AMD on Friday released an off-branch Preview driver that should interest those playing Warhammer 40K: Space Marine 2 this weekend. The Adrenalin 24.10.37.10 Preview Driver fixes intermittent driver timeout bugs facing the game during gameplay. The drivers also fix overly dark shadows or desaturated colors in "Black Myth: Wukong" when the Global Illumination setting is medium or higher. But these aren't the main payload of this driver release, it has to do with extending AMD Anti Lag 2 Vulkan API support for Counter-Strike 2. The technology works to reduce whole-system latency during gameplay, which should improve your responsiveness in online multiplayer gameplay.

DOWNLOAD: AMD Software Adrenalin 24.10.37.10 Preview Drivers

With German retailer Mindfactory.de listing the Ryzen 5 7600X3D, European hardware reviewers are beginning to put the chip through its paces on their Socket AM5 test beds still warm from last month's Ryzen 9000 "Zen 5" launch coverage. PCGH is among the first such reviewers, and has an interesting set of findings. The biggest question everyone is looking to be answered is "how does it game?" and here PCGH has some good news. The processor is very fast at gaming, and in fact beats the 8-core Ryzen 7 9700X "Zen 5" chip in gaming benchmarks, ending up 6% faster than when averaged across the games in PCGH's test suite. It's also about 9% slower than the Ryzen 7 7800X3D, which remains the reigning champion.

Being faster than the 9700X also means that the Ryzen 5 7600X3D is faster than every other Ryzen 9000 series processor launched till date, including the flagship Ryzen 9 9950X. The 7600X3D is a whopping 11% faster than the 9950X at gaming. When compared to Intel contemporaries, the 7600X3D ends up about 1% slower than the Core i5-13600K, and 2% slower than the newer i5-14600K. These were the two chips the 7600X3D was sent to beat at gaming, so crowds are drawn to the Ryzen 5 series, and the chip ends up falling a touch short. A lot will depend on whether AMD gives the 7600X3D a wider launch, and what its street price ends up being. Find the complete PCGH review of the Ryzen 5 7600X3D in the source link below.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

AMD Ryzen 5 7600X3D Socket AM5 desktop processor isn't a MicroCenter USA-exclusive anymore, with the chip now being available across the pond in Germany. Major German retailer Mindfactory.de has the processor listed at €329 (including taxes). This puts its pricing €60 less than that of the popular Ryzen 7 7800X3D (going for €390 on the site). Unlike the MicroCenter deal, the Mindfactory listing is standalone—you get the processor in a retail PIB package, and not part of a bundle. To sweeten things, you also get an AMD-branded T-shirt.

The 6-core/12-thead processor is based on the older "Zen 4" microarchitecture, but supercharged with 3D V-cache technology, which gives it 96 MB of last-level cache that is known to have a significant impact on gaming performance. The 7600X3D comes with a 4.10 GHz base frequency, and 4.70 GHz maximum turbo frequency. The retail PIB box resembles that of the 7800X3D, but with the Ryzen 5 brand extension. There's no cooling solution included in the box, but the cooling requirements of this processor aren't steep, with its TDP being rated at just 65 W.

OpenSIL is an open-source CPU initialization framework project that seeks to replace on-chip initialization microcode, such as AGESA, across both client- and server processors. AMD looks to implement OpenSIL as it makes its AMD EPYC processors more friendly to large customers that want to take control of this aspect of the processor. Since its open-sourcing in June 2023, AMD has come up with reference motherboards implementing OpenSIL, as well as modifying a Supermicro server motherboard to the architecture, to demo at conferences. AMD firmware engineer Paul Grimes presented the company's progress with implementing OpenSIL, at the OSFC conference, in Germany. It's been known that AMD is targeting a 2025-26 timeline for OpenSIL to hit product, but AMD put out specifics, such as its next-generation "Venice" server processor supporting OpenSIL.

"Venice" is codename for an AMD EPYC server processor generation succeeding "Turin." It is built on the future "Zen 6" microarchitecture, and AMD could at least unveil the processor some time in 2025, if not mass-produce it. late-2024 thru 2025 could see the company ramp up "Turin" and other server processors implementing "Zen 5." That's not all, AMD plans to being OpenSIL even to client processors, with the generation of Ryzen processors based on "Zen 6." This will see the AGESA microcode replaced by a first-party firmware from AMD based on OpenSIL, which PC OEMs will be able to customize. The biggest impact of this change will be felt in the commercial notebook and commercial desktop segments, where large organizations can take greater control over the chip initialization firmware.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Lenovo, a global leader in technology innovation, announced its latest advancements at Lenovo Innovation World 2024, unveiling a series of AI PC devices, including ThinkPad, ThinkBook, Yoga, and IdeaPad laptops, designed to transform both enterprise and consumer user experiences.

AI PC Era
AI PCs are set to revolutionize computing as their relevance grows, with 60% of PCs shipped by 2027 anticipated to be AI-capable. Lenovo's AI PCs are at the forefront of this transformation, leveraging natural interactions, personalized large language models, and advanced computing architectures. These innovations make computing more personal by tailoring experiences to individual users, more productive by enhancing workflow efficiency, and more protected by integrating robust security features into AI-driven systems.

Taipei, Taiwan－September 5th, 2024－Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to announce that a total of 71 cooling products are fully compatible with the latest Intel Arrow Lake-S and AMD Ryzen 9000 series processors. The upcoming Intel 15th Gen CPUs feature the new LGA 1851 socket and retain compatibility with the LGA 1700 socket.

Meanwhile, the AMD Ryzen 9000 series is continually designed with the AM5 socket. This indicates that users can seamlessly upgrade to the brand-new Intel and AMD CPUs while pairing up with the existing Thermaltake coolers. Regardless of air coolers, all-in-one liquid coolers, or water blocks, Thermaltake offers a wide range of superior cooling solutions to these next-gen processors.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new flagship GIGABYTE G593 series servers supporting direct liquid cooling (DLC) technology to advance green data centers using NVIDIA HGX H200 GPU. As DLC technology is becoming a necessity for many data centers, GIGABYTE continues to increase its product portfolio with new DLC solutions for GPU and CPU technologies, and for these new G593 servers the cold plates are made by CoolIT Systems.

G593 Series - Tailored Cooling
The GPU-centric G593 series is custom engineered to house an 8-GPU baseboard, and its design had foresight for both air and liquid cooling. The compact 5U chassis leads the industry in its readily scalable nature, fitting up to sixty-four GPUs in a single rack and supporting 100kW of IT hardware. This helps to consolidate the IT hardware, and in turn, decrease the data center footprint. The G593 series servers for DLC are in response to the rising customer demand for greater energy efficiency. Liquids have a higher thermal conductivity than air, so they can rapidly and effectively remove heat from hot components to maintain lower operating temperatures. And by relying on water and heat exchangers, the overall energy consumption of the data center is reduced.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

Acer today expanded its Copilot+ PC lineup with the new Swift Go 14 AI and Swift 14 AI laptops, delivering versatile performance and elevated productivity with incredible battery life.

The Swift Go 14 AI features the latest Snapdragon X Plus 8-core processor in an ultra-portable design. Acer also announced the Swift 14 AI featuring the new AMD Ryzen AI 300 Series processors which leverage the advanced AMD XDNA 2 architecture to utilize greater AI processing power and performance without compromise. Whether creating, working, or streaming on-the-go, these Copilot+ PCs streamline daily tasks and workloads more efficiently and enable Acer's on-device AI applications to help elevate users' digital experiences.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.

Acer today announced the expansion of its Predator gaming monitor line with two new 27-inch models that promise to deliver exceptional speed and stunning visuals for enjoying the latest titles in their full glory. Both monitors bring cutting-edge technology and innovation to the forefront, catering to the needs of gamers who demand only the best performance.

Equipped with a WQHD, 360 Hz panel, and the new NVIDIA G-SYNC Pulsar technology, the Predator XB273U F5 is a gaming powerhouse and is certain to awe even the most demanding players with smooth and dynamic frames. The Predator XB273K V5 comes with a 4K UHD resolution display with 160 Hz refresh rate, and AMD FreeSync Premium technology to showcase crisp details and motion for enjoying games in stunning clarity. With Dynamic Frequency and Resolution (DFR) technology, users can opt to switch to FHD resolution at 320 Hz to tailor the gaming experience based on their preference.

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable. Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.

"MSI not only brings the industry's most comprehensive AI+ PC lineup but also introduces multiple new laptops and handheld devices designed for gamers worldwide," said Eric Kuo, MSI's Executive Vice President and General Manager of NB Business Unit. "We welcome global guests to visit the MSI booth to experience next-gen AI computing and exciting gaming products."

A PC enthusiast in Romania bagged a good deal on a used AMD Ryzen 7 7800X3D processor they found on OLX, an P2P and B2B online marketplace. Only, this wasn't a 7800X3D. In fact, it wasn't even a processor—a complete paperweight. While you can't return stuff you found on OLX, for deals executed through the platform, there are fraud protection measures that can withhold funds to the seller. Unfortunately, as most P2P deals on platforms such as OLX or even eBay, the buyer and seller tend to negotiate a lower price to cut out the platform costs, and transact privately. This is how the enthusiast ended up with the dud. Der8auer discovered this, and offered to buy the processor from him.

Der8auer installed the processor and turned on the machine, and of course it wouldn't POST. So this isn't a case of a cheaper (but functional) processor being mislabeled and sold at a higher price. Der8auer then proceeded to de-lid the processor (remove its integrated heat spreader) to discover that it's a complete fake. There's not a shred of silicon under it. The IHS is designed to mimic the shape of the cIOD and CCD. Der8auer provided some quick tips on how to spot a fake: start with the substrate's solder-mask color—it should be green. The SMDs should have a thin sealant, which protect them in machines with extreme cooling solutions that can have condensation. The substrate itself is thin (under 1 mm), whereas the real chip has about 1.3 mm in substrate thickness. Lastly, look for font and alignment errors on the chip label, on the IHS itself. Be careful when looking for 7800X3D processors in the P2P market, ensure you either have a platform that can refund you, or use a mode of payment that can (such as Paypal). Find Der8auer's video in the source link below.

Motherboard manufacturers are beginning to roll out UEFI firmware updates that not just patch the Sinkclose critical vulnerability, but enable an experimental "105 W TDP mode" option as part of the processor's custom BIOS settings (CBS). The mode elevates the power limits of the Ryzen 5 9600X and Ryzen 7 9700X "Zen 5" desktop processors, with up to 13%" performance gains being reported by the motherboard vendors themselves. By default, your motherboard will run these processors at their original 65 W TDP, and you're supposed to manually enable the setting in the UEFI firmware setup program. It could either be found in the overclocking/tuning page, or the AMD CBS section.

To remove the last bit of hesitation among users go turn this setting on, AMD is working to extend its processor warranty to cover the 105 W TDP mode, reports Wccftech editor Hassan Mujtaba. Currently, the setting is being shipped with AM5 AGESA version 1.2.0.1, which includes the Sinkclose vulnerability patch, but will "officially" release it with AM5 AGESA 1.2.0.2, along with warranty coverage. Mujtaba reports that firmware updated with AGESA 1.2.0.2 are expected to begin rolling out in late-September.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.

We've known for the past couple of weeks that AMD is working on the Ryzen 5 7600X3D—a 6-core/12-thread processor based on the older "Zen 4" microarchitecture, but featuring 3D V-cache that enables significant gaming performance uplifts. The company finally launched the chip, but here's the bummer—it's only available in the US, and is a MicroCenter exclusive, where's it's going for $299.99. Here's the second bummer—you can't buy the processor on its own, but in a 3-part bundle that includes it, an ASUS TUF Gaming B650-Plus Wi-Fi motherboard, and an unspecified brand of 32 GB (2x 16 GB) DDR5-6000 memory kit. When you add up the prices of the three parts when purchased separately, you arrive at $630, but MicroCenter is selling the bundle for an impressive $450—a $180 discount.

The AMD Ryzen 5 7600X3D comes with a maximum boost frequency of 4.70 GHz, which is a steep 600 MHz fall from that of the regular Ryzen 5 7600X, and 400 MHz less than that of the 65 W Ryzen 5 7600 (non-X). Much like the 7600, the 7600X3D comes with a 65 W TDP. Where it loses on clock speeds, it makes up for with its large cache—1 MB of L2 cache per core, and 96 MB of L3 cache (or 102 MB of L2+L3 "total cache."). The bundle could offer good value for those building PCs from scratch, or coming in from the older Socket AM4 platform. The TUF Gaming B650-Plus Wi-Fi is a fairly feature-packed mid-range ATX motherboard.

AMD has released its latest version of AMD Software Adrenalin drivers, version 24.8.1 WHQL. The latest drivers update adds game optimizations for Call of Duty: Black Ops 6 Open Beta, Concord, FINAL FANTASY XVI, and Star Wars Outlaws, as well as expands HYPR-Tune support. It also adds Anti-Lag 2 support for Ghost of Tsushima DIRECTOR'S CUT and adds support and optimizations for Amuse 2.1 with FLUX.1 model on select Radeon, Radeon PRO and Ryzen AI series products.

AMD also fixed several issues seen with previous drivers, including intermittent application crash or driver timeout in Black Myth: Wukong, Kunitsu-Gami: Path of the Goddess on some Radeon RX 6600 and 6700 series GPUs, and Pacific Drive or KINGDOM HEARTS -HD 1.5+2.5 ReMIX-. It also fixes artifacts in games like Marvel's Spider-Man: Miles Morales or Rust, improves "Optimizing Shaders" time when launching Forza Motorsport, and fixes issues with Anti-Aliasing and Anisotropic Filtering settings for some OpenGL applications. There are also several known issues, and AMD also issued an important note that it is working with the developers of Star Wars Outlaws to address an intermittent corruption issue that occurs after changing certain in-game graphics settings, which can now be resolved by relaunching the game.

DOWNLOAD: AMD Software Adrenalin 24.8.1 WHQL

This could very well be what the elusive new PlayStation 5 console looks like. DeaLabs illustrated its design as part of its article compiling all rumored tech specs of the console. The console's body retains the essential design of the digital-only variant of PlayStation 5, and its refresh. The disc variant of PlayStation 5 has a crease accent running along its side panels, toward the top one-quarter. The PS5 Pro possibly has more crease accents in its place, possibly even serving as a set of air vents. This is only a 2-color illustration, which means the console could have a unique body color scheme, too.

The PlayStation 5 Pro is being designed for a nearly 2-3 times performance uplift over the original PlayStation 5, and its 6 nm mid-lifecycle refresh. AMD remains the SoC supplier for the PS5 Pro, and its chip is codenamed "Viola." This chip could be built on a more advanced foundry node than even the 6 nm "Oberon Plus" powering the PS5 (refresh). It is a semi-custom chip in the true sense, as it has a unique mix of AMD IP blocks from several generations.

The MLCommons consortium on Wednesday posted MLPerf Inference v4.1 benchmark results for popular AI inferencing accelerators available in the market, across brands that include NVIDIA, AMD, and Intel. AMD's Instinct MI300X accelerators emerged competitive to NVIDIA's "Hopper" H100 series AI GPUs. AMD also used the opportunity to showcase the kind of AI inferencing performance uplifts customers can expect from its next-generation EPYC "Turin" server processors powering these MI300X machines. "Turin" features "Zen 5" CPU cores, sporting a 512-bit FPU datapath, and improved performance in AI-relevant 512-bit SIMD instruction-sets, such as AVX-512, and VNNI. The MI300X, on the other hand, banks on the strengths of its memory sub-system, FP8 data format support, and efficient KV cache management.

The MLPerf Inference v4.1 benchmark focused on the 70 billion-parameter LLaMA2-70B model. AMD's submissions included machines featuring the Instinct MI300X, powered by the current EPYC "Genoa" (Zen 4), and next-gen EPYC "Turin" (Zen 5). The GPUs are backed by AMD's ROCm open-source software stack. The benchmark evaluated inference performance using 24,576 Q&A samples from the OpenORCA dataset, with each sample containing up to 1024 input and output tokens. Two scenarios were assessed: the offline scenario, focusing on batch processing to maximize throughput in tokens per second, and the server scenario, which simulates real-time queries with strict latency limits (TTFT ≤ 2 seconds, TPOT ≤ 200 ms). This lets you see the chip's mettle in both high-throughput and low-latency queries.

AMD's next generation RDNA 4 graphics architecture will see the company focus on the performance segment of the market. The company is rumored to not be making a successor to the enthusiast-segment "Navi 21" and "Navi 31" chips based on RDNA 4, and will instead focus on improving performance and efficiency in the most high-volume segments, just like the original RDNA-powered generation, the Radeon RX 5000 series. There are two chips in the new RDNA 4 generation that have hit the rumor mill, the "Navi 48" and the "Navi 44." The "Navi 48" is the faster of the two, powering the top SKUs in this generation, while the "Navi 44" is expected to be the mid-tier chip.

According to Kepler_L2, a reliable source with GPU leaks, and VideoCardz, which connected the tweet to the RDNA 4 generation, the top "Navi 48" silicon is expected to feature a 256-bit wide GDDR6 memory interface—so there's no upgrade to GDDR7. The top SKU based on this chip, the "Navi 48 XTX," will feature a memory speed of 20 Gbps, for 640 GB/s of memory bandwidth. The next-best SKU, codenamed "Navi 48 XT," will feature a slightly lower 18 Gbps memory speed at the same bus-width, for 576 GB/s of memory bandwidth. The "Navi 44" chip has a respectable 192-bit wide memory bus, and its top SKU will feature a 19 Gbps speed, for 456 GB/s of bandwidth on tap.

ASUS today announced the launch of the exclusive Warhammer 40,000: Space Marine 2 Collector's Edition graphics card, developed in collaboration with AMD and Focus Entertainment and officially unveiled at the ROG press event during Gamescom on August 20. At the Gamescom press event, ASUS revealed that this card is based on the TUF Gaming Radeon RX 7900 XTX and is custom-built for a global giveaway for gamers and fans of Space Marine 2 and the Warhammer 40K universe.

To celebrate the game's launch, ASUS and AMD collaborated on a live stage event at the Gamescom Hall on August 23, where three randomly-chosen audience members competed to win one of the exclusive Space Marine 2 graphics cards. After several rounds of quickfire questions centered around Warhammer 40,000 lore and Space Marine 2, one of the participants received the first Space Marine 2 graphics card prize.