MediaTek today launched the Dimensity 9400, the company's new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek's flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm's v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek's second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek's previous generation flagship chipset, the Dimensity 9300. Built on TSMC's second-generation 3 nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

Arm has announced a pair of new Armv9 CPU cores today, alongside a refresh of a third. The new additions are the Cortex-X925—which is a huge model number jump from the previous Cortex-X4—and the Cortex-A725 which should be an upgraded Cortex-A720. Finally the Cortex-A520 has been refreshed to bring a 15 percent power efficiency improvement as well as support for 3 nm production nodes. Arm claims that the Cortex-A925 delivers its highest performance improvement ever over a previous generation with a single core uplift of up to 36 percent and an AI performance improvement of up to 46 percent compared to the Cortex-X4. The Cortex-X925 will support up to 3 MB private L2 cache and is tape-out ready for 3 nm production nodes.

The Cortex-A725 is said to offer a 35 percent performance efficiency improvement over the Cortex-A720 and it's been given performance boosts both when it comes to AI and gaming workloads. It's said to be up to 25 percent more power efficient than the Cortex-A720 and L3 cache traffic has been improved by up to 20 percent. Again, the Cortex-A720 is ready for production on a 3 nm node. Finally, Arm has also updated its DynamIQ Shared Unit to the DS-120 and here Arm has managed to reduce the typical workload power by up to 50 percent and the cache miss power by up to 60 percent. The DSU-120 scales to up to 14 Arm cores, suggesting that we might get to see some interesting new SoC implementations in the coming years from Arm's partners, although Arm's reference platform is a 2-4-2 configuration of the new cores.

Last week Patrick Moorhead, CEO and founder of Moor Insights & Strategy, shared his insider sourced thoughts about ARM's next generation Cortex-X processor: "Blackhawk is planned to enable in smartphones shipping at the end of 2024. I think phones could be on the shelf a year from now at CES or maybe MWC." Moorhead believes that Cortex-X4's successor will be the most powerful option available at launch, which forms part of (ARM CEO) Rene Haas's strategy to "eliminate the performance gap between ARM-designed processors and custom ARM implementations." He believes that "this is a big and bold claim," since Apple is widely considered to rule the roost here with its cutting edge ARM-based Bionic designs. Moorhead's inside information has "Blackhawk" demonstrating the "largest year-over-year IPC performance increase in 5 years" citing undisclosed Geekbench 6 results.

He also presented evidence that the artificial intelligence processing is a key focus: "I am hopeful these performance goals translate to app performance as well. ARM also believes that Blackhawk will provide "great" LLM performance. I will assume that this has to do with big CPU IPC performance improvements as ARM says that its Cortex CPU is the #1 AI target for developers...The NPU and GPU can be an efficient way to run AI, but a CPU is the easiest and most pervasive way, which is why developers target it. A higher-performing CPU obviously helps here, but as the world moves increasingly to smaller language models, Arm's platform with higher-performing CPU and GPU combined with its tightly integrated ML libraries and frameworks will likely result in a more efficient experience on devices."

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

In April, Intel Foundry Services (IFS) and Arm announced a multigenerational agreement to enable chip designers to build low-power compute system-on-chip (SoCs) on Intel technology. We are excited to provide our customers with the opportunity to design their mobile SoCs on Intel's leading-edge 18 A process technology paired with the latest, most powerful Arm CPU core—the recently launched next-generation Cortex-X4—for improved power and performance. This is a great sign of the momentum building around IFS, and it is part of the reason why I was eager to take on leadership of the organization in March. IFS is on a remarkable journey, and now that I've spent some time with the organization, I want to share more about why our mission is critically important for foundry customers around the world, for Intel and for me.

I first joined Intel in 1981 at the dawn of the PC era and returned in 2021 when our CEO Pat Gelsinger introduced Intel's IDM 2.0 strategy. In hearing his vision, I was motivated by the opportunity to help restore Intel's global leadership in the growing semiconductor industry. The global demand for semiconductors continues to see sustained, long-term growth, and the chip industry is expected to reach $1 trillion in sales by the end of the decade. This is an unprecedented opportunity. At the same time, 80% of the world's chip manufacturing capacity is concentrated in Asia, and many foundry customers are looking for more options.

Mobile devices touch every aspect of our digital lives. In the palm of your hand is the ability to both create and consume increasingly immersive, AI-accelerated experiences that continue to drive the need for more compute. Arm is at the heart of many of these, bringing unlimited delight, productivity and success to more people than ever. Every year we build foundational platforms designed to meet these increasing compute demands, with a relentless focus on high performance and efficiency. Working closely with our broader ecosystem, we're delivering the performance, efficiency and intelligence needed on every generation of consumer device to expand our digital lifestyles.

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system. This includes a new world-class Arm Immortalis GPU based on our brand-new 5th Generation GPU architecture for ultimate visual experiences, a new cluster of Armv9 CPUs that continue our performance leadership for next-gen artificial intelligence (AI), and new enhancements to deliver more accessible software for the millions of Arm developers.