Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, announces the COLORFIRE B650M-MEOW WIFI motherboard that supports the latest AMD Ryzen 9000 Series processors. COLORFUL is excited to expand the beloved COLORFIRE MEOW Series which now includes a motherboard for the AMD Ryzen platform. The COLORFIRE B650M-MEOW WIFI motherboard adopts the design and colors of Bobi the orange tabby cat making it easy to color-match with the existing COLORFIRE MEOW Series components. The COLORFIRE B650 MEOW motherboard is perfect for AMD enthusiasts and cat-lovers alike!

The COLORFIRE B650M-MEOW WIFI motherboard features the new MEOW UI BIOS Design, exclusive to the MEOW Series motherboards. The custom MEOW BIOS has been redesigned for improved usability, reducing menu levels from three to two for a more intuitive experience. Related sub-items are now grouped within the same menu, minimizing page navigation.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Today, Lenovo announced the introduction of ThinkShield Firmware Assurance as part of its portfolio of enterprise-grade cybersecurity solutions. ThinkShield Firmware Assurance is one of the only computer OEM solutions to enable deep visibility and protection below the operating system (OS) by embracing Zero Trust Architecture (ZTA) component-level visibility to generate more accurate and actionable risk management insights.

As a security paradigm, ZTA explicitly identifies users and devices to grant appropriate levels of access so a business can operate with less risk and minimal friction. ZTA is a critical framework to reduce risk as organizations endeavor to complete Zero-Trust implementations.

Microsoft has announced its new Azure HBv5 virtual machines, featuring unique custom hardware made by AMD. CEO Satya Nadella made the announcement during Microsoft Ignite, introducing a custom-designed AMD processor solution that achieves remarkable performance metrics. The new HBv5 virtual machines deliver an extraordinary 6.9 TB/s of memory bandwidth, utilizing four specialized AMD processors equipped with HBM3 technology. This represents an eightfold improvement over existing cloud alternatives and a staggering 20-fold increase compared to previous Azure HBv3 configurations. Each HBv5 virtual machine boasts impressive specifications, including up to 352 AMD EPYC "Zen4" CPU cores capable of reaching 4 GHz peak frequencies. The system provides users with 400-450 GB of HBM3 RAM and features doubled Infinity Fabric bandwidth compared to any previous AMD EPYC server platform. Given that each VM had four CPUs, this yields 88 Zen 4 cores per CPU socket, with 9 GB of memory per core.

The architecture includes 800 Gb/s of NVIDIA Quantum-2 InfiniBand connectivity and 14 TB of local NVMe SSD storage. The development marks a strategic shift in addressing memory performance limitations, which Microsoft identifies as a critical bottleneck in HPC applications. This custom design particularly benefits sectors requiring intensive computational resources, including automotive design, aerospace simulation, weather modeling, and energy research. While the CPU appears custom-designed for Microsoft's needs, it bears similarities to previously rumored AMD processors, suggesting a possible connection to the speculated MI300C chip architecture. The system's design choices, including disabled SMT and single-tenant configuration, clearly focus on optimizing performance for specific HPC workloads. If readers can recall, Intel also made customized Xeons for AWS and their needs, which is normal in the hyperscaler space, given they drive most of the revenue.

While the current generation of AMD graphics cards employs RDNA 3 at its core, and the upcoming RX 8000 series will feature RDNA 4, the latest leaks suggest RDNA 5 is not in development. Instead, UDNA will succeed RDNA 4, simplifying AMD's GPU roadmap. A credible source on the Chiphell forums, zhangzhonghao, reports that the UDNA-based RX 9000 series and Instinct MI400 AI accelerator will incorporate the same advanced Arithmetic Logic Unit (ALU) designs in both products, reminiscent of AMD's earlier GCN architectures before the CDNA and RDNA split. Sony's next-generation PlayStation 6 is also rumored to adopt UDNA technology. The PS5 and PS5 Pro currently utilize RDNA 2, while the Pro variant integrates elements of RDNA 4 for enhanced ray tracing. The PS6's CPU configuration remains unclear, but speculation revolves around Zen 4 or Zen 5 architectures.

The first UDNA gaming GPUs are expected to enter production by Q2 2026. Interestingly, AMD's RDNA 4 GPUs are anticipated to focus on entry-level to mid-range markets, potentially leaving high-end offerings until the UDNA generation. This strategic pause may allow AMD to refine AI-accelerated technologies like FidelityFX Super Resolution (FSR) 4, aiming to compete with NVIDIA's DLSS. This unification is inspired by NVIDIA's CUDA ecosystem, which supports cross-platform compatibility from laptops to high-performance servers. As AMD sees it, the decision addresses the challenges posed by maintaining separate architectures, which complicate memory subsystem optimizations and hinder forward and backward compatibility. Putting developer resources into RDNA 5 is not economically or strategically wise, given that UDNA is about to take over. Additionally, the company is enabling ROCm software support across all products ranging from consumer Radeon to enterprise Instinct MI. Accelerating software for one platform will translate to the entire product stack.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive Lineup for AI and HPC Success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that are powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

MSI, a leading global provider of high-performance server solutions, is excited to unveil its latest AMD EPYC 9005 Series CPU-based server boards and platforms at SC24 (SuperComputing 2024), Booth #3655, from November 19-21. Built on the OCP Modular Hardware System (DC-MHS) architecture, these new platforms deliver high-density, AI-ready solutions, including multi-node, enterprise, CXL memory expansion, and GPU servers, designed to meet the intensive demands of modern data centers.

"As AI continues to reshape the landscape of data center infrastructure, MSI's servers, powered by the AMD EPYC 9005 Series processors, offer unmatched density, energy efficiency, and cost optimization—making them ideal for modern data centers," said Danny Hsu, General Manager of Enterprise Platform Solutions. "Our servers optimize thermal management and performance for virtualized and containerized environments, positioning MSI at the forefront of AI and cloud-based workloads."

The 64th edition of the TOP500 reveals that El Capitan has achieved the top spot and is officially the third system to reach exascale computing after Frontier and Aurora. Both systems have since moved down to No. 2 and No. 3 spots, respectively. Additionally, new systems have found their way onto the Top 10.

The new El Capitan system at the Lawrence Livermore National Laboratory in California, U.S.A., has debuted as the most powerful system on the list with an HPL score of 1.742 EFlop/s. It has 11,039,616 combined CPU and GPU cores and is based on AMD 4th generation EPYC processors with 24 cores at 1.8 GHz and AMD Instinct MI300A accelerators. El Capitan relies on a Cray Slingshot 11 network for data transfer and achieves an energy efficiency of 58.89 GigaFLOPS/watt. This power efficiency rating helped El Capitan achieve No. 18 on the GREEN500 list as well.

ASRock Rack Inc., a leading innovative server company, today announces its presence at SC24, held at the Georgia World Congress Center in Atlanta from November 18-21. At booth #3609, ASRock Rack will showcase a comprehensive high-performance portfolio of server boards, systems, and rack solutions with NVIDIA accelerated computing platforms, helping address the needs of enterprises, organizations, and data centers.

Artificial intelligence (AI) and high-performance computing (HPC) continue to reshape technology. ASRock Rack is presenting a complete suite of solutions spanning edge, on-premise, and cloud environments, engineered to meet the demand of AI and HPC. The 2U short-depth MECAI, incorporating the NVIDIA GH200 Grace Hopper Superchip, is developed to supercharge accelerated computing and generative AI in space-constrained environments. The 4U10G-TURIN2 and 4UXGM-GNR2, supporting ten and eight NVIDIA H200 NVL PCIe GPUs respectively, are aiming to help enterprises and researchers tackle every AI and HPC challenge with enhanced performance and greater energy efficiency. NVIDIA H200 NVL is ideal for lower-power, air-cooled enterprise rack designs that require flexible configurations, delivering acceleration for AI and HPC workloads regardless of size.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

Today, AMD showcased its ongoing high performance computing (HPC) leadership at Supercomputing 2024 by powering the world's fastest supercomputer for the sixth straight Top 500 list.

The El Capitan supercomputer, housed at Lawrence Livermore National Laboratory (LLNL), powered by AMD Instinct MI300A APUs and built by Hewlett Packard Enterprise (HPE), is now the fastest supercomputer in the world with a High-Performance Linpack (HPL) score of 1.742 exaflops based on the latest Top 500 list. Both El Capitan and the Frontier system at Oak Ridge National Lab claimed numbers 18 and 22, respectively, on the Green 500 list, showcasing the impressive capabilities of the AMD EPYC processors and AMD Instinct GPUs to drive leadership performance and energy efficiency for HPC workloads.

IBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients. This collaboration will also enable support for AMD Instinct MI300X accelerators within IBM's watsonx AI and data platform, as well as Red Hat Enterprise Linux AI inferencing support.

"As enterprises continue adopting larger AI models and datasets, it is critical that the accelerators within the system can process compute-intensive workloads with high performance and flexibility to scale," said Philip Guido, executive vice president and chief commercial officer, AMD. "AMD Instinct accelerators combined with AMD ROCm software offer wide support including IBM watsonx AI, Red Hat Enterprise Linux AI and Red Hat OpenShift AI platforms to build leading frameworks using these powerful open ecosystem tools. Our collaboration with IBM Cloud will aim to allow customers to execute and scale Gen AI inferencing without hindering cost, performance or efficiency."

AMD has claimed the top ten spots in Amazon's best-selling and most wished-for category with its Ryzen processors. The success of AMD's CPUs can be attributed to the competitive pricing, top-tier performance, and overall features provided by Team Red. In its best-sellers category, Amazon lists the following CPUs: AMD Ryzen 7 5700X, Ryzen 5 5600X, Ryzen 7 7800X3D, Ryzen 5 7600X, Ryzen 7 9800X3D, Ryzen 9 5900X, Ryzen 7 5700X3D, Ryzen 7 7700X, Ryzen 7 5800X, Ryzen 5 7600, and Ryzen 5 5500. The first Intel CPU to appear in the list, at the time of writing, is the Intel Core i5-13600KF CPU, sitting in the spot number 12 in the best-selling department.

Another interesting list to look at is the most wished-for, where Amazon shoppers put CPUs on their wishlist and wait for a purchase. The number one most wished-for CPU is the AMD Ryzen 7 9800X3D with 3D V-Cache. The eight spots are occupied by: AMD Ryzen 7 7800X3D, Ryzen 7 5700X3D, Ryzen 9 5900X, Ryzen 7 5800X, Ryzen 7 7700X, Ryzen 5 7600X, Ryzen 9 9900X, and Ryzen 5 5600X. Intel Core i9-14900K CPU currently occupies the number ten spot. This truly shows the enthusiasm of Amazon shoppers towards AMD's CPU offerings and the company's current mindshare. With an increasing market share, AMD is challenging Intel in the CPU department, providing great competition to tech enthusiasts.

LG Electronics (LG) is unveiling its latest, premium UltraGear OLED gaming monitor GX7 (model 27GX790A). Designed for serious gamers, the new model features a 27-inch, QHD resolution (2,560 x 1,440) WOLED display with a 0.03milliseconds Gray-to-Gray (GTG) response time and a 480 Hz refresh rate - the fastest of any QHD OLED monitor. The 27GX790A, the most compact UltraGear OLED display yet, delivers enhanced gaming immersion with exceptional picture quality, silky-smooth performance and 4-side virtually borderless design. It also works seamlessly with the newest graphics cards, thanks to an array of advanced connectivity options, including DisplayPort 2.1.

The all-new 27GX790A is equipped with LG's WOLED display technology, which employs a white OLED light source with color filters to produce accurate RGB colors and impressive screen brightness. This technology provides a high contrast ratio, vibrant colors, deep blacks and excellent motion clarity - even during the most fast-paced gaming action - LG's WOLED tech has earned the new UltraGear OLED gaming monitor both VESA DisplayHDR True Black 400 certification and highest VESA ClearMR tier.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today launched the cutting-edge GIGABYTE AMD Radeon PRO W7800 AI TOP 48G. GIGABYTE has taken a significant leap forward with the release of the Radeon PRO W7800 AI TOP 48G graphics card, featuring AMD's RDNA 3 architecture and a massive 48 GB of GDDR6 memory. This significant increase in memory capacity, compared to its predecessor, provides workstation professionals, creators, and AI developers with incredible computational power to effortlessly handle complex design, rendering, and AI model training tasks.

⁠GIGABYTE stands as the AMD professional graphics partner in the market, with a proven ability to design and manufacture the entire Radeon PRO series. Our dedication to quality products, unwavering business commitment, and comprehensive customer service empower us to deliver professional-grade GPU solutions, expanding user's choices in workstation and AI computing.⁠

AMD has published a blog post about its latest AMD Ryzen AI 300 series processors, claiming they are changing the game for portable devices. To back these claims, Team Red has compared its Ryzen AI 9 HX 370 processor to Intel's latest Core Ultra 7 258V, using the following games: Assassin's Creed Mirage, Baldur's Gate 3, Borderlands 3, Call of Duty: Black Ops 6, Cyberpunk 2077, Doom Eternal, Dying Light 2 Stay Human, F1 24, Far Cry 6, Forza Horizon 5, Ghost of Tsushima, Hitman 3, Hogwarts Legacy, Shadow of the Tomb Raider, Spider-Man Remastered, and Tiny Tina's Wonderlands. The conclusion was that AMD's Ryzen AI 9 HX 370, with its integrated Radeon 890M graphics powerhouse, outperformed the Intel "Lunar Lake" Core Ultra 7 258V with Intel Arc Graphics 140V by 75% on average.

To support this performance leap, AMD also relies on software technologies, including FidelityFX Super Resolution 3 (FSR 3) and HYPR-RX, to unlock additional power and gaming efficiency. FSR 3 alone enhances visuals in over 95 games, while HYPR-RX, with features like AMD Fluid Motion Frames 2 (AFMF 2) and Radeon Anti-Lag, provides substantial performance boosts across thousands of games. The company has also compared its FSR/HYPR-RS combination with Intel's XeSS, which is available in around 130 games. AMD claims its broader suite supports 415+ games and is optimized for smoother gameplay. The AFMF 2 claims support with thousands of titles, while Intel's GPU software stack lacks a comparison point. Of course, these marketing claims are to be taken with a grain of salt, so independent testing is always the best to compare the two.

With over 250 million devices sold globally, Amazon expands its Fire TV lineup with a brand-new Omni Mini-LED Series and refreshed 4-Series—plus, the new Soundbar Plus Series.

Since launching Fire TV 10 years ago, we've been on a mission to make TVs more intelligent, accessible, and connected. Our approach is unique: We put content—not apps—at the center of the experience, and make it incredibly easy to find something to watch, including with just your voice. What started with the first Fire TV device in 2014 has evolved into a versatile lineup of devices, from Cubes and Sticks to smart TVs made by some of the world's strongest TV brands including Panasonic, Hisense, Toshiba, and TCL. And it's no understatement to say customers love Fire TV—customers around the world have purchased well over 250 million Fire TV devices.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive line-up for AI and HPC success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

According to CRN, AMD is looking to make some cuts to its workforce of approximately 26,000 employees. The company hasn't announced a specific number, but in a comment to the publication AMD said that "as a part of aligning our resources with our largest growth opportunities, we are taking a number of targeted steps that will unfortunately result in reducing our global workforce by approximately 4 percent". In actual headcount numbers that should be just north of a thousand people that the company will let go. It's not clear which departments or divisions at AMD will be affected the most, but the cutback appears to be a response to AMD's mixed quarterly report.

AMD's statement also doesn't make it clear on exactly what the company will be putting its focus on moving forward, but CRN seems to suggest that the embedded and gaming business is where AMD is struggling. That said, it's not likely that AMD will put an increased focus on those businesses, but instead the company is more likely to invest more into its server products, least not to try and catch up with NVIDIA in the AI server market. According to CRN, AMD has also seen a strong demand in AI PCs, such as the Ryzen AI 300-series of mobile SoCs, so it's possible AMD will put an extra effort into is mobile product range. The Ryzen 9000-series is thankfully also doing well, so it's unlikely there will be any big cutbacks here. We already know that AMD is not going after NVIDIA with a new flagship GPU to compete with NVIDIA's GeForce RTX 5000-series flagship SKU, so it's possible that the company will cut back on some people in its consumer GPU team for the time being, but this should become clear come CES in January.

AMD on Tuesday released its flagship FPGA series, and possibly its most important product launch after the company's Xilinx acquisition, the Versal Premium Series Gen 2 SoC. It's hard to call this an FPGA, much in the same way as it's hard to call a modern processor "a CPU," there are many integrated devices, platform interfaces, and application-specific accelerators, and much in the same way, the Versal Premium Series Gen 2 is marketed as an "adaptive SoC," rather than a really powerful FPGA. Speaking of I/O, this is AMD's first product to implement PCI-Express Gen 6 and CXL 3.1.

There's no host platform that currently support these standards—neither EPYC "Turin" nor Xeon 6 "Granite Rapids," but it goes to show that the chip is future-ready and can put the new I/O standards to use. The chip is designed to be implemented as a standalone SoC, and so it supports both DDR5 RDIMMs and LPDDR5X, giving end-users the flexibility to go with the two vastly different memory standards depending on what their application is. These capabilities make the Versal Premium Series Gen 2 well-suited for demanding applications in sectors like data centers, communications, test and measurement, aerospace, and defense, where high-speed data processing is critical.

With the latest industry boom in AI, the demand for more compute power is greater than ever, and the recent industry forecast predicts that the global GPU market will exceed $98.5 billion in value by the year 2024. This staggering projection, outlined in the 2024 supply-side GPU market summary report by Jon Peddie Research (JPR), shows how far the GPU market has come. Once primarily associated with powering consumer gaming rigs with AMD or NVIDIA inside, GPUs have become a key part of our modern tech stack, worth almost $100 billion in 2024 alone. Nowadays, GPUs are found in many products, from smartphones and vehicles to internet-connected devices and data centers.

"Graphics processor units (GPUs) have become ubiquitous and can be found in almost every industrial, scientific, commercial, and consumer product made today," said Dr. Jon Peddie, founder of JPR. "Some market segments, like AI, have grabbed headlines because of their rapid growth and high average selling price (ASP), but they are low-volume compared to other market segments." The report also shows the wide range of companies that are actively participating in the GPU marketplace, including industry giants like AMD, NVIDIA, and Intel, as well as smaller players from China like Loongson Zhongke, Siroyw, and Lingjiu Micro. Besides the discrete GPU solutions, the GPU IP market is very competitive, and millions of chips are shipped with GPU IP every year. Some revenue estimates of Chinese companies are not public, but JPR is measuring it from the supply chain side, so these estimates are pretty plausible.

NEC Corporation (NEC; TSE: 6701) has received an order for a next-generation supercomputer system from Japan's National Institutes for Quantum Science and Technology (QST), under the National Research and Development Agency, and the National Institute for Fusion Science (NIFS), part of the National Institutes of Natural Sciences under the Inter-University Research Institute Corporation. The new supercomputer system is scheduled to be operational from July 2025. The next-generation supercomputer system will feature multi-architecture with the latest CPUs and GPUs and will consist of large storage capacity and a high-speed network. This system is expected to be used for various research and development in the field of fusion science research.

Specifically, the system will be used for precise prediction of experiments and creation of operation scenarios in the ITER project, which is being promoted as an international project, and the Satellite Tokamak (JT-60SA) project, which is being promoted as a Broader Approach activity, and for design of DEMO reactors. The DEMO project promotes large-scale numerical calculations for DEMO design and R&D to accelerate the realization of a DEMO reactor that contributes to carbon neutrality. In addition, NIFS will conduct numerical simulation research using the supercomputer for multi-scale and multi-physics systems, including fusion plasmas, to broadly accelerate research on the science and applications of fusion plasmas, and as an Inter-University Research Institute, will provide universities and research institutes nationwide with opportunities for collaborative research using the state-of-the-art supercomputer.

TinyGrad, the company behind the popular TinyBox system, is aiming to commoditize the PetaFLOP. Its latest powerhouse, the TinyBox Pro, is on display on X. This high-performance system boasts an impressive 1.36 PetaFLOPS of FP16 computing power and is based on commercial GPU. The TinyBox Pro configuration features eight NVIDIA RTX 4090 GPUs, surpassing its predecessors with a combined GPU RAM of 192 GB and a memory bandwidth of 8,064 GB/s. This substantial upgrade is complemented by dual AMD Genoa processors and 384 GB of system RAM, delivering a memory bandwidth of 921.6 GB/s. What sets the TinyBox Pro apart is its enterprise-grade architecture. The system utilizes four 2000 W power supplies requiring 200 V+ input, housed in a 4U form factor that spans 31 inches in depth. Despite its compact size, weighing 88 pounds, the unit comes equipped with Supermicro rails for seamless rack integration.

Connectivity options are equally impressive, featuring two open PCIe 5.0 x16 slots that provide extensive expansion capabilities. Storage is managed through a 1 TB boot drive, though this might seem conservative compared to some competitors' offerings. The system runs on Ubuntu 22.04 and is noted for its superior driver quality (compared to commercial AMD GPUs), addressing a common pain point in high-performance computing on commercial hardware. On social media, TinyGrad was very vocal about its fight with the AMD Radeon GPU drivers. However, potential buyers should be prepared for significant noise levels during operation, a trade-off for the remarkable computing power packed into the 4U chassis. With a pre-order price tag of $40,000, the TinyBox Pro positions itself as a serious contender in the professional AI computing market, where regular GPU boxes can cost 100s of thousands of US Dollars. This pricing reflects its enterprise-grade specifications and positions it as an accessible alternative to larger, more expensive computing clusters.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the Hyper 411 Nano, the company's latest iteration of their esteemed Hyper series of CPU air coolers. The Hyper 411 Nano brings a selection of all-new, cutting-edge features to the table, adding on to the already excellent performance of the Hyper series.

Features

• Direct contact technology: Four heat pipes directly connect to the cooling mechanism to ensure efficient, rapid heat transfer.
• All-black aesthetic: A novel all-black look gives the Hyper 411 Nano a modern, sleek feel.
• AMD and Intel compatibility: Specially designed mounting ensures compatibility with all the latest AMD and Intel CPUs.
• Easy fan installation: Included clips makes installing the fan easy.