AMD is rumored to be readying two new entry-level desktop GPU models in the Radeon RX 7000 series. These are the RX 7400 and the RX 7300, which probably succeed the RX 6500 XT and RX 6400, respectively. Perhaps the most interesting aspect of the two are the silicon they're based on. Apparently, AMD is carving the two out from its 6 nm "Navi 33," the same chip it uses for its Radeon RX 7600 and RX 7600 XT SKUs.

The "Navi 33" monolithic silicon is based on the RDNA 3 graphics architecture, and has 16 workgroup processors (WGPs), or 32 compute units (CU), worth 2,048 stream processors, 64 AI accelerators, 32 Ray accelerators, 128 TMUs, and 64 ROPs. The silicon is maxed out in the RX 7600 and RX 7600 XT, and we haven't seen anything to suggest the existence of a desktop RX 7500, which means the RX 7400 and RX 7300 could be heavily cut down from the chip, with AMD reducing not just the CU count, but even the 128-bit GDDR6 memory bus width.

A fleet of recent reports have highlighted stability issues affecting Intel's 13th and 14th-generation desktop processors, raising concerns among consumers and industry professionals. The problem, which has gained significant attention over the past few months, is related to the processors' physical degradation over time. Custom PC builder Puget Systems has shared insights from its experience with these processors, revealing a nuanced perspective on the issue. While it has observed an increase in CPU failures, particularly with the 14th-generation chips, its failure rates remain notably lower than those reported by some game development studios and cloud gaming providers, who have cited failure rates as high as 50%. An interesting observation is that Puget Systems recorded a higher failure rate with AMD Ryzen 5000 and Ryzen 7000 series than Intel's 13/14th generation, with most failures happening at Puget's shop rather than the "field" in customers' hands.

Puget Systems attributes their more modest failure rates of Intel processors to their conservative approach to power management settings. By adhering strictly to Intel's specifications and developing their own power settings that don't hurt performance, they've managed to mitigate some of the stability issues plaguing other users. Intel has acknowledged the problem and announced plans to release a microcode patch by mid-August, with extended warranty program. This update is expected to prevent further degradation but may not reverse existing damage. Despite the elevated failure rates, Puget Systems' data shows that the issue, while concerning, still needs to be at critical levels for their operations. The company reports that failure rates for 13th and 14th gen Intel processors, while higher than ideal, are still lower than those they experienced with Intel's 11th gen chips and some AMD Ryzen processors. In response to the situation, Puget Systems is taking several steps, including maintaining its current power management practices, promptly validating Intel's upcoming microcode update, and extending warranties for affected customers. Below, you can see failure rates by month, by Intel's Core generation, as well as by "shop" vs "field" testing.

NVIDIA has reportedly been hit with a US Department of Justice (DOJ) antitrust probe over the tactics the company allegedly employs to sell or lease its AI GPUs and data-center networking equipment, "The Information" reported. Shares of the NVIDIA stock fell 3.6% in the pre-market trading on Friday (08/02). The main complainants behind the probe appear to be a special interest group among the customers of AI GPUs, and not NVIDIA's competitors in the AI GPU industry per se. US Senator Elizabeth Warren and US progressives have been most vocal about calling upon the DOJ to investigate antitrust allegations against NVIDIA.

Meanwhile, US officials are reportedly reaching out to NVIDIA's competitors, including AMD and Intel, to gather information about the complaints. NVIDIA holds 80% of the AI GPU market, while AMD, and to a much lesser extent, Intel, have received spillover demand for AI GPUs. "The Information" report says that the complaint alleges NVIDIA pressured cloud customers to buy "multiple products". We don't know what this means, one theory holds that NVIDIA is getting them to commit to buying multiple generations of products (eg: Ampere, Hopper, and over to Blackwell); while another holds that it's getting them to buy multiple kinds of products, which include not just the AI GPUs, but also NVIDIA's first-party server systems and networking equipment. Yet another theory holds that it is bundle first-party software and services to go with the hardware, far beyond the basic software needed to get the hardware to work.

ASUS is betting bigger on game consoles or PCs built like consoles. The company in 2023 introduced the first ROG Z13 Flow, a gaming-grade tablet, powered by a 13th Gen Core "Raptor Lake" processor and mid-tier RTX 40-series "Ada" discrete mobile GPU. The 2025 ROG Z13 Flow is a 13-inch, 16:10 tablet with an integrated kickstand. You can use it like a handheld with touch controls, or place it on a surface and use conventional gaming peripherals, such as keyboard+mouse, or a game controller. Since the device is meant to provide a AAA gaming experience, it packs some serious kit.

Apparently, the 2025 ASUS ROG Z13 Flow will implement AMD's upcoming "Strix Halo" processor that packs up to 16 "Zen 5" CPU cores, and an oversized iGPU with 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5 memory interface, besides a 50 TOPS-class NPU to qualify for Copilot+ AI PC rating. Such a chip would meet the hardware goals of the ROG Z13 Flow, and eliminate the need for a discrete GPU, letting ASUS reduce the mainboard size. The power management of "Strix Halo" would see the CPU and SoC given a roughly 30 W budget, and the iGPU roughly 80 W. Its cooling solution focuses squarely on the "Strix Halo" chip, with no other major chip on the device (the SoC is wired out to serve all chipset functions, no FCH needed).

Official Ryzen 9000-series pricing has leaked just ahead of the launch, courtesy of Newegg and BestBuy in the US. Serial leaker @momomo_us over at X/Twitter managed to snap screenshots of the pricing before it was removed by the retailers. This might've been because of a mixup, since the Ryzen 9000-series was supposed to launch today, before being pushed back to the 8th and 14th of August respectively, depending on the SKU. Admittedly the pricing might still change, but it's highly likely that the leaked pricing is AMD's MSRP for the four new CPUs, as both of the retailers have listed identical pricing for the four SKUs.

The good news for prospective buyers of the new CPUs is that AMD has lowered the pricing across the board compared to the launch pricing for the Ryzen 7000-series, especially at the higher-end. The Ryzen 5 9600X should have an MSRP of US$279, followed by US$359 for the Ryzen 7 9700X. That's US$20 and US$40 lower than their Ryzen 7000-series counterparts respectively. The Ryzen 9 9900X should retail for US$449, followed by US$599 for the Ryzen 9 9950, both US$100 less than their Ryzen 7000-series counterparts. This could in part be due to the expected X3D parts coming at a later point in time and AMD now knowing it has to offer the non X3D SKUs for a more competitive price point.

According to sources close to Bloomberg, Intel plans to cut 10,000 jobs from its global workforce. The news comes amid heavy pressure on the semiconductor giant, which has been on a steady decline over the years, while other industry rivals like AMD and NVIDIA have been rising and taking market share in various areas from Intel. It is reported that Intel currently has 110,000 employees globally, and reducing the workforce by 10,000 would net Intel around 100,000 global employees left. These figures exclude employees from spun-out units like Altera FPGA company, which is under Intel's ownership. Intel's aim to reduce its workforce is expected to come with a significant cost benefit to the company, with projected savings of $10 billion by 2025.

The news isn't yet official, but it is expected to see the light of the day as soon as this week. As Intel's CEO Pat Gelsinger invests heavily into the fab construction and development of next-generation products, there have been a few notes that Intel would have to overcome some challenges shortly to reach its long-term goals like more advanced silicon manufacturing facilities and new products for AI/HPC and client sector. One of those short-term measures is reducing the workforce to cut down expenses. Intel has reduced its workforce before. In 2022, the company announced reduced spending in non-critical areas and reducing the workforce, and in 2023, cut the workforce by 5% to 124,800 employees last year, only to be left with 110,000 employees in 2024.

AMD (NASDAQ:AMD) today announced revenue for the second quarter of 2024 of $5.8 billion, gross margin of 49%, operating income of $269 million, net income of $265 million and diluted earnings per share of $0.16. On a non-GAAP(*) basis, gross margin was 53%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.69.

"We delivered strong revenue and earnings growth in the second quarter driven by record Data Center segment revenue," said AMD Chair and CEO Dr. Lisa Su. "Our AI business continued accelerating and we are well positioned to deliver strong revenue growth in the second half of the year led by demand for Instinct, EPYC and Ryzen processors. The rapid advances in generative AI are driving demand for more compute in every market, creating significant growth opportunities as we deliver leadership AI solutions across our business."

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.

The first die shot of AMD's new 4 nm "Strix Point" mobile processor surfaced, thanks to an enthusiast on Chinese social media. "Strix Point" is a significantly larger die than "Phoenix." It measures 12.06 mm x 18.71 mm (L x W), compared to the 9.06 mm x 15.01 mm of "Phoenix." Much of this die size increase comes from the larger CPU, iGPU, and NPU. The process has been improved from TSMC N4 on "Phoenix" and its derivative "Hawk Point," to the newer TSMC N4P node.

Nemez (GPUsAreMagic) annotated the die shot in great detail. The CPU now has 12 cores spread across two CCX, one of which contains four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The two CCXs connect to the rest of the chip over Infinity Fabric. The rather large iGPU takes up the central region of the die. It is based on the RDNA 3.5 graphics architecture, and features 8 workgroup processors (WGPs), or 16 compute units (CU) worth 1,024 stream processors. Other key components include four render backends worth 16 ROPs, and control logic. The GPU has its own 2 MB of L2 cache that cushions transfers to the Infinity Fabric.

ASUS announced availability for the company's new lineup of AMD Ryzen AI laptops featuring advanced AI capability with 50 TOPS NPU AI engines.

ASUS ProArt P16 / ProArt PX13
The new ASUS ProArt laptop lineup is designed to empower every creator — whether they are everyday users, outdoor content creators, or professionals — to transform their precious life moments into enduring stories. The lightweight, durable, and powerful laptops allow users to create anywhere, create faster, and create smarter.

AMD has introduced Fluid Motion Frames 2 (AFMF 2), an upgraded version of its frame generation technology designed to improve gameplay smoothness and frame rates. This new iteration brings several enhancements and expanded compatibility across Radeon RX 6000 and 7000 series graphics cards. AMD debuted Fluid Motion Frames (AFMF) in September 2023 introducing frame generation capabilities across a broad spectrum of GPUs, including those from NVIDIA, and Intel. This technology was compatible with all DirectX 12 and DirectX 11 games, potentially doubling performance when frame generation was activated.

Following its initial release, AMD addressed major concerns such as stuttering and frame-pacing through substantial driver improvements. The refined version of AFMF was officially incorporated into AMD's driver package in January of this year. Now, AMD is offering Fluid Motion Frames 2 as a technical preview using a special driver to convince gamers that they can have an even faster and smoother gaming experience.

AMD today released the Ryzen Chipset Drivers 6.07.22.037 WHQL. The drivers are essential for notebooks powered by the latest Ryzen AI 300 series "Strix Point" processors, as they add driver support for the various SoC interfaces of the chip. The drivers are also needed to expose the NPU of Ryzen 7000 "Phoenix," Ryzen 8000 "Hawk Point," Ryzen 8000G desktop APUs, and Ryzen AI 300 "Strix Point" processors as a classified device in the Windows Device Manager, as well as give Windows 11 the ability to read out the NPU in the Task Manager, so you can look for things there such as real-time NPU utilization, memory footprint, and driver version. The driver package also updates the drivers of the various components, including GPIO, PSP, PPM, USB4 host controller, etc. It also adds program support for various interfaces of the SoC, including SMBus, Hetero, and RCEC. Grab the drivers from the link below.

DOWNLOAD: AMD Chipset Drivers 6.07.22.037

AMD Ryzen 9000 series "Granite Ridge" desktop processors were supposed to start selling on July 31, 2024, but the launch has since been delayed. Since then, social media has been abuzz with theory crafting behind what could be the cause of the delay. AMD's announcement of the delay mentions: "During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations," causing some to speculate if there are design flaws such as the ones affecting Intel's 13th Gen and 14th Gen Core desktop processors. A picture doing rounds on social media has a more goofy explanation: there is a glaring typo on the product label printed on the integrated heatspreader (IHS) of the processors.

Apparently, some of the first batches of Ryzen 9000 processors see the brand extensions mislabeled. Ryzen 7 9700X is printed as "Ryzen 9 9700X." This error in the brand extension may have been easily "patched" if it was on the retail packaging (the box), where hardware manufacturers tend to fix typos by simply pasting stickers on them. You can't do this with the IHS, which is a key component of the processor's cooling mechanism. Also, since times immemorial, chip labels (information printed on the chip) have served as crucial last resorts for accuracy of information such as the chip's exact model number, steppings or revisions (if any), and production serial numbers, besides the chip's national origin, which determines the applicable import tariffs. A typo here could prove problematic. We're not entirely sure how AMD is fixing these errors with mere 1-2 week delays. It's likely that they're recalling the affected batch and simply replacing inventory in the channel with "good" batches. The recalled chips will simply have their IHS reprinted.

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today launched the first passive series graphics cards -- ASRock AMD Radeon RX 7900 XTX Passive 24 GB and ASRock AMD Radeon RX 7900 XT Passive 20 GB graphics cards.

ASRock Radeon RX 7900 Passive series graphics cards are powered by the AMD Radeon RX 7900 XTX and Radeon RX 7900 XT GPUs. Both of these two cards are supporting multi-GPU collaborative computing, and designed for multi-card parallel computing for better performance. ASRock AMD Radeon RX 7900 Passive series graphics cards are featuring a VAPOR-CHAMBER heatsink, efficiency aluminum cooling fins with v-shaped cutting. Furthermore, thanks to the single horizontal 12V-2x6 power connector, to install couple of ASRock AMD Radeon RX 7900 Passive series graphics cards become much easily due to less power cords.

Despite the postponement of the Ryzen 9000 launch announced by AMD on Wednesday, early engineering samples used by motherboard makers reached some users (mainly overclockers). As it is the case with a pre-launch sample of AMD's flagship Ryzen 9 9950X. This CPU is equipped with 16 cores, 32 threads, a base clock frequency of 4.3 GHz with a 5.7 GHz max boost, 80 MB cache (64 MB L3 + 16 MB L2), and a TDP of 170 W.

A user overclocked the 9950X sample to 5.953 GHz using an ASUS ROG Crosshair X670E motherboard equipped with 32 GB DDR5-6000 memory. (Note: There's no information on whether air or water cooling was used.) The user then posted new results in Geekbench 5 and Geekbench 6, which demonstrate impressive performance gains for the 9950X. It's worth noting that AMD also overclocked the processor to 6.6 and even 6.7 GHz, however, they used liquid nitrogen.

AMD has unveiled its latest processor, the Ryzen 8040H. This new model boasts 8 Zen 4 cores and full RDNA3 graphics with 12 Compute Units. Notably, it lacks the AMD XDNA processor, confirming earlier rumors of a mobile SKU without a Neural Processing Unit (NPU). Contrary to speculation, the 8040H's specifications differ from the Ryzen 8845HS. The new chip has a boost clock of 4.9 GHz, 200 MHz lower than its predecessor. Graphics performance has also been slightly reduced, with the 12 Compute Units clocked at 2.6 GHz, down from 2.7 GHz in the 8845H.

The Lenovo XiaoXin 14 Pro is the first laptop to feature this new APU, priced at 5499 RMB ($768) with 24 GB of memory. For comparison, a similar model with the 8845H and 32 GB of memory is priced at 5599 RMB ($773), suggesting only a marginal price difference between the two configurations.

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

In a statement published today shortly after the release of a batch of new Zen 5 architecture details, AMD's computing and graphics SVP Jack Huynh released a statement regarding a delay to the release of the Ryzen 9000 processors based on Zen 5. Originally set to launch in just one week on July 31st, the processors have now been pushed back to a staggered release on August 8th and August 15th; one and two weeks after the initial launch window. AMD supposedly found some of the launch inventory processors did not go through proper testing procedures before being shipped out, and AMD is recalling those processors before any potential problems could have a chance to affect the first customers to buy the new chips.

The statement is as follows:

We appreciate the excitement around Ryzen 9000 series processors. During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations. Out of an abundance of caution and to maintain the highest quality experiences for every Ryzen user, we are working with our channel partners to replace the initial production units with fresh units. As a result, there will be a short delay in retail availability. The Ryzen 7 9700X and Ryzen 5 9600X processors will now go on sale on August 8th and the Ryzen 9 9950X and Ryzen 9 9900X processors will go on-sale on August 15th. We pride ourselves in providing a high-quality experience for every Ryzen user, and we look forward to our fans having a great experience with the new Ryzen 9000 series.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

AMD in its architecture deep-dive Q&A session with the press, confirmed that the "Zen 5" and "Zen 5c" cores on the "Strix Point" silicon only feature 256-bit wide FPU data-paths, unlike the "Zen 5" cores in the "Granite Ridge" Ryzen 9000 desktop processors. "The Zen 5c used in Strix has a 256-bit data-path, and so does the Zen 5 used inside of Strix," said Mike Clark, AMD corporate fellow and chief architecture of the "Zen" CPU cores. "So there's no delta as you move back and forth [thread migration between the Zen 5 and Zen 5c complexes] in vector throughput," he added.

It doesn't seem like AMD disabled a physically available feature, but rather, the company developed a variant of both the "Zen 5" and "Zen 5c" cores that physically lack the 512-bit data-paths. "And you get the area advantage to be able to scale out a little bit more," Clark continued. This suggests that the "Zen 5" and "Zen 5c" cores on "Strix Point" are physically smaller than the ones on the 4 nm "Eldora" 8-core CCD that is featured in "Granite Ridge" and some of the key models of the upcoming 5th Gen EPYC "Turin" server processors.

AMD presented a closer look at the Radeon 890M iGPU powering the Ryzen AI 300 series "Strix Point" mobile processor. The iGPU introduces the new RDNA 3.5 graphics architecture, with several architecture-level improvements built around the existing RDNA 3 SIMD, to yield performance/Watt improvements that AMD could trade in to increase the SIMD muscle for its processors, and proportionately increase performance. The iGPU features one Shader Engine with 8 workgroup processors (WGPs), which amount to 16 CU (compute units), for a total of 1,024 stream processors, 32 AI accelerators, and 16 Ray accelerators. The iGPU also has 4 render backends+, for 16 ROPs. It is specced with a maximum engine clock of 2.90 GHz, which yields over 11 TFLOP/s of FP32 throughput, which is around 30% higher than the iGPU of "Phoenix" (12 CU, RDNA 3), at comparable power.

AMD goes into the finer points of how it yielded the performance/Watt gains. The company worked on the texture subsystem to double the texture sampler rate, and introduced point-sampling acceleration. The shader sub-system features interpolation and comparison rate doubling. The raster sub-system introduces sub-batching of batch raster operations, with a programmable bin order, for the hardware to be more efficient. Lastly, AMD worked on the iGPU's memory-management, to be more aware of LPDDR5 (which has a different physical layer or way of writing/fetching than GDDR6). The company worked on improving the memory compression technologies, to improve performance, and reduce the iGPU's memory footprint.

AMD "Granite Ridge" is codename for the four new Ryzen 9000 series desktop processors the company plans to launch on July 31, 2024. The processor is built in the Socket AM5 package, and is meant to be backwards compatible with AMD 600-series chipset motherboards, besides the new 800-series chipset ones that will launch alongside. "Granite Ridge" is a chiplet-based processor, much like the Ryzen 7000 "Raphael," Ryzen 5000 "Vermeer," and Ryzen 3000 "Matisse." AMD is carrying over the 6 nm client I/O die over from "Raphael" in an effort to minimize development costs, much in the same way it carried over the 12 nm cIOD for "Vermeer" from "Matisse."

The SoC I/O features of "Granite Ridge" are contemporary, with its awesome 28-lane PCI-Express Gen 5 root complex that allows a PCI-Express 5.0 x16, two CPU-attached M.2 Gen 5 slots, and a Gen 5 x4 chipset bus. There's also a basic integrated graphics solution based on the older RDNA 2 graphics architecture; which should make these processors fit for all use-cases that don't need discrete graphics. The iGPU even has multimedia accelerators, an audio coprocessor, a display controller, and USB 3.2 interfaces from the processor.