MSI is thrilled to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the new X870 chipsets. Powered by cutting-edge 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unparalleled performance, efficiency, and versatility for gamers and content creators. At launch, there will be four new AMD Ryzen 9000 Series CPUs available: the Ryzen 9 9950X, 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. They are compatible with the AM5 socket, existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate with each other by updating to the latest BIOS, readily available on MSI's product support page.

At this year's Computex 2024, visitors to the MSI booth will have the opportunity to witness two models firsthand, the MAG X870 TOMAHAWK WIFI and PRO X870-P WIFI. Additionally, a comprehensive lineup of features awaits users across the MPG and MEG series, ensuring a diverse range of options to suit every need. Here is a sneak-peak of features that you can expect to see on the upcoming MSI's X870 motherboards.

AMD Socket AM4 is now an 8-year-old platform, since its debut back in 2016. AMD objectively went above and beyond for this platform, launching processors powered by the original "Zen," the refreshed "Zen+," the "Zen 2," and the Intel-beating "Zen 3" microarchitecture, including 3D V-cache versions of the "Zen 3" that were competitive even with Intel's 12th Gen Core "Alder Lake" processors in gaming. Those on older processors on AM4 are spoiled for choice with upgrades within the platform, without having to change it, with AMD releasing new processor models every year for the past 8 years. The 2024 launches include the Ryzen 5000XT series.

It's hard to call the Ryzen 5000XT a "series," since there are only two SKUs—the Ryzen 9 5900XT, and the Ryzen 7 5800XT. Neither of the two feature 3D V-cache, but push clock speeds up. The Ryzen 9 5900XT is a 16-core/32-thread part, and is not meant to be confused with the 5900X, which is a 12-core/24-thread part. The 16-core 5900XT comes with a maximum boost frequency of 4.80 GHz, which is 100 MHz less than that of the 5950X. It has the same 105 W TDP, and a significantly lower $360 price. The Ryzen 7 5800XT, on the other hand, is an 8-core/16-thread chip with 4.80 GHz maximum boost frequency, compared to the 4.70 GHz of the 5800X, and the same 105 W TDP. It's priced around $260. Both chips include an AMD Wraith Prism RGB cooler that's capable of handling 140 W TDP processors. The Ryzen 9 5900XT is claimed by AMD to offer similar gaming performance to the Intel Core i7-13700K; while the 5800XT is claimed to play games competitively to the Intel Core i5-13600KF. Both chips should be available sometime in July, 2024.

AMD today announced its much awaited Ryzen 9000 series desktop processors. Built in the Socket AM5 package, and drop-in compatible with all current AM5 motherboards with a BIOS update, the processors are based on the new "Zen 5" CPU microarchitecture. The operational part of the processor, the CPU complex dies (CCDs), are built on the 4 nm process, wired to a 6 nm I/O die. AMD didn't get down into the nuts and bolts of the microarchitecture, but briefly mentioned an impressive 16% IPC increase over "Zen 4." Coupled with the fact that the first wave of processors lack 3D V-cache and can sustain higher boost frequencies and TDP, processors in the series should beat the Ryzen 7 7800X3D in gaming performance, which also means that AMD has beaten the 14th Gen Core "Raptor Lake Refresh" processor series by a significant margin.

The 16% IPC increase over "Zen 4" is backed by branch prediction improvements, wider pipelines and vectors, and deeper window sizes across the core design, for more parallelism. The core also features doubling in instruction bandwidth for front-end instructions, FPU to L1, and L1 to L2 data bandwidth, and a redesigned FPU to double AI performance and AVX512 throughput. The company hasn't put out a block design for "Zen 5," and we'll learn more about it in the run-up to the market availability of these chips some time in July 2024.

AMD today launched its Ryzen AI 300 series mobile processors, codenamed "Strix Point." These chips implement a combination of the AMD "Zen 5" microarchitecture for the CPU cores, the XDNA 2 architecture for its powerful new NPU, and the RDNA 3+ graphics architecture for its 33% faster iGPU. The new "Zen 5" microarchitecture provides a 16% generational IPC uplift over "Zen 4" on the backs of several front-end enhancements, wider execution pipelines, more intra core bandwidth, and a revamped FPU that doubles performance of AI and AVX-512 workloads. AMD didn't go in-depth with the microarchitecture, but the broad points of "Zen 5" are detailed in our article for the Ryzen 9000 "Granite Ridge" desktop processors. Not only is AMD using these faster "Zen 5" CPU cores, but also increased the CPU core count by 50%, for a maximum of 12-core/24-thread.

The "Strix Point" monolithic silicon is built on the 4 nm foundry node, and packs a CPU core complex (CCX) with 12 CPU cores, four of these are "Zen 5," which can achieve the highest possible boost frequencies, the other eight are "Zen 5c" cores that feature an identical IPC and the full ISA, including support for SMT; but don't boost as high as the "Zen 5" cores. AMD is claiming a productivity performance increase ranging between 4% and 73% for its top model based in the series, when compared to Intel's Core Ultra 9 185H "Meteor Lake" processor. The iGPU sees its compute unit (CU) count go all the way up to 16 from 12 in the previous generation, and this yields a claimed 33% increase in iGPU gaming performance compared to the integrated Arc graphics of the Core Ultra 9 185H. Lastly, the XDNA 2 NPU sees more that triple the AI inference performance to 50 AI TOPS, compared to the 16 TOPS of the Ryzen 8040 "Hawk Point" processor, and 12 TOPS of Core Ultra "Meteor Lake." This makes the processor meet Microsoft's Copilot+ AI PC requirements.

We are live from Computex 2024 in Taipei, where AMD CEO Dr Lisa Su takes center-stage to announce what's next from the world of AMD. The company is expected to announce its new "Zen 5" CPU architecture powering new processors across form-factors. In particular, the company is expected to announce processors for the new AI PC Copilot+ standard announced recently by Microsoft. Several more announcements are expected from the world of datacenters and AI GPU acceleration.01:26 UTC: Setting the tone of things to come is this graphic flashing on the screens. Given the colors, we expect AI announcements both in the enterprise and client segments, but beginning with the enterprise side of it.01:38 UTC: And we're up, with a TAITRA introduction of AMD.

MSI, a leading global server provider, will introduce its latest server platforms based on the 4th Gen AMD EPYC processors at Computex 2024, booth #M0806 in Taipei, Taiwan, from June 4-7. These new platforms, designed for growing cloud-native environments, deliver a combination of performance and efficiency for data centers.

"Leveraging the advantages of 4th Gen AMD EPYC processors, MSI's latest server platforms feature scalability and flexibility with new adoption of CXL technology and DC-MHS architecture, helping data centers achieve the most scalable cloud applications while delivering leading performance," said Danny Hsu, General Manager of Enterprise Platform Solutions.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in AI servers and green computing, today announced its participation in COMPUTEX and unveiling of solutions tackling complex AI workloads at scale, as well as advanced cooling infrastructure that will lead to greater energy efficiency. Additionally, to support innovations in accelerated computing and generative AI, GIGABYTE will have NVIDIA GB200 NVL72 systems available in Q1 2025. Discussions around GIGABYTE products will be held in booth #K0116 in Hall 1 at the Taipei Nangang Exhibition Center. As an NVIDIA-Certified System provider, GIGABYTE servers also support NVIDIA NIM inference microservices, part of the NVIDIA AI Enterprise software platform.

Redefining AI Servers and Future Data Centers
All new and upcoming CPU and accelerated computing technologies are being showcased at the GIGABYTE booth alongside GIGA POD, a rack-scale AI solution by GIGABYTE. The flexibility of GIGA POD is demonstrated with the latest solutions such as the NVIDIA HGX B100, NVIDIA HGX H200, NVIDIA GH200 Grace Hopper Superchip, and other OAM baseboard GPU systems. As a turnkey solution, GIGA POD is designed to support baseboard accelerators at scale with switches, networking, compute nodes, and more, including support for NVIDIA Spectrum -X to deliver powerful networking capabilities for generative AI infrastructures.

NVIDIA has taken note of the upward-and-outward trend for enthusiast-segment GeForce RTX gaming graphics cards to be huge, and out of sight for small form-factor gaming PC builds. This can be a problem, as SFF gaming PC builds are confined to exotic liquid cooling solutions that drive up costs, or to make do with mid-performance graphics cards, or simply give up the idea in favor of a next generation console, such as the upcoming ones from Xbox and PlayStation. To confront this trend, NVIDIA developed the new GeForce RTX SFF-Ready Enthusiast Graphics Card Guideline.

Put simply, the guideline calls for SFF-Ready advertised enthusiast segment graphics cards to be no larger than the specified dimensions. These are a maximum of 30.4 cm in length, a maximum of 15.1 cm in height, and a maximum of 5 cm or 2.5 slots in card thickness. Only cards at or smaller than these dimensions (304 mm x 151 mm x 50 mm) quality for the SFF-ready marker. It's also important to note that board partners cannot work their way around this by using AIO liquid cooling solutions where there's more to the card than its main component (i.e. tubing and a radiator). The total physical dimensions of the card cannot exceed the ones specified above. In addition to this, NVIDIA is now going to maintain a continuously updating list of graphics cards and cases that meet the SFF-Ready dimensions.

NVIDIA today announced new NVIDIA RTX technology to power AI assistants and digital humans running on new GeForce RTX AI laptops. NVIDIA unveiled Project G-Assist—an RTX-powered AI assistant technology demo that provides context-aware help for PC games and apps. The Project G-Assist tech demo debuted with ARK: Survival Ascended from Studio Wildcard. NVIDIA also introduced the first PC-based NVIDIA NIM inference microservices for the NVIDIA ACE digital human platform.

These technologies are enabled by the NVIDIA RTX AI Toolkit, a new suite of tools and software development kits that aid developers in optimizing and deploying large generative AI models on Windows PCs. They join NVIDIA's full-stack RTX AI innovations accelerating over 500 PC applications and games and 200 laptop designs from manufacturers. In addition, newly announced RTX AI PC laptops from ASUS and MSI feature up to GeForce RTX 4070 GPUs and power-efficient systems-on-a-chip with Windows 11 AI PC capabilities. These Windows 11 AI PCs will receive a free update to Copilot+ PC experiences when available.

NVIDIA today announced widespread adoption of the NVIDIA Spectrum -X Ethernet networking platform as well as an accelerated product release schedule. CoreWeave, GMO Internet Group, Lambda, Scaleway, STPX Global and Yotta are among the first AI cloud service providers embracing NVIDIA Spectrum-X to bring extreme networking performance to their AI infrastructures. Additionally, several NVIDIA partners have announced Spectrum-based products, including ASRock Rack, ASUS, GIGABYTE, Ingrasys, Inventec, Pegatron, QCT, Wistron and Wiwynn, which join Dell Technologies, Hewlett Packard Enterprise, Lenovo and Supermicro in incorporating the platform into their offerings.

"Rapid advancements in groundbreaking technologies like generative AI underscore the necessity for every business to prioritize networking innovation to gain a competitive edge," said Gilad Shainer, senior vice president of networking at NVIDIA. "NVIDIA Spectrum-X revolutionizes Ethernet networking to let businesses fully harness the power of their AI infrastructures to transform their operations and their industries."

NVIDIA today announced the general availability of NVIDIA ACE generative AI microservices to accelerate the next wave of digital humans, as well as new generative AI breakthroughs coming soon to the platform. Companies in customer service, gaming and healthcare are the first to adopt ACE technologies to simplify creating, animating and operating lifelike digital humans across customer service, telehealth, gaming and entertainment.

These include NVIDIA Nemotron-3 4.5B, the company's first SLM, which has been purpose-built to run on device with similar levels of precision and accuracy as large language models (LLMs) running in the cloud. Nemotron-3 4.5B SLM is now in early access. NVIDIA Audio2Face and NVIDIA Riva ASR on-device models will be available soon in early access. The new NVIDIA AI Inference Manager software development kit simplifies the deployment of ACE to PCs. It preconfigures the PC with the necessary AI models, engines and dependencies while orchestrating AI inference seamlessly across PCs and the cloud.

To address the increasing need for real-time AI computing at the industrial edge, NVIDIA today announced the general software availability of NVIDIA AI Enterprise-IGX with NVIDIA Holoscan on the NVIDIA IGX platform. Together, they empower solution providers within the medical, industrial and scientific computing sectors to develop and deploy edge AI solutions faster, with enterprise-grade software and support.

NVIDIA AI Enterprise-IGX is a new offering providing enterprises with unprecedented performance, security and support for the edge computing software stack, streamlining AI-powered operations and the deployment of AI applications at scale. NVIDIA Holoscan is a sensor-processing platform for streamlining the development and deployment of AI and high-performance computing applications to deliver real-time insights.

ASUS today announced the ROG Ally X, its ambitious new handheld game console that's a step up from the ROG Ally that the company launched last year. The ROG Ally X is powered by the same AMD Ryzen Z1 Extreme processor as the ROG Ally, but with 50% more unified memory—now up to 24 GB of LPDDR5X-7500, which runs at an 18% higher speed than the 16 GB LPDDR5-6400 of the original. The designers also implemented an M.2-2280 NVMe SSD slot, which opens the console up to the widest possible selection of NVMe SSDs. The console includes a 1 TB drive, which is double that of the 500 GB that the ROG Ally comes with. The company has also significantly upgraded the thermal solution of the console with a larger fan, and better thermal venting, which offers 6°C lower gaming temperatures.

Perhaps the biggest feature upgrade is the battery, which is 80 Wh, a 100% increase from the 40 Wh of the original ROG Ally. This may not be a linear 100% increase in battery life from the ROG Ally (due to the various hardware upgrades), but should still pose significant improvements to it. Other hardware updates include USB4, which includes DisplayPort passthrough from the iGPU; besides a separate USB 3.2 Gen 2 type-C. The console supports USB-PD with 140 W fast-charging, and is paired with a first-party GaN-based 140 W fast-charger. Dimensions are similar to those of the ROG Ally, except for 4 mm added thickness, and 70 g added weight (608 g vs. 678 g). Available from July, the ROG Ally X is priced at $799, and includes a 3-month Xbox Game Pass. We went hands on with the console at ASUS's pre-Computex event. Stay tuned for several more announcements form the company in the coming days.

At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in addition to a keynote by Vice Chairman and CEO Dr. Rick Tsai about how MediaTek can enable ubiquitous AI.

At this year's show, MediaTek will debut two new chipsets with powerful performance and support for the latest AI enhancements across multiple verticals: the Kompanio 838 SoC for premium Chromebooks, and the Pentonic 800 SoC for 4K premium smart TVs and displays.

Although it has been rumoured for a little while now that AMD might be launching Ryzen 5000XT CPUs, that rumour just got some added fuel to the fire courtesy of @CodeCommando_ on X/Twitter. The leaker provided a somewhat pixelated screenshot of two new AM4 CPUs, namely the Ryzen 9 5900XT and the Ryzen 7 5800XT. This is one less CPU compared to the Ryzen 3000XT series that AMD launched in 2020 and it looks like the benefits on offer are similar as well. Both chips are 105 Watt parts and have a maximum boost speed of 4.8 GHz, but this is where the similarities end. The Ryzen 9 5900XT has a rather odd SKU name, as it has the same max boost clock as the Ryzen 9 5900X, but the same core and cache count as the Ryzen 5950X.

The Ryzen 7 5800XT on the other hand is a pretty straightforward 100 MHz higher clock speed SKU over the Ryzen 7 5800X, which makes one wonder why AMD even bothered. According to VideoCardz, we're looking at a US$359 MSRP for the Ryzen 9 5900XT, with the Ryzen 7 5800XT coming in at US$249, making both a potentially interesting enough upgrade option for someone that is still using an older AM4 CPU. The pricing and CPU details are said to have been revealed at a pre-Computex media briefing, so it's highly likely that the information is correct. Both chips are said to hit retail in July.

TechPowerUp flies to Taipei this weekend to bring you our biggest ever Live coverage of what is shaping up to be the most exhaustive edition of Computex ever, with hundreds of brands and thousands of new products on display. We have scheduled meetings with all brands from the world of hardware and gaming, so that we can get you full coverage, including hands-on with the hardware you're looking forward to. Besides the show floor, there's a lot happening at Computex, with leading hardware companies announcing their latest platforms. The running theme of course is AI for everyone, and AI everywhere. Since Computex is a mainly PC-focussed expo, the dominating device is bound to be the AI PC. This would mean a slew of core hardware and peripherals enhanced with on-device AI acceleration capabilities.

After the break, we've compiled a list of announcements that we expect from major companies like Intel, AMD, NVIDIA

GeIL will feature at Computex 2024 the EVO V series and TUF GAMING ALLIANCE MEMORY with an Active Dual Fan Cooling System, ensuring optimal stability and performance. GeIL enhances memory stability and reliability with CKD (Client Clock Driver) chips in CUDIMM and CSODIMM products. The CAMM2 and LPCAMM2 modules offer faster speeds and larger capacities for next-gen compact devices, ideal for AI PCs and server applications requiring high capacity and quick access.

GeIL TUF GAMING ALLIANCE MEMORY
In addition to the well-known EVO V series, GeIL TUF GAMING ALLIANCE MEMORY includes the Active Dual Fan Cooling System design, which greatly helps heat dissipation. The enhanced cooling efficiency ensures optimal stability and performance under the most demanding conditions. To provide users with a variety of product options, GeIL TUF GAMING ALLIANCE MEMORY also offers an RGB SKU without fans. Both models will be demonstrated at GeIL's booth at Computex 2024.

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers, today announces a new specification: DDR5-9000 CL40-54-54-112 32 GB (2 x 16 GB) optimized for AMD Ryzen 8000G series processors, providing the ultimate system performance for AMD enthusiasts.

Blazing Speed at DDR5-9000 CL40 1.45 V
With the blazing speed of DDR5 9000 MT/s, users can expect more responsive performance in the most demanding applications and games. The impressive specification of DDR5-9000 16 GB x 2 CL40-54-54-112 at 1.45 V is validated with AMD Ryzen 8000G series processors and the ASUS ROG CROSSHAIR X670E GENE motherboard, as shown in the screenshots below.

AVerMedia, a pioneer in digital multimedia, is thrilled to announce its participation in COMPUTEX 2024, taking place from June 4-7, 2024, at the Taipei Nangang Exhibition Center. Visit us at booth L1309a (Hall 1, 4F) to explore our latest innovations designed to empower creators, streamers, and professionals in the digital age.

Under the theme "Create and Connect", AVerMedia will showcase a range of groundbreaking solutions. These include the new Premium Go Series for handheld device charging and capturing, an award-winning streaming software that integrates all essentials for diverse streaming applications, advanced solutions for next-gen gameplay streaming, a comprehensive series of video conference tools to enhance remote communication and collaboration, and innovative embedded solutions that push the boundaries of what's possible in the digital multimedia landscape.

ENERMAX today announced the showcase of a new series of ATX 3.1 power supplies at Computex Taipei. The lineup features efficiency levels spanning 80 Plus Titanium, Platinum, and Gold, with wattage reaching up to an impressive 2400 W. Additionally, ENERMAX will demonstrate the LIQTECH XTR, a workstation-grade CPU cooler, and unveil an innovative new CPU cooling concept that combines the benefits of both AIO and air cooling solutions. Furthermore, ENERMAX is excited to announce a collaboration with the world's top overclocker, Splave, to launch the REVOLUTION D.F. X PRO Splave edition power supply, with an exclusive 5VSB Discharging Function.

Continuing its pursuit of excellence and innovation, ENERMAX introduces the MaxTytan Digital 1650 W 80 Plus Titanium power supply at Computex 2024 Taipei. This power supply adheres to the ATX 3.1 standard and incorporates an intelligent semi-fanless design where the fan remains static until the power supply operates at 60% load, optimizing both performance and acoustics. Additionally, the power supply is equipped with a built-in wattage display on the rear side, allowing users to obtain real-time output wattage information without the need for additional software. The MaxTytan Digital delivers 1650 W at 80 Plus Titanium efficiency and can reach up to 2000 W at 80 Plus Gold efficiency (230 V only).

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is excited to announce its participation in the upcoming COMPUTEX Taipei 2024. AI has been a hot topic in the IT industry in recent years. ASRock keeps up with the trends, showcasing the latest AI solutions. In addition, creating an impressive gaming environment is one of ASRock's commitments for gamers. Visitors can explore the latest products and AI computing solutions firsthand and experience the gaming simulator at ASRock booth L0818.

Full Firepower Display of Next Gen Motherboard Platform
ASRock will also be revealing its full range of next generation Intel & AMD motherboards including the new line up of Taichi & Phantom Gaming Series, the robust Steel Legend, newly designed Livemixer and mainstream Pro series. The high end Taichi brand will receive its major repositioning and reorganized to be ASRock' s flagship series by merging with existing OC Formula & AQUA product line. Alongside the next gen Phantom Gaming series, the full array of Taichi AQUA, Taichi OCF, Taichi and Taichi Lite motherboards will also be revealed during Computex 2024!

Alphacool is breaking new ground and presenting the innovative Core DDCzero PWM pump at this year's COMPUTEX. This completely new development was designed in collaboration with Xylem and is offered exclusively by Alphacool.

The Core DDCzero PWM pump sets new standards in terms of performance and efficiency. It is powerful enough to reliably supply a complete cooling loop consisting of GPU, CPU and three radiators. At the same time, it remains particularly quiet and impresses with its extremely compact design, allowing it to be integrated into any system with ease.

COUGAR's next generation of gear takes center stage at COMPUTEX, where we're excited to present our latest advancements in PC components and gaming chairs. Our focus this year is on disruptive design, subverting expectations on market trends: our gaming chairs address the needs of integrated work/play spaces as well as prioritizing lumbar health, powerhouse airflow PC cases apply thermodynamic principles to ventilation, and our interpretation of the increasingly ubiquitous panoramic view case puts a literal spin on the conventional design. COUGAR will be exhibiting from June 4-7 in the Nangang Exhibition Hall in Taipei, at Booth L0602: all are welcome to come check us out.

Transparency and brilliance are at the core of the FV270's design, featuring a polyhedral, tempered curved glass perimeter. The unobstructed view of the interior lets the world see your build not only as it is, but all that you imagine it to be. The innovative angled cooling fan placements and a lifted front panel enhance airflow, drawing in cold currents from below for optimal cooling. Cable management is seamless, hiding cable clutter behind the motherboard with reverse routing. Supporting E-ATX motherboards and GPUs up to 420 mm with horizontal and vertical mounting options, custom build potential for the FV270 is limitless. Easily removable filters guarantee protection from dust, and an optional illuminated rotating platform showcases your collectibles, putting a literal spin on conventional panoramic case design and making your PC a personal statement.

MIPS, a leading developer of efficient and configurable IP compute cores, will showcase the company's latest innovations and suite of system deployments at Computex 2024. As part of its activities at Computex 2024, MIPS will highlight its latest solutions demonstrating the company's differentiation around data movement to enable customers to achieve Edge AI innovation. MIPS' architecture enables a bespoke solution with tight integration of the CPU to the overall System-on-Chip (SoC) architecture, managing data movement and memory balancing to predict and solve bottlenecks caused by the increasing throughput demands of new use-cases in AI.

"We are excited to participate in Computex 2024 where we will show how we've evolved as a company and are developing RISC-V tools that give edge AI Embedded customers the freedom to innovate compute," said Durgesh Srivastava, CTO of MIPS. "We remain committed to providing our customers and partners with the innovative solutions they need to succeed in today's rapidly evolving accelerated computing markets. We are anticipating a lot of interest in our technology at the show and look forward to connecting with ecosystem partners, our customers and fellow industry leaders."

V-Color Technology Inc. is excited to announce its participation at COMPUTEX 2024, one of the most significant events in the technology calendar. From June 4th to June 7th, visitors can find v-color on the first floor of Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), booth number J0418, where will be showcasing their memory solutions and innovations.

At COMPUTEX 2024, v-color will feature live demonstrations of their new OC-RDIMMs (Overclocking Registered DIMMs) for workstations, achieving impressive speeds of 8000 MT/s. These demonstrations will highlight the power and reliability of the memory modules when paired with the latest AMD Threadripper PRO 7000 series processors on TRX50 and WRX90 motherboards. This showcase is set to be a must-see for professionals and enthusiasts, opening a new future for workstation performance and AI development.