Earlier this week, it was reported that AMD is preparing at least online media event to announce and detail its upcoming Radeon RX 9070 series next-generation graphics cards powered by the RDNA 4 graphics architecture. It turns out that both the Radeon RX 9070 XT and Radeon RX 9070 will be available on March 6, 2025, according to a report by Uniko's Hardware. Reviews of the two cards should go live some time between the late-February media event and this launch date. AMD launching the RX 9070 XT and RX 9070 on the same date isn't the only thing the two SKUs share. Both SKUs max out the 4 nm "Navi 48" silicon they're based on, and are differentiated by clock speeds. The two are expected to square off against NVIDIA's GeForce RTX 5070 series.

Priced at the equivalent of $116, the China-exclusive Ryzen 5 7400F is a 6-core/12-thread processor powered by the older "Zen 4" microarchitecture, but which is based on the "Raphael" MCM, giving it a comprehensive PCIe Gen 5 I/O (as opposed to designing such a chip based on the "Phoenix Point" monolithic silicon with its PCIe Gen 4 I/O). The chip benefits from the full 32 MB on-die L3 cache being enabled on the "Zen 4" CCD, besides the full 1 MB per core L2 cache, and that I/O, but misses out on the iGPU. At its price, the 7400F is attracting a segment of value-conscious gamers.

To bring this chip at its price point, AMD had to cut costs somewhere, and Chinese PC enthusiast "Melon Master" soon found out where. On de-lidding (removing IHS) of the Ryzen 5 7400F, it was found that the chip does not use a soldered TIM like the other Ryzen 7000 series "Raphael" processors, instead using more cost-effective thermal paste, as is common in entry-level chips from both AMD and Intel. Harukaze5719 comments that this could be the reason the chip has a fairly noticeable Cinebench R23 performance delta against the Ryzen 5 7500F that's globally available, and has STIM, but is priced at $145. The 7400F and 7500F share the same base frequency of 3.70 GHz, but while the former boosts up to 4.70 GHz, the latter goes all the way up to 5.00 GHz.

German PC hardware retailer MindFactory sold an astonishing 25,625 AMD and Intel CPUs in January 2025. However, an honor falls to AMD this time, as Team Red has managed to capture as much as 92.16% (23,615) of all units sold by this retailer. Not only did it leave Intel with 7.84% (2010) of total units sold, AMD also beat Intel in average selling price, where AMD managed to keep ASP at 320 Euros, while Intel buyers were considering some less expensive CPU SKUs at 290 Euros. This has resulted in AMD's revenue share recording 93.45% at 8,300,674 Euros, while Intel left a smaller mark at 6.55% or 581,959 Euros. The best-selling CPU was AMD's Ryzen 7 9800X3D, sold in 8,390 units in January.

A detailed analysis of socket distribution reveals AMD's AM5 platform's overwhelming dominance, securing 18,410 units or 71.84% of total sales. The mature AM4 platform maintains a significant market presence with 5,205 units (20.31%), showing strong continued demand for AMD's previous-generation socket. Intel's LGA 1700, compatible with 12/13/14th generation processors, accounted for 1,745 units (6.81%), while their older platforms showed minimal market penetration. The LGA 1851 socket, supporting Intel's latest Core Ultra 200S processors, managed just 185 units (0.72%), with legacy LGA 1200 and LGA 1151 sockets trailing at 55 (0.21%) and 25 (0.1%) units respectively. AMD's latest platform market performance suggests strong consumer confidence in AM5's upgrade path and performance capabilities. This dramatic market share capture by AMD represents one of the most significant shifts in the desktop CPU market in recent years, particularly notable given the higher average selling prices at which AMD CPUs are now sold.

AMD today announced financial results for the fourth quarter and full year of 2024. Fourth quarter revenue was a record $7.7 billion, gross margin was 51%, operating income was $871 million, net income was $482 million and diluted earnings per share was $0.29. On a non-GAAP basis, gross margin was 54%, operating income was a record $2.0 billion, net income was a record $1.8 billion and diluted earnings per share was $1.09.

For the full year 2024, AMD reported record revenue of $25.8 billion, gross margin of 49%, operating income of $1.9 billion, net income of $1.6 billion, and diluted earnings per share of $1.00. On a non-GAAP basis, gross margin was a record 53%, operating income was $6.1 billion, net income was $5.4 billion and diluted earnings per share was $3.31.

AMD is planning a media event to formally launch the Radeon RX 9070 series next-generation graphics cards some time in late-February 2024, VideoCardz reports. The company could simultaneously announce the flagship Radeon RX 9070 XT, its second-best RX 9070, and new stuff on the software side, such as FSR 4, although availability dates of each could vary. Availability of at least the top RX 9070 XT could be expected in March, the report says. Both the RX 9070 XT and RX 9070 are being prepared by AMD as performance-segment products, where they probably go up against SKUs from NVIDIA's GeForce RTX 5070 series. Given the rather minor performance uplift the RTX 5080 yielded over its previous generation predecessor, the performance segment is in for some competition.

The Radeon RX 9070 XT and RX 9070 are both based on the 4 nm "Navi 48" silicon, which reportedly features 64 compute units for 4,096 stream processors, and a new generation AI accelerator that's both faster and more capable than the one introduced with RDNA 3. There is expected to be a significant uplift in the ray tracing performance, too, reducing the performance cost of enabling ray tracing in games. FSR 4 is expected to leverage the AI acceleration capabilities of RDNA 4 for its super resolution algorithm. Both SKUs are expected to have all 64 CU enabled, but differ in clock speeds. Both are expected to feature 16 GB of older GDDR6 memory across a 256-bit wide memory interface. As for the media event, we gathered from our post-CES roundtable with AMD that the event will at least be an online presentation.

One of AMD's key announcements at its 2025 International CES keynote was the Ryzen 9000HX line of processors, codenamed "Fire Range." A successor to the 7000HX "Dragon Range," this is essentially a BGA package of the "Granite Ridge" MCM, which combines one or two "Zen 5" CCDs with a client I/O die. The processor lacks an NPU and has a basic iGPU, but is meant for enthusiast segment gaming notebooks and portable workstations, as it's meant to be paired with discrete GPUs, taking advantage of the package's lavish 28 PCIe Gen 5 lanes. The Ryzen 9 9955HX3D stands out in the series as the only model with 3D V-Cache, making it possibly the fastest mobile processor for gaming notebooks—faster than even the "Arrow Lake-HX," given how the desktop 9800X3D compares to the Core Ultra 9 285K at gaming.

Notebook OEM Dream Machines put out a press release which specifies that the first notebooks powered by the 9955HX3D will ship either toward the end of March, or early-April 2025. "Fire Range" is known to have scored design wins from several popular notebook OEMs, which means the chips could have a good run at the markets this generation. Notebooks powered by the 9955HX3D and discrete GPU options that include the GeForce RTX 5090 Laptop GPU and the RTX 5070 Ti Laptop GPU, are expected to be priced around €2,530 and €3,860, respectively.

Google Security Research team has just published its latest research on a fundamental flaw in the microcode patch verification system that affects AMD processors from "Zen 1" through "Zen 4" generations. The vulnerability stems from an inadequate hash function implementation in the CPU's signature validation process for microcode updates, enabling attackers with local administrator privileges (ring 0 from outside a VM) to inject malicious microcode patches, potentially compromising AMD SEV-SNP-protected confidential computing workloads and Dynamic Root of Trust Measurement systems. Google disclosed this high-severity issue to AMD on September 25, 2024, leading to AMD's release of an embargoed fix to customers on December 17, 2024, with public disclosure following on February 3, 2025; however, due to the complexity of supply chain dependencies and remediation requirements, comprehensive technical details are being withheld until March 5, 2025, allowing organizations time to implement necessary security measures and re-establish trust in their confidential compute environments.

AMD has released comprehensive mitigation measures through AGESA firmware updates across its entire EPYC server processor lineup, from the first-generation Naples to the latest Genoa-X and Bergamo architectures. The security patch, designated as CVE-2024-56161 with a high severity rating of 7.2, introduces critical microcode updates: Naples B2 processors require uCode version 0x08001278, Rome B0 systems need 0x0830107D, while Milan and Milan-X variants mandate versions 0x0A0011DB and 0x0A001244 respectively. For the latest Genoa-based systems, including Genoa-X and Bergamo/Siena variants, the required microcode versions are 0x0A101154, 0x0A10124F, and 0x0AA00219. These updates implement robust protections across all SEV security features - including SEV, SEV-ES, and SEV-SNP - while introducing new restrictions on microcode hot-loading capabilities to prevent future exploitation attempts.

Report with market evolution powered by AI—The global artificial intelligence (AI) chips market size is estimated to grow by USD 902.6 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 81.2% during the forecast period. Increased focus on developing AI chips for smartphones is driving market growth, with a trend towards convergence of AI and IoT. However, dearth of technically skilled workers for ai chips development poses a challenge. Key market players include Advanced Micro Devices Inc., Baidu Inc., Broadcom Inc., Cerebras, Fujitsu Ltd., Google LLC, Graphcore Ltd., Huawei Technologies Co. Ltd., Intel Corp., International Business Machines Corp., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., SambaNova Systems Inc., Samsung Electronics Co. Ltd., SenseTime Group Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and Tesla Inc.

AMD on Monday released Unreal Engine plugins for FidelityFX Super Resolution (FSR) 3.1.3 and AMD Anti-Lag 2 through its GPUOpen initiative. Both plugins support the latest Unreal Engine 5.5, and can be picked up by game developers to integrate with their ongoing projects or be released as updates to their released games. FSR 3.1.3 succeeds the FSR 3.1.1 major release that had introduced Anti-Lag 2 support among a dozen other updates. The latest FSR version adds Unreal Engine 5.5 support, besides a minor update to the way FSR handles UseDistortionTexture commands. Meanwhile, the Anti-Lag 2 plugin for Unreal Engine 5.5 is being released as part of the latest v2.0.2 release of the technology. There are no other changes. AMD FSR 3.1.3 plugin for Unreal Engine 5.5 can be accessed here, and the Anti-Lag 2 plugin for UE 5.5 here.

AMD is set to share its fourth-quarter results on Tuesday, Feb. 4 facing opportunities and problems in the fast-changing AI chip market as investors are expected to look closely at AMD's AI strategy. Reuters reports that experts think AMD's revenue will increase by over 22% to $7.53 billion. They expect its data center part to make up more than half of total sales at $4.15 billion. Yet, investors still worry about how AMD stands in the AI race. TD Cowen experts and Omdia believe AMD could sell $10 billion worth of AI chips this year, this is twice what AMD itself thinks it will sell, which is $5 billion. However, the scene is getting more complex with Big Tech firms like Microsoft, Amazon, and Meta making their own special chips for AI work. This move to custom chips, along with NVIDIA's strong market position and its popular CUDA software, makes things tough for AMD. The high costs of switching chipmakers also make it hard for AMD to grow its share of the market, however, the ongoing increase in AI spending by tech giants could help balance out these problems. Investors see "customer silicon and NVIDIA as the AI chip market going forward," said Ryuta Makino, analyst at AMD investor Gabelli Funds.

Supply chain issues make AMD's position more difficult as TSMC is boosting its advanced packaging ability to fix bottlenecks, while NVIDIA's production increase of its new "Blackwell" AI chips might restrict AMD's access to manufacturing resources. Yet, AMD's business has some good news, its personal computer unit should grow by almost 33% to $1.94 billion catching up to Intel.

AMD's upcoming Instinct MI400 accelerator series, scheduled for 2026 introduction, is set to incorporate a new Multimedia IO Die (MID) architecture alongside significant compute density improvements. According to recent patches discovered in AMD-GFX mailing lists, the accelerator will feature a dual Active Interposer Die (AID) design, with each AID housing four Accelerated Compute Dies (XCDs)—doubling the XCD count per AID compared to the current MI300 series. Introducing dedicated Multimedia IO Dies is a new entry in AMD's accelerator design philosophy. Documentation reveals support for up to two MIDs, with each likely paired to an AID, suggesting a more specialized approach to multimedia processing and interface management.

Specifications from the Register Remapping Table (RRMT) implementation indicate sophisticated die-to-die communication pathways, with support for local and remote transactions across XCDs, AIDs, and the new MIDs. The system enables granular control over eight potential XCD configurations (XCD0 through XCD7), suggesting that AMD can scale compute up and down with SKUs. While AMD has yet to release detailed specifications for the MI400 series, separating multimedia functions into dedicated dies could optimize performance and power efficiency. As the 2026 launch window approaches, AMD will spend the remaining time refining the software stack and ROCm support for its next-generation accelerator based on UDNA architecture. Since designing an accelerator is a year-long effort from the physical implementation standpoint, we expect the Instinct MI400 design to be finalized by now. All left is silicon bring-up, software optimization, and mass production, likely at TSMC's facilities.

There is hardly a scarcity of mini PCs available on the market. These pocket-friendly computers have an ever-expanding fan base, and now it appears that brands are pulling all sorts of tricks to make their offerings stand out from the rest. Chaatrey is a well-known player in the mini PC segment, and has announced the AMD-powered AN3P mini PC. The product does have quite an interesting feature, which we will get to later.

At its core, the AN3P mini PC is powered by the AMD Ryzen 7 7735HS APU with eight Zen 3+ cores and sixteen threads. Despite having already blown out two birthday candles, the Ryzen 7 7735HS continues to be quite a performant chip in 2025, trading blows with the Intel Core 5 120U in synthetic benchmarks. In terms of memory and storage, the AN3P can be equipped with up to 32 GB of memory, and up to 1 TB of solid-state storage. Both the memory and storage are user-accessible and can be upgraded down the road, which surely is a must-have for many people.

A new Steam Deck mod is here, and the performance improvements that it brings to the table appear to be quite promising, thanks to the magic of frame generation. The gaming handheld is not exactly the most performant in terms of raw GPU performance, so technologies such as AMD's FSR 3 undoubtedly improve the gaming experience on the Deck by quite a substantial degree. Dubbed Decky Framegen, the plugin utilizes AMD FSR 3 to generate frames without having to go about rendering them, thereby increasing FPS quite a lot.

As of right now, this plugin allows gamers to employ frame generation in unsupported games such as Final Fantasy XVI, Witcher 3, Hogwarts Legacy, and a few others. Deck Wizard's detailed video reveals that the plugin does quite a good job, allowing for playable framerates in several titles. However, the games which are unable to manage 30 FPS are unlikely to benefit much, owing to the issues surrounding input lag. Moreover, a few graphical glitches here and there are also to be expected, which is something that many purists might not entirely be willing to deal with. Considering that Valve recently shot rumors of an AMD Ryzen Z2-powered Steam Deck 2 being in the works, there is no denying that those holding out for hardware improvements, still have a fair amount of waiting to do.

As the 2025 International CES was drawing to a close, we hung around a little longer in Las Vegas to catch some important one-on-one interviews with industry leaders. We were invited by AMD to interview David McAfee Corporate Vice President and General Manager of the Client Channel Business. His position in the company gives him a hawk's eye view on everything that matters to you—from Ryzen desktop CPUs to Ryzen AI processors, the disruptive new Ryzen AI MAX chips, and the all important Radeon RX 9000 series powered by RDNA 4. AMD's CES 2025 announcements event had some notable misses, such as the lack of updates on the Radeon RX 9000 series, or even the Ryzen Z2 line of processors for gaming handhelds. We began by asking McAfee how this year's CES event was distinct from previous ones, often led by CEO Lisa Su and covering a wide range of product families.The interview follows.

Mid-week, a member of Valve's Linux graphics driver team updated the Mesa 25.0 documentation with an insightful note—in which, Samuel Pitoiset (lead developer of the RADV open-source driver) shared an early observation regarding AMD's upcoming RDNA 4 generation. The software engineer and his colleagues are busy getting everything finalized prior to an impending Mesa 25.0 feature freeze. Wednesday's patch notes reveal the outlook for "GFX12 on RADV"—Pitoiset seemed satisfied about "initial support expectations—he reckoned that it: "should be good enough, but it's missing two features (cooperative matrix and video decode/encode), compared to GFX11 (RDNA 3) because lack of time. DCC is still under active development, but it might be possible to finish it during the RC period."

According to Phoronix's expert opinion, the two missing features are not complete "show-stoppers" for potential buyers of first wave RDNA 4 GPUs. The site's editor-in-chief—Michael Larabel—posits that the "vast majority of those wanting to buy the Radeon RX 9070 graphics cards (when they launch in March)" will not be discouraged by the inceptive absence of RADV Vulkan Video and VK_KHR_cooperative_matrix. He added some post-publication clarification regarding the RADV patch notes: "this is only about Vulkan Video, not VA-API video acceleration... It seems some readers are taking this to mean VA-API support for the new VCN block isn't ready for RDNA 4. It's just the RADV Vulkan Video support that isn't complete." Mesa 25.0 is expected to reach a stable release stage by the end of February—just ahead of Team Red's next-gen desktop GPU launch. Late last week, an AMD official divulged that their team would be: "taking a little extra time to optimize the software stack for maximum performance" on Radeon RX 9070 XT and Radeon RX 9070 (non-XT) graphics cards.

Intel Corporation today reported fourth-quarter and full-year 2024 financial results. "The fourth quarter was a positive step forward as we delivered revenue, gross margin and EPS above our guidance," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "Our renewed focus on strengthening and simplifying our product portfolio, combined with continued progress on our process roadmap, is positioning us to better serve the needs of our customers. Dave and I are taking actions to enhance our competitive position and create shareholder value."

"The cost reduction plan we announced last year to improve the trajectory of the company is having an impact," said David Zinsner, interim co-CEO and chief financial officer of Intel. "We are fostering a culture of efficiency across the business while driving toward greater returns on our invested capital and improved profitability. Our Q1 outlook reflects seasonal weakness magnified by macro uncertainties, further inventory digestion and competitive dynamics. We will remain highly focused on execution to build on our progress and unlock value."

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled a variety of custom-configurable "50 Series" gaming desktops, featuring NVIDIA's newly revealed GeForce RTX 5080 and RTX 5090 GPUs. Available across seven gaming chassis options—MG-1, North, shroud, shroud Signature Edition, Rush, Force, and Zero, as well as all Workstations—these systems can be custom configured with NVIDIA GeForce RTX 50-series GPUs and the latest CPU options from AMD and Intel to set a new benchmark for desktop gaming performance and customization.

Building on the excitement from CES 2025, MAINGEAR's "50 Series" also introduces non-APEX configurations of the hot new Rush and Force desktops, featuring 360 mm and 420 mm AIO coolers respectively, instead of open loop liquid cooling. Additionally, customers can order Rush desktops with custom chassis artwork for unparalleled personalization - as seen at CES. Available custom designs include Machina, Night Drive and Good Fortune.

Corsair today launched the new edition of its celebrated Vengeance Gaming PCs, featuring NVIDIA GeForce RTX 50 Series graphics cards paired with Intel Core Ultra or AMD Ryzen 9000 Series processors. Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity with full ray tracing, further reduces latency with Reflex 2 technology, multiplies performance with NVIDIA DLSS, generates images at unprecedented speed, and unleashes your creativity with NVIDIA Studio.

Vengeance PCs with GeForce RTX 50 Series GPUs are NVIDIA NIM-ready RTX AI PCs, supporting the latest NIM microservices—optimized AI models for language, speech, vision, content generation, and more. These systems enable enthusiasts and developers to build AI assistants, productivity plug-ins, and innovative content creation workflows with peak performance.

It would be fair to say that the GeForce RTX 5080 has been quite disappointing, being roughly 16% faster in gaming than the RTX 4080 Super. Unsurprisingly, this gives AMD a lot of opportunity to offer excellent price-to-performance with its upcoming RDNA 4 GPUs, considering that the RTX 5070 and RTX 5070 Ti aren't really expected to pull off any miracles. According to a recent tidbit shared by the renowned leaker Moore's Law is Dead, the Radeon RX 9070 XT is expected to be around 3% faster than the RTX 4080, if AMD's internal performance goals are anything to go by. MLID also notes that RDNA 4's performance is improving by roughly around 1% each month, which makes it quite likely that the RDNA 4 cards will exceed the targets.

If it does turn out that way, the Radeon RX 9070 XT, according to MLID, should be roughly around 15% faster than its competitor from the Green Camp, the RTX 5070 Ti, and roughly match the RTX 4080 Super in gaming performance. The Radeon RX 9070, on the other hand, is expected to be around 12% faster than the RTX 5070. Of course, these performance improvements are limited to rasterization performance, and when ray tracing is brought to the scene, the performance improvements are expected to be substantially more modest, as per tradition. Citing our data for Cyberpunk 4K with RT, MLID stated that his sources indicate that the RX 9070 XT falls somewhere between the RTX 4070 Ti Super and RTX 3090 Ti, whereas the RX 9070 should likely trade blows with the RTX 4070 Super. Considering AMD's track record with ray tracing, this sure does sound quite enticing.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

ASRock has quietly updated its CPU Support List with entries for the upcoming AMD Ryzen 9 9950X3D and 9900X3D desktop processors—starting off with motherboard BIOS versions 3.15 and 3.16. The Taiwanese manufacturer seems to be the very first company to add these "Zen 5" models to public-facing motherboard compatibility databases—according to yesterday evening's VideoCardz report, the likes of MSI, GIGABYTE, and ASUS have not yet followed suit (at the time of writing). The appearance of Team Red's "Granite Ridge" 16-core and 12-core 3D V-Cache-equipped processors on ASRock's website has set off chatter across PC hardware discussion communities.

AMD has not officially revealed a specific launch date (or pricing details) for its Ryzen 9 9950X3D and 9900X3D CPUs—instead, a loose March window has been marked down on this year's calendar. Industry watchdogs believe that ASRock's freshly updated database is proof of an imminent launch—a couple of insiders predicted a January rollout, but this seems unlikely to occur by the end of this working week. Given the reported scarcity of Team Red's already released and highly-praised Ryzen 7 9800X3D gaming processor, many folks will welcome the addition of two alternative options. Team Red has already set expectations for the (presumably) more expensive models—recently, a product manager disclosed that their "new chips will provide similar overall gaming performance" to the current champion.

If you're looking for innovative use of AI technology, look to the cloud. Gartner reports, "73% of respondents to the 2024 Gartner CIO and Tech Executive Survey have increased funding for AI." And IDC says that AI: "will have a cumulative global economic impact of $19.9 trillion through 2030." But end users aren't running most of those AI workloads on their own hardware. Instead, they are largely relying on cloud service providers and large technology companies to provide the infrastructure for their AI efforts. This approach makes sense since most organizations are already heavily reliant the cloud. According to O'Reilly, more than 90% of companies are using public cloud services. And they aren't moving just a few workloads to the cloud. That same report shows a 175% growth in cloud-native interest, indicating that companies are committing heavily to the cloud.

As a result of this demand for infrastructure to power AI initiatives, cloud service providers are finding it necessary to rapidly scale up their data centers. IDC predicts: "the surging demand for AI workloads will lead to a significant increase in datacenter capacity, energy consumption, and carbon emissions, with AI datacenter capacity projected to have a compound annual growth rate (CAGR) of 40.5% through 2027." While this surge creates massive opportunities for service providers, it also introduces some challenges. Providing the computing power necessary to support AI initiatives at scale, reliably and cost-effectively is difficult. Many providers have found that deploying AMD EPYC CPUs and Instinct GPUs can help them overcome those challenges. Here's a quick look at three service providers who are using AMD chips to accelerate AI advancements.

AMD's small portfolio of current-gen (RDNA 3) mobile-oriented Radeon dedicated GPUs pales in comparison to a wide selection of related desktop offerings—a certain demographic of PC gamers have wondered whether the incoming RDNA 4 generation will produce more options for portable platforms. An extensive Notebookcheck article indicates that Team Red is not (immediately) interested in catering to mobile dGPU enthusiasts—the online publication conducted an interview with Ben Conrad, director of product management (client-side). The "Navi Mobile" Radeon RX 7000M range is an uncommon sight on gaming laptops—relative to NVIDIA's wide rollout of dedicated GeForce RTX 4000 Mobile GPUs—normally, higher-end models are present on ultra-expensive specification sheets (paired with "Dragon Range" Ryzen HX CPUs). Industry experts believe that lower-end options are more likely to turn up inside external enclosures.

One of Notebookcheck's questions focused in on this topic—they believe that: "the number of AMD dGPU-based laptop SKUs have been pretty anemic." Their interviewee was ambushed with a query regarding his company's outlook for mobile RDNA 4 options. In response, Conrad stated: "our current graphics strategy is focused on the desktop market with RDNA 4. So, I think you'll see those types of products first in the future. Certainly, RDNA 4 and future graphics technologies will make it into mobile, whether they be on APUs or future products." VideoCardz has read "between-the-lines" and posits that Team Red could skip a generation—UDNA is possibly a better fit for a new wave of laptop dGPUs. A sort-of stopgap has appeared on the horizon—in the shape of AMD's forthcoming "Strix Halo" RDNA 3.5-based integrated solution. The flagship chip's Radeon 8060S iGPU looks promising when compared to a current-gen dGPU, but it will likely struggle when pitted against Team Green's "Blackwell" dedicated mobile platform. Upcoming competition in the APU field will arrive in the form of Intel's "Panther Lake" processors—slated for launch later this year. Its next-gen iGPU is said to utilize the Xe3 "Celestial" architecture.

Earlier in the month, AMD introduced multiple Ryzen 200 series CPU models—these mainstream laptop and desktop offerings are based on well established architectures. Team Red is once again treading familiar ground with its selection of "Hawk Point" hardware—featuring "Zen 4" CPU cores, as well as (RDNA 3) Radeon 700M series integrated graphics solutions. AMD's latest mild re-branding of existing designs—notably the Ryzen 8000 mobile APU series—are expected to arrive within the second quarter of 2025. Several of these "new" products will sport NPUs, but marketing/press material is surprisingly free of all things AI-related.

Yesterday, a Lenovo China product manager revealed that the entire Ryzen 200 product stack will adopt the FP8 chip package—formerly exclusive to the region-exclusive Ryzen 7 8745H APU. The Beijing-based company representative disclosed—via a Weibo blog post—that the incoming Ryzen 200 processor series will not use the "FP7 and FP7r2" formats. Additionally, they also introduced a previously unannounced SKU: "the FP8 package version of Ryzen 7 8745H will be launched in 2025 as Ryzen 7 255H." This model is likely another Chinese exclusive—the Weibo comment section provides further evidence of new Lenovo ThinkBook products being based on this Ryzen 7 255H. AMD's official listings have quietly confirmed that their Ryzen 200 series will be FP8-exclusive. Team Green is likely making matters easier for itself, by streamlining its packaging options for this affordable-tier of laptop-oriented chips.

Intel has implemented substantial price cuts across its Xeon 6 "Granite Rapids" server processor lineup, marking a significant shift in its data center strategy. The reductions, quietly introduced and reflected in Intel's ARK database, come just four months after the processors' September launch. The most dramatic cut affects Intel's flagship 128-core Xeon 6980P, which saw its price drop from $17,800 by 30% to $12,460. This aggressive pricing positions the processor below AMD's competing EPYC "Turin" 9755 128-core CPU both absolute and per-core pricing, intensifying the rivalry between the two semiconductor giants. AMD's SKU at 128 cores is now pricier at $12,984, with higher core count SKUs reaching up to $14,813 for 192-core EPYC 9965 CPU based on Zen 5c core. Intel is expected to release 288-core "Sierra Forest" Xeon SKUs this quarter, so we can get an updated pricing structure and compare it to AMD.

Additionally, Intel's price adjustments extend beyond the flagship model, with three of the five Granite Rapids processors receiving substantial reductions. The 96-core Xeon 6972P and 6952P models have been marked down by 13% and 20% respectively. These cuts make Intel's offerings particularly attractive to cloud providers who prioritize core density and cost efficiency. However, Intel's competitive pricing comes with trade-offs. The higher power consumption of Intel's processors—exemplified by the 96-core Xeon 6972P's 500 W requirement, which exceeds AMD's comparable model by 100 W—could offset the initial savings through increased operational costs. Ultimately, most of the data center buildout will be won by whoever can serve the most CPU volume shipped (read wafer production capacity) and the best TCO/ROI balance, including power consumption and performance.