure to run a distributed training job on two 24,000 GPU clusters. That is 48,000 GPUs used for training a single AI model.

Called "Catalina," it is built on the NVIDIA Blackwell platform, emphasizing modularity and adaptability while incorporating the latest NVIDIA GB200 Grace Blackwell Superchip. To address the escalating power requirements of GPUs, Catalina introduces the Orv3, a high-power rack capable of delivering up to 140kW. The comprehensive liquid-cooled setup encompasses a power shelf supporting various components, including a compute tray, switch tray, the Orv3 HPR, Wedge 400 fabric switch with 12.8 Tbps switching capacity, management switch, battery backup, and a rack management controller. Interestingly, Meta also upgraded its "Grand Teton" system for internal usage, such as deep learning recommendation models (DLRMs) and content understanding with AMD Instinct MI300X. Those are used to inference internal models, and MI300X appears to provide the best performance per Dollar for inference. According to Meta, the computational demand stemming from AI will continue to increase exponentially, so more NVIDIA and AMD GPUs is needed, and we can't wait to see what the company builds.

AMD China has set up a press event to launch its new Ryzen 7 9800X3D "Zen 5" processor with 3D V-cache. The company is sending out invitations like the one pictured below to the Chinese tech press and select PC enthusiasts. The event is slated to take place in Zhuhai, and spans October 23 and 24, which could mean that the company has set up an experience zone, where visitors can take gaming desktops powered by the 9800X3D for a spin with popular game titles. It won't surprise us if AMD has at least an online press event planned around this time for the rest of the world.

The Ryzen 7 9800X3D is widely expected to extend AMD's lead with gaming performance. In first-party gaming benchmarks put out by Intel for its upcoming Core Ultra 9 285K "Arrow Lake" processor, the new chip is shown within 3% of the Core i9-14900K, which the current Ryzen 7 7800X3D beats, and the 9800X3D can only push the gaming performance envelope further from here. If it's not the higher IPC of "Zen 5," then it could be the alleged 5.20 GHz all-core boost frequency for the 9800X3D. The Ryzen 7 9800X3D is expected to go on sale in the first week of November 2024.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, is proud to announce the launch of X3D Turbo Mode, a revolutionary BIOS feature designed to maximize gaming performance on X870E, X870, and 600 series motherboards with AMD Ryzen 7000 X3D and Ryzen 9000 series processors.⁠

GIGABYTE X3D Turbo Mode is a cutting-edge BIOS feature that pushes the boundaries of gaming performance. Empirical testing demonstrates that this innovative BIOS feature delivers tangible benefits to gamers, with performance increases of up to 35% for incoming Ryzen 9000 X3D processors and an astounding 20% for Ryzen 9000 non-X3D processors. Moreover, X3D Turbo Mode's unique optimization parameters allow even Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency by GIGABYTE's BIOS wizardry-X3D Turbo Mode.

MSI is thrilled to announce the Unknown 9: Awakening Game Bundle promotion, running from October 18 to November 18, 2024. Participants can enroll while supplies last for a chance to receive a free game code for the PC standard edition of Unknown 9: Awakening - Standard Edition PC valued at USD $49.99 with the purchase of select eligible X870/X870E motherboards.

Delve into the mysterious world of the Unknown 9, and uncover mysteries hidden in plain sight. You are Haroona, a Quaestor born with the ability to venture into a mysterious dimension that overlaps our own, known only as the Fold. On her quest for powerful hidden knowledge, Haroona will learn to master her unique connection to the Fold, which allows her to channel its powers into our world... But such power does not go unnoticed and Haroona quickly becomes the target of the Ascendants, who want to use the Fold to alter the course of human history.

AMD Ryzen 7 5800X3D has hit end-of-life, according to a ComputerBase.de report. Introducing the new 3D V-cache technology, the 5800X3D breathed life back into the Socket AM4 platform as Intel debuted its 12th Gen Core "Alder Lake" processors, while there was still some time to go before AMD could mount up a defense with Ryzen 7000 "Zen 4." AMD figured out a way to augment the 32 MB on-die L3 cache with an additional 64 MB stacked cache that appears as a contiguous 96 MB addressable block to software. Having such a large fast cache next to the CPU cores greatly enhances performance in gaming workloads.

The 5800X3D was able to match the gaming performance of Intel's flagship Core i9-12900K despite being based on the generationally older "Zen 3" microarchitecture, and being restricted with older DDR4 memory. It would go on to be an incredible upgrade option for those still on the Socket AM4 platform, giving them performance in league with Intel's 12th- and 13th Gen processors. As of this writing, US retailer Newegg no longer has the 5800X3D in stock. Amazon has it, and so do some of the smaller retailers. Across the pond, the chip is vanishing from European retailers. In the absence of the 5800X3D, users still have the option of the Ryzen 7 5700X3D and the 6-core 5600X3D, which were both launched in the last year.

AVX-512 was proposed by Intel more than a decade ago—in 2013 to be precise. A decade later, the implementation of this instruction set on CPU cores remains wildly spotty—Intel implemented it first on an HPC accelerator, then its Xeon server processors, then its client processors, before realizing that hardware hasn't caught up with the technology to execute AVX-512 instructions in an energy-efficient manner, before deprecating it on the client. AMD implemented it just a couple of years ago with Zen 4 with a dual-pumped 256-bit FPU on 5 nm, before finally implementing a true 512-bit FPU on 4 nm. AVX-512 is a microcosm of what's wrong with the x86 ecosystem.

There are only two x86 CPU core vendors, the IP owner Intel, and its only surviving licensee capable of contemporary CPU cores, AMD. Any new additions to the ISA introduced by either of the two have to go through the grind of their duopolistic competition before software vendors could assume that there's a uniform install base to implement something new. x86 is a net-loser of this, and Arm is a net-winner. Arm Holdings makes no hardware of its own, except continuously developing the Arm machine architecture, and a first-party set of reference-design CPU cores that any licensee can implement. Arm's great march began with tiny embedded devices, before its explosion into client computing with smartphone SoCs. There are now Arm-based server processors, and the architecture is making inroads to the last market that x86 holds sway over—the PC. Apple's M-series processors compete with all segments of PC processors—right from the 7 W class, to the HEDT/workstation class. Qualcomm entered this space with its Snapdragon Elite family, and now Dell believes NVIDIA will take a swing at client processors in 2025. Then there's RISC-V. Intel finally did something it should have done two decades ago—set up a multi-brand Ecosystem Advisory Group. Here's what it is, and more importantly, what it's not.

Call of Duty: Black Ops 6 is fast approaching its October 25 launch date on the PC Microsoft Store, Battle.net and Steam. In partnership with Treyarch Studios, Call of Duty PC lead developer Beenox is developing a cutting-edge PC experience with 4K graphics and Ultrawide support plus a huge number of options across a variety of settings so players can dial in the best playing experience possible.

Get the Ultimate Performance Boost with AMD FSR 3.1
Some of the major features include:

• AMD FidelityFX Super Resolution
  • AMD FidelityFX Super Resolution 3 transforms your gaming experience with faster, more responsive framerates in Black Ops 6 using super resolution temporal upscaling and advanced frame generation.
• Advanced Frame Generation Technologies
  • The FSR Frame Generation toggle found in your graphics settings allows you to enable Frame Generation, which significantly increases your framerate and works seamlessly with other upscaling solutions.
• AMD FidelityFX Contrast Adaptive Sharpening (CAS)
  • An overhead sharpening slider can help bring more details to edges of weapons, players, and environments.

AMD FSR 3.1 is compatible with a wide range of graphics cards from AMD and other vendors, delivering exceptional upscaling image quality and massive performance boosts when gaming at 4K or 1440p.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

Micro Center, a leading national computer and electronic device retailer, has relaunched the online presence of its PowerSpec brand, a trusted name in high-performance desktop PCs. The newly redesigned PowerSpec.com offers an enhanced user experience tailored to meet the needs of gamers, professionals, and tech enthusiasts alike.

Since 1992, PowerSpec has been at the forefront of delivering powerful, adaptable, and upgradeable PCs backed by Micro Center's industry-leading customer service. The revamped website reflects PowerSpec's commitment to quality, innovation, and customer satisfaction by offering streamlined navigation, detailed product information, and easy access to essential drivers and support resources.

Intel Corp. (INTC) and AMD (NASDAQ: AMD) today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world's most widely used computing architecture. x86 is uniquely positioned to meet customers' emerging needs by delivering superior performance and seamless interoperability across hardware and software platforms. The group will focus on identifying new ways to expand the x86 ecosystem by enabling compatibility across platforms, simplifying software development, and providing developers with a platform to identify architectural needs and features to create innovative and scalable solutions for the future.

For over four decades, x86 has served as the bedrock of modern computing, establishing itself as the preferred architecture in data centers and PCs worldwide. In today's evolving landscape - characterized by dynamic AI workloads, custom chiplets, and advancements in 3D packaging and system architectures - the importance of a robust and expanding x86 ecosystem is more crucial than ever.

AMD is allegedly announcing its Ryzen 7 9800X3D processor on October 25, with availability in the first week of November 2024. This according to leaky taps among Chinese tech forums with a track record of getting such details right. We've been hearing about an October launch of the 9800X3D in late-September, which puts the announcement just a month after the 9800X3D's early launch first hit the radar. We've since seen a couple of performance or specs leaks, such as this one, which talks about a significant increase in clock speeds over past generations of X3D processors, this one which points to its Cinebench scores, and this one, which confirms a 5.20 GHz all-core boost frequency. Perhaps the biggest leak of them all, which is quasi-official, as it comes from a major PC hardware manufacturer, is this one, with some performance testing. When you cross-reference these numbers with Intel's first party gaming performance claims for its upcoming Core Ultra 9 285K "Arrow Lake-S" processor, you get the hint that AMD is set to win this round for gaming performance.