Tachyum today announced that it is bringing 1U and 2U platform solutions to market behind a strategy that ensures customers and partners will be able to quickly and easily test, benchmark and deploy Prodigy solutions across a broad range of supported applications and workloads. Tachyum's platform strategy includes offering evaluation platforms for early testing with OEMs and ODMs able to incorporate Prodigy into their own designs. The 2U evaluation platform, optimized to address the high-performance needs of HPC and Big AI, will be the first to sample in Q1 of 2025. The 1U platform, targeting applications such as AI inference and a wide range of cloud applications, follows in the second quarter.

Tachyum has chosen Chenbro as the chassis partner for the Prodigy evaluation platforms. Chenbro's standard chassis products provide solutions for both 1U and 2U that address Prodigy's high-performance requirements, allowing Tachyum to focus on the device and motherboard development. Both platforms will use the same 2-socket motherboard supporting 32 DDR5 DIMMs, as well as supporting storage integration for 16 E1.S SSDs. The evaluation platforms will initially launch as air-cooled infrastructures, allowing for fast, easy evaluations, with a 4-socket liquid-cooled platform arriving later.

MiTAC Computing Technology, a subsidiary of MiTAC Holdings Corp., proudly reveals its groundbreaking suite of server solutions that deliver unsurpassed capabilities with the 5th Gen Intel Xeon Scalable Processors. MiTAC introduces its cutting-edge signature platforms that seamlessly integrate the Intel Data Center GPUs, both Intel Max Series and Intel Flex Series, an unparalleled leap in computing performance is unleashed targeting HPC and AI applications.

MiTAC Announce its Full Array of Platforms Supporting the latest 5th Gen Intel Xeon Scalable Processors
Last year, Intel transitioned the right to manufacture and sell products based on Intel Data Center Solution Group designs to MiTAC. MiTAC confidently announces a transformative upgrade to its product offerings, unveiling advanced platforms that epitomize the future of computing. Featured with up to 64 cores, expanded shared cache, increased UPI and DDR5 support, the latest 5th Gen Intel Xeon Scalable Processors deliver remarkable performance per watt gains across various workloads. MiTAC's Intel Server M50FCP Family and Intel Server D50DNP Family fully support the latest 5th Gen Intel Xeon Scalable Processors, made possible through a quick BIOS update and easy technical resource revisions which provide unsurpassed performance to diverse computing environments.

At MWC Barcelona 2024, Huawei launched the Huawei OptiXtrans DC908 Pro, a new platform for Data Center Interconnect (DCI) designed for the intelligent era. This innovative platform ensures the efficient, secure, and stable transmission of data between data centers (DCs), setting a new standard for DCI networks. As AI continues to proliferate across various service scenarios, the demand for foundation models has intensified, leading to an explosion in data volume. DCs are now operating at the petabyte level, and DCI networks have evolved from single-wavelength 100 Gbit/s to single-wavelength Tbit/s.

In response to the challenges posed by massive data transmission in the intelligent era, Huawei introduces the next-generation DCI platform, the Huawei OptiXtrans DC908 Pro. Compared to its predecessor, the DC908 Pro offers higher bandwidth, reliability, and intelligence.

In Sept. 2023, Quantum Machines (QM) unveiled OPX1000, our most advanced quantum control system to date - and the industry's leading controller in terms of performance and channel density. OPX1000 is the third generation of QM's processor-based quantum controllers. It enhances its predecessor, OPX+, by expanding analog performance and multiplying channel density to support the control of over 1,000 qubits. However, QM's vision for quantum controllers extends far beyond.

OPX1000 is designed as a platform for orchestrating the control of large-scale QPUs (quantum processing units). It's equipped with 8 frontend modules (FEMs) slots, representing the cutting-edge modular architecture for quantum control. The first low-frequency (LF) module was introduced in September 2023, and today, we're happy to introduce the Microwave (MW) FEM, which delivers additional value to our rapidly expanding customer base.

NVIDIA is reported to be setting up an AI-focused semi-custom chip design business unit, according to inside sources known to Reuters—it is believed that Team Green leadership is adapting to demands leveraged by key data-center customers. Many companies are seeking cheaper alternatives, or have devised their own designs (budget/war chest permitting)—NVIDIA's current range of AI GPUs are simply off-the-shelf solutions. OpenAI has generated the most industry noise—their alleged early 2024 fund-raising pursuits have attracted plenty of speculative/kind-of-serious interest from notable semiconductor personalities.

Team Green is seemingly reacting to emerging market trends—Jensen Huang (CEO, president and co-founder) has hinted that NVIDIA custom chip designing services are on the cusp. Stephen Nellis—a Reuters reporter specializing in tech industry developments—has highlighted select NVIDIA boss quotes from an incoming interview piece: "We're always open to do that. Usually, the customization, after some discussion, could fall into system reconfigurations or recompositions of systems." The Team Green chief teased that his engineering team is prepared to take on the challenge meeting exact requests: "But if it's not possible to do that, we're more than happy to do a custom chip. And the benefit to the customer, as you can imagine, is really quite terrific. It allows them to extend our architecture with their know-how and their proprietary information." The rumored NVIDIA semi-custom chip design business unit could be introduced in an official capacity at next month's GTC 2024 Conference.

A collaboration including Intel, Dell Technologies, Nvidia and the Ohio Supercomputer Center (OSC), today introduces Cardinal, a cutting-edge high-performance computing (HPC) cluster. Purpose-built to meet the increasing demand for HPC resources in Ohio across research, education and industry innovation, particularly in artificial intelligence (AI).

AI and machine learning are integral tools in scientific, engineering and biomedical fields for solving complex research inquiries. As these technologies continue to demonstrate efficacy, academic domains such as agricultural sciences, architecture and social studies are embracing their potential. Cardinal is equipped with the hardware capable of meeting the demands of expanding AI workloads. In both capabilities and capacity, the new cluster will be a substantial upgrade from the system it will replace, the Owens Cluster launched in 2016.

Edged Energy, a subsidiary of Endeavour devoted to carbon neutral data center infrastructure, announced today the launch of its first four U.S. data centers, all designed for today's high-density AI workloads and equipped with advanced waterless cooling and ultra-efficient energy systems. The facilities will bring more than 300 MW of critical capacity with an industry-leading average Power Usage Effectiveness (PUE) of 1.15 portfolio-wide. Edged has nearly a dozen new data centers operating or under construction across Europe and North America and a gigawatt-scale project pipeline.

The first phase of this U.S. expansion includes a 168 MW campus in Atlanta, a 96 MW campus in the Chicago area, 36 MW in Phoenix and 24 MW in Kansas City. At a time of growing water scarcity where rivers, aquifers and watersheds are at dangerously low levels, it is more critical than ever that IT infrastructure conserve precious water resources. The new Edged facilities are expected to save more than 1.2 billion gallons of water each year compared to conventional data centers. "The rise of AI and machine learning is requiring more power, and often more water, to cool outdated servers. While traditional data centers struggle to adapt, Edged facilities are ready for the advanced computing of today and tomorrow without consuming any water for cooling," said Bryant Farland, Chief Executive Officer for Edged. "Sustainability is at the core of our platform. It is why our data centers are uniquely optimized for energy efficiency and water conservation. We are excited to be partnering with local communities to bring future-proof solutions to a growing digital economy."

Intel Corporation today reported fourth-quarter and full-year 2023 financial results. "We delivered strong Q4 results, surpassing expectations for the fourth consecutive quarter with revenue at the higher end of our guidance," said Pat Gelsinger, Intel CEO. "The quarter capped a year of tremendous progress on Intel's transformation, where we consistently drove execution and accelerated innovation, resulting in strong customer momentum for our products. In 2024, we remain relentlessly focused on achieving process and product leadership, continuing to build our external foundry business and at-scale global manufacturing, and executing our mission to bring AI everywhere as we drive long-term value for stakeholders."

David Zinsner, Intel CFO, said, "We continued to drive operational efficiencies in the fourth quarter, and comfortably achieved our commitment to deliver $3 billion in cost savings in 2023. We expect to unlock further efficiencies in 2024 and beyond as we implement our new internal foundry model, which is designed to drive greater transparency and accountability and higher returns on our owners' capital." For the full year, the company generated $11.5 billion in cash from operations and paid dividends of $3.1 billion.

KIOXIA brought a handful of its latest data center SSDs to the 2024 International CES. The lineup begins with the CD8P series designed for a balance in data-heat (frequency of access) and capacity, with applications that include CDN, compute, read-intensive use-cases, and data streaming. The drive comes in the 2.5-inch 18 mm U.2 and EDSFF E3.8 form-factors. The CD8P features a PCI-Express 5.0 x4 host interface, and comes in capacities ranging between 1.92 TB, going all the way up to 15.36 TB. Write endurance recommended is between 1 DWPD to 3 DWPD, so this really isn't a major write-intensive drive, for that, you'll need to pay attention to our next drive, the KIOXIA FL6.

The FL6 from KIOXIA is a scribe par none. It's aimed at write heavy applications such as server caching, and the hottest tiers in tiered storage; and Big Iron database machines. The FL6 comes in capacities of up to 3.2 TB, but offers a mammoth 60 DWPD write endurance. It comes in the 2.5-inch 18 mm form factor with PCI-Express 3.0 x4 interface. Security features include SIE, SED, and FIPS 140-2.

Intel Corporation today announced the appointment of Justin Hotard as executive vice president and general manager of its Data Center and AI Group (DCAI), effective Feb. 1. He joins Intel with more than 20 years of experience driving transformation and growth in computing and data center businesses, and is a leader in delivering scalable AI systems for the enterprise.

Hotard will become a member of Intel's executive leadership team and report directly to CEO Pat Gelsinger. He will be responsible for Intel's suite of data center products spanning enterprise and cloud, including its Intel Xeon processor family, graphics processing units (GPUs) and accelerators. He will also play an integral role in driving the company's mission to bring AI everywhere.

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, today announced successful collaboration with Keysight Technologies, a market-leading design, emulation, and test solutions provider, demonstrating interoperability between Alphawave Semi's PCIe 6.0 64 GT/s Subsystem (PHY and Controller) Device and Keysight PCIe 6.0 64 GT/s Protocol Exerciser, negotiating a link to the maximum PCIe 6.0 data rate. Alphawave Semi, already on the PCI-SIG 5.0 Integrators list, is accelerating next-generation PCIe 6.0 Compliance Testing through this collaboration.

Alphawave Semi's leading-edge silicon implementation of the new PCIe 6.0 64 GT/s Flow Control Unit (FLIT)-based protocol enables higher data rates for hyperscale and data infrastructure applications. Keysight and Alphawave Semi achieved another milestone by successfully establishing a CXL 2.0 link setting the stage for future cache coherency in the datacenter.

In the era of high-tech development and the ever-increasing demand for data processing power, data centers are consuming more energy and generating excess heat. As a global leader in thermal solutions, SUNON is at the forefront, offering a diverse range of cutting-edge liquid cooling solutions tailored to advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.

SUNON's liquid cooling design services are ideally suited for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are meticulously customized to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they guarantee exceptional cooling efficiency and reliability, ultimately contributing to a significant reduction in a client's total cost of ownership (TCO) in the long term. In the pursuit of net-zero emissions standards, SUNON's liquid cooling solutions play a pivotal role in enhancing corporate sustainability. They o ff er a win-win scenario for clients seeking to transition toward greener and more digitalized operations.

Today at the "AI Everywhere" event, Intel launched its 5th Gen Intel Xeon processors (code-named Emerald Rapids) that deliver increased performance per watt and lower total cost of ownership (TCO) across critical workloads for artificial intelligence, high performance computing (HPC), networking, storage, database and security. This launch marks the second Xeon family upgrade in less than a year, offering customers more compute and faster memory at the same power envelope as the previous generation. The processors are software- and platform-compatible with 4th Gen Intel Xeon processors, allowing customers to upgrade and maximize the longevity of infrastructure investments while reducing costs and carbon emissions.

"Designed for AI, our 5th Gen Intel Xeon processors provide greater performance to customers deploying AI capabilities across cloud, network and edge use cases. As a result of our long-standing work with customers, partners and the developer ecosystem, we're launching 5th Gen Intel Xeon on a proven foundation that will enable rapid adoption and scale at lower TCO." -Sandra Rivera, Intel executive vice president and general manager of Data Center and AI Group.

Supermicro, Inc., a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, is announcing three new additions to its AMD-based H13 generation of GPU Servers, optimized to deliver leading-edge performance and efficiency, powered by the new AMD Instinct MI300 Series accelerators. Supermicro's powerful rack scale solutions with 8-GPU servers with the AMD Instinct MI300X OAM configuration are ideal for large model training.

The new 2U liquid-cooled and 4U air-cooled servers with the AMD Instinct MI300A Accelerated Processing Units (APUs) accelerators are available and improve data center efficiencies and power the fast-growing complex demands in AI, LLM, and HPC. The new systems contain quad APUs for scalable applications. Supermicro can deliver complete liquid-cooled racks for large-scale environments with up to 1,728 TFlops of FP64 performance per rack. Supermicro worldwide manufacturing facilities streamline the delivery of these new servers for AI and HPC convergence.

Today at the "Advancing AI" event, AMD was joined by industry leaders including Microsoft, Meta, Oracle, Dell Technologies, HPE, Lenovo, Supermicro, Arista, Broadcom and Cisco to showcase how these companies are working with AMD to deliver advanced AI solutions spanning from cloud to enterprise and PCs. AMD launched multiple new products at the event, including the AMD Instinct MI300 Series data center AI accelerators, ROCm 6 open software stack with significant optimizations and new features supporting Large Language Models (LLMs) and Ryzen 8040 Series processors with Ryzen AI.

"AI is the future of computing and AMD is uniquely positioned to power the end-to-end infrastructure that will define this AI era, from massive cloud installations to enterprise clusters and AI-enabled intelligent embedded devices and PCs," said AMD Chair and CEO Dr. Lisa Su. "We are seeing very strong demand for our new Instinct MI300 GPUs, which are the highest-performance accelerators in the world for generative AI. We are also building significant momentum for our data center AI solutions with the largest cloud companies, the industry's top server providers, and the most innovative AI startups ꟷ who we are working closely with to rapidly bring Instinct MI300 solutions to market that will dramatically accelerate the pace of innovation across the entire AI ecosystem."

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

The 62nd edition of the TOP500 reveals that the Frontier system retains its top spot and is still the only exascale machine on the list. However, five new or upgraded systems have shaken up the Top 10.

Housed at the Oak Ridge National Laboratory (ORNL) in Tennessee, USA, Frontier leads the pack with an HPL score of 1.194 EFlop/s - unchanged from the June 2023 list. Frontier utilizes AMD EPYC 64C 2GHz processors and is based on the latest HPE Cray EX235a architecture. The system has a total of 8,699,904 combined CPU and GPU cores. Additionally, Frontier has an impressive power efficiency rating of 52.59 GFlops/watt and relies on HPE's Slingshot 11 network for data transfer.

EK, the leading premium liquid cooling gear manufacturer, will soon provide a one-stop-shop purchasing option where System Integrators, Data Centers, AI/ML-focused companies, and similar customers can get full enterprise-grade custom liquid-cooling loops for their systems. The products belong to the EK-Pro line of professional liquid cooling solutions tailor-made for HPC systems and high-compute density applications. This means that System Integrators and Data Centers will be able to purchase full liquid cooling loops for their HPC servers and workstations and enjoy all the benefits that water-cooled HPC systems can provide.

The Advantages of Liquid Cooling for HPC Systems
High Performance Computing facilities use servers and workstations that leverage powerful GPUs, multithreaded CPUs, petabytes of RAM, and extensive storage space. All this computing power, despite modern advancements in manufacturing and power efficiency, generates tremendous amounts of heat. In fact, it is estimated that up to 40% of the total energy requirements of these facilities is spent on keeping the IT equipment within acceptable operating temperatures. Plus, the components that use conventional air cooling tend to underperform and have shorter lifespans.

Dell Technologies, Intel and the University of Cambridge announce the deployment of the co-designed Dawn Phase 1 supercomputer. Leading technical teams built the U.K.'s fastest AI supercomputer that harnesses the power of both artificial intelligence (AI) and high performance computing (HPC) to solve some of the world's most pressing challenges. This sets a clear way forward for future U.K. technology leadership and inward investment into the U.K. technology sector. Dawn kickstarts the recently launched U.K. AI Research Resource (AIRR), which will explore the viability of associated systems and architectures. Dawn brings the U.K. closer to reaching the compute threshold of a quintillion (1018) floating point operations per second - one exaflop, better known as exascale. For perspective: Every person on earth would have to make calculations 24 hours a day for more than four years to equal a second's worth of processing power in an exascale system.

"Dawn considerably strengthens the scientific and AI compute capability available in the U.K., and it's on the ground, operational today at the Cambridge Open Zettascale Lab. Dell PowerEdge XE9640 servers offer a no-compromises platform to host the Intel Data Center GPU Max Series accelerator, which opens up the ecosystem to choice through oneAPI. I'm very excited to see the sorts of early science this machine can deliver and continue to strengthen the Open Zettascale Lab partnership between Dell Technologies, Intel and the University of Cambridge, and further broaden that to the U.K. scientific and AI community," said Adam Roe, EMEA HPC technical director at Intel.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

Phytium, a Chinese semiconductor company that faced U.S. government sanctions from 2021, has introduced its latest data center processor, the 64-core Feiteng Tengyun S2500. Designed for cloud and high-performance computing applications, this processor features a large-capacity shared L3 cache, enhanced security capabilities for cloud servers, and improved memory subsystem reliability. The Feiteng Tengyun S2500 features 64 FTC661 cores developed by Phytium, which are based on Armv8 ISA. Reportedly, the CPU features 64 MB of L3 cache and 512 KB of L2 per core, bringing the total to 96 MB of processor cache. Compared to the previous generation line, the S2500 brings an L3 cache and TDP of 150 Watts, up from 90 Watts of previous generation.

This is Phytium's first new CPU in several years, raising questions about its production capacity and access to foundries, given its sanctions-related restrictions. It is currently unknown which foundry will manufacture the Feiteng Tengyun S2500, and we expect to hear more about it as (if) units get shipped. So far only display units have made appearance. Nonetheless, the company has continued its hardware development efforts and garnered interest in collaborating with Huawei to unify hardware and software ecosystems, which has yet to come to fruition.

Moore Threads Technology (MTT), a Chinese GPU manufacturer, is reportedly testing its next-generation graphics processors for client PCs and data centers. The products under scrutiny are the MTT S90 for client/gaming computers and the MTT S4000 for data centers. Characterized by their Device IDs, 0301 and 0323, this could imply that these GPUs belong to MTT's 3rd generation GPU lineup. While few details about these GPUs are available, the new Device IDs suggest a possible introduction of a novel microarchitecture following the MTT Chunxiao GPU series. The current generation Chunxiao series, featuring the MTT S70, MTT S80, and MTT S3000, failed to compete effectively with AMD, Intel, and NVIDIA GPUs.

Thanks to @Löschzwerg who found the Device Hunt submission, we see hardware identifiers in PCI ID and USB ID repositories earlier than launch, as this often signals the testing of new chips or drivers by various companies. In the case of MTT, the latest developments are complicated by its recent inclusion on the U.S. Entity List, limiting its access to US-made technologies. This introduces a problem for the company, as they can't access TSMC's facilities for chip production, and will have to turn to domestic production in the likely case, with SMIC being the only leading option to consider.

LITEON Technology, the global leading provider of power and cooling solutions, is set to unveil its groundbreaking liquid cooling solutions featuring immersion technology through its new brand, COOLITE. This will be the very first time that LITEON showcases its COOLITE solutions, along with state-of-the-art power solutions at the OCP Global Summit. These pioneering solutions are poised to transform data centers by significantly enhancing efficiency, performance, and sustainability.

LITEON COOLITE Liquid Cooling Solutions Bring a Paradigm Shift in Data Center Cooling
LITEON's COOLITE Liquid Cooling Solutions, with immersion technology, bring a paradigm shift in data center cooling. By immersing servers and components in a specialized cooling fluid, these solutions eliminate the constraints of traditional air-based cooling. This results in significantly improved thermal efficiency, enabling data centers to handle high-performance workloads with ease. Furthermore, the reduced energy consumption and carbon footprint contribute to the sustainability goals of data centers.

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products: