AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

Phytium, a Chinese semiconductor company that faced U.S. government sanctions from 2021, has introduced its latest data center processor, the 64-core Feiteng Tengyun S2500. Designed for cloud and high-performance computing applications, this processor features a large-capacity shared L3 cache, enhanced security capabilities for cloud servers, and improved memory subsystem reliability. The Feiteng Tengyun S2500 features 64 FTC661 cores developed by Phytium, which are based on Armv8 ISA. Reportedly, the CPU features 64 MB of L3 cache and 512 KB of L2 per core, bringing the total to 96 MB of processor cache. Compared to the previous generation line, the S2500 brings an L3 cache and TDP of 150 Watts, up from 90 Watts of previous generation.

This is Phytium's first new CPU in several years, raising questions about its production capacity and access to foundries, given its sanctions-related restrictions. It is currently unknown which foundry will manufacture the Feiteng Tengyun S2500, and we expect to hear more about it as (if) units get shipped. So far only display units have made appearance. Nonetheless, the company has continued its hardware development efforts and garnered interest in collaborating with Huawei to unify hardware and software ecosystems, which has yet to come to fruition.

Moore Threads Technology (MTT), a Chinese GPU manufacturer, is reportedly testing its next-generation graphics processors for client PCs and data centers. The products under scrutiny are the MTT S90 for client/gaming computers and the MTT S4000 for data centers. Characterized by their Device IDs, 0301 and 0323, this could imply that these GPUs belong to MTT's 3rd generation GPU lineup. While few details about these GPUs are available, the new Device IDs suggest a possible introduction of a novel microarchitecture following the MTT Chunxiao GPU series. The current generation Chunxiao series, featuring the MTT S70, MTT S80, and MTT S3000, failed to compete effectively with AMD, Intel, and NVIDIA GPUs.

Thanks to @Löschzwerg who found the Device Hunt submission, we see hardware identifiers in PCI ID and USB ID repositories earlier than launch, as this often signals the testing of new chips or drivers by various companies. In the case of MTT, the latest developments are complicated by its recent inclusion on the U.S. Entity List, limiting its access to US-made technologies. This introduces a problem for the company, as they can't access TSMC's facilities for chip production, and will have to turn to domestic production in the likely case, with SMIC being the only leading option to consider.

LITEON Technology, the global leading provider of power and cooling solutions, is set to unveil its groundbreaking liquid cooling solutions featuring immersion technology through its new brand, COOLITE. This will be the very first time that LITEON showcases its COOLITE solutions, along with state-of-the-art power solutions at the OCP Global Summit. These pioneering solutions are poised to transform data centers by significantly enhancing efficiency, performance, and sustainability.

LITEON COOLITE Liquid Cooling Solutions Bring a Paradigm Shift in Data Center Cooling
LITEON's COOLITE Liquid Cooling Solutions, with immersion technology, bring a paradigm shift in data center cooling. By immersing servers and components in a specialized cooling fluid, these solutions eliminate the constraints of traditional air-based cooling. This results in significantly improved thermal efficiency, enabling data centers to handle high-performance workloads with ease. Furthermore, the reduced energy consumption and carbon footprint contribute to the sustainability goals of data centers.

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

The recent development of AI models that are more capable than ever has led to a massive demand for hardware infrastructure that powers them. As the dominant player in the industry with its GPU and CPU-GPU solutions, NVIDIA has reportedly discussed leasing data center space to power its own cloud service for these AI applications. Called NVIDIA Cloud DGX, it will reportedly put the company right up against its clients, which are cloud service providers (CSPs) as well. Companies like Microsoft Azure, Amazon AWS, Google Cloud, and Oracle actively acquire NVIDIA GPUs to power their GPU-accelerated cloud instances. According to the report, this has been developing for a few years.

Additionally, it is worth noting that NVIDIA already owns parts for its potential data center infrastructure. This includes NVIDIA DGX and HGX units, which can just be interconnected in a data center, with cloud provisioning so developers can access NVIDIA's instances. A great benefit that would attract the end-user is that NVIDIA could potentially lower the price point of its offerings, as they are acquiring GPUs for much less compared to the CSPs that receive them with a profit margin that NVIDIA imposes. This can attract potential customers, leaving hyperscalers like Amazon, Microsoft, and Google without a moat in the cloud game. Of course, until this project is official, we should take this information with a grain of salt.

Data center infrastructure is a complex matter. It requires shelter, cooling, and dedicated power generators that keep the servers running at full capacity and uptime. However, as these data centers can consume MegaWatts of power, it is becoming increasingly more work for hyperscalers like Meta, Google, Amazon, Microsoft, and others to ensure proper power supply to their data centers. Today, according to the job listing by Microsoft, we learn that the Redmond giant is preparing its infrastructure for nuclear power to reduce data centers' dependency on the outside grid. According to the job listing, Microsoft is seeking a "Principal Program Manager, Nuclear Technology, who will be responsible for maturing and implementing a global Small Modular Reactor (SMR) and microreactor energy strategy."

The SMR and microreactor systems are smaller-scale than traditional nuclear reactors that many power plants are using today and are more manageable due to their sheer size. The power plants based on the aforementioned technology can reside right next to the data center. We are sure that Microsoft had calculated the return on investment (ROI) of creating its power grid, as its electricity consumption will only increase in the coming years as the infrastructure expands. P. Todd Noe, director of nuclear technologies engineering at Microsoft, shared a note regarding the listing, stating: "This is not just a job, it is a challenge. By joining us, you will be part of a global movement that is transforming the way we produce and consume energy. You will also have the chance to grow your skills, advance your career, and make an impact on millions of lives." Below, you can see an example SMR from NuScale.

As the world experiences a generational shift to artificial intelligence, each of us is participating in a new era of global expansion enabled by silicon. It's the "Siliconomy," where systems powered by AI are imbued with autonomy and agency, assisting us across both knowledge-based and physical-based tasks as part of our everyday environments.

At Intel Innovation, the company unveiled technologies to bring AI everywhere and to make it more accessible across all workloads - from client and edge to network and cloud. These include easy access to AI solutions in the cloud, better price performance for Intel data center AI accelerators than the competition offers, tens of millions of new AI-enabled Intel PCs shipping in 2024 and tools for securely powering AI deployments at the edge.

Intel Innovation 2023 - September 13, 2023 - MiTAC Computing Technology, a professional IT solution provider and a subsidiary of MiTAC Holdings Corporation, will showcase its DSG (Datacenter Solutions Group) product lineup powered by 4th Gen Intel Xeon Scalable processors for enterprise, cloud and AI workloads at Intel Innovation 2023, booth #H216 in the San Jose McEnery Convention Center, USA, from September 19-20.

"MiTAC has seamlessly and successfully managed the Intel DSG business since July. The datacenter solution product lineup enhances MiTAC's product portfolio and service offerings. Our customers can now enjoy a comprehensive one-stop service, ranging from motherboards and barebones servers to Intel Data Center blocks and complete rack integration for their datacenter infrastructure needs," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology.

Today, MLCommons published results of its MLPerf Inference v3.1 performance benchmark for GPT-J, the 6 billion parameter large language model, as well as computer vision and natural language processing models. Intel submitted results for Habana Gaudi 2 accelerators, 4th Gen Intel Xeon Scalable processors, and Intel Xeon CPU Max Series. The results show Intel's competitive performance for AI inference and reinforce the company's commitment to making artificial intelligence more accessible at scale across the continuum of AI workloads - from client and edge to the network and cloud.

"As demonstrated through the recent MLCommons results, we have a strong, competitive AI product portfolio, designed to meet our customers' needs for high-performance, high-efficiency deep learning inference and training, for the complete spectrum of AI models - from the smallest to the largest - with leading price/performance." -Sandra Rivera, Intel executive vice president and general manager of the Data Center and AI Group

Today, AMD announced Amazon Web Services (AWS) has expanded its 4th Gen AMD EPYC processor-based offerings with the general availability of Amazon Elastic Compute Cloud (EC2) M7a and Amazon EC2 Hpc7a instances, which offer next-generation performance and efficiency for applications that benefit from high performance, high throughput and tightly coupled HPC workloads, respectively.

"For customers with increasingly complex and compute-intensive workloads, 4th Gen EPYC processor-powered Amazon EC2 instances deliver a differentiated offering for customers," said David Brown, vice president of Amazon EC2 at AWS. "Combined with the power of the AWS Nitro System, both M7a and Hpc7a instances allow for fast and low-latency internode communications, advancing what our customers can achieve across our growing family of Amazon EC2 instances."

According to the job listing found by Electrek, Tesla is currently hiring staff for Tesla's "1st of its kind Data Centers." Tesla is a company with a huge demand for computing, especially with training self-driving technology on its hardware. The company is building its training chips called Dojo D1, which is used to train neural networks that power the company's Full Self Driving (FSD) that is inferenced locally on each Tesla vehicle. However, to support such training infrastructure and other data processing, the company is in need of its own data centers, and the recruitment for it has just started.

It is interesting to mention a "first of its kind" data center, meaning that some unique design and/or application goal will be present. The global data center is roughly a 250 billion USD market, and with Tesla entering, we are still waiting to see the size of its investment. Nonetheless, the latest position, "Engineering Program Manager, Data Centers," will oversee these efforts and lead the end-to-end design and engineering of this supposedly unique data center.

Lightelligence, the global leader in photonic computing and connectivity systems, today announced Photowave, the first optical communications hardware designed for PCIe and Compute Express Link (CXL) connectivity, unleashing next-generation workload efficiency.

Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks. The first public demonstration of Photowave will be at Flash Memory Summit today through Thursday, August 10, in Santa Clara, Calif.

From the cloud, to the edge, to the enterprise, data center architects are deploying higher levels of flash to unlock the potential of AI, object storage, file sharing and more. At the same time, they are laser-focused on controlling spend and must find solutions to help them manage, scale and utilize storage assets more efficiently. This is driving a growing trend to disaggregate and share NVMe flash over fabric (NVMe-oF) for improved performance, availability and flexibility of storage resources.

Helping customers simplify NVMe/NVMe-oF storage deployment, Western Digital (NASDAQ: WDC) today announced its enhanced OpenFlex Data24 3200 NVMe-oF JBOF/Storage Platform along with the next-generation RapidFlex A2000 and C2000 NVMe-oF fabric bridge devices (FBDs), and the new Ultrastar DC SN655 PCIe Gen 4.0 dual-port NVMe SSD. These new storage solutions are enabling an ecosystem, providing more flexibility and choice for simplifying NVMe and NVMe-oF deployment for customers. Western Digital is now the only company with vertical integration capabilities targeting both ends of the Ethernet wire to deliver solutions where data travels from the server initiator to the storage target.

KIOXIA America, Inc. today announced the addition of the KIOXIA CD8P Series to its lineup of data center-class solid state drives (SSDs). KIOXIA CD8P drives are well-suited to general purpose server and cloud environments that can take advantage of PCIe 5.0 (32 gigatransfers/s x4) performance. These data center applications can generate complex mixed workloads spread across large scale virtualized systems. The new drives are available in capacities up to 30.72 terabytes (TB) and in both Enterprise and Data Center Standard Form Factor (EDSFF) E3.S and 2.5-inch (U.2) form factors.

Optimized for the performance, latency, reduced power and thermal requirements of data center environments where power and cooling efficiency is critical, the KIOXIA CD8P Series provides the predictability and consistency needed for a seamless user experience. According to Jeff Janukowicz, Research Vice President, IDC, "Growth in NVMe SSDs continues with PCIe capacity shipments in servers and storage systems expected to grow at a 40% CAGR between 2022 and 2027. The new CD8P Series SSDs gives these customers the range of performance, capacity, and security choices essential for meeting the storage requirements of next-generation digital enterprise and data center infrastructure."

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

Cerebras Systems, the pioneer in accelerating generative AI, and G42, the UAE-based technology holding group, today announced Condor Galaxy, a network of nine interconnected supercomputers, offering a new approach to AI compute that promises to significantly reduce AI model training time. The first AI supercomputer on this network, Condor Galaxy 1 (CG-1), has 4 exaFLOPs and 54 million cores. Cerebras and G42 are planning to deploy two more such supercomputers, CG-2 and CG-3, in the U.S. in early 2024. With a planned capacity of 36 exaFLOPs in total, this unprecedented supercomputing network will revolutionize the advancement of AI globally.

"Collaborating with Cerebras to rapidly deliver the world's fastest AI training supercomputer and laying the foundation for interconnecting a constellation of these supercomputers across the world has been enormously exciting. This partnership brings together Cerebras' extraordinary compute capabilities, together with G42's multi-industry AI expertise. G42 and Cerebras' shared vision is that Condor Galaxy will be used to address society's most pressing challenges across healthcare, energy, climate action and more," said Talal Alkaissi, CEO of G42 Cloud, a subsidiary of G42.

The U.S. Department of Energy (DOE) has announced its selection of Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers. The award, announced in May, is part of the COOLERCHIPS program - Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems - supported by DOE's Advanced Research Projects Agency-Energy (ARPA-E). Intel's project, anticipated to be a three-year agreement with $1.71 million in funding, will enable the continuation of Moore's Law by allowing Intel to add more cores and transistors to its highest performance processors, while managing the heat on future devices.

Tejas Shah, principal engineer and lead thermal architect for Intel's Super Compute Platforms Group said: "Immersion cooling is used for its simplicity, sustainability and ease of upgrades. This proposal will enable two-phase immersion cooling to align with the exponential increase in power expected by processors over the next decade."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

NVIDIA and SoftBank Corp. today announced they are collaborating on a pioneering platform for generative AI and 5G/6G applications that is based on the NVIDIA GH200 Grace Hopper Superchip and which SoftBank plans to roll out at new, distributed AI data centers across Japan. Paving the way for the rapid, worldwide deployment of generative AI applications and services, SoftBank will build data centers that can, in collaboration with NVIDIA, host generative AI and wireless applications on a multi-tenant common server platform, which reduces costs and is more energy efficient.

The platform will use the new NVIDIA MGX reference architecture with Arm Neoverse-based GH200 Superchips and is expected to improve performance, scalability and resource utilization of application workloads. "As we enter an era where society coexists with AI, the demand for data processing and electricity requirements will rapidly increase. SoftBank will provide next-generation social infrastructure to support the super-digitalized society in Japan," said Junichi Miyakawa, president and CEO of SoftBank Corp. "Our collaboration with NVIDIA will help our infrastructure achieve a significantly higher performance with the utilization of AI, including optimization of the RAN. We expect it can also help us reduce energy consumption and create a network of interconnected data centers that can be used to share resources and host a range of generative AI applications."

Lenovo Group today announced full-year results, reporting Group revenue of US$62 billion and net income of US$1.6 billion, or US$1.9 billion on a non-Hong Kong Financial Reporting Standards (HKFRS) [1] basis. Profitability was stable with gross margin and operating margin both delivering 18-year highs and non-HKFRS net margin flat year-to-year. While Group revenue was impacted due to the softness in the device market, revenue from non-PC businesses reached a fiscal year high of nearly 40%, fueled by Lenovo's diversified growth engines of Solutions and Services Group (SSG) and Infrastructure Solutions Group (ISG) growing revenue to record highs of US$6.7 billion and US$9.8 billion respectively, up 22% and 37% year-on-year.

After a year of industry and global uncertainties, Lenovo sees positive signs of the market stabilizing. The Group expects the entire PC and smart devices market to resume year-to-year growth in the second half of 2023, and for the IT services market to resume relatively high growth - together these will drive the total IT market in 2023 back to moderate growth. In the mid-to-long term, digital and intelligent transformation will continue to accelerate, leading to a big growth potential for cloud and computing infrastructure.

Today, AMD (NASDAQ: AMD) showcased its high performance computing (HPC) leadership at ISC High Performance 2023 and celebrated, along with key partners, its first year of breaking the exascale barrier. AMD EPYC processors and AMD Instinct accelerators continue to be the solutions of choice behind many of the most innovative, green and powerful supercomputers in the world, powering 121 supercomputers on the latest TOP500 list.

"AMD's mission in high-performance computing is to enable our customers to tackle the world's most important challenges," said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. "Our industry partners and the global HPC community continue to leverage the performance and efficiency of AMD EPYC processors and Instinct accelerators to advance their groundbreaking work and scientific discoveries."

At the ISC High Performance Conference, Intel showcased leadership performance for high performance computing (HPC) and artificial intelligence (AI) workloads; shared its portfolio of future HPC and AI products, unified by the oneAPI open programming model; and announced an ambitious international effort to use the Aurora supercomputer to develop generative AI models for science and society.

"Intel is committed to serving the HPC and AI community with products that help customers and end-users make breakthrough discoveries faster," said Jeff McVeigh, Intel corporate vice president and general manager of the Super Compute Group. "Our product portfolio spanning Intel Xeon CPU Max Series, Intel Data Center GPU Max Series, 4th Generation Intel Xeon Scalable Processors and Habana Gaudi 2 are outperforming the competition on a variety of workloads, offering energy and total cost of ownership advantages, democratizing AI and providing choice, openness and flexibility."

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.