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Several AMD RDNA 4 Architecture Ray Tracing Hardware Features Leaked

We've known since May that AMD is giving its next generation RDNA 4 graphics architecture a significant upgrade with ray tracing performance, and had some clue since then, that the company is working on putting more of the ray tracing workflow through dedicated, fixed function hardware, unburdening the shader engine further. Kepler_L2, a reliable source with GPU leaks sheds light on some of the many new hardware features AMD is introducing with RDNA 4 to better accelerate ray tracing, which should give its GPUs a reduced performance cost of having ray tracing enabled. Kepler_L2 believes that these hardware features should also make it to the GPU of the upcoming Sony PlayStation 5 Pro.

To begin with, the RDNA 4 ray accelerator introduces the new Double Ray Tracing Intersect Engine, which should at least mean a 100% ray intersection performance increase over RDNA 3, which in turn offered a 50% increase over that of RDNA 2. The new RT instance node transform instruction should improve the way the ray accelerators handle geometry. Some of the other features we have trouble describing include a 64-byte RT node, ray tracing tri-pair optimization, Change flags encoded in barycentrics to simplify detection of procedural nodes; improved BVH footprint (possibly memory footprint): and RT support for oriented bounding box and instance node intersection. AMD is expected to debut Radeon RX series gaming GPUs based on RDNA 4 in early 2025.

AMD Software Adrenalin 24.7.1 WHQL Released

AMD today released the latest version of AMD Software Adrenalin drivers for its graphics cards and integrated graphics. Version 24.7.1 WHQL comes with optimization for "Zenless Zone Zero" and "Kunitsu-Gami: Path of the Goddess." The drivers add HYPR-Tune support for "Gray Zone Warfare," "Lords of the Fallen," "RoboCop: Rogue City," and "Like a Dragon Gaiden: The Man Who Erased His Name." The drivers also add Radeon Anti-Lag 2 support for "Dota 2."

Among the issues fixed with this release include stutter noticed with Anti-Lag and FSR 3; stutter when playing Fortnite with DirectX 12 renderer, a texture corruption noticed when playing TEKKEN 8 with ray tracing or upscale enabled; display corruption noticed when playing Dying Light: Stay Human with Radeon Boost enabled, crash or corruption noticed with Marvel's Guardians of the Galaxy with ray tracing enabled; VSR or display color enhancements being disabled after driver update; inability to change display pixel format with certain language settings; black corruption being observed on scaled 3D models while using Origin or OriginPro; and a black display corruption noticed when seeking with PotPlayer.

DOWNLOAD: AMD Software Adrenalin 24.7.1 WHQL

GMKtec to Release a New AMD Ryzen-based Mini-PC with Vapor Chamber and OCuLink

Chinese tech company GMKtec is preparing to unveil a new Mini-PC powered by an AMD Ryzen processor, featuring an enhanced cooling system. The company's product lineup already includes a variety of AMD and Intel-based compact computers, with their K-series representing their most powerful offerings. Now, GMKtec teased a new addition to their lineup on Weibo, China's popular social media platform. The upcoming model will support a 70 W TDP and is likely to feature the Ryzen 9 8945HS processor, based on the "R9" mentioned in the post title. This distinction is important as the next-generation processors (Strix Point) use "Ryzen AI 9" branding.

A standout feature of this upcoming model is its vapor chamber cooling system, which is uncommon in the Mini-PC market. However, GMKtec hasn't mentioned the use of a secondary fan or other cooling features, which some competitors employ. The new Mini-PC will include an OCuLink connector for external device compatibility, including graphics cards. Other features include dual 2.5GbE networking, USB ports, HDMI 2.1 and DisplayPort 2.0 outputs. While full specifications are yet to be disclosed, more details are expected to be revealed in the near future. GMKtec has not announced a specific release date or price for this new Mini-PC.

ASUS Announces Major Update to Armoury Crate SE Software for Launch of ROG Ally X

ASUS Republic of Gamers (ROG) today released Armoury Crate Special Edition 1.5 (ACSE 1.5)—a brand-new major update to this software—to coincide with the launch of the ROG Ally X gaming handheld. Featuring a massive 80 Wh battery, upgraded joysticks and face buttons, and redesigned handgrips, the ROG Ally X is an improvement in every way on the original ROG Ally.

ACSE is the control software behind the ROG Ally and ROG Ally X, and provides a centralized hub for game storage, access, and settings customization for gamers to play all of their games, no matter the launcher. ACSE 1.5 introduces a more console-like and easy-to-navigate UI, with more customization for how game titles are displayed and arranged, and revamped carousel and list views. Taken together, ACSE has seen a huge usability increase since its initial launch just over a year ago.

G.SKILL Announces Trident Z5 Royal Neo Series DDR5 Memory with AMD EXPO, Up to DDR5-8000

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Trident Z5 Royal Neo series DDR5 memory, designed for AMD AM5 platforms. Trident Z5 Royal Neo memory comes with AMD EXPO (Extended Profiles for Overclocking) technology, and will be available up to DDR5-8000 CL38-48-48-127 extreme speed memory specification in 32 GB (2x16GB) and 48 GB (2x24GB) kit capacities. With a mirrored finish in gold or silver, this new memory series is the ideal DDR5 memory solution for enthusiasts and overclockers to build a stylish, high-performance AMD PC system.

Luxury-Class DDR5 with AMD EXPO
Following the luxury-class Trident Z5 Royal design with CNC-cut aluminum heatspreader in mirrored-finish gold or silver colors and a crystalline light bar for magnificent RGB lighting, the Trident Z5 Royal Neo is designed for AMD AM5 platforms with AMD EXPO profile. Customizable RGB lighting is supported through the G.SKILL Trident Z Lighting Control software or third-party motherboard lighting software.

ASRock Launches AMD Radeon RX 7900 Creator Series Graphics Cards with 12V-2x6 Power Connector

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today launched their first blower series graphics cards -- ASRock Radeon RX 7900 XTX Creator 24 GB and ASRock Radeon RX 7900 XT Creator 20 GB graphics cards.

ASRock Radeon RX 7900 Creator series graphics cards are powered by the AMD Radeon RX 7900 XTX and Radeon RX7900 XT GPUs. Both of these two cards are supporting multi-GPU collaborative computing, and designed for multi-card parallel computing for better performance. Radeon RX 7900 Creator series graphics cards are featuring a VAPOR-CHAMBER heatsink, efficiency blower fan and 2-slot thickness. Furthermore, thanks to the single horizontal 12V-2x6 power connector, installing a couple of ASRock Radeon RX 7900 Creator series graphics cards becomes much easier due to fewer power cords.

Acer Regulatory Filings Reveal Radeon RX 7900, RX 7800, and RX 7700 non-XT GPUs

Regulatory filings by PC OEM major Acer, with the Eurasian Economic Commission (EEC), drop some of the first references to three upcoming performance-segment graphics card SKUs by AMD. These include the Radeon RX 7900, the Radeon RX 7800, and the Radeon RX 7700. Acer is an AMD Radeon add-in board partner under its Acer Predator brand, which makes graphics cards not just for Predator and Nitro gaming PCs, but also graphics cards for the retail channel.

At this point, there are no specs known for the three, not even their memory sizes. It would be interesting to see how AMD slots the three into its product stack, particularly the RX 7900. The company currently has three RX 7900 series SKUs—the flagship RX 7900 XTX, and the second-best RX 7900 XT, but then the SKU next to this is the RX 7900 GRE, which saw a worldwide launch. Then there are the RX 7800 and RX 7700, which are pretty straightforward to predict. The RX 7800 will slot in between the RX 7700 XT and RX 7800 XT, and will probably feature a 256-bit wide memory interface with 16 GB of memory, much like the RX 7800 XT; whereas the RX 7700 will be positioned below the RX 7700 XT. It wouldn't surprise us if AMD further cuts down the memory interface to 160-bit (10 GB).

AMD Ryzen 9 7950X3D Drops to Record Low Price of $465

Prices of AMD's current generation flagship desktop processor, the Ryzen 9 7950X3D, dropped earlier this week, to a record low $464.99 on Amazon and Newegg. The 16-core/32-thread Socket AM5 processor features 3D V-cache technology, and roughly matches the gaming performance of Intel Core i9-14900K, in our testing. It also offers a much stronger productivity and content creation performance than the Ryzen 7 7800X3D owing to its 16-core compute muscle. The $465 new price is exactly two-thirds the processor's launch price of $700. The chip was designed to topple the Core i9-13900K "Raptor Lake." The price cuts are triggered by the impending launch of the Ryzen 9000 "Granite Ridge" processors based on the newer "Zen 5" microarchitecture.

Gigabyte AI TOP Utility Reinventing Your Local AI Fine-tuning

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, released the GIGABYTE exclusive groundbreaking AI TOP Utility. With reinvented workflows, user-friendly interface, and real-time progress monitoring, AI TOP Utility provides a reinventing touch of local AI model training and fine-tuning. It features a variety of groundbreaking technologies that can be easily adapted by beginners or experts, for most common open-source LLMs, in anyplace even on your desk.

GIGABYTE AI TOP is the all-round solution for local AI Model Fine-tuning. Running local AI training and fine-tuning on sensitive data can relatively provide greater privacy and security with maximum flexibility and real-time adjustment. Collocating with GIGABYTE AI TOP hardware and AI TOP Utility, the common constraints of GPU VRAM insufficiency when trying to execute AI fine-tuning locally can be addressed. By GIGABYTE AI TOP series motherboard, PSU, and SSD, as well as GIGABYTE graphics cards lineup covering NVIDIA GeForce RTX 40 Series, AMD Radeon RX 7900 Series, Radeon Pro W7900 and W7800 series, the size of open-source LLM fine-tuning can now reach up to 236B and more.

Global AI Server Demand Surge Expected to Drive 2024 Market Value to US$187 Billion; Represents 65% of Server Market

TrendForce's latest industry report on AI servers reveals that high demand for advanced AI servers from major CSPs and brand clients is expected to continue in 2024. Meanwhile, TSMC, SK hynix, Samsung, and Micron's gradual production expansion has significantly eased shortages in 2Q24. Consequently, the lead time for NVIDIA's flagship H100 solution has decreased from the previous 40-50 weeks to less than 16 weeks.

TrendForce estimates that AI server shipments in the second quarter will increase by nearly 20% QoQ, and has revised the annual shipment forecast up to 1.67 million units—marking a 41.5% YoY growth.

Qualcomm Snapdragon X "Copilot+" AI PCs Only Accounted for 0.3% of PassMark Benchmark Runs

The much-anticipated revolution in AI-powered personal computing seems to be off to a slower start than expected. Qualcomm's Snapdragon X CPUs, touted as game-changers in the AI PC market, have struggled to gain significant traction since their launch. Recent data from PassMark, a popular benchmarking software, reveals that Snapdragon X CPUs account for a mere 0.3% of submissions in the past 30 days. This is a massive contrast to the 99.7% share held by traditional x86 processors from Intel and AMD, which raises questions about the immediate future of ARM-based PCs. The underwhelming adoption comes despite bold predictions from industry leaders. Qualcomm CEO Cristiano Amon had projected that ARM-based CPUs could capture up to 50% of the Windows PC market by 2029. Similarly, ARM's CEO anticipated a shift away from x86's long-standing dominance.

However, it turns out that these PCs are primarily bought for the battery life, not their AI capabilities. Of course, it's premature to declare Arm's Windows venture a failure. The AI PC market is still in its infancy, and upcoming mid-tier laptops featuring Snapdragon X Elite CPUs could boost adoption rates. A lot of time still needs to pass before the volume of these PCs reaches millions of units shipped by x86 makers. The true test will come with the launch of AMD's Ryzen AI 300 and Intel's Lunar Lake CPUs, providing a clearer picture of how ARM-based options compare in AI performance. As the AI PC landscape evolves, Qualcomm faces mounting pressure. NVIDIA's anticipated entry into the market and significant performance improvements in next-generation x86 processors from Intel and AMD pose a massive challenge. The coming months will be crucial in determining whether Snapdragon X CPUs can live up to their initial hype and carve out a significant place in the AI PC ecosystem.

MSI Intros PRO B650-A WIFI Motherboard

MSI introduced the PRO B650-A WIFI, a feature-rich entry-mainstream Socket AM5 motherboard under its PRO series. Built in the standard ATX form-factor, the board features a 6-layer PCB, and includes heatsinks for all its M.2 slots, The board draws power from a 24-pin ATX and two 8-pin EPS power connectors and uses a 14+2+1 phase VRM solution that's capable of even the top 170 W TDP Ryzen 9 chips. The CPU socket is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two M.2 NVMe Gen 4 slots. The board's third M.2 Gen 4 slot is wired to the B650 FCH.

The MSI PRO B650-A WIFI offers a fairly premium onboard audio solution driven by a Realtek ALC4080 CODEC. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 type-C port, three 10 Gbps USB 3.2 Gen 2 type-A, four 5 Gbps USB 3.2 Gen 1, and a few USB 3.2 and USB 2.0 ports by internal headers. Display outputs include HDMI and DisplayPort. Networking connectivity includes a 2.5 GbE interface driven by a Realtek 8125B controller, and an AMD/Mediatek sourced WLAN module with Wi-Fi 6E and Bluetooth 5.3. Besides the three M.2 Gen 4 slots, you get four SATA 6 Gbps ports. The board supports USB BIOS Flashback. The company didn't reveal pricing.

AMD Granite Ridge and Strix Point Zen 5 Die-sizes and Transistor Counts Confirmed

AMD is about give the new "Zen 5" microarchitecture a near-simultaneous launch across both its client segments—desktop and mobile. The desktop front is held by the Ryzen 9000 "Granite Ridge" Socket AM5 processors; while Ryzen AI 300 "Strix Point" powers the company's crucial effort to capture Microsoft Copilot+ AI PC market share. We recently did a technical deep-dive on the two. HardwareLuxx.de scored two important bits of specs for both processors in its Q&A interaction with AMD—die sizes and transistor counts.

To begin with, "Strix Point" is a monolithic silicon, which is confirmed to be built on the TSMC N4P foundry node (4 nm). This is a slight upgrade over the N4 node that the company built its previous generation "Phoenix" and "Hawk Point" processors on. The "Strix Point" silicon measures 232.5 mm² in area, which is significantly larger than the 178 mm² of "Hawk Point" and "Phoenix." The added die area comes from there being 12 CPU cores instead of 8, and 16 iGPU compute units instead of 12; and a larger NPU. There are many other factors, such as the larger 24 MB CPU L3 cache; and the sizes of the "Zen 5" and "Zen 5c" cores themselves.

AMD Ryzen 9 9950X Supports PBO After All

AMD's upcoming flagship desktop processor, the Ryzen 9 9950X, supports Precision Boost Overdrive (PBO) overclocking. In the comments section of our Zen 5 Technical Deep Dive article, a keen-eyed user noticed a footnote in one of the slides that reads that PBO is supported on Ryzen 9000 series desktop processor with the parenthesis "excluding the 9950." Add to this, the company's presentation slide for PBO on Ryzen 9000 series only highlights performance gains for the Ryzen 9 9900X, the Ryzen 7 9700X, and the Ryzen 5 9600X, but not the 9950X. We reached out to AMD seeking a clarification on this.

AMD got back to us and confirmed that the Ryzen 9 9950X does indeed support PBO overclocking: "Confirmed that PBO is supported with 9950X", just like the 9900X, 9700X, and the 9600X, and that there is an "Error in the footnotes." It would be highly unusual for AMD to disable PBO on a specific SKU, especially considering that all non-APU Ryzen processors in the past have supported PBO, not just some special overclocking SKUs, like the "K" models on Intel.

HP is Betting on AI for their Notebooks and Desktops

HP Inc. today introduced two new innovations—the world's highest performance AI PC and the first integration of a trust framework into an AI model development platform. Both announcements expand HP's efforts to make AI real for companies and people with new and transformative AI experiences across the company's PCs, software, and partner ecosystem.

HP is empowering everyone, from corporate knowledge workers to freelancers and students, to unlock the power of AI. Users can connect with anyone in the world with real time translation to 40 languages, become master presenters with their personal communication coach, and quickly create videos like a pro.

Arm Unveils "Accuracy Super Resolution" Based on AMD FSR 2

In a community blog post, Arm has announced its new Accuracy Super Resolution (ASR) upscaling technology. This open-source solution aims to transform mobile gaming by offering best-in-class upscaling capabilities for smartphones and tablets. Arm ASR addresses a critical challenge in mobile gaming: delivering high-quality graphics while managing power consumption and heat generation. By rendering games at lower resolutions and then intelligently upscaling them, Arm ASR promises to significantly boost performance without sacrificing visual quality. The technology builds upon AMD's FidelityFX Super Resolution 2 (FSR 2) and adapts it specifically for mobile devices. Arm ASR utilizes temporal upscaling, which combines information from multiple frames to produce higher-quality images from lower-resolution inputs. Even though temporal upscaling is more complicated to implement than spatial frame-by-frame upscaling, it delivers better results and gives developers more freedom.

This approach allows for more ambitious graphics while maintaining smooth gameplay. In benchmark tests using a complex scene, Arm demonstrated impressive results. Devices featuring the Arm Immortalis-G720 GPU showed substantial framerate improvements when using Arm ASR compared to native resolution rendering and Qualcomm's Game Super Resolution (GSR). Moreover, the technology helped maintain stable temperatures, preventing thermal throttling that can compromise user experience. Collaboration with MediaTek revealed significant power savings when using Arm ASR on a Dimensity 9300 handset. This translates to extended battery life for mobile gamers, addressing key concerns. Arm is releasing ASR under an MIT open-source license, encouraging widespread adoption and experimentation among developers. Below you can see the comparison of various upscalers.

AMD Plans to Use Glass Substrates in its 2025/2026 Lineup of High-Performance Processors

AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and mechanical strength. These characteristics make them well-suited for advanced SiPs containing multiple chiplets, especially in data center applications where performance and durability are critical. The adoption of glass substrates aligns with the industry's broader trend towards more complex chip designs. As leading-edge process technologies become increasingly expensive and yield gains diminish, manufacturers turn to multi-chiplet designs to improve performance. AMD's current EPYC server processors already incorporate up to 13 chiplets, while its Instinct AI accelerators feature 22 pieces of silicon. A more extreme testament is Intel's Ponte Vecchio, which utilized 63 tiles in a single package.

Glass substrates could enable AMD to create even more complex designs without relying on costly interposers, potentially reducing overall production expenses. This technology could further boost the performance of AI and HPC accelerators, which are a growing market and require constant innovation. The glass substrate market is heating up, with major players like Intel, Samsung, and LG Innotek also investing heavily in this technology. Market projections suggest explosive growth, from $23 million in 2024 to $4.2 billion by 2034. Last year, Intel committed to investing up to 1.3 trillion Won (almost one billion USD) to start applying glass substrates to its processors by 2028. Everything suggests that glass substrates are the future of chip design, and we await to see first high-volume production designs.

AMD Readies Ryzen 7 8745HS Hawk Point APU with Disabled NPU

According to a recent leak from Golden Pig on Weibo, AMD is gearing up to introduce the Ryzen 7 8745HS, a modified version of the existing Ryzen 7 8845HS APU. The key difference in this new chip lies in its neural processing capabilities. While the 8845HS boasts AMD's XDNA-based NPU (Neural Processing Unit), the upcoming 8745HS is rumored to have this feature disabled. Specifications for the 8745HS are expected to closely mirror its predecessor, featuring eight Zen 4 cores, 16 threads, and a configurable TDP range of 35-54 W. The chip will likely retain the Radeon 780M integrated GPU with 12 Compute Units. However, it is possible that AMD might introduce slight clock speed reductions to differentiate the new model further.

It is also worth pointing out that Hawk Point generation is not Copilot+ certified due to first-generation XDNA NPU being only 16 TOPS out of 40 TOPS required, so having an NPU doesn't help AMD advertise these processors as Copilot+ ready. The success of this new variant will largely depend on its pricing and adoption by laptop/mobile OEMs. Without the NPU, the 8745HS could offer a more budget-friendly option for users who don't require extensive local AI processing capabilities. After all, AI workloads remain a niche segment in consumer computing, and many users may find the 8745HS an attractive alternative if pricing is reduced, especially given the availability of cloud-based AI tools.

TSMC to Raise Wafer Prices by 10% in 2025, Customers Seemingly Agree

Taiwanese semiconductor giant TSMC is reportedly planning to increase its wafer prices by up to 10% in 2025, according to a Morgan Stanley note cited by investor Eric Jhonsa. The move comes as demand for cutting-edge processors in smartphones, PCs, AI accelerators, and HPC continues to surge. Industry insiders reveal that TSMC's state-of-the-art 4 nm and 5 nm nodes, used for AI and HPC customers such as AMD, NVIDIA, and Intel, could see up to 10% price hikes. This increase would push the cost of 4 nm-class wafers from $18,000 to approximately $20,000, representing a significant 25% rise since early 2021 for some clients and an 11% rise from the last price hike. Talks about price hikes with major smartphone manufacturers like Apple have proven challenging, but there are indications that modest price increases are being accepted across the industry. Morgan Stanley analysts project a 4% average selling price increase for 3 nm wafers in 2025, which are currently priced at $20,000 or more per wafer.

Mature nodes like 16 nm are unlikely to see price increases due to sufficient capacity. However, TSMC is signaling potential shortages in leading-edge capacity to encourage customers to secure their allocations. Adding to the industry's challenges, advanced chip-on-wafer-on-substrate (CoWoS) packaging prices are expected to rise by 20% over the next two years, following previous increases in 2022 and 2023. TSMC aims to boost its gross margin to 53-54% by 2025, anticipating that customers will absorb these additional costs. The impact of these price hikes on end-user products remains uncertain. Competing foundries like Intel and Samsung may seize this opportunity to offer more competitive pricing, potentially prompting some chip designers to consider alternative manufacturing options. Additionally, TSMC's customers could reportedly be unable to secure their capacity allocation without "appreciating TSMC's value."

AMD to Acquire Silo AI to Expand Enterprise AI Solutions Globally

AMD today announced the signing of a definitive agreement to acquire Silo AI, the largest private AI lab in Europe, in an all-cash transaction valued at approximately $665 million. The agreement represents another significant step in the company's strategy to deliver end-to-end AI solutions based on open standards and in strong partnership with the global AI ecosystem. The Silo AI team consists of world-class AI scientists and engineers with extensive experience developing tailored AI models, platforms and solutions for leading enterprises spanning cloud, embedded and endpoint computing markets.

Silo AI CEO and co-founder Peter Sarlin will continue to lead the Silo AI team as part of the AMD Artificial Intelligence Group, reporting to AMD senior vice president Vamsi Boppana. The acquisition is expected to close in the second half of 2024.

CPU-Z v2.10 Changelog Confirms Core-Config of Ryzen AI 300-series Processors

CPUID this week released the latest version of CPU-Z, and its change-log confirms the core-configurations of upcoming AMD Ryzen AI 300-series "Strix Point" processor SKUs. On paper, "Strix Point" packs a 12-core CPU based on the latest "Zen 5" microarchitecture, but there's more to this number. We've known since June 2024 that the chip has a heterogeneous multicore configuration of four full-sized "Zen 5" cores, and eight compacted "Zen 5c" cores. Only the "Zen 5" cores can reach the maximum boost frequencies rated for the chip, while the "Zen 5c" cores go a few notches above the base frequency, although it's expected that the gap in boost frequencies between the two core types is expected to slightly narrow compared to that between the "Zen 4" and "Zen 4c" cores in chips such as the "Phoenix 2."

The series is led by the AMD Ryzen AI 9 HX 375, an enthusiast segment chip that maxes out all 12 cores on the chip—that's 4x "Zen 5" and 8x "Zen 5c." This model is closely followed by the Ryzen AI 9 365, which AMD marked in its presentations as being simply a 10-core/20-thread chip. We're now learning that it has 4x "Zen 5" and 6x "Zen 5c," meaning that AMD hasn't touched the counts of its faster "Zen 5" cores. It's important to note here that "Zen 5c" is not an E-core. It supports SMT, and at base frequency, it has an identical IPC to "Zen 5." It also supports the entire ISA that "Zen 5" does.

Battery Life is Driving Sales of Qualcomm Snapdragon Copilot+ PCs, Not AI

The recent launch of Copilot+ PCs, a collaboration between Microsoft and Qualcomm, has taken an unexpected turn in the market. While these devices were promoted for their artificial intelligence capabilities, a Bloomberg report reveals that consumers are primarily drawn to them for their impressive battery life. The Snapdragon X-powered Copilot+ PCs have made a significant impact, securing 20% of global PC sales during their launch week. However, industry analyst Avi Greengart points out that the extended battery life, not the AI features, is driving these sales. Microsoft introduced three AI-powered features exclusive to these PCs: Cocreator, Windows Studio Effects, and Live Captions with Translation. Despite these innovations, many users find these features non-essential for daily use. The delay of the anticipated Recall feature due to privacy concerns has further dampened enthusiasm for the AI aspects of these devices.

The slow reception of on-device AI capabilities extends beyond consumer preferences to the software industry. Major companies like Adobe, Salesforce, and SentinelOne declined Microsoft's request to optimize their apps for the new hardware, citing resource constraints and the limited market share of AI-capable PCs. Gregor Steward, SentinelOne's VP for AI, suggests it could take years before AI PCs are widespread enough to justify app optimization. Analysts project that by 2028, only 40% of new computers will be AI-capable. Despite these challenges, Qualcomm remains optimistic about the future of AI PCs. While the concept may currently be more on the marketing side, the introduction of Arm-based Windows laptops offers a welcome alternative to the Intel-AMD duopoly. As the technology evolves and adoption increases, on-device AI features may become more prevalent and useful. The imminent arrival of AMD Ryzen AI 300 series and Intel Lunar Lake chips promises to expand the Copilot+ PC space further. For now, however, it appears that superior battery life remains the primary selling point for consumers.

AMD Releases FidelityFX SDK v1.1 to GPUOpen, Includes FSR 3.1 Source Code

AMD today released the FidelityFX SDK 1.1 to the public through its GPUOpen initiative. This update includes the source code to FSR 3.1, which should make it easier for game developers to understand the technology, and integrate it with their games. FSR 3.1 requires an AMD Radeon RX 5000 series (or later) GPU, or an NVIDIA GeForce RTX 20-series (or later) GPU, although the company recommends at least an RX 6000 series or RTX 30-series GPU, regardless of model. You get the full upscaling and frame-generation capabilities of FSR 3.1 on all supported GPUs, across AMD and NVIDIA, which is the main pull for the tech, as the rival DLSS 3 Frame Generation technology only works on RTX 40-series (or later) GPUs.

AMD FSR 3.1 builds on top of FSR 3 by introducing updates to the upscaler. If you recall, the star attraction with FSR 3 has been frame-generation, but the underlying upscaling tech had been carried over from FSR 2.2. FSR 3.1 introduces some much-needed updates to the quality of upscaling, and introduces new upscaler quality presets, including a native AA mode analogous to NVIDIA's DLAA. These increases in upscaler quality lets you trade in quality for performance better. You can find all the resources you need on FSR 3.1 here.

AMD "Strix Halo" a Large Rectangular BGA Package the Size of an LGA1700 Processor

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

AMD Ryzen PC Gets Integrated into a Foldable Keyboard

Ling-Long, a Chinese PC manufacturer, has introduced an innovative device that combines a fully functional AMD Ryzen 7 8840U PC with a foldable keyboard. This design stands out among recent Mini and Portable PC offerings. Unlike Mini PCs, it doesn't require an external power source to boot, and unlike laptops, it lacks a built-in display. Users can simply connect it to a monitor and mouse to create a complete workstation. Ling-Long emphasizes the product's extreme portability, demonstrating how it can fit in a pocket.

Aiming to surpass the compactness and functionality of Apple's Macbook and Mac mini, Ling-Long describes their product as an "unibody" design with a dedicated converting mechanism. Essentially, it's a mini-PC integrated into a keyboard. The device's chassis is divided into two compartments: one for the main PC with a single active-blower fan and copper heatsink, and another for the battery pack. Battery life varies from 10 hours for light workloads to 4 hours for gaming.
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