SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced launched the new SiFive Performance family of processors. The SiFive Performance family debuts with two new processor cores, the P270, SiFive's first Linux capable processor with full support for the RISC-V vector extension v1.0 rc, and the SiFive Performance P550 core, SiFive's highest performance processor to date. The new SiFive Performance P550 delivers a SPECInt 2006 score of 8.65/GHz, making it the highest performance RISC-V processor available today, and comparable to existing proprietary solutions in the application processor space.

"SiFive Performance is a significant milestone in our commitment to deliver a complete, scalable portfolio of RISC-V cores to customers in all markets who are at the vanguard of SOC design and are dissatisfied with the status quo," said Dr. Yunsup Lee, Co-Founder and CTO of SiFive. "These two new products cover new performance points and a wide range of application areas, from efficient vector processors that easily displace yesterday's SIMD architectures, to the bleeding edge that the P550 represents. SiFive is proud to set the standard for RISC-V processing and is ready to deliver these products to customers today."

NVIDIA, the maker of high-performance GPUs, has yesterday announced that the company will be investing at least 100 million US Dollars into UK's most powerful supercomputer. Back in October of 2020, NVIDIA announced that it will be building a supercomputer in Cambridge, UK, that will be called Cambridge-1. However, the original plan suggested that the investment would amount to around 40 million GBP, which is roughly 55.6 million USD. Now, it seems that NVIDIA is doubling the initial investment plan and the company now wants to invest 100 million USD, just at the initial phase, which would mean that the total budget could be much greater.

As the company is facing difficulties in the process of acquiring Arm Ltd. from Softbank, by building the most powerful supercomputer in the UK, it hopes to show its commitment to growing UK's Arm operations. And more specifically, it is building the Cambridge-1 in the same place as Arm's HQ, which is also Cambridge. In terms of technologies that will end up in this supercomputer, we are still not supplied with exact information, however, we can expect it to combine the latest CPU, GPU, and networking technologies into one powerful machine.

Qualcomm is proposing a consortium of companies that will make a competitive bid to acquire Arm Holdings from SoftBank, if NVIDIA falters in its acquisition, according to a report in The Telegraph citing an interview with Qualcomm CEO Cristiano Amon. Unlike NVIDIA's bid, where a single company that's in the SoC designing business, gets to own Arm IP, giving it a competitive upper-hand over other Arm licensees; the consortium would be made up of several companies, including Qualcomm, one of Arm's largest IP licensees, which makes SoCs for smartphones, tablets, wearables, and IoT devices, across all market segments.

"If Arm has an independent future, I think you will find there is a lot of interest from a lot of the companies within the ecosystem, including Qualcomm, to invest in Arm," said Amon. "We will definitely be open to it, and we have had discussions with other companies that feel the same way. That's the reason it's a logical conclusion for us, and for many other companies, that to invest in a strong and independent Arm is probably the best for everyone," he added. NVIDIA is in the process of acquiring Arm Holdings, lock, stock, and barrel, in a humongous $40 billion deal, which has run into hold-ups with competition regulators across the globe, including the UK, the home of Arm Holdings.

Tachyum Inc. today announced that it has taken delivery of an IO motherboard for its Prodigy Universal Processor hardware emulator from manufacturing. This provides the company with a complete system prototype integrating CPU, memory, PCI Express, networking and BMC management subsystems when connected to the previously announced field-programmable gate array (FPGA) emulation system board.

The Tachyum Prodigy FPGA DDR-IO Board connects to the Prodigy FPGA CPU Board to provide memory and IO connectivity for the FPGA-based CPU tiles. The fully functional Prodigy emulation system is now ready for further build out, including Linux boot and incorporation of additional test chips. It is available to customers to perform early testing and software development prior to a full four-socket reference design motherboard, which is expected to be available Q4 2021.

Qualcomm Technologies, Inc. today announced the Qualcomm Snapdragon Developer Kit, which is designed to enable extended support for independent software vendors and application developers to test and optimize their applications for the growing ecosystem of devices powered by Snapdragon compute platforms. Built in collaboration with Microsoft, this Windows 10 on Arm-based developer kit is a cost-effective resource for developers to verify and validate their solutions to help ensure great user experiences for working, learning, and collaborating on Snapdragon-enabled Windows 10 PCs.

This is the latest collaboration between Qualcomm Technologies and Microsoft to strengthen resources for developers who are recompiling, optimizing, and testing applications for Windows 10 devices powered by Snapdragon compute platforms. In September 2020, Microsoft announced the expansion of its App Assure Program to Windows 10 on Arm PCs powered by Snapdragon compute platforms, as well as the optimization of Microsoft Edge, Microsoft Teams, and Visual Studio Code. The latest advancement in the coordinated support of independent software vendors and application developers was the December 2020 introduction of x64 emulation preview for Windows 10 PCs, to the Windows Insider Program.

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

As one of the most important tech summits globally, COMPUTEX Forum and its discussion topics have always garnered great attention. To facilitate the discussion on future technology trends, the COMPUTEX Forum on June 2 and 3 will evolve around the theme of "The New Era of Intelligence." TAITRA announced the lineup of speakers to discuss key applications of 5G, AI, IoT, and electric vehicles, deep diving into business strategies in the post-pandemic era.

In the morning of Wednesday, June 2, COMPUTEX Forum will address the topic of "AIoT Evolution." Leading semiconductor giants such as Intel, Micron, NVIDIA and Supermicro, will explore how they accelerate business opportunities in the 5G era. In the afternoon, NXP Semiconductors will kick off the "AI Empowerment" session by sharing its vision and lead the Secure Edge and AI Empowerment discussions in fields. As AI rises in various applications, Arm, Delta Electronics, Micron and Check Point Software will elaborate their latest solution in different scopes.

Since lobbying is both legal and regulated in the US (an attempt to bring attempts of influencing political power by corporations under legal boundaries, as opposed to being done in the dark), it feels like it was only a matter of time before big tech attempted to join under one banner. As such, the Semiconductors in America Coalition (SIAC) has now been put together, and boasts of 64 members including Microsoft, Apple, TSMC, Intel, AMD, NVIDIA, Arm, and Samsung. It seems that all of these companies - which are often at odds with one another when it comes to competing for consumers' choice and money - have found enough similarities to get organized in an attempt to nudge political power in their favor.

SIAC said in a press release that its mission is to "advance federal policies that promote semiconductor manufacturing and research in the U.S. to strengthen America's economy, national security, and critical infrastructure." The first announcement from the SIAC following its foundation was its intention to support the CHIPS for America Act. The Act (supported by The Semiconductor Industry Association (SIA) and President Joe Biden) has already been approved by the House and the Senate as part of the National Defense Authorization Act for 2021 but has not yet been funded. It seems that SIAC's first mission is to get the government to open up its $50 billion-deep pockets.

British competition regulator Competition and Markets Authority (CMA) on Monday, launched an enquiry into the ramifications of AMD's buy-out of FPGA maker Xilinx. The agency is soliciting opinions from the public on whether the $35 billion all-stock purchase will make goods and services less competitive for the UK. Unlike NVIDIA's Arm buyout the Xilinx acquisition is seeing no opposition from tech-giants. The Register notes that AMD could combine Xilinx's FPGAs with its x86 CPU and RDNA SIMD to create highly customizable HPC accelerators. AMD president Dr Lisa Su said "By combining our world-class engineering team and deep domain expertise, we will create an industry leader with the vision, talent and scale to define the future of high performance computing."

Samsung is readying a powerful Arm-based SoC rivaling Apple's groundbreaking M1 silicon, under its Exynos brand. This chip is being designed for thin-and-light notebooks, as well as premium tablets, essentially letting Samsung target Apple's MacBook (M1) and iPad Pro form-factors. Unlike Apple, Samsung won't be burdened with having to rally its ISV partners to develop specifically for its hardware; the company is preparing to launch notebooks in the second half of 2021 that are powered by a Windows 10 on Arm derivative. This would give the notebook access to all of the applications already developed for the OS, including Office and certain Adobe Creativity Suite apps. The M1-rivaling Exynos chip will pack the latest-generation 64-bit Arm CPU cores, as well as an integrated GPU designed by AMD.

The demands of data center workloads and internet traffic are growing exponentially, and new solutions are needed to keep up with these demands while reducing the current and anticipated growth of power consumption. But the variety of workloads and applications being run today means the traditional one-size-fits all approach to computing is not the answer. The industry demands flexibility; design freedom to achieve the right level of compute for the right application.

As Moore's Law comes to an end, solution providers are seeking specialized processing. Enabling specialized processing has been a focal point since the inception of our Neoverse line of platforms, and we expect these latest additions to accelerate this trend.

The UK government has stalled NVIDIA's $40 billion acquisition of Arm by constituting an investigation in "public interest." This investigation will look into the national security implications to the UK, of the acquisition. Although Arm is being transacted between Japan's SoftBank Holdings and American NVIDIA, Arm itself is a UK-based entity. The Competition and Markets Authority (CMA) will lead the investigation, and file a report with the UK government by June 30, 2021.

NVIDIA responded to the development, stating that the acquisition has no material national-security issues affecting the UK. "We will continue to work closely with the British authorities, as we have done since the announcement of this deal," NVIDIA stated. Leading tech firms, namely Google, Qualcomm, and Microsoft, etc., voiced apprehensions over the deal. Unlike SoftBank, NVIDIA is a chip-designer in its own right, and could withhold cutting-edge Arm technology to itself, giving its CPUs/SoCs a competitive edge over other Arm licensees, these firms believe.

NVIDIA has recently announced the company's first standalone Grace CPU that will come out as a product in 2023. NVIDIA has designed Grace on Arm ISA, likely ARM v9, to represent a new way that data centers are built and deliver a whole new level of HPC and AI performance. However, the CPU competition in a data center space is considered one of the hardest markets to enter. Usually, the market is a duopoly between Intel and AMD, which supply x86 processors to server vendors. In the past few years, there have been few Arm CPUs that managed to enter the data canter space, however, NVIDIA is aiming to deliver much more performance and grab a bigger piece of the market.

As a self-proclaimed leader in AI, Intel is facing hard competition from NVIDIA in the coming years. In an interview with Fortune, Intel's new CEO Pat Gelsinger has talked about NVIDIA and how the company sees the competition between the two. Mr. Gelsinger is claiming that Intel is a leader in CPUs that feature AI acceleration built in the chip and that they are not playing defense, but rather offense against NVIDIA. You can check out the whole quote from the interview below.

NVIDIA today announced the NVIDIA BlueField -3 DPU, its next-generation data processing unit, to deliver the most powerful software-defined networking, storage and cybersecurity acceleration capabilities available for data centers.

The first DPU built for AI and accelerated computing, BlueField-3 lets every enterprise deliver applications at any scale with industry-leading performance and data center security. It is optimized for multi-tenant, cloud-native environments, offering software-defined, hardware-accelerated networking, storage, security and management services at data-center scale.

NVIDIA today announced its first data center CPU, an Arm-based processor that will deliver 10x the performance of today's fastest servers on the most complex AI and high performance computing workloads.

The result of more than 10,000 engineering years of work, the NVIDIA Grace CPU is designed to address the computing requirements for the world's most advanced applications—including natural language processing, recommender systems and AI supercomputing—that analyze enormous datasets requiring both ultra-fast compute performance and massive memory. It combines energy-efficient Arm CPU cores with an innovative low-power memory subsystem to deliver high performance with great efficiency.

Today, Arm introduced the Armv9 architecture in response to the global demand for ubiquitous specialized processing with increasingly capable security and artificial intelligence (AI). Armv9 is the first new Arm architecture in a decade, building on the success of Armv8 which today drives the best performance-per-watt everywhere computing happens.

To address the greatest technology challenge today - securing the world's data - the Armv9 roadmap introduces the Arm Confidential Compute Architecture (CCA). Confidential computing shields portions of code and data from access or modification while in-use, even from privileged software, by performing computation in a hardware-based secure environment.

Nintendo's Switch console is one of the most successful consoles ever made by the Japanese company. It has sold in millions of units and has received great feedback from the gaming community. However, as the hardware inside the console becomes outdated, the company is thinking about launching a new revision of the console, with the latest hardware and technologies. Today, we got ahold of information about the graphics side of things in Nintendo's upcoming console. Powered by NVIDIA Tegra SoC, it will incorporate unknown Arm-based CPU cores. The latest rumors suggest that the CPU will be accommodated with NVIDIA's Ada Lovelace GPU architecture. According to @kopite7kimi, a known hardware leaker, who simply replied to VideoCardz's tweet with "Ada", we are going to see the appearance of Ada Lovelace GPU architecture in the new SoC. Additionally, the new Switch SoC will have hardware accelerated NVIDIA Deep Learning Super Sampling (DLSS) and 4K output.

Xilinx, Inc., the leader in adaptive computing, today announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world's only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

AAEON, an industry leader in Edge Computing solutions, announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments.
The SRG-3352C builds upon the features, durability and reliability of the SRG-3352 Edge IoT Gateway System with expanded support for more connections and wireless communications. All of this is packed into a compact form factor that makes deploying the SRG-3352C even easier, powering more flexible edge network deployments.

The SRG-3352C is powered by the Arm Cortex-A8 800 MHz RISC processor. This innovative processor reduces the energy requirements of the system, allowing for a more efficient system to help save electricity costs. While powerful enough to connect edge networks together, the low energy usage can help cities with achieving green energy goals, and even allow the system to operate on solar power or batteries. It also eliminates the need for dedicated heatsinks, allowing the system to operate in wider temperatures, from 0°C up to 60°C without loss in performance.

Addressing the demands of the modern data center, Xilinx, Inc. (NASDAQ: XLNX) today announced a range of new data center products and solutions, including a new family of Alveo SmartNICs, smart world AI video analytics applications, an accelerated algorithmic trading reference design for sub-microsecond trading, and the Xilinx App Store.

Today's most demanding and complex applications, from networking and AI analytics to financial trading, require low-latency and real-time performance. Achieving this level of performance has been limited to expensive and lengthy hardware development. With these new products and solutions, Xilinx is eliminating the barriers for software developers to quickly create and deploy software-defined, hardware accelerated applications on Alveo accelerator cards.

In September of last year, NVIDIA has officially announced that the current industry rumor about its big acquisition was true. The company has announced that it is acquiring Arm Limited from the Softbank Group. Paying as much as $40 billion for the purchase, NVIDIA is gaining access to the complete company, along with its extensive portfolio of IP and knowledge. That means that NVIDIA is not essentially a holder of the Arm ISA, which is the most dominant ISA within mobile processors. Such a deal, however, is a bit hard to process without some troubles popping up along the way. As Arm held a neutral position as IP provider, NVIDIA is expected to remain as such, and the company even promised to stay true to that.

However, not everything is going as planned. Before completing the acquisition process, NVIDIA must first comply with regulators from all around the world, including the US, UK, EU, and China. If any objections raise within those regions, they are to be interrogated. Today, Google, Microsoft, and Qualcomm have objected that NVIDIA's Arm acquisition is hurting the market and are urging antitrust officials to intervene. Mentioned companies believe that NVIDIA's move is hurting the market and the company could limit its competitors from accessing the IP, thus breaking Arm's neutral position as an IP provider. NVIDIA has made statements that Arm will remain in such a position, however, the skepticism of the mentioned companies is slowing the merger. Now all that remains is to see how the conflicted companies solve their worries.

Apple has today patented a new approach to how it uses memory in the System-on-Chip (SoC) subsystem. With the announcement of the M1 processor, Apple has switched away from the traditional Intel-supplied chips and transitioned into a fully custom SoC design called Apple Silicon. The new designs have to integrate every component like the Arm CPU and a custom GPU. Both of these processors need good memory access, and Apple has figured out a solution to the problem of having both the CPU and the GPU accessing the same pool of memory. The so-called UMA (unified memory access) represents a bottleneck because both processors share the bandwidth and the total memory capacity, which would leave one processor starving in some scenarios.

Apple has patented a design that aims to solve this problem by combining high-bandwidth cache DRAM as well as high-capacity main DRAM. "With two types of DRAM forming the memory system, one of which may be optimized for bandwidth and the other of which may be optimized for capacity, the goals of bandwidth increase and capacity increase may both be realized, in some embodiments," says the patent, " to implement energy efficiency improvements, which may provide a highly energy-efficient memory solution that is also high performance and high bandwidth." The patent got filed way back in 2016 and it means that we could start seeing this technology in the future Apple Silicon designs, following the M1 chip.

Update 21:14 UTC: We have been reached out by Mr. Kerry Creeron, an attorney with the firm of Banner & Witcoff, who provided us with additional insights about the patent. Mr. Creeron has provided us with his personal commentary about it, and you can find Mr. Creeron's quote below.

MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6 nm Dimensity 1200 and 1100 chipsets to MediaTek's 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier," said JC Hsu, Corporate Vice President and General Manager of MediaTek's Wireless Communications Business Unit. "Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements."