AMD at a special media event titled "together we advance_data centers," formally launched its 4th generation EPYC "Genoa" server processors based on the "Zen 4" microarchitecture. These processors debut an all new platform, with modern I/O connectivity that includes PCI-Express Gen 5, CXL, and DDR5 memory. The processors come in CPU core-counts of up to 96-core/192-thread. There are as many as 18 processor SKUs, differentiated not just in CPU core-counts, but also the way the the cores are spread across the up to 12 "Zen 4" chiplets (CCDs). Each chiplet features up to 8 "Zen 4" CPU cores, depending on the model; up to 32 MB of L3 cache, and is built on the 5 nm EUV process at TSMC. The CCDs talk to a centralized server I/O die (sIOD), which is built on the 6 nm process.

The processors AMD is launching today are the EPYC "Genoa" series, targeting general purpose servers, although they can be deployed in large cloud data-centers, too. To large-scale cloud providers such as AWS, Azure, and Google Cloud, AMD is readying a different class of processor, codenamed "Bergamo," which is plans to launch later. In 2023, the company will launch the "Genoa-X" line of processor for technical-compute and HPC applications, which benefit from large on-die caches, as they feature the 3D Vertical Cache technology. There will also be "Siena," a class of EPYC processors targeting the telecom and edge-computing markets, which could see an integration of more Xilinx IP.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

Hewlett Packard Enterprise (NYSE: HPE) today announced it is making supercomputing accessible for more enterprises to harness insights, solve problems and innovate faster by delivering its world-leading, energy-efficient supercomputers in a smaller form factor and at a lower price point.

The expanded portfolio includes new HPE Cray EX and HPE Cray XD supercomputers, which are based on HPE's exascale innovation that delivers end-to-end, purpose-built technologies in compute, accelerated compute, interconnect, storage, software, and flexible power and cooling options. The supercomputers provide significant performance and AI-at-scale capabilities to tackle demanding, data-intensive workloads, speed up AI and machine learning initiatives, and accelerate innovation to deliver products and services to market faster.

Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, announces its JumpStart remote access program - Supermicro H13 JumpStart -- for workload testing and application tuning on 4th Gen AMD EPYC processor-based systems. Developers and IT administrators in AI, Deep Learning, Manufacturing, Telco, Storage, and other industries will get immediate access to leading-edge technologies to accelerate their solution deployment on Supermicro's extensive portfolio of upcoming H13 systems. Customers will be able to test compatibility with previous generations of AMD EPYC processor-based systems and optimize their applications to take advantage of DDR5 memory, PCI-E 5.0 storage, networking, accelerators, and CXL 1.1+ peripherals of the 4th Gen AMD EPYC processors.

"Supermicro's 4th Gen AMD EPYC processor JumpStart program is poised to give customers a market advantage over their competitors through quick validation of workload performance to accelerate data center deployments," said Charles Liang, president and CEO, Supermicro. "Supermicro's application-optimized servers incorporate the latest technologies to improve performance per watt, energy efficiency, and reduced TCO."

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2022 of $5.6 billion, gross margin of 42%, operating loss of $64 million, net income of $66 million and diluted earnings per share of $0.04. On a non-GAAP(*) basis, gross margin was 50%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.67.

"Third quarter results came in below our expectations due to the softening PC market and substantial inventory reduction actions across the PC supply chain," said AMD Chair and CEO Dr. Lisa Su. "Despite the challenging macro environment, we grew revenue 29% year-over-year driven by increased sales of our data center, embedded and game console products. We are confident that our leadership product portfolio, strong balance sheet, and ongoing growth opportunities in our data center and embedded businesses position us well to navigate the current market dynamics."

AMD appears to like to play coy when it comes to new product announcements, or at least the reveal of upcoming product announcements. Just as with its November 3rd event, the company has put out a miniscule teaser for its November 10th announcement of what the company is simply calling "the unveiling of our next-gen server processors" on Twitter. The event will kick off at 10 am Pacific time and it appears there will be a live stream, as AMD is inviting people to watch the event online. It's highly likely that we're talking about new EPYC parts here, as the event is called "together we advance_data centers".

AMD earlier this week released basic enablement for the GNU Compiler Collections (GCC), which extend "Zen 4" microarchitecture awareness. The "basic enablement patch" for the new Zenver4 target is essentially similar to Zenver3, but with added support for the new AVX-512 instructions, namely AVX512F, AVX512DQ, AVX512IFMA, AVX512CD, AVX512BW, AVX512VL, AVX512BF16, AVX512VBMI, AVX512VBMI2, GFNI, AVX512VNNI, AVX512BITALG, and AVX512VPOPCNTDQ. Besides AVX-512, "Zen 4" is largely identical to its predecessor, architecturally, and so the enablement is rather basic. This should come just in time for software vendors to prepare for next-generation EPYC "Genoa" server processors, or even small/medium businesses building servers with Ryzen 7000-series processors.

In December of 2021, we covered the appearance of Russia's home-grown Baikal-S processor, which has 48 cores based on Arm Cortex-A75 cores. Today, thanks to the famous chip photographer Fritzchens Fritz, we have the first die shows that show us exactly how Baikal-S SoC is structured internally and what it is made up of. Manufactured on TSMC's 16 nm process, the Baikal-S BE-S1000 design features 48 Arm Cortex-A75 cores running at a 2.0 GHz base and a 2.5 GHz boost frequency. With a TDP of 120 Watts, the design seems efficient, and the Russian company promises performance comparable to Intel Skylake Xeons or Zen1-based AMD EPYC processors. It also uses a home-grown RISC-V core for management and controlling secure boot sequences.

Below, you can see the die shots taken by Fritzchens Fritz and annotated details by Twitter user Locuza that marked the entire SoC. Besides the core clusters, we see that a slum of cache connects everything, with six 72-bit DDR4-3200 PHYs and memory controllers surrounding everything. This model features a pretty good selection of I/O for a server CPU, as there are five PCIe 4.0 x16 (4x4) interfaces, with three supporting CCIX 1.0. You can check out more pictures below and see the annotations for yourself.

The leading manufacturer of multi-GPU workstations and professional liquid cooling solutions, Comino has confirmed that their Comino CPU (AMD EPYC, Ryzen Threadripper, Ryzen Threadripper PRO) WCB for Socket SP3 / TR4, Cu-Steel is fully compatible with the AMD Threadripper PRO 5000WX-Series processors. Comino's thermal performance comparison between 3995WX and 5995WX shows a better delta T between the chip and the coolant.

On top of that, the waterblock can be used for different motherboards thanks to its unique design with interchangeable VRM cold-plates. See the compatibility list for more information. The Comino liquid cooling solution can ensure smooth operation of power-hungry hardware even if it is overclocked. Waterblocks are made purely of non-corrosive materials: copper, stainless steel, and plastic which ensures low hardware temperatures even during 24/7 operation. Learn more at Comino's website.

Today AMD (NASDAQ: AMD) announced its collaboration with the Energy Sciences Network (ESnet) on the launch of ESnet6, the newest generation of the U.S. Department of Energy's (DOE's) high-performance network dedicated to science. AMD worked closely with ESnet since 2018 to integrate powerful adaptive computing for the smart and programmable network nodes of ESnet6. ESnet6's extreme scale packet monitoring system uses AMD Alveo U280 FPGA-based network-attached accelerator cards at the core network switching nodes. This will enable high-touch packet processing and help improve the accuracy of network monitoring and management to enhance performance. The programmable hardware allows for new capabilities to be added for continuous innovation in the network.

In order to customize AMD Alveo U280 2x100Gb/s accelerators as network interface cards (NIC) for ESnet6, the OpenNIC overlay - developed by AMD - was used to provide standard network-interface and host-attachment hardware, allowing novel and experimental networking functions to be implemented easily on the Alveo card. OpenNIC has since been open-sourced after being successfully used and evolved by ESnet, as well as various leading academic research groups. Also important for rapid innovation by non-hardware experts was the use of the AMD VitisNetP4 development tools for compiling the P4 packet processing language to FPGA hardware.

AMD Alveo U280 cards, using OpenNIC and VitisNetP4, are being deployed on every node of the ESnet6 network. The high-touch approach based on FPGA-accelerated processing allows every packet in the ESnet6 network to be monitored at extremely high transfer rates to enable deep insights into the behavior of the network, as well as helping to rapidly detect and correct problems and hot spots in the network. The Alveo U280 card with OpenNIC platform also supplies the adaptability to allow the continuous roll-out of new capabilities to the end user community as needs evolve over the lifetime of ESnet6.

When AMD announced that the company would deliver the world's fastest supercomputer, Frontier, the company also took a massive task to provide a machine capable of producing one ExaFLOP of total sustained ability to perform computing tasks. While the system is finally up and running, making a machine of that size run properly is challenging. In the world of High-Performance Computing, getting the hardware is only a portion of running the HPC center. In an interview with InsideHPC, Justin Whitt, program director for the Oak Ridge Leadership Computing Facility (OLCF), provided insight into what it is like to run the world's fastest supercomputer and what kinds of issues it is facing.

The Frontier system is powered by AMD EPYC 7A53s "Trento" 64-core 2.0 GHz CPUs and Instinct MI250X GPUs. Interconnecting everything is the HPE (Cray) Slingshot 64-port switch, which is responsible for sending data in and out of compute blades. The recent interview points out a rather interesting finding: exactly AMD Instinct MI250X GPUs and Slingshot interconnect cause hardware troubles for the Frontier. "It's mostly issues of scale coupled with the breadth of applications, so the issues we're encountering mostly relate to running very, very large jobs using the entire system … and getting all the hardware to work in concert to do that," says Justin Whitt. In addition to the limits of scale "The issues span lots of different categories, the GPUs are just one. A lot of challenges are focused around those, but that's not the majority of the challenges that we're seeing," he said. "It's a pretty good spread among common culprits of parts failures that have been a big part of it. I don't think that at this point that we have a lot of concern over the AMD products. We're dealing with a lot of the early-life kind of things we've seen with other machines that we've deployed, so it's nothing too out of the ordinary."

Intel in the second day of its InnovatiON event, turned attention to its next-generation Xeon Scalable "Sapphire Rapids" server processors, and demonstrated on-package accelerators. These are fixed-function hardware components that accelerate specific kinds of popular server workloads (i.e. run them faster than a CPU core can). With these, Intel hopes to close the CPU core-count gap it has with AMD EPYC, with the upcoming "Zen 4" EPYC chips expected to launch with up to 96 cores per socket in its conventional variant, and up to 128 cores per socket in its cloud-optimized variant.

Intel's on-package accelerators include AMX (advanced matrix extensions), which accelerate recommendation-engines, natural language processing (NLP), image-recognition, etc; DLB (dynamic load-balancing), which accelerates security-gateway and load-balancing; DSA (data-streaming accelerator), which speeds up the network stack, guest OS, and migration; IAA (in-memory analysis accelerator), which speeds up big-data (Apache Hadoop), IMDB, and warehousing applications; a feature-rich implementation of the AVX-512 instruction-set for a plethora of content-creation and scientific applications; and lastly, the QAT (QuickAssist Technology), with speed-ups for data compression, OpenSSL, nginx, IPsec, etc. Unlike "Ice Lake-SP," QAT is now implemented on the processor package instead of the PCH.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

AMD announced that the AMD Pensando Distributed Services Card, powered by the industry's most advanced data processing unit (DPU)1, will be one of the first DPU solutions to support VMware vSphere 8 available from leading server vendors including Dell Technologies, HPE and Lenovo.

As data center applications grow in scale and sophistication, the resulting workloads increase the demand on infrastructure services as well as crucial CPU resources. VMware vSphere 8 aims to reimagine IT infrastructure as a composable architecture with a goal of offloading infrastructure workloads such as networking, storage, and security from the CPU by leveraging the new vSphere Distributed Services Engine, freeing up valuable CPU cycles to be used for business functions and revenue generating applications.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

The next-generation flagship AMD GENOA EPYC CPU has recently appeared on Geekbench 5 in a dual-socket configuration for a total of 192 cores and 384 threads. The processors were installed in an unknown Suma 65GA24 motherboard running at 3.51 GHz and paired with 768 GB of DDR5 memory. This setup achieved a single-core score of 1460 and multi-core result of 96535 which places the processor approximately 17% ahead of an equivalently clocked 128 core EPYC 7763 in single-threaded performance. The Geekbench listing also includes an OPN code of 100-000000997-01 which most likely corresponds to the flagship AMD EPYC 9664 with a max TDP of 400 W according to existing leaks.

EK Fluid Works, a high-performance workstation manufacturer, is expanding its Compute Series with a rackmount liquid-cooled GPU server, the X7000-RM. The EK Fluid Works Compute Series X7000-RM is tailor-made for high-compute density applications such as machine learning, artificial intelligence, rendering farms, and scientific compute simulations.

What separates the X7000-RM from similar GPU server solutions is EK's renowned liquid cooling and high compute density. It offers 175% more GPU computational power than air-cooled servers of similar size while maintaining 100% of its performance output no matter the intensity or duration of the task. The standard X7000-RM 5U chassis can be equipped with an AMD EPYC Milan-X 64 Core CPU, up to 2 TB of DDR4 RAM, and up to seven NVIDIA A100 80 GB GPUs for the ultimate heavy-duty GPU computational power. Intel Xeon Scalable single and dual socket solutions are also possible, but such configurations are limited to a maximum of five GPUs.

AMD in its Q2-2022 financial results call with analysts, confirmed that the company's next-generation Ryzen 7000 desktop processors based on the "Zen 4" microarchitecture will debut this quarter (i.e. Q3-2022, or before October 2022). CEO Dr Lisa Su stated "Looking ahead, we're on track to launch our all-new 5 nm Ryzen 7000 desktop processors and AM5 platforms later this quarter with leadership performance in gaming and content creation."

The company also stated that its next-generation Radeon 7000 series GPUs based on the RDNA3 graphics architecture are on-track for launch "later this year," without specifying whether it meant this quarter, which could mean launch any time before January 2023. AMD is also on course to beating Intel to the next-generation of server processors with DDR5 and PCIe Gen 5 support, with its EPYC "Genoa" 96-core processor slated for later this year, as Intel struggles with a Q1-2023 general availability timeline for its Xeon Scalable "Sapphire Rapids" processor.

QNAP Systems, today introduced the high-density NVMe all-flash NAS TS-h1090FU, featuring U.2 NVMe PCIe Gen 4 x4 SSD architecture for high throughput and low latency workloads. With built-in dual-port 25 GbE connectivity, PCIe Gen 4 expandability, ZFS reliability, and QNAP's SSD optimization technologies, the TS-h1090FU provides exceptional performance for IO-intensive file servers, virtualization, collaborative 4K/8K video editing, and efficient data backup/recovery applications. Businesses can retire hybrid arrays and opt for the TS-h1090FU at the same cost as optimal Tier 2 storage applications with an ideal low cost-per-GB.

"QNAP's all-flash storage lineup offers a great combination of performance, reliability, and capacity, providing businesses with the highest system performance at the lowest storage cost," said Jason Hsu, Product Manager of QNAP, adding "Running on a ZFS-based OS that is optimized for enterprise storage, the 25 GbE-ready TS-h1090FU all-flash NAS demonstrates superior performance with future-proof growth to empower mission critical workloads."

QNAP Systems, Inc., today launched the TS-h1290FX NAS. Providing QNAP's first PCIe 4.0 and U.2 NVMe/SATA all-flash NAS in a tower form factor, the TS-h1290FX excels in the most demanding work environments such as collaborative high-resolution video workflows. Featuring AMD EPYC 8/16-core processors, built-in 25GbE and 2.5GbE connectivity, PCIe Gen 4 expansion, and up to petabyte-scale storage capacity, the TS-h1290FX tackles data-intensive and latency-sensitive applications, such as large media file transfer, real-time editing of 4K/8K high-resolution media, online collaborative workflows, and virtualization applications.

"Modern businesses and studios shouldn't need to dedicate entire rooms to accommodate hot and loud servers, and that's where the TS-h1290FX comes in. Contained within a unique tower form factor and utilizing quiet cooling is exceptional performance driven by a server-grade processor, all-flash U.2 NVMe SSD storage, and QNAP's enterprise-grade QuTS hero operating system," said Jason Hsu, Product Manager of QNAP.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched the TS-h1290FX NAS. Providing QNAP's first PCIe 4.0 and U.2 NVMe/SATA all-flash NAS in a tower form factor, the TS-h1290FX excels in the most demanding work environments such as collaborative high-resolution video workflows. Featuring AMD EPYC 8/16-core processors, built-in 25 GbE and 10GbE connectivity, PCIe Gen 4 expansion, and up to petabyte-scale storage capacity, the TS-h1290FX provides up to 816K/318K iSCSI 4K random read/write IOPS for tackling data-intensive and latency-sensitive applications, such as large media file transfer, real-time editing of 4K/8K media, and virtualization applications.

"Modern businesses and studios shouldn't need to dedicate entire rooms to accommodate hot and loud servers, and that's where the TS-h1290FX comes in. Contained within a unique tower form factor and utilizing quiet cooling is exceptional performance driven by a server-grade processor, all-flash U.2 NVMe SSD storage, and QNAP's enterprise-grade QuTS hero operating system," said Jason Hsu, Product Manager of QNAP, adding "the TS-h1290FX is a remarkable storage solution that provides exceptional power to deal with the modern demands of businesses and studios - including high-resolution media editing and online collaborative workflows."

AMD in its Financial Analyst Day 2022 presentation, unveiled its next-generation "Zen 5" CPU microarchitecture. The company's latest CPU microarchitecture roadmap also confirms that variants of its "Zen 4" CCDs with 3D Vertical Cache (3DV Cache) are very much in the works, and there will be variants of the EPYC "Genoa" processors with 3DV Cache, besides standard ones.

AMD stated that it completed the design goal of the current "Zen 3" architecture, by building it on both 7 nm and 6 nm nodes (the latter being the client "Rembrandt" processor). The new "Zen 4" architecture will debut on the 5 nm node (TSMC N5), and could see a similar optical shrink to the newer 4 nm node somewhere down the line, although AMD wouldn't specify whether it's on the enterprise segment, or client. The next-gen "Zen 5" architecture will debut on 4 nm, and see an optical shrink to 3 nm on some future product.

Supercomputing game has been chasing various barriers over the years. This has included MegaFLOP, GigaFLOP, TeraFLOP, PetaFLOP, and now ExaFLOP computing. Today, we are witnessing for the first time an introduction of an Exascale-level machine contained at Oak Ridge National Laboratory. Called the Frontier, this system is not really new. We have known about its upcoming features for months now. What is new is the fact that it was completed and is successfully running at ORNL's facilities. Based on the HPE Cray EX235a architecture, the system uses 3rd Gen AMD EPYC 64-core processors with a 2 GHz frequency. In total, the system has 8,730,112 cores that work in conjunction with AMD Instinct MI250X GPUs.

As of today's TOP500 supercomputers list, the system is overtaking Fugaku's spot to become the fastest supercomputer on the planet. Delivering a sustained HPL (High-Performance Linpack) score of 1.102 Exaflop/s, it features a 52.23 GigaFLOPs/watt power efficiency rating. In the HPL-AI metric, dedicated to measuring the system's AI capabilities, the Frontier machine can output 6.86 exaFLOPs at reduced precisions. This alone is, of course, not a capable metric for Exascale machines as AI works with INT8/FP16/FP32 formats, while the official results are measured in FP64 double-precision form. Fugaku, the previous number one, scores about 2 ExaFLOPs in HPL-AI while delivering "only" 442 PetaFlop/s in HPL FP64 benchmarks.

AMD today announced new Confidential virtual machines (VMs) on the existing the N2D and C2D VMs on Google Cloud, all powered by AMD EPYC processors. These VMs extend the AMD EPYC processor portfolio of Confidential Computing on Google Cloud with the performance of 3rd Gen EPYC processors in compute-optimized VMs.

A key Confidential Computing component provided by AMD EPYC processors is AMD Secure Encrypted Virtualization (SEV), part of AMD Infinity Guard. This advanced hardware-based security feature encrypts full system memory and individual virtual machine memory as well as isolating the VM memory from the hypervisor, without dramatically impacting performance. With the expansion of Confidential Computing in N2D and C2D VMs, Google Cloud customers now have access to advanced hardware enabled security features powered by 3rd Gen AMD EPYC processors that will help protect sensitive, wide-variety workloads.