At today's Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery. To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems.

In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and Intel Foundry is advancing the semiconductor industry with silicon to system design solutions to meet the evolving needs for AI and high-performance computing applications. Our production-ready EDA flows, IP, and multi-die solution, provides our mutual customers with comprehensive technologies to accelerate the development of chip designs that meet or exceed their requirements."

If you're a fan of science fiction movies, you've probably seen the story where countries come together to avert or overcome a crisis. These films usually begin with some unexpected dangerous event—maybe an alien invasion, a pandemic or rogue robots. Earth's smartest scientists and engineers work non-stop to discover a solution. Governments pool their resources and, in the end—usually at the very last possible second—humanity triumphs. This might seem like a Hollywood fantasy, but believe it or not, this movie plot is playing out in real life right now. No, we aren't facing an alien invasion or fighting off AI overlords, but the earth does face some pretty serious crises. And nations of the world are working together to develop technology to help address those problems.

For example, the LUMI supercomputer, located in Kajaani, Finland receives a portion of its funding from the European High-Performance Computing Joint Undertaking (EuroHPC JU), an effort that pools EU resources to create/provide exascale computing platforms. Additional funding comes from LUMI consortium countries, which include Finland, Belgium, Czech Republic, Denmark, Estonia, Iceland, the Netherlands, Norway, Poland, Sweden and Switzerland. According to the Top500 list published in November 2024, LUMI is the 8th fastest supercomputer in the world and the fastest supercomputer in Europe. The final configuration of the LUMI supercomputer can sustain 380 petaflops of performance, which is roughly the equivalent of 1.5 million high-end laptops. It's based on the HPE Cray EX platform with AMD EPYC CPUs and AMD Instinct MI250X GPUs. According to the Green500 list, LUMI is also the world's 25th most energy efficient supercomputer. It runs on 100% hydropower and the waste heat from the facility is recaptured to heat about 100 homes in Kajaani.

At Xbox, our goal is to empower as many people as possible to play the games they want, with the people they want, anywhere they want, in a way that works for them. This includes the more than 429 million players with some form of disability, who may rely on a variety of accessibility hardware - such as the recently launched Xbox Adaptive Joystick—and features to get the most from their gaming. For many players, it can be a challenge not having a common and consistent language to describe the accessibility features within different video games. To help solve this, Xbox introduced its Game Accessibility Feature Tags back in November 2021.

But we want to do more; at Game Developers Conference (GDC), Xbox proudly joined forces with Electronic Arts, Google, Nintendo of America, Ubisoft and other gaming companies to announce that it is a member of the new Accessible Games Initiative. This initiative, helmed by the Entertainment Software Association (ESA), strives to provide players with clear information about the accessibility features in video games through a set of "tags" that players can use to identify the features available in a specific game, before they make a purchase.

Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital to break down the AI bottleneck of data movement with its optical I/O technology. This brings the company's total funding to $370 million and raises the company's valuation to above $1 billion.

The strength of the round and caliber of investors, including participation from AMD Ventures, Intel Capital, and NVIDIA, marks another key milestone as Ayar Labs prepares its optical solution for high volume manufacturing strategically aligned to customer roadmaps. Other new strategic and financial investors participating in the round include 3M Ventures and Autopilot. They join existing investors such as Applied Ventures LLC, Axial Partners, Boardman Bay Capital Management, GlobalFoundries, IAG Capital Partners, Lockheed Martin Ventures, Playground Global, and VentureTech Alliance.

The CHERI Alliance CIC (Community Interest Company) today announced its official launch and the expansion of its membership, welcoming Chevin Technology (UK), Critical Technologies (USA), the Defence Science and Technology Laboratory (DSTL, UK), Google (USA), Light Momentum Technology Corporation (Taiwan), National Cyber Security Centre (NCSC, a part of GCHQ, UK), Parvat Infotech (India), SRI International (USA), TechWorks (UK), Trusted Computer Center of Excellence (USA), the University of Birmingham (UK), and the University of Glasgow (UK) as founding members.

Founded to unite hardware security leaders and system developers, the CHERI Alliance aims to establish CHERI (Capability Hardware Enhanced RISC Instructions) as the new standard for memory safety and scalable software compartmentalization.

Last time we reported on Samsung Foundry, the company publicly apologized for its setbacks in the memory and foundry divisions, especially as its 3 nm GAA FET node has failed to attract new customers. On the other hand, Intel has also been struggling with its Foundry unit bleeding billions of Dollars in a bid to secure its spot as one of the best foundries for companies to manufacture their chips. There is no better pair than two struggling foundries looking for customers and new ways to conduct research than Intel and Samsung. According to an exclusive by South Korean media outlet "MK," it has reportedly been confirmed that Intel approached Samsung to form a "Foundry Alliance" to boost their foundry business units.

According to the source, Intel CEO Pat Gelsinger is reportedly eager to meet with Samsung Electronics Chairman Lee Jae-yong face-to-face to discuss "comprehensive collaboration in the foundry sector." What exactly will happen between the two is still unclear. Back in 2014, GlobalFoundries and Samsung formed a partnership for 14 nm FinFET offerings, and that was a wide success. Jointly developing a node and offering it in their foundry units could be the target goal for Intel and Samsung. At some level, research and development, as well as sharing valuable manufacturing information on yield improvements, should be beneficial for both to put together the final pieces of the semiconductor puzzle.

E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers.

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, HYAWEI OPTRONICS for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and other key component suppliers such as HIWIN, HIWIN MIKROSYSTEM, Keyence Taiwan, Mirle Group, ACE PILLAR CHYI DING), and Coherent.

The Bluetooth Special Interest Group (SIG), the organization that oversees Bluetooth technology, announced the release of Bluetooth Channel Sounding, a new secure, fine-ranging feature that promises to enhance the convenience, safety, and security of Bluetooth connected devices. By enabling true distance awareness in billions of everyday devices, Bluetooth Channel Sounding opens countless possibilities for developers and users alike.

"Bluetooth technology has become an ingredient of everyday life," said Neville Meijers, CEO, Bluetooth Special Interest Group. "When connected devices are distance-aware, a range of new possibilities emerge. Adding true distance awareness to Bluetooth technology exemplifies the ongoing commitment of the Bluetooth SIG community to continuously enhance our connection with our devices, one another, and the world around us."

NVIDIA today announced major advancements to Universal Scene Description, or OpenUSD, that will expand adoption of the universal 3D data interchange framework to robotics, industrial design and engineering, and accelerate developers' abilities to build highly accurate virtual worlds for the next evolution of AI.

Through new OpenUSD-based generative AI and NVIDIA-accelerated development frameworks built on the NVIDIA Omniverse platform, more industries can now develop applications for visualizing industrial design and engineering projects, and for simulating environments to build the next wave of physical AI and robots.

"The Earth is Blue," said Yuri Gagarin, the first human to journey into space. With two-thirds of its surface covered in water, Earth is a planet that exuberates its blue radiance in the dark space. However, today, the scarcity of water is a challenge that planet Earth is confronted with. For some, this may be hard to understand. What happened to our blue planet Earth? To put in numbers, more than 97% of the water on Earth consists of seawater, with another 2% locked in ice caps. That only leaves a mere 1% of water available for our daily use. The problem lies in the fact that this 1% of water is gradually becoming scarcer due to reasons such as climate change, environmental pollution, and population growth, leading to increased water stress. 'Water stress' is quantified by the proportion of water demand to the available water resources on an annual basis, indicating the severity of water scarcity as the stress index rises. Higher stress indexes signify experiencing severe water scarcity.

The semiconductor ecosystem, unsustainable without water
Because water stress issues transcend national boundaries, various stakeholders including international organizations and governments work to negotiate water resource management strategies and promote collaboration. UN designates March 22nd as an annual "World Water Day" to raise awareness about the severity of water scarcity running various campaigns. Now, it's imperative for companies to also take responsibility for the water resources given and pursue sustainable management.

The kingdom of Stormwind lies in ruins. The greatest strategists of the Alliance and the Horde race towards a terrifying clash as war continues to rage across Azeroth. It's up to you to defend this world and its people…or crush these pitiful weaklings and claim their realm for the Horde! You can now add 1995's Warcraft II: Tides of Darkness and its expansion, Beyond the Dark Portal, to your catalog of games right from the Battle.net Shop. This game took the series' real-time strategy to new heights and added greater tactical depth, expanding your armies with flying and even seafaring units. With bigger maps and more diverse armies, Warcraft II will challenge your strategic and tactical skills. Think fast and act decisively; the fate of your people depends on it!

This release includes:
28 missions across two epic campaigns: Follow the Horde and Alliance campaigns and decide the fate of Azeroth. Visit key historic locations such as Dalaran or Stratholme, and see how they were first introduced.
Even more adventure awaits Beyond the Dark Portal: Once you've beaten the Tides of Darkness campaign, embark on the final chapter of Warcraft II with the Beyond the Dark Portal expansion. Conquer the shattered realm of Outland, and end the orcish threat once and for all!
More maps, more players, more mayhem: Fight against up to seven computer-controlled opponents or other players across an even bigger selection of online multiplayer battlefields. Take to the field as a team or try to seize victory on your own, and prove your worth as a master tactician.
Get creative with the Warcraft II map editor: Use the mapmaking tool to create your own multiplayer maps, then challenge your friends to epic battles on your turf!

Samsung Electronics today at Integrated Systems Europe (ISE) 2024 in Barcelona is showcasing how SmartThings will bolster its B2B displays to shape the future of business connectivity. Samsung's "SmartThings for Business" exhibition emphasizes the new advancements that the cutting-edge internet-of-things (IoT) platform will offer, as well as Samsung's commitment to providing more connected, easy-to-control digital signage across industries. "In a commercial display sector where operational efficiency is key, Samsung digital signage is leveraging SmartThings to deliver next-gen connectivity and features to organizations of all sizes," said SW Yong, President and Head of Visual Display Business at Samsung Electronics. "This further expansion of the SmartThings ecosystem will serve to elevate experiences for customers and partners from a wide variety of industries."

How Businesses Can Leverage Connected Tech Through SmartThings—From the Smart Store to Smart Office
At the event, Samsung is showcasing how SmartThings enables business owners to leverage their digital signage to connect and gain more control of their smart devices across various landscapes. By offering the SmartThings connectivity feature to commercial display products such as Smart Signage and Hotel TVs, users can experience the convenience of hyper-connectivity in their business environments. These changes will include Samsung smart devices, as well as other devices that support the industry's latest IoT specifications, Matter and the Home Connectivity Alliance (HCA). Through the application of SmartThings to various business environments, Samsung contributes to the more efficient management of space and energy by transforming places of business into interconnected smart spaces. These connectivity improvements have been designed to benefit all types of business customers, from small and mid-sized business owners to enterprises. Examples of the smart spaces—including a smart store, smart office and smart hotel—are on display at Samsung's booth at ISE 2024.

MediaTek, one of the first adopters of Wi-Fi 7 technology, today announced that it is working closely within Wi-Fi Alliance to launch a complete first wave of Wi-Fi CERTIFIED 7 products, which will be featured as part of MediaTek's global ecosystem showcase at CES 2024. In an era where people rely on artificial intelligence to improve their lives and productivity, a fast and reliable network ensures consumers and professionals have the connectivity needed to utilize the latest AI tools. These devices, powered by MediaTek Filogic Wi-Fi CERTIFIED 7 chipsets, represent fast, reliable and always-on connected experiences for a wide variety of consumer and enterprise products, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

"As a technology leader, we make significant investments in formulating the standards that drive the industry, in addition to developing products that utilize those standards," said Alan Hsu, corporate vice president at MediaTek. "The recent announcement of our family of Wi-Fi CERTIFIED 7 chipset solutions has enabled us to work with Wi-Fi Alliance to provide testbeds for devices on both the access point and client sides, streamlining the product certification process for manufacturers."

Wi-Fi CERTIFIED 7 is here, introducing powerful new features that boost Wi-Fi performance and improve connectivity across a variety of environments. Cutting-edge capabilities in Wi-Fi CERTIFIED 7 enable innovations that rely on high throughput, deterministic latency, and greater reliability for critical traffic. New use cases - including multi-user AR/VR/XR, immersive 3-D training, electronic gaming, hybrid work, industrial IoT, and automotive - will advance as a result of the latest Wi-Fi generation. Wi-Fi CERTIFIED 7 represents the culmination of extensive collaboration and innovation within Wi-Fi Alliance, facilitating worldwide product interoperability and a robust, sophisticated device ecosystem.

Wi-Fi 7 will see rapid adoption across a broad ecosystem with more than 233 million devices expected to enter the market in 2024, growing to 2.1 billion devices by 2028. Smartphones, PCs, tablets, and access points (APs) will be the earliest adopters of Wi-Fi 7, and customer premises equipment (CPE) and augmented and virtual reality (AR/VR) equipment will continue to gain early market traction. Wi-Fi CERTIFIED 7 pushes the boundaries of today's wireless connectivity, and Wi-Fi CERTIFIED helps ensure advanced features are deployed in a consistent way to deliver high-quality user experiences.

Realizing the full potential of next-generation deep learning requires highly efficient AI infrastructure. For a computing platform to be scalable and cost efficient, optimizing every layer of the AI stack, from algorithms to hardware, is essential. Advances in narrow-precision AI data formats and associated optimized algorithms have been pivotal to this journey, allowing the industry to transition from traditional 32-bit floating point precision to presently only 8 bits of precision (i.e. OCP FP8).

Narrower formats allow silicon to execute more efficient AI calculations per clock cycle, which accelerates model training and inference times. AI models take up less space, which means they require fewer data fetches from memory, and can run with better performance and efficiency. Additionally, fewer bit transfers reduces data movement over the interconnect, which can enhance application performance or cut network costs.

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

Taiwan's Economic Daily reckons that a freshly formed partnership between TSMC, Broadcom, and NVIDIA will result in the development of cutting-edge silicon photonics. The likes of IBM, Intel and various academic institutes are already deep into their own research and development processes, but the alleged new alliance is said to focus on advancing AI computer hardware. The report cites a significant allocation of—roughly 200—TSMC staffers onto R&D involving the integration of silicon photonic technologies into high performance computing (HPC) solutions. They are very likely hoping that the usage of optical interconnects (on a silicon medium) will result in greater data transfer rates between and within microchips. Other benefits include longer transmission distances and a lower consumption of power.

TSMC vice president Yu Zhenhua has placed emphasis on innovation, in a similar fashion to his boss, within the development process (industry-wide): "If we can provide a good silicon photonics integrated system, we can solve the two key issues of energy efficiency and AI computing power. This will be a new one...Paradigm shift. We may be at the beginning of a new era." The firm is facing unprecedented demand from its clients—it hopes to further expand its advanced chip packaging capacity to address these issues by late 2024. A shift away from the limitations of "conventional electric" data transmissions could bring next generation AI compute GPUs onto the market by 2025.

NVIDIA joined Pixar, Adobe, Apple and Autodesk today to found the Alliance for OpenUSD, a major leap toward unlocking the next era of 3D graphics, design and simulation. The group will standardize and extend OpenUSD, the open-source Universal Scene Description framework that's the foundation of interoperable 3D applications and projects ranging from visual effects to industrial digital twins.

Several leading companies in the 3D ecosystem already signed on as the alliance's first general members—Cesium, Epic Games, Foundry, Hexagon, IKEA, SideFX and Unity. Standardizing OpenUSD will accelerate its adoption, creating a foundational technology that will help today's 2D internet evolve into a 3D web. Many companies are already working with NVIDIA to pioneer this future.

Today, U.S. Deputy National Security Advisor Anne Neuberger, Chairwoman of the Federal Communications Commission (FCC) Jessica Rosenworcel, and Laurie Locascio, Director of the National Institute of Standards and Technology (NIST) unveiled the U.S. national IoT security label at the White House.

Infineon Technologies AG supports this action to address the growing need for IoT security. The new label supports the IoT security requirements under NISTIR 8425, which resulted from an Executive Order to improve the nation's cybersecurity. This label will recognize products that meet these requirements by permitting them to display a U.S. government label and be listed in a registry indicating that these products meet U.S. cybersecurity standards.

The recent semiconductor shortage has put an unprecedented amount of focus on the industry. Both commercial and government entities have come to recognize the lack of advanced node semiconductor manufacturing capabilities onshore in the United States. Intel Foundry Services (IFS) entry into the commercial foundry space is poised to change all that. As part of IFS Accelerator program, Intel recently announced their new IFS Cloud Alliance program, with Microsoft Azure as one of the inaugural members.

This is the latest chapter in a partnership between Intel and Microsoft that stretches back decades all the way back to the early days of the personal computer. In the last few years, Intel and Microsoft have collaborated on advancing semiconductor design on the cloud by working together to bring out EDA centric cloud compute such as the FX series on Azure, working with EDA vendors to enhance their software to better take advantage of the elasticity of the Azure cloud, as well as collaborating on a secure cloud-based semiconductor development platform for the US Department of Defense RAMP and RAMP-C programs.

In a joint effort to make the web more secure and usable for all, Apple, Google and Microsoft today announced plans to expand support for a common passwordless sign-in standard created by the FIDO Alliance and the World Wide Web Consortium. The new capability will allow websites and apps to offer consistent, secure, and easy passwordless sign-ins to consumers across devices and platforms. Password-only authentication is one of the biggest security problems on the web, and managing so many passwords is cumbersome for consumers, which often leads consumers to reuse the same ones across services. This practice can lead to costly account takeovers, data breaches, and even stolen identities. While password managers and legacy forms of two-factor authentication offer incremental improvements, there has been industry-wide collaboration to create sign-in technology that is more convenient and more secure.

The expanded standards-based capabilities will give websites and apps the ability to offer an end-to-end passwordless option. Users will sign in through the same action that they take multiple times each day to unlock their devices, such as a simple verification of their fingerprint or face, or a device PIN. This new approach protects against phishing and sign-in will be radically more secure when compared to passwords and legacy multi-factor technologies such as one-time passcodes sent over SMS.

Intel, Micron, Analog Devices, and MITRE Engenuity announced they have an agreement of principles to accelerate semiconductor research, development, and prototyping to build a more robust U.S. semiconductor industry, foster advanced manufacturing in the United States, and protect intellectual property amid increased global competition. This engagement signifies a commitment to collaborate on ensuring the resiliency of the industry. It establishes the Semiconductor Alliance to propose the foundation for a whole-of-nation approach for a more innovation-focused U.S. semiconductor industry and supply chain, one that ensures American innovation truly leads to American growth.

The Semiconductor Alliance, led by MITRE Engenuity, was developed from working groups in 2021, and its principles were published in a white paper on American Innovation for American Growth summarizing the Alliance's whole-of-nation call to action for a fair and objective National Semiconductor Technology Center (NSTC). The leading U.S. semiconductor manufacturers—Intel, Micron, and Analog Devices—and MITRE Engenuity seek engagement from industry and experts from all facets of the U.S. semiconductor ecosystem, including integrated device manufacturers; fabless chip companies; providers of infrastructure, design, and manufacturing tools; and technology innovators from industry and academia. MITRE Engenuity is built on MITRE's 60+ year history of serving as an independent, objective bridge and convener of government, industry, and academia, bringing together the whole of nation to tackle some of the biggest challenges to our national security.

Ansys today announced its inaugural partnership to IFS Accelerator - EDA Alliance to provide best-in-class EDA tools and simulation solutions that will support customer innovation, including bespoke silicon for customizable three-dimensional integrated circuit (3D-IC) designs. By leveraging Ansys' market-leading multiphysics solutions, IFS Accelerator will make silicon technology available to customers to design uniquely innovative chips. Ansys' cutting-edge EDA and simulation tools will enable mutual customers to reduce design barriers, minimize design risk and cost, and accelerate time-to-market.

The IFS Accelerator will foster collaborative innovation with world-leading EDA, design services and IP partners to provide a comprehensive design ecosystem with premium process technologies, advanced packaging technologies, and manufacturing capabilities. "We are excited to announce the IFS Accelerator - EDA Alliance as a major step forward for Intel's foundry ambitions," said Rahul Goyal, VP and GM of Intel Product & Design Ecosystem Enablement. "Together with Ansys and other partners, this alliance will create advanced flows and methodologies, and accelerate productivity by combining our knowledge, resources, and shared passion to drive electronic design."

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

NVIDIA has today announced the expansion of its GeForce NOW game streaming service to Turkey, Saudi Arabia, and Australia. The company has worked closely with telecommunication providers to ensure that the streaming service is working well and now they can deliver even more gamers a chance to play their favorite games in the cloud. NVIDIA stated that: "It also offers an opportunity for the world's leading telecommunications firms to deliver high-quality, low-latency PC gaming to nearly any device from the cloud. These partners form the GeForce NOW Alliance, a partnership of operators using RTX Servers and NVIDIA cloud-gaming software to expand and improve cloud gaming globally."

As a reminder, the GeForce NOW is a game streaming service that "brings real-time raytracing to today's biggest blockbusters to underpowered PCs, Macs, Chromebooks, Android and iOS devices." You can access a wide range of games from almost any device and play as much as you like.