Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs.

As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs.

Micron Technology, Inc., today announced it has begun qualification of the 6550 ION NVMe SSD with customers. The Micron 6550 ION is the world's fastest 60 TB data center SSD and the industry's first E3.S and PCIe Gen 5 60 TB SSD. It follows the success of the award-winning 6500 ION and is engineered to provide best-in-class performance, energy efficiency, endurance, security, and rack density for exascale data center deployments. The 6550 ION excels in high-capacity NVMe workloads such as networked AI data lakes, ingest, data preparation and check pointing, file and object storage, public cloud storage, analytic databases, and content delivery.

"The Micron 6550 ION achieves a remarkable 12 GB/s while using just 20 watts of power, setting a new standard in data center performance and energy efficiency," said Alvaro Toledo, vice president and general manager of Micron's Data Center Storage Group. "Featuring a first-to-market 60 TB capacity in an E3.S form factor and up to 20% better energy efficiency than competitive drives, the Micron 6550 ION is a game-changer for high-capacity storage solutions to address the insatiable capacity and power demands of AI workloads."

AMD today announced revenue for the third quarter of 2024 of $6.8 billion, gross margin of 50%, operating income of $724 million, net income of $771 million and diluted earnings per share of $0.47. On a non-GAAP basis, gross margin was 54%, operating income was $1.7 billion, net income was $1.5 billion and diluted earnings per share was $0.92.

"We delivered strong third quarter financial results with record revenue led by higher sales of EPYC and Instinct data center products and robust demand for our Ryzen PC processors," said AMD Chair and CEO Dr. Lisa Su. "Looking forward, we see significant growth opportunities across our data center, client and embedded businesses driven by the insatiable demand for more compute."

During the Open Compute Project (OCP) Summit 2024, Meta, one of the prime members of the OCP project, showed its NVIDIA "Blackwell" GB200 systems for its massive data centers. We previously covered Microsoft's Azure server rack with GB200 GPUs featuring one-third of the rack space for computing and two-thirds for cooling. A few days later, Google showed off its smaller GB200 system, and today, Meta is showing off its GB200 system—the smallest of the bunch. To train a dense transformer large language model with 405B parameters and a context window of up to 128k tokens, like the Llama 3.1 405B, Meta must redesign its data center infrastructure to run a distributed training job on two 24,000 GPU clusters. That is 48,000 GPUs used for training a single AI model.

Called "Catalina," it is built on the NVIDIA Blackwell platform, emphasizing modularity and adaptability while incorporating the latest NVIDIA GB200 Grace Blackwell Superchip. To address the escalating power requirements of GPUs, Catalina introduces the Orv3, a high-power rack capable of delivering up to 140kW. The comprehensive liquid-cooled setup encompasses a power shelf supporting various components, including a compute tray, switch tray, the Orv3 HPR, Wedge 400 fabric switch with 12.8 Tbps switching capacity, management switch, battery backup, and a rack management controller. Interestingly, Meta also upgraded its "Grand Teton" system for internal usage, such as deep learning recommendation models (DLRMs) and content understanding with AMD Instinct MI300X. Those are used to inference internal models, and MI300X appears to provide the best performance per Dollar for inference. According to Meta, the computational demand stemming from AI will continue to increase exponentially, so more NVIDIA and AMD GPUs is needed, and we can't wait to see what the company builds.

SK hynix is showcasing its leading AI and data center memory products at the 2024 Open Compute Project (OCP) Global Summit held October 15-17 in San Jose, California. The annual summit brings together industry leaders to discuss advancements in open source hardware and data center technologies. This year, the event's theme is "From Ideas to Impact," which aims to foster the realization of theoretical concepts into real-world technologies.

In addition to presenting its advanced memory products at the summit, SK hynix is also strengthening key industry partnerships and sharing its AI memory expertise through insightful presentations. This year, the company is holding eight sessions—up from five in 2023—on topics including HBM and CMS.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

Western Digital Corp. today announced that its PCIe Gen 5 DC SN861 E.1S enterprise-class NVMe SSDs have been certified to support the NVIDIA GB200 NVL72 rack-scale system.

The rapid rise of AI, ML, and large language models (LLMs) is creating a challenge for companies with two opposing forces. Data generation and consumption are accelerating, while organizations face pressure to quickly derive value from this data. Performance, scalability, and efficiency are essential for AI technology stacks as storage demands rise. Certified to be compatible with the GB200 NVL72 system, Western Digital's enterprise SSD addresses the growing needs of the AI market for high-speed accelerated computing combined with low latency to serve compute-intensive AI environments.

Advantech, a global leader in embedded computing, is excited to announce the release of the SQRAM CXL 2.0 Type 3 Memory Module. Compute Express Link (CXL) 2.0 is the next evolution in memory technology, providing memory expansion with a high-speed, low-latency interconnect designed to meet the demands of large AI Training and HPC clusters. CXL 2.0 builds on the foundation of the original CXL specification, introducing advanced features such as memory sharing, and expansion, enabling more efficient utilization of resources across heterogeneous computing environments.

Memory Expansion via E3.S 2T Form Factor
Traditional memory architectures are often limited by fixed allocations, which can result in underutilized resources and bottlenecks in data-intensive workloads. With the E3.S form factor, based on the EDSFF standard, the CXL 2.0 Memory Module overcomes these limitations, allowing for dynamic resource management. This not only improves performance but reduces costs by maximizing existing resources.

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.

Today, Lenovo announced its industry-leading ThinkSystem infrastructure solutions powered by AMD EPYC 9005 Series processors, as well as AMD Instinct MI325X accelerators. Backed by 225 of AMD's world-record performance benchmarks, the Lenovo ThinkSystem servers deliver an unparalleled combination of AMD technology-based performance and efficiency to tackle today's most demanding edge-to-cloud workloads, including AI training, inferencing and modeling.

"Lenovo is helping organizations of all sizes and across various industries achieve AI-powered business transformations," said Vlad Rozanovich, Senior Vice President, Lenovo Infrastructure Solutions Group. "Not only do we deliver unmatched performance, we offer the right mix of solutions to change the economics of AI and give customers faster time-to-value and improved total value of ownership."

Hewlett Packard Enterprise today announced the HPE ProLiant Compute XD685 for complex AI model training tasks, powered by 5th Gen AMD EPYC processors and AMD Instinct MI325X accelerators. The new HPE system is optimized to quickly deploy high-performing, secure and energy-efficient AI clusters for use in large language model training, natural language processing and multi-modal training.

The race is on to unlock the promise of AI and its potential to dramatically advance outcomes in workforce productivity, healthcare, climate sciences and much more. To capture this potential, AI service providers, governments and large model builders require flexible, high-performance solutions that can be brought to market quickly.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces the launch of a new series of servers, GPU-accelerated systems, and storage servers featuring the AMD EPYC 9005 Series processors and AMD Instinct MI325X GPUs. The new H14 product line represents one of the most extensive server families in the industry, including Supermicro's Hyper systems, the Twin multi-node servers, and AI inferencing GPU systems, all available with air or liquid cooling options. The new "Zen 5" processor core architecture implements full data path AVX-512 vector instructions for CPU-based AI inference and provides 17% better instructions per cycle (IPC) than the previous 4th generation EPYC processor, enabling more performance per core.

Supermicro's new H14 family uses the latest 5th Gen AMD EPYC processors which enable up to 192 cores per CPU with up to 500 W TDP (thermal design power). Supermicro has designed new H14 systems including the Hyper and FlexTwin systems which can accommodate the higher thermal requirements. The H14 family also includes three systems for AI training and inference workloads supporting up to 10 GPUs which feature the AMD EPYC 9005 Series CPU as the host processor and two which support the AMD Instinct MI325X GPU.

MSI, a leading global provider of high-performance server solutions, today introduced its latest AMD EPYC 9005 Series CPU-based server boards and platforms, engineered to tackle the most demanding data center workloads with leadership performance and efficiency.

Featuring AMD EPYC 9005 Series processors with up to 192 cores and 384 threads, MSI's new server platforms deliver breakthrough compute power, unparalleled density, and exceptional energy efficiency, making them ideal for handling AI-enabled, cloud-native, and business-critical workloads in modern data centers.

AMD (NASDAQ: AMD) today announced the availability of the 5th Gen AMD EPYC processors, formerly codenamed "Turin," the world's best server CPU for enterprise, AI and cloud. Using the "Zen 5" core architecture, compatible with the broadly deployed SP5 platform and offering a broad range of core counts spanning from 8 to 192, the AMD EPYC 9005 Series processors extend the record-breaking performance and energy efficiency of the previous generations with the top of stack 192 core CPU delivering up to 2.7X the performance compared to the competition.

New to the AMD EPYC 9005 Series CPUs is the 64 core AMD EPYC 9575F, tailor made for GPU powered AI solutions that need the ultimate in host CPU capabilities. Boosting up to 5 GHz, compared to the 3.8 GHz processor of the competition, it provides up to 28% faster processing needed to keep GPUs fed with data for demanding AI workloads.

Super Micro Computer, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces the launch of a new, versatile, high-density infrastructure platform optimized for AI inferencing at the network edge. As companies seek to embrace complex large language models (LLM) in their daily operations, there is a need for new hardware capable of inferencing high volumes of data in edge locations with minimal latency. Supermicro's innovative system combines versatility, performance, and thermal efficiency to deliver up to 10 double-width GPUs in a single system capable of running in traditional air-cooled environments.

"Owing to the system's optimized thermal design, Supermicro can deliver all this performance in a high-density 3U 20 PCIe system with 256 cores that can be deployed in edge data centers," said Charles Liang, president and CEO of Supermicro. "As the AI market is growing exponentially, customers need a powerful, versatile solution to inference data to run LLM-based applications on-premises, close to where the data is generated. Our new 3U Edge AI system enables them to run innovative solutions with minimal latency."

Today, Inflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers. Inflection AI is launching Inflection for Enterprise, an industry-first, enterprise-grade AI system powered by Intel Gaudi and Intel Tiber AI Cloud (AI Cloud), to deliver empathetic, conversational, employee-friendly AI capabilities and provide the control, customization and scalability required for complex, large-scale deployments. This system is available presently through the AI Cloud and will be shipping to customers as an industry-first AI appliance powered by Gaudi 3 in Q1 2025.

"Through this strategic collaboration with Inflection AI, we are setting a new standard with AI solutions that deliver immediate, high-impact results. With support for open-source models, tools, and competitive performance per watt, Intel Gaudi 3 solutions make deploying GenAI accessible, affordable, and efficient for enterprises of any size." -Justin Hotard, Intel executive vice president and general manager of the Data Center and AI Group

Alongside German Chancellor Olaf Scholz, senior European government officials and European-based global enterprises, IBM (NYSE: IBM) today unveiled the first IBM Quantum Data Center located outside of the United States. It is the company's second quantum data center in the world and marks a significant expansion of its fleet of advanced, utility-scale quantum systems available to global users via the cloud.

Now online in Ehningen, Germany, Europe's first IBM Quantum Data Center includes two new utility-scale, IBM Quantum Eagle-based systems, and will soon feature a new IBM Quantum Heron-based system. These systems are capable of performing computations beyond the brute-force simulation capabilities of classical computers.

IBM announced today the completion of its latest expansion of the IBM Quantum Data Center in Poughkeepsie, New York, which operates the highest number of available utility-scale quantum computers at a single location in the world. These systems are a part of the more than a dozen quantum computers offered to global clients via the IBM cloud.

To advance its mission of bringing useful quantum computing to the world, IBM has heavily invested in deploying advanced quantum hardware architectures. First introduced late last year, the IBM Quantum Heron processor has now been deployed in IBM's global Quantum Data Center in Poughkeepsie.

AMD today announced that Oracle Cloud Infrastructure (OCI) has chosen AMD Instinct MI300X accelerators with ROCm open software to power its newest OCI Compute Supercluster instance called BM.GPU.MI300X.8. For AI models that can comprise hundreds of billions of parameters, the OCI Supercluster with AMD MI300X supports up to 16,384 GPUs in a single cluster by harnessing the same ultrafast network fabric technology used by other accelerators on OCI. Designed to run demanding AI workloads including large language model (LLM) inference and training that requires high throughput with leading memory capacity and bandwidth, these OCI bare metal instances have already been adopted by companies including Fireworks AI.

"AMD Instinct MI300X and ROCm open software continue to gain momentum as trusted solutions for powering the most critical OCI AI workloads," said Andrew Dieckmann, corporate vice president and general manager, Data Center GPU Business, AMD. "As these solutions expand further into growing AI-intensive markets, the combination will benefit OCI customers with high performance, efficiency, and greater system design flexibility."

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

"Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions."

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment. To meet this demand head-on, Intel today launched Xeon 6 with Performance-cores (P-cores) and Gaudi 3 AI accelerators, bolstering the company's commitment to deliver powerful AI systems with optimal performance per watt and lower total cost of ownership (TCO).

"Demand for AI is leading to a massive transformation in the data center, and the industry is asking for choice in hardware, software and developer tools," said Justin Hotard, Intel executive vice president and general manager of the Data Center and Artificial Intelligence Group. "With our launch of Xeon 6 with P-cores and Gaudi 3 AI accelerators, Intel is enabling an open ecosystem that allows our customers to implement all of their workloads with greater performance, efficiency and security."

According to new information from Tom's Hardware, AMD has announced plans to unify its consumer-focused gaming RDNA and data center CDNA graphics architectures into a single, unified design called "UDNA." The announcement was made by AMD's Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group, at IFA 2024 in Berlin. The goal of the new UDNA architecture is to provide a single focus point for developers so that each optimized application can run on consumer-grade GPU like Radeon RX 7900XTX as well as high-end data center GPU like Instinct MI300. This will create a unification similar to NVIDIA's CUDA, which enables CUDA-focused developers to run applications on everything ranging from laptops to data centers.

Jack HuynhSo, part of a big change at AMD is today we have a CDNA architecture for our Instinct data center GPUs and RDNA for the consumer stuff. It's forked. Going forward, we will call it UDNA. There'll be one unified architecture, both Instinct and client [consumer]. We'll unify it so that it will be so much easier for developers versus today, where they have to choose and value is not improving.