In addition to the new Zen 5 Ryzen 9000 series desktop CPUs and Ryzen AI 300 series mobile CPUs, as well as the new Ryzen 5000XT series AM4 socket desktop CPUs and updates to the AMD Instinct AI GPU roadmap, AMD rather silently announced the new Radeon PRO W7900 Dual Slot workstation graphics card at the Computex 2024. While not a completely new product, as it is just a model update of the currently available flagship Radeon PRO W7900 workstation graphics card, it is still a rather important update since AMD managed to squeeze it into a dual-slot design, which gives it support for multi-GPU setups.

As said, the AMD Radeon PRO W7900 Dual Slot still uses the same Navi 31 GPU with 96 Compute Units (CUs), 96 Ray Accelerators, 192 AI Accelerators, and 6144 Stream Processors, as well as 48 GB of GDDR6 ECC memory on a 384-bit memory interface, giving it maximum memory bandwidth of 864 GB/s. It still needs 2x8-pin PCIe power connectors and has a Total Board Power (TBP) of 295 W. The card still comes with three DisplayPort 2.1 and one Enhanced Mini DisplayPort 1.2 outputs. What makes the new Radeon PRO W7900 Dual Slot special is the fact that AMD managed to get it down to a dual-slot design, even with the same blower-fan cooler. Unfortunately, it is not clear if the fan or its profiles are different, but it does make it suitable to be used in multi-GPU configurations.

At Computex 2024, ASUS unveiled major updates to its popular laptop lineups, designed for the "Copilot+" era of AI computing. The first is the Zenbook S16 is a premium 16-inch laptop series powered by AMD's latest Ryzen AI 9 HX 370 processors with dedicated AI acceleration. Remarkably, ASUS has managed to pack this high-performance silicon into an ultra-portable 1.1 cm thin chassis weighing just 1.5 kg. The Zenbook S16 integrates AMD's new NPU capable of a 50 TOPS of AI compute for accelerating AI/ML workloads. The centerpiece is the laptop's stunning 16-inch 3K OLED display made with ASUS Lumina technology. It offers 100% vibrant DCI-P3 color gamut coverage, a blazing-fast 120 Hz refresh rate with 0.2 ms response time, and up to 600 nits brightness. ASUS paired this premium visual experience with a six-speaker audio system for an immersive multimedia experience.

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.Update 07:03 UTC: We have some pricing and availability details from Schenker.

During Computex 2024, GIGABYTE unveiled its new "AI TOP" series designed to empower users to develop and run AI applications locally on their systems. The AI TOP lineup includes AI-optimized motherboards, graphics cards, and complete system solutions. The flagship motherboard is called TRX50 AI TOP, which boasts support for AMD's Ryzen Threadripper 7000 PRO and a regular series of CPUs. The flagship TRX50 AI TOP motherboard features a special VRM design with beefy heatsinks, four PCIe 5.0 x16 slots for quad-GPU setup, eight-channel DDR5 memory with room for eight DIMMs, and a few M.2 PCIe Gen 5 slots. Next in the AI TOP line is the GIGABYTE GeForce RTX 4070 Ti SUPER AI TOP edition. Formed as a blower-style cooler, the RTX 4070 Ti SUPER AI TOP is envisioned for tight spaces and parallel installation with other GPUs to accelerate local AI development and inference.

Supposedly, there will be more AI TOP motherboards and GPUs than what is showcased. GIGABYTE may have an AI TOP makeover for Intel's upcoming Z890 AORUS Xtreme, and there could be more GPUs in the future with the blower-style AI TOP design. The goal of AI TOP series is optimization for AI workloads, which require lots of GPUs and lots of memory, like the TRX50 AI TOP motherboard shows.

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.

AMD Socket AM4 is now an 8-year-old platform, since its debut back in 2016. AMD objectively went above and beyond for this platform, launching processors powered by the original "Zen," the refreshed "Zen+," the "Zen 2," and the Intel-beating "Zen 3" microarchitecture, including 3D V-cache versions of the "Zen 3" that were competitive even with Intel's 12th Gen Core "Alder Lake" processors in gaming. Those on older processors on AM4 are spoiled for choice with upgrades within the platform, without having to change it, with AMD releasing new processor models every year for the past 8 years. The 2024 launches include the Ryzen 5000XT series.

It's hard to call the Ryzen 5000XT a "series," since there are only two SKUs—the Ryzen 9 5900XT, and the Ryzen 7 5800XT. Neither of the two feature 3D V-cache, but push clock speeds up. The Ryzen 9 5900XT is a 16-core/32-thread part, and is not meant to be confused with the 5900X, which is a 12-core/24-thread part. The 16-core 5900XT comes with a maximum boost frequency of 4.80 GHz, which is 100 MHz less than that of the 5950X. It has the same 105 W TDP, and a significantly lower $360 price. The Ryzen 7 5800XT, on the other hand, is an 8-core/16-thread chip with 4.80 GHz maximum boost frequency, compared to the 4.70 GHz of the 5800X, and the same 105 W TDP. It's priced around $260. Both chips include an AMD Wraith Prism RGB cooler that's capable of handling 140 W TDP processors. The Ryzen 9 5900XT is claimed by AMD to offer similar gaming performance to the Intel Core i7-13700K; while the 5800XT is claimed to play games competitively to the Intel Core i5-13600KF. Both chips should be available sometime in July, 2024.

AMD today announced its much awaited Ryzen 9000 series desktop processors. Built in the Socket AM5 package, and drop-in compatible with all current AM5 motherboards with a BIOS update, the processors are based on the new "Zen 5" CPU microarchitecture. The operational part of the processor, the CPU complex dies (CCDs), are built on the 4 nm process, wired to a 6 nm I/O die. AMD didn't get down into the nuts and bolts of the microarchitecture, but briefly mentioned an impressive 16% IPC increase over "Zen 4." Coupled with the fact that the first wave of processors lack 3D V-cache and can sustain higher boost frequencies and TDP, processors in the series should beat the Ryzen 7 7800X3D in gaming performance, which also means that AMD has beaten the 14th Gen Core "Raptor Lake Refresh" processor series by a significant margin.

The 16% IPC increase over "Zen 4" is backed by branch prediction improvements, wider pipelines and vectors, and deeper window sizes across the core design, for more parallelism. The core also features doubling in instruction bandwidth for front-end instructions, FPU to L1, and L1 to L2 data bandwidth, and a redesigned FPU to double AI performance and AVX512 throughput. The company hasn't put out a block design for "Zen 5," and we'll learn more about it in the run-up to the market availability of these chips some time in July 2024.

AMD today launched its Ryzen AI 300 series mobile processors, codenamed "Strix Point." These chips implement a combination of the AMD "Zen 5" microarchitecture for the CPU cores, the XDNA 2 architecture for its powerful new NPU, and the RDNA 3+ graphics architecture for its 33% faster iGPU. The new "Zen 5" microarchitecture provides a 16% generational IPC uplift over "Zen 4" on the backs of several front-end enhancements, wider execution pipelines, more intra core bandwidth, and a revamped FPU that doubles performance of AI and AVX-512 workloads. AMD didn't go in-depth with the microarchitecture, but the broad points of "Zen 5" are detailed in our article for the Ryzen 9000 "Granite Ridge" desktop processors. Not only is AMD using these faster "Zen 5" CPU cores, but also increased the CPU core count by 50%, for a maximum of 12-core/24-thread.

The "Strix Point" monolithic silicon is built on the 4 nm foundry node, and packs a CPU core complex (CCX) with 12 CPU cores, four of these are "Zen 5," which can achieve the highest possible boost frequencies, the other eight are "Zen 5c" cores that feature an identical IPC and the full ISA, including support for SMT; but don't boost as high as the "Zen 5" cores. AMD is claiming a productivity performance increase ranging between 4% and 73% for its top model based in the series, when compared to Intel's Core Ultra 9 185H "Meteor Lake" processor. The iGPU sees its compute unit (CU) count go all the way up to 16 from 12 in the previous generation, and this yields a claimed 33% increase in iGPU gaming performance compared to the integrated Arc graphics of the Core Ultra 9 185H. Lastly, the XDNA 2 NPU sees more that triple the AI inference performance to 50 AI TOPS, compared to the 16 TOPS of the Ryzen 8040 "Hawk Point" processor, and 12 TOPS of Core Ultra "Meteor Lake." This makes the processor meet Microsoft's Copilot+ AI PC requirements.

We are live from Computex 2024 in Taipei, where AMD CEO Dr Lisa Su takes center-stage to announce what's next from the world of AMD. The company is expected to announce its new "Zen 5" CPU architecture powering new processors across form-factors. In particular, the company is expected to announce processors for the new AI PC Copilot+ standard announced recently by Microsoft. Several more announcements are expected from the world of datacenters and AI GPU acceleration.01:26 UTC: Setting the tone of things to come is this graphic flashing on the screens. Given the colors, we expect AI announcements both in the enterprise and client segments, but beginning with the enterprise side of it.01:38 UTC: And we're up, with a TAITRA introduction of AMD.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in AI servers and green computing, today announced its participation in COMPUTEX and unveiling of solutions tackling complex AI workloads at scale, as well as advanced cooling infrastructure that will lead to greater energy efficiency. Additionally, to support innovations in accelerated computing and generative AI, GIGABYTE will have NVIDIA GB200 NVL72 systems available in Q1 2025. Discussions around GIGABYTE products will be held in booth #K0116 in Hall 1 at the Taipei Nangang Exhibition Center. As an NVIDIA-Certified System provider, GIGABYTE servers also support NVIDIA NIM inference microservices, part of the NVIDIA AI Enterprise software platform.

Redefining AI Servers and Future Data Centers
All new and upcoming CPU and accelerated computing technologies are being showcased at the GIGABYTE booth alongside GIGA POD, a rack-scale AI solution by GIGABYTE. The flexibility of GIGA POD is demonstrated with the latest solutions such as the NVIDIA HGX B100, NVIDIA HGX H200, NVIDIA GH200 Grace Hopper Superchip, and other OAM baseboard GPU systems. As a turnkey solution, GIGA POD is designed to support baseboard accelerators at scale with switches, networking, compute nodes, and more, including support for NVIDIA Spectrum -X to deliver powerful networking capabilities for generative AI infrastructures.

ASUS today announced the ROG Ally X, its ambitious new handheld game console that's a step up from the ROG Ally that the company launched last year. The ROG Ally X is powered by the same AMD Ryzen Z1 Extreme processor as the ROG Ally, but with 50% more unified memory—now up to 24 GB of LPDDR5X-7500, which runs at an 18% higher speed than the 16 GB LPDDR5-6400 of the original. The designers also implemented an M.2-2280 NVMe SSD slot, which opens the console up to the widest possible selection of NVMe SSDs. The console includes a 1 TB drive, which is double that of the 500 GB that the ROG Ally comes with. The company has also significantly upgraded the thermal solution of the console with a larger fan, and better thermal venting, which offers 6°C lower gaming temperatures.

Perhaps the biggest feature upgrade is the battery, which is 80 Wh, a 100% increase from the 40 Wh of the original ROG Ally. This may not be a linear 100% increase in battery life from the ROG Ally (due to the various hardware upgrades), but should still pose significant improvements to it. Other hardware updates include USB4, which includes DisplayPort passthrough from the iGPU; besides a separate USB 3.2 Gen 2 type-C. The console supports USB-PD with 140 W fast-charging, and is paired with a first-party GaN-based 140 W fast-charger. Dimensions are similar to those of the ROG Ally, except for 4 mm added thickness, and 70 g added weight (608 g vs. 678 g). Available from July, the ROG Ally X is priced at $799, and includes a 3-month Xbox Game Pass. We went hands on with the console at ASUS's pre-Computex event. Stay tuned for several more announcements form the company in the coming days.

AMD has announced a new bug bounty program with prizes for individuals and public researchers. The company is partnering with the cloud security provider Intigriti on this new "bugs hunting campaign", this time, they have a better reward system with up to $30,000 in cash up for grab, while more people can take part. Bug bounties are not new in the industry, with modern hardware, bugs and issues have increased, this being a good way for companies to find vulnerabilities without spending too much on detection.

Individuals look for bugs, and then send a report to the company describing the bug and its impacts, AMD then gives prizes to the hunters based on factors like bug severity. It will be at least interesting to see what happens with AMD's new bug bounty program since public researchers can now take part.

(Eligible list with products and technologies below)

ASRock is ready with the first Radeon RX gaming graphics card to feature a modern 12V-2x6 power connector, replacing the up to three 8-pin PCIe power connectors it took, to power a Radeon RX 7900 series graphics card. The ASRock RX 7900 series WS graphics cards are also the first 2-slot RX 7900 series graphics cards. They target workstations and GPU rendering farms that stack multiple graphics cards into 4U or 5U rackmount cases, with no spacing between 2-slot graphics cards. ASRock is designing cards based on both the RX 7900 XT, and the flagship RX 7900 XTX.

The ASRock RX 7900 series WS graphics cards appear long and no more than 2 slots thick. To achieve these dimensions, a lateral-flow cooling solution is used, which combines a dense aluminium or copper channel heatsink with a lateral blower. Remember we said these cards are meant for workstations or rendering farms? So the noise output will be deafening, at least up to datacenter standards. The most striking aspect of these cards of course is their 12+4 pin ATX 12V-2x6 power input, which is capable of drawing 600 W of continuous power from a single cable. It's located at the card's tail-end, where it would have been an engineering challenge to put three 8-pin connectors.

AMD is debuting its Ryzen 9000 series "Granite Ridge" desktop processors powered by the "Zen 5" microarchitecture later this year. These chips are compatible with existing AMD 600-series chipset motherboards with a simple UEFI firmware update, but the company is also taking the opportunity to launch the AMD 800-series chipset family alongside these chips. The lineup will be led by the AMD X870E, followed by the X870. These two chipsets should launch immediately alongside the new processors, but will later be joined by the AMD B850 and B840. There's no entry-level chipset planned, the AMD A620 will continue to hold the fort for AMD here. There is an interesting new mix of product differentiation, according to a leaked GIGABYTE slide scored by VideoCardz.

If you recall, the X670E and X670 were differentiated by a lack of Gen 5 PCI-Express x16 PEG slots on the X670, which instead was limited to Gen 4 on the PEG slot. The X670 still had Gen 5 NVMe slots attached to the CPU, and had practically the same I/O features as the X670E, including the same counts of downstream PCIe Gen 4 general purpose lanes. Both the X670E and X670 are 2-chip solutions, in that the second chip is a connected to the general purpose PCIe lanes of the first chip, which in turn is connected to the processor. Things are going to change with the 800-series. The top-spec X870E will be a 2-chip solution, with PCIe Gen 4 general purpose lane counts resembling the X670E; but the X870 is a single-chip solution that more closely resembles the B650E in I/O. The X870 (non-E) now gives you Gen 5 PCI-Express x16 PEG, just like the X870E and the B650E, and at least one Gen 5 x4 NVMe slot attached to the CPU, but has fewer downstream Gen 4 general purpose PCIe lanes than the X670. Both the X870E and X870 assure USB4 connectivity, and support CPU overclocking. Things get very interesting in the mid-range.

Although it has been rumoured for a little while now that AMD might be launching Ryzen 5000XT CPUs, that rumour just got some added fuel to the fire courtesy of @CodeCommando_ on X/Twitter. The leaker provided a somewhat pixelated screenshot of two new AM4 CPUs, namely the Ryzen 9 5900XT and the Ryzen 7 5800XT. This is one less CPU compared to the Ryzen 3000XT series that AMD launched in 2020 and it looks like the benefits on offer are similar as well. Both chips are 105 Watt parts and have a maximum boost speed of 4.8 GHz, but this is where the similarities end. The Ryzen 9 5900XT has a rather odd SKU name, as it has the same max boost clock as the Ryzen 9 5900X, but the same core and cache count as the Ryzen 5950X.

The Ryzen 7 5800XT on the other hand is a pretty straightforward 100 MHz higher clock speed SKU over the Ryzen 7 5800X, which makes one wonder why AMD even bothered. According to VideoCardz, we're looking at a US$359 MSRP for the Ryzen 9 5900XT, with the Ryzen 7 5800XT coming in at US$249, making both a potentially interesting enough upgrade option for someone that is still using an older AM4 CPU. The pricing and CPU details are said to have been revealed at a pre-Computex media briefing, so it's highly likely that the information is correct. Both chips are said to hit retail in July.

An alleged company slide by motherboard maker GIGABYTE leaked a few interesting tidbits about the upcoming AMD Ryzen 9000 "Granite Ridge" Socket AM5 desktop processor powered by the "Zen 5" microarchitecture. To begin with, we're getting our first confirmation that the "Zen 5" common CCD used on "Granite Ridge" desktop processors and future EPYC "Turin" server processors, is built on the 4 nm EUV foundry node by TSMC, an upgrade from the 5 nm EUV node that the "Zen 4" CCD is built on. This could be the same version of the TSMC N4 node that AMD had been using for its "Phoenix" and "Hawk Point" mobile processors.

AMD is likely carrying over the client I/O die (cIOD) from the "Raphael" processor. This is built on the TSMC 6 nm DUV node. It packs a basic iGPU based on RDNA 2 with 2 compute units; a dual-channel DDR5 memory controller, and a 28-lane PCIe Gen 5 root complex, besides some SoC connectivity. AMD is rumored to be increasing the native DDR5 speeds for "Granite Ridge," up from the DDR5-5200 JEDEC-standard native speed, and DDR5-6000 "sweetspot" speed of "Raphael," so the cIOD isn't entirely the same.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is excited to announce its participation in the upcoming COMPUTEX Taipei 2024. AI has been a hot topic in the IT industry in recent years. ASRock keeps up with the trends, showcasing the latest AI solutions. In addition, creating an impressive gaming environment is one of ASRock's commitments for gamers. Visitors can explore the latest products and AI computing solutions firsthand and experience the gaming simulator at ASRock booth L0818.

Full Firepower Display of Next Gen Motherboard Platform
ASRock will also be revealing its full range of next generation Intel & AMD motherboards including the new line up of Taichi & Phantom Gaming Series, the robust Steel Legend, newly designed Livemixer and mainstream Pro series. The high end Taichi brand will receive its major repositioning and reorganized to be ASRock' s flagship series by merging with existing OC Formula & AQUA product line. Alongside the next gen Phantom Gaming series, the full array of Taichi AQUA, Taichi OCF, Taichi and Taichi Lite motherboards will also be revealed during Computex 2024!

Acer today announced a new range of AI-enhanced TravelMate business laptops. Powered with the latest generation of processors with built-in NPUs, the new laptops offer professionals and executives next-level performance, productivity, and mobility, in addition to enhanced security and connectivity features.

Optimized to deliver new AI-powered capabilities and user experiences, all of the new business laptops come with Acer TravelMateSense for quick access to device management settings and customizations, a new Acer Experience Zone for the collection of the devices' AI features, and Copilot accessible through a dedicated hotkey. Each model also offers advanced security and administration features to streamline device deployment and management for business, ensuring data are safeguarded with discrete Trusted Platform Module (TPM) 2.0, biometric security, and a camera privacy shutter.

God of War Ragnarök will be coming to PC on September 19, 2024! Santa Monica Studio's development partner for God of War (2018) on PC, Jetpack Interactive, is back to help deliver the PC version of God of War Ragnarök. Alongside the release date, we'd also like to share a selection of the features that will be available (Account for PlayStation Network is required).

Unlocked framerates
Experience the epic conclusion of Kratos and Atreus' journey in the Norse saga at peak performance. Unlocked framerates and the option of true 4K resolution expand the full potential of the cinematic no-cut camera as you travel through the stunning vistas of the Nine Realms to do battle against deadly foes in the forms of Norse gods and monsters.

According to a report by KED Global, Korean chipmaking giant Samsung is ramping up its efforts to compete with global giants like TSMC and Intel. The latest partnership on the horizon is AMD's collaboration with Samsung. AMD is planning to utilize Samsung's cutting-edge 3 nm technology for its future chips. More specifically, AMD wants to utilize Samsung's gate-all-around FETs (GAAFETs). During ITF World 2024, AMD CEO Lisa Su noted that the company intends to use 3 nm GAA transistors for its future products. The only company offering GAAFETs on a 3 nm process is Samsung. Hence, this report from KED gains more credibility.

While we don't have any official information, AMD's utilization of a second foundry as a manufacturing partner would be a first for the company in years. This strategic move signifies a shift towards dual-sourcing, aiming to diversify its supply chain and reduce dependency on a single manufacturer, previously TSMC. We still don't know what specific AMD products will use GAAFETs. AMD could use them for CPUs, GPUs, DPUs, FPGAs, and even data center accelerators like Instinct MI series.

AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft today announced they have aligned to develop a new industry standard dedicated to advancing high-speed and low latency communication for scale-up AI systems linking in Data Centers.

Called the Ultra Accelerator Link (UALink), this initial group will define and establish an open industry standard that will enable AI accelerators to communicate more effectively. By creating an interconnect based upon open standards, UALink will enable system OEMs, IT professionals and system integrators to create a pathway for easier integration, greater flexibility and scalability of their AI-connected data centers.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, introduced the latest all-round B650E AORUS PRO X USB4 motherboard. Built-in with Dual USB4 ports and comprehensive leading features, B650E AORUS PRO X USB4 enables users to enjoy the most affordable next-gen AM5 platform in advance.

With blisteringly fast and reliable transfer speeds, extensive compatibility, efficient charging, and ultra-HD display connectivity, USB4 has evidently become an essential specification on the coming next-gen AM5 platform. Among the increasing number of USB4-ready devices on the market, the B650E AORUS PRO X USB4 exclusively features dual native USB4 ports, providing up to 40 Gbps on each port with support for all Ryzen processors. Uniquely, this total 40 Gbps bandwidth can be fully used for data transferring, unlike Thunderbolt 4, which shares bandwidth between data and video. Aside from the full 40 Gbps USB4, B650E AORUS PRO X USB4 also offers superb connectivity with Wi-Fi 7 using GIGABYTE's Ultra-High Gain antenna and 2.5 GbE LAN.

Microsoft on Wednesday made the DirectSR API Preview available to game developers through the DirectX GitHub. The API aims to simplify implementation of super-resolution technologies with games. A super-resolution technology renders your game at a lower resolution that your display resolution, and upscales it to your display resolution using intelligent upscalers that attempt to reconstruct details lost to the process. This yields a significant gain in performance from the lower render resolution, and lets you max out game settings—something you could only do if your hardware was up to it. By default, DirectSR provides an upscaling technology based on AMD FSR 2.2, but the API looks for the best available technology available with the graphics drivers that are supported by the game. All three discrete GPU makers responded positively to DirectSR.

An AMD Ryzen 9000 "Granite Ridge" desktop processor engineering sample with a maximum boost frequency of 5.80 GHz was found to offer an astonishing 19% higher single-threaded performance increase over an AMD Ryzen 9 7950X. "Granite Ridge" is codename for the Socket AM5 desktop processor family that implements the new "Zen 5" CPU microarchitecture. The unnamed "Granite Ridge" processor comes with an OPN code of 100-0000001290. Its CPU core count is irrelevant, as the single-threaded performance is in question here. The processor boosts up to 5.80 GHz, which means the core handling the single-threaded benchmark workload is achieving this speed. This speed is 100 MHz higher than the 5.70 GHz that the Ryzen 9 7950X processor based on the "Zen 4" architecture, boosts up to.

The single-threaded benchmark in question is the CPU-Z Bench. The mostly blurred out CPU-Z screenshot that reveals the OPN also mentions a processor TDP of 170 W, which means this engineering sample chip is either 12-core or 16-core. The chip posts a CPU-Z Bench single-thread score of 910 points, which matches that of the Intel Core i9-14900K with its 908 points. You've to understand that the i9-14900K boosts one of its P-cores to 6.00 GHz, to yield the 908 points that's part CPU-Z's reference scores. So straight off the bat, we see that "Zen 5" has a higher IPC than the "Raptor Cove" P-core powering the i9-14900K. Its gaming performance might end up higher than the Ryzen 7000 X3D family.Many Thanks to TumbleGeorge for the tip.

BoostR is an Indiegogo crowdfunded project that seeks to integrate a multi-functional I/O dock with an external GPU. It's a rather brilliant idea—the dock draws connectivity from a USB4 (40 Gbps) connection, which it uses to connect an AMD Radeon RX 7600M GPU, an M.2-2280 NVMe SSD slot, a 1 GbE networking interface, an SD 4.0 card reader, and a bunch of USB 3.2 downstream ports.

The device comes with a power brick, and by default draws 100 W for all its functions, including the eGPU. You can boost the power limit to 120 W, which should improve the GPU's performance. The GPU puts out a couple of HDMI 2.1 and DisplayPort 2.0 connectors. BoostR was briefly available on Indiegogo at an early-bird price of $499, at which it would undercut the Ayaneo OneXGPU, a similar contraption of an eGPU+M.2+port dock that's priced at $699. One area where the BoostR has an edge over the OneXGPU is its 120 W mode that give the GPU improved boost frequency residency. It remains to be seen what the regular price of BoostR will be, but the company is offering a 5% discount on the final price if you sign up for their newsletter.