Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.

The first die shot of AMD's new 4 nm "Strix Point" mobile processor surfaced, thanks to an enthusiast on Chinese social media. "Strix Point" is a significantly larger die than "Phoenix." It measures 12.06 mm x 18.71 mm (L x W), compared to the 9.06 mm x 15.01 mm of "Phoenix." Much of this die size increase comes from the larger CPU, iGPU, and NPU. The process has been improved from TSMC N4 on "Phoenix" and its derivative "Hawk Point," to the newer TSMC N4P node.

Nemez (GPUsAreMagic) annotated the die shot in great detail. The CPU now has 12 cores spread across two CCX, one of which contains four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The two CCXs connect to the rest of the chip over Infinity Fabric. The rather large iGPU takes up the central region of the die. It is based on the RDNA 3.5 graphics architecture, and features 8 workgroup processors (WGPs), or 16 compute units (CU) worth 1,024 stream processors. Other key components include four render backends worth 16 ROPs, and control logic. The GPU has its own 2 MB of L2 cache that cushions transfers to the Infinity Fabric.

ASUS announced availability for the company's new lineup of AMD Ryzen AI laptops featuring advanced AI capability with 50 TOPS NPU AI engines.

ASUS ProArt P16 / ProArt PX13
The new ASUS ProArt laptop lineup is designed to empower every creator — whether they are everyday users, outdoor content creators, or professionals — to transform their precious life moments into enduring stories. The lightweight, durable, and powerful laptops allow users to create anywhere, create faster, and create smarter.

AMD has introduced Fluid Motion Frames 2 (AFMF 2), an upgraded version of its frame generation technology designed to improve gameplay smoothness and frame rates. This new iteration brings several enhancements and expanded compatibility across Radeon RX 6000 and 7000 series graphics cards. AMD debuted Fluid Motion Frames (AFMF) in September 2023 introducing frame generation capabilities across a broad spectrum of GPUs, including those from NVIDIA, and Intel. This technology was compatible with all DirectX 12 and DirectX 11 games, potentially doubling performance when frame generation was activated.

Following its initial release, AMD addressed major concerns such as stuttering and frame-pacing through substantial driver improvements. The refined version of AFMF was officially incorporated into AMD's driver package in January of this year. Now, AMD is offering Fluid Motion Frames 2 as a technical preview using a special driver to convince gamers that they can have an even faster and smoother gaming experience.

AMD today released the Ryzen Chipset Drivers 6.07.22.037 WHQL. The drivers are essential for notebooks powered by the latest Ryzen AI 300 series "Strix Point" processors, as they add driver support for the various SoC interfaces of the chip. The drivers are also needed to expose the NPU of Ryzen 7000 "Phoenix," Ryzen 8000 "Hawk Point," Ryzen 8000G desktop APUs, and Ryzen AI 300 "Strix Point" processors as a classified device in the Windows Device Manager, as well as give Windows 11 the ability to read out the NPU in the Task Manager, so you can look for things there such as real-time NPU utilization, memory footprint, and driver version. The driver package also updates the drivers of the various components, including GPIO, PSP, PPM, USB4 host controller, etc. It also adds program support for various interfaces of the SoC, including SMBus, Hetero, and RCEC. Grab the drivers from the link below.

DOWNLOAD: AMD Chipset Drivers 6.07.22.037

AMD Ryzen 9000 series "Granite Ridge" desktop processors were supposed to start selling on July 31, 2024, but the launch has since been delayed. Since then, social media has been abuzz with theory crafting behind what could be the cause of the delay. AMD's announcement of the delay mentions: "During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations," causing some to speculate if there are design flaws such as the ones affecting Intel's 13th Gen and 14th Gen Core desktop processors. A picture doing rounds on social media has a more goofy explanation: there is a glaring typo on the product label printed on the integrated heatspreader (IHS) of the processors.

Apparently, some of the first batches of Ryzen 9000 processors see the brand extensions mislabeled. Ryzen 7 9700X is printed as "Ryzen 9 9700X." This error in the brand extension may have been easily "patched" if it was on the retail packaging (the box), where hardware manufacturers tend to fix typos by simply pasting stickers on them. You can't do this with the IHS, which is a key component of the processor's cooling mechanism. Also, since times immemorial, chip labels (information printed on the chip) have served as crucial last resorts for accuracy of information such as the chip's exact model number, steppings or revisions (if any), and production serial numbers, besides the chip's national origin, which determines the applicable import tariffs. A typo here could prove problematic. We're not entirely sure how AMD is fixing these errors with mere 1-2 week delays. It's likely that they're recalling the affected batch and simply replacing inventory in the channel with "good" batches. The recalled chips will simply have their IHS reprinted.

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today launched the first passive series graphics cards -- ASRock AMD Radeon RX 7900 XTX Passive 24 GB and ASRock AMD Radeon RX 7900 XT Passive 20 GB graphics cards.

ASRock Radeon RX 7900 Passive series graphics cards are powered by the AMD Radeon RX 7900 XTX and Radeon RX 7900 XT GPUs. Both of these two cards are supporting multi-GPU collaborative computing, and designed for multi-card parallel computing for better performance. ASRock AMD Radeon RX 7900 Passive series graphics cards are featuring a VAPOR-CHAMBER heatsink, efficiency aluminum cooling fins with v-shaped cutting. Furthermore, thanks to the single horizontal 12V-2x6 power connector, to install couple of ASRock AMD Radeon RX 7900 Passive series graphics cards become much easily due to less power cords.

Despite the postponement of the Ryzen 9000 launch announced by AMD on Wednesday, early engineering samples used by motherboard makers reached some users (mainly overclockers). As it is the case with a pre-launch sample of AMD's flagship Ryzen 9 9950X. This CPU is equipped with 16 cores, 32 threads, a base clock frequency of 4.3 GHz with a 5.7 GHz max boost, 80 MB cache (64 MB L3 + 16 MB L2), and a TDP of 170 W.

A user overclocked the 9950X sample to 5.953 GHz using an ASUS ROG Crosshair X670E motherboard equipped with 32 GB DDR5-6000 memory. (Note: There's no information on whether air or water cooling was used.) The user then posted new results in Geekbench 5 and Geekbench 6, which demonstrate impressive performance gains for the 9950X. It's worth noting that AMD also overclocked the processor to 6.6 and even 6.7 GHz, however, they used liquid nitrogen.

AMD has unveiled its latest processor, the Ryzen 8040H. This new model boasts 8 Zen 4 cores and full RDNA3 graphics with 12 Compute Units. Notably, it lacks the AMD XDNA processor, confirming earlier rumors of a mobile SKU without a Neural Processing Unit (NPU). Contrary to speculation, the 8040H's specifications differ from the Ryzen 8845HS. The new chip has a boost clock of 4.9 GHz, 200 MHz lower than its predecessor. Graphics performance has also been slightly reduced, with the 12 Compute Units clocked at 2.6 GHz, down from 2.7 GHz in the 8845H.

The Lenovo XiaoXin 14 Pro is the first laptop to feature this new APU, priced at 5499 RMB ($768) with 24 GB of memory. For comparison, a similar model with the 8845H and 32 GB of memory is priced at 5599 RMB ($773), suggesting only a marginal price difference between the two configurations.

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

In a statement published today shortly after the release of a batch of new Zen 5 architecture details, AMD's computing and graphics SVP Jack Huynh released a statement regarding a delay to the release of the Ryzen 9000 processors based on Zen 5. Originally set to launch in just one week on July 31st, the processors have now been pushed back to a staggered release on August 8th and August 15th; one and two weeks after the initial launch window. AMD supposedly found some of the launch inventory processors did not go through proper testing procedures before being shipped out, and AMD is recalling those processors before any potential problems could have a chance to affect the first customers to buy the new chips.

The statement is as follows:

We appreciate the excitement around Ryzen 9000 series processors. During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations. Out of an abundance of caution and to maintain the highest quality experiences for every Ryzen user, we are working with our channel partners to replace the initial production units with fresh units. As a result, there will be a short delay in retail availability. The Ryzen 7 9700X and Ryzen 5 9600X processors will now go on sale on August 8th and the Ryzen 9 9950X and Ryzen 9 9900X processors will go on-sale on August 15th. We pride ourselves in providing a high-quality experience for every Ryzen user, and we look forward to our fans having a great experience with the new Ryzen 9000 series.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

AMD in its architecture deep-dive Q&A session with the press, confirmed that the "Zen 5" and "Zen 5c" cores on the "Strix Point" silicon only feature 256-bit wide FPU data-paths, unlike the "Zen 5" cores in the "Granite Ridge" Ryzen 9000 desktop processors. "The Zen 5c used in Strix has a 256-bit data-path, and so does the Zen 5 used inside of Strix," said Mike Clark, AMD corporate fellow and chief architecture of the "Zen" CPU cores. "So there's no delta as you move back and forth [thread migration between the Zen 5 and Zen 5c complexes] in vector throughput," he added.

It doesn't seem like AMD disabled a physically available feature, but rather, the company developed a variant of both the "Zen 5" and "Zen 5c" cores that physically lack the 512-bit data-paths. "And you get the area advantage to be able to scale out a little bit more," Clark continued. This suggests that the "Zen 5" and "Zen 5c" cores on "Strix Point" are physically smaller than the ones on the 4 nm "Eldora" 8-core CCD that is featured in "Granite Ridge" and some of the key models of the upcoming 5th Gen EPYC "Turin" server processors.

AMD presented a closer look at the Radeon 890M iGPU powering the Ryzen AI 300 series "Strix Point" mobile processor. The iGPU introduces the new RDNA 3.5 graphics architecture, with several architecture-level improvements built around the existing RDNA 3 SIMD, to yield performance/Watt improvements that AMD could trade in to increase the SIMD muscle for its processors, and proportionately increase performance. The iGPU features one Shader Engine with 8 workgroup processors (WGPs), which amount to 16 CU (compute units), for a total of 1,024 stream processors, 32 AI accelerators, and 16 Ray accelerators. The iGPU also has 4 render backends+, for 16 ROPs. It is specced with a maximum engine clock of 2.90 GHz, which yields over 11 TFLOP/s of FP32 throughput, which is around 30% higher than the iGPU of "Phoenix" (12 CU, RDNA 3), at comparable power.

AMD goes into the finer points of how it yielded the performance/Watt gains. The company worked on the texture subsystem to double the texture sampler rate, and introduced point-sampling acceleration. The shader sub-system features interpolation and comparison rate doubling. The raster sub-system introduces sub-batching of batch raster operations, with a programmable bin order, for the hardware to be more efficient. Lastly, AMD worked on the iGPU's memory-management, to be more aware of LPDDR5 (which has a different physical layer or way of writing/fetching than GDDR6). The company worked on improving the memory compression technologies, to improve performance, and reduce the iGPU's memory footprint.

AMD "Granite Ridge" is codename for the four new Ryzen 9000 series desktop processors the company plans to launch on July 31, 2024. The processor is built in the Socket AM5 package, and is meant to be backwards compatible with AMD 600-series chipset motherboards, besides the new 800-series chipset ones that will launch alongside. "Granite Ridge" is a chiplet-based processor, much like the Ryzen 7000 "Raphael," Ryzen 5000 "Vermeer," and Ryzen 3000 "Matisse." AMD is carrying over the 6 nm client I/O die over from "Raphael" in an effort to minimize development costs, much in the same way it carried over the 12 nm cIOD for "Vermeer" from "Matisse."

The SoC I/O features of "Granite Ridge" are contemporary, with its awesome 28-lane PCI-Express Gen 5 root complex that allows a PCI-Express 5.0 x16, two CPU-attached M.2 Gen 5 slots, and a Gen 5 x4 chipset bus. There's also a basic integrated graphics solution based on the older RDNA 2 graphics architecture; which should make these processors fit for all use-cases that don't need discrete graphics. The iGPU even has multimedia accelerators, an audio coprocessor, a display controller, and USB 3.2 interfaces from the processor.

ASUS today announced an all-new range of servers, workstations and motherboards driven by the power of AMD EPYC 4004 CPUs - heralding next-level performance and density. The new offerings include: ASUS Pro ER100A B6, a compact, 1U rack server. ASUS ExpertCenter Pro ET500A B6, a power-efficient Zen 4 workstation, ASUS Pro WS 665-ACE, a resilient ATX workstation motherboard; and ASUS Pro WS 600M-CL, a compact, chipset-less mATX motherboard for workstation applications.

Engineered specifically for the dynamic needs of small businesses and hosted IT service providers, these business-grade platforms empower high-performance computing in diverse forms, from ready-to-roll workstations to powerful motherboards. Ideal for a variety of applications, from cloud services to dedicated hosting or content delivery, ASUS equipment with AMD EPYC 4004-series processors ensure that that evolving business operations are powered by the performance the modern world demands - and backed by the ASUS expertise enterprise expects.

AMD today announced that AMD President Victor Peng is retiring effective August 30, 2024. He will continue to serve on the AMD executive team in an advisory role and support the transition until his retirement date. "Victor re-joined AMD in 2022 following the acquisition of Xilinx and played an important role successfully integrating and scaling our embedded business and leading our cross-company AI strategy," said AMD Chair and CEO Dr. Lisa Su. "Under his leadership, AMD became the industry's #1 provider of FPGA and adaptive computing solutions. On behalf of the AMD Board, executive leadership team and the thousands of employees who have worked with him, I want to thank Victor for his outstanding leadership and wish him the best in his retirement."

Peng retires with over 40 years of experience defining and delivering leadership technologies across FPGAs, SoCs, GPUs and high-performance CPUs. He has served as president at AMD since February 2022 when he rejoined the company after the acquisition of Xilinx, where he spent 14 years, most recently serving as president, CEO and member of the board of directors.

AMD today released the first public version of FLM, or Frame Latency Meter, a utility that lets you measure the response time of games with mouse movements. The tool targets advanced gamers, power users, and game developers wanting to optimize whole-system latency or reducing input latency. It measures the time it takes for a mouse movement to translate into a new frame on the screen. Options are included to use frame capture codecs such as AMF (optimized for AMD GPUs) or DXGI (any brand of GPUs). The tool generates detailed latency and effective-framerate statistics that can be exported to CSVs for data analysis. A key difference between FLM and NVIDIA LDAT is that it doesn't rely on "muzzle flashes" on the screens to measure latency, which means your measurement data can span any amount of time without worrying about running out of ammo during your test session.

DOWNLOAD: AMD Frame Latency Meter (FLM) v1.0

Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications. These substrates are made in SEMCO's key the technology hub in Busan and the newly built state of the art factory in Vietnam. Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW in 2028. SEMCO's substantial investment of 1.9 trillion KRW in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and the future technology needs.

SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.

It appears like 2024 will go down as the second consecutive year without any new GPU generation launch from either NVIDIA or AMD. Kopite7kimi, a reliable source with NVIDIA leaks, says that the GeForce RTX 50-series "Blackwell" generation won't see a debut before the 2025 International CES (January 2025). It was earlier expected that the company would launch at least its top two SKUs—the RTX 5090 and RTX 5080—toward the end of 2024, and ramp the series up from 2025. There is no explanation behind this "delay." Like everyone else, NVIDIA could be rationing its foundry allocation of the 3 nm wafers from TSMC for its high-margin "Blackwell" AI GPUs. The company now makes over five times the revenue from selling AI GPUs than it does from gaming GPUs, so this development should come as little surprise.

Things aren't any different with NVIDIA's rivals in this space, AMD and Intel. AMD's RDNA 4 graphics architecture and the Radeon RX series GPUs based on it, aren't expected to arrive before 2025. AMD is making several architectural upgrades with RDNA 4, particularly to its ray tracing hardware; and the company is expected to build these GPUs on a new foundry node. Meanwhile, Intel's Arc B-series gaming GPUs based on the Xe2 "Battlemage" graphics architecture are expected to arrive in 2025, too, although these chips are rumored to be based on a more mature 4 nm-class foundry node.

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

MINISFORUM is proud to announce the MS-A1, the world's smallest and most expandable AM5 platform Mini PC. Equipped with the latest AMD AM5 platform, the MS-A1 offers a replaceable CPU, ensuring a longer motherboard lifecycle and sustainable upgrades for future generations of CPUs. Integrated with the AMD Radeon 780M graphics card, the MS-A1 includes 12 GPU cores and a GPU frequency of up to 2900 MHz, effortlessly handling both graphical and gaming demands. Additionally, it incorporates a dedicated NPU unit with up to 16 TOPS of processing power, making it the first desktop processor to include a specialized AI neural processing unit (NPU).

At its highest configuration, the MS-A1 features the AMD Ryzen 7 8700G desktop processor, built on the Zen 4 architecture. This powerhouse boasts 8 cores and 16 threads, a maximum boost clock of 5.10 GHz, and a 65 W TDP, delivering unparalleled performance. The MS-A1 supports dual-channel DDR5 5200 MHz high-speed memory, with a capacity of up to 96 GB, enabling users to achieve fast and efficient multitasking. It also features four M.2 PCIe 4.0 NVMe SSD slots, offering transfer speeds of up to 7000 MB/s. These extensive expansion slots allow for a maximum system capacity of up to 27 TB, catering to the vast storage needs of creative and multimedia professionals.