Server processors tend to be one of the most profitable businesses for AMD and Intel. Thus, investment groups and analysts closely monitor happenings in the server and data center world. A report from Mizuho Securities (investment bank) Managing Director Jordan Klein states that many upcoming changes on the server processor front are coming this year. Mr. Klein cites sources over at Insupur Systems, one of the most prominent server vendors. More precisely, Dolly Wu is the VP and GM of Datacenter/Cloud at Inspur. According to the report, AMD and Intel will change their strategy in the server market going forward in 2022.

As far as AMD is concerned, the company plans to increase the pricing of its EPYC processors by 10-30%. This increase should be a bit easier on the strategic cloud customers. The report also indicates that as the demand far exceeds the supply of EPYC processors, AMD increases prices and makes a "take it or leave it" offer, resulting in most customers accepting the increased costs. Another interesting tidbit from the report was the talk about Intel. The blue team laid out its strategy to launch highly-anticipated Sapphire Rapids Xeons in Q2 of 2022. However, it will maybe get delayed to Q3 of 2022. Intel doesn't plan to increase prices to remain competitive with AMD, so the server space will see Intel fighting to regain the lost market share.

AMD announced Amazon Web Services (AWS) has expanded its AMD EPYC processor-based offerings with the general availability of the new Amazon EC2 Hpc6a instances, which are purpose-built for high performance computing (HPC) workloads in the cloud. According to AWS, Amazon EC2 Hpc6a instances deliver up to 65 percent better price-performance compared to similar Amazon EC2 instances. Hpc6a will help customers run their most compute-intensive HPC workloads like, genomics, computational fluid dynamics, weather forecasting, financial risk modeling, EDA for semiconductor design, computer-aided engineering, and seismic imaging.

Throughout the HPC industry, there has been a growing preference for AMD as showcased by AMD EPYC processors powering 73 supercomputers on the latest Top500 list and holding 70 HPC world records. The new Hpc6a instances bring the leadership performance and capabilities of 3rd Gen AMD EPYC processors to compute-optimized Amazon EC2 instances used for highly complex HPC workloads.

In recent years, government institutions have been funding the development of home-grown hardware that will power the government infrastructure. This trend was born out of a desire to design chips with no back doors implemented so that no foreign body could monitor the government's processes. Today, Russian company Baikal Electronics managed to boot up the Baikal-S processor with 48 cores based on Arm Instruction Set Architecture (ISA). The processor codenamed BE-S1000 manages to operate 48 cores at a 2.0 GHz base frequency, with a maximum boost of 2.5 GHz clock speed. All of that is achieved at the TDP of 120 Watts, making this design very efficient.

When it comes to some server configurations, the Baikal-S processor run in up to four sockets in a server board. It offers a home-grown RISC-V processor for safe boot and management, so the entire SoC is controlled by a custom design. Baikal Electronics provided some benchmark numbers, which you can see in the slides below. They cover SPEC2006 CPU Integer, Coremark, Whetstone, 7Zip, and HPLinkpack performance. Additionally, the company claims that Baikal-S is in line with Intel Xeon Gold 6148 Skylake design and AMD EPYC 7351 CPU based on Zen1 core. Compared to Huawei's Kunpeng 920, the Baikal-S design provides 0.86x performance.

The semicondustor market in 3Q21 is red hot with total revenue of the global top 10 IC design (fabless) companies reaching US$33.7 billion or 45% growth YoY, according to TrendForce's latest investigations. In addition to the Taiwanese companies MediaTek, Novatek, and Realtek already on the list, Himax comes in at number ten, bringing the total number of Taiwanese companies on the top 10 list to 4.

Qualcomm has been buoyed by continuing robust demand for 5G mobile phones form major mobile phone manufacturers with further revenue growth from its processor and radio frequency front end (RFFE) departments. Qualcomm's IoT department benefited from strong demand in the consumer electronics, edge networking, and industrial sectors, posting revenue growth of 66% YoY, highest among Qualcomm departments. In turn, this drove Qualcomm's total 3Q21 revenue to US$7.7 billion, 56% growth YoY, and ranking first in the world.

Managing massive datasets is excessively complex and costly. Today, Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, announced the new Exos Application Platform (AP) with a new controller featuring 2nd Gen AMD EPYC processors. The efficient, scalable, affordable end-to-end compute and storage platform delivers integrated compute and storage in a single enclosure optimizing rack space utilization, power efficiency, heat dissipation, and storage density.

The need for advanced storage solutions continues to rise to unprecedented levels with the ever-increasing growth in data generation. According to a report commissioned by Seagate and conducted by the research firm IDC, Rethink Data, enterprise data is expected to grow at an average rate of 42.2% over the next two years. The survey, which was conducted by IDC, also found that only 32% of data available to enterprises is put to work. The remaining 68% is unleveraged.

Just yesterday, thanks to the Linux driver update, we found information stating that AMD's upcoming EPYC Genoa processor generation based on Zen 4 core IP will have a 12-channel memory controller. However, we didn't know how AMD engineered the memory controller of this processor generation and some of its maximum capabilities. However, there is an exciting discovery. According to the report from ComputerBase, with information exclusive to them, AMD will enable up to 12 TB of DDR5 memory spread across 12 memory channels. The processor supports DDR5-5200 memory, but when all 24 memory slots (two per channel) are populated, the DDR5 maximum speed drops to 4000 MT/s.

It is unclear why this is the case, and if any difficulties were designing the controller, so the maximum speed drops when every slot is used. One reassuring thing is that the bandwidth created by 12 memory channels should be sufficient to make up for the lost speed of DDR5 memory reduction.

Thanks to a Linux driver update, we now know that AMD's upcoming Zen 4 based EPYC CPUs will support up to 12 channels of DDR5 memory, an upgrade over the current eight. The EDAC driver, or Error Detection and Correction driver update from AMD contained details of the memory types supported by AMD's upcoming server and workstation CPUs and although this doesn't tell us much about what we'll see from the desktop platform, some of this might spill over to a future Ryzen Threadripper CPU.

The driver also reveals that there will be support for both RDDR5 and LRDDR5, which translates to Registered DDR5 and Load-Reduced DDR5 respectively. LRDDR5 is the replacement for LRDIMMs, which are used in current servers with very high memory densities. Although we don't know when AMD is planning to announce Zen 4, even less so the new EPYC processors, it's expected that it will be some time in the second half next year.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

AMD (NASDAQ: AMD) announced Amazon Web Services, Inc. (AWS) has expanded its AMD EPYC processor-based offerings with the general availability of general-purpose Amazon EC2 M6a instances. The M6a instances are powered by 3rd Gen AMD EPYC processors delivering, according to AWS, up to 35% better price-performance compared to the previous M5a instances and a 10% lower cost than comparable x86-based EC2 instances.

"Our 3rd Gen AMD EPYC processors provide Amazon EC2 users excellent scalability and impressive price-performance compared to previous generation Amazon EC2 M5a instances. This announcement shows our strong collaboration as well as highlights our overall momentum in cloud infrastructure," said Lynn Comp, corporate vice president, Cloud Business, AMD. "Our work with AWS exemplifies our commitment to giving end users innovation and performance for their cloud environments and workloads."

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

During this year's Supercomputing Conference 2021 (SC21), AMD is showcasing its expanded presence and growing preference in the high performance computing (HPC) industry with the exceptional innovation and adoption of AMD data center processors and accelerators. Customers across the industry continue to expand their use of AMD EPYC processors and AMD Instinct accelerators to power cutting-edge research needed to address some of the world's biggest challenges in climate, life sciences, medicine, and more.

Growing preference for AMD is showcased in the latest Top500 list. AMD now powers 73 supercomputers, compared to 21 in the November 2020 list, a more than 3x year-over-year increase. Additionally, AMD powers four out of the top ten most powerful supercomputers in the world, as well as the most powerful supercomputer in EMEA. Finally, AMD EPYC 7003 series processors, which launched eight months ago, are utilized by 17 of the 75 AMD powered supercomputers in the list, demonstrating the rapid adoption of the latest generation of EPYC processors.

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

AMD EPYC class of enterprise processors has gotten infected by as many as 22 different security vulnerabilities. These vulnerabilities range anywhere from medium to high severity, affecting all three generations of AMD EPYC processors. This includes AMD Naples, Rome, and Milan generations, where almost all three are concerned with the whole 22 exploits. There are a few exceptions, and you can find that on AMD's website. However, not all seems to be bad. AMD says that "During security reviews in collaboration with Google, Microsoft, and Oracle, potential vulnerabilities in the AMD Platform Security Processor (PSP), AMD System Management Unit (SMU), AMD Secure Encrypted Virtualization (SEV) and other platform components were discovered and have been mitigated in AMD EPYC AGESA PI packages."

AMD has already shipped new mitigations in the form of AGESA updates, and users should not fear if they keep their firmware up to date. If you or your organization is running on AMD EPYC processors, you should update the firmware to avoid any exploits from happening. The latest updates in question are NaplesPI-SP3_1.0.0.G, RomePI-SP3_1.0.0.C, and MilanPI-SP3_1.0.0.4 AGESA versions, which fix all of 22 security holes.

AMD announced today that IBM Cloud has chosen 3rd Gen AMD EPYC processors to expand its bare metal service offerings designed to power customers' demanding workloads and solutions. The new servers, featuring 128 cores, up to 4 TB of memory and 10 NVMe drives per server, give users full access to high-end, dual-socket performance with AMD EPYC 7763 processors; a first for IBM Cloud in a dual-socket platform.

"Our customers have a high demand for computing processing power and the new 3rd Gen AMD EPYC processors provide the high levels of performance and scalability we were looking for," said Suresh Gopalakrishnan, vice president, IBM Cloud. "Our collaboration with AMD has helped us deliver our highest core counts and bandwidth ever available for IBM Cloud customers, to offer top market performance for today and tomorrow's demanding workloads."

"IBM Cloud customers regularly running compute-intensive workloads can see an immediate benefit to speed and scalability by upgrading to 3rd Gen AMD EPYC processors, while helping to deliver a secure experience for end-users," said Lynn Comp, corporate vice president, Cloud Business Group, AMD. "Our continued collaboration with IBM Cloud is further validation of the strong standing AMD holds in the market as we deliver topline solutions that promote a seamless experience for cloud partners and their customers."

AMD held its Accelerated Data Center Keynote address by CEO Dr Lisa Su today. The company made some big announcements for the enterprise space in this first major series of announcements by AMD after Intel's launch of its Alder Lake 12th Gen Core processors that set the tone for what's to come from Intel in the enterprise space (Xeon "Sapphire Rapids"). First up is the EPYC "Milan-X" line of server processors leveraging 3D Infinity Cache memory, a tripling in L3 cache amount, which the company claims significantly improves performance of memory-intensive applications. This should also give you an idea if any upcoming Ryzen desktop processor based on the refreshed chiplet could live up to its claim of "up to 15% gaming performance boost." The next-generation Instinct MI200 series GPU compute accelerators are equally important as they bring the CDNA2 compute architecture to market, establishing competition to NVIDIA's A-series Tensor Core processors, and Intel's upcoming "Ponte Vecchio" Xe-HPC accelerators.

AMD in its Computex 2021 presentation showed off its upcoming "Zen 3" CCD (CPU complex dies) featuring 64 MB of "3D vertical cache" memory on top of the 32 MB L3 cache. The die-on-die stacked contraption, AMD claims, provides an up to 15% gaming performance uplift, as well as significant improvements for enterprise applications that can benefit from the 96 MB of total last-level cache per chiplet. Ahead of the its debut later today in the company's rumored EPYC "Milan-X" enterprise processor reveal, we're learning that AMD could brand 3D Vertical Cache as "3D Infinity Cache."

This came to light when Greymon55, a reliable source with AMD and NVIDIA leaks, used the term "3D IFC," and affirmed it to be "3D Infinity Cache." AMD realized that its GPUs and CPUs have a lot of untapped performance potential with use of large on-die caches that can make up for much of the hardware's memory-management optimization. The RDNA2 family of gaming GPUs feature up to 128 MB of on-die Infinite Cache memory operating at bandwidths as high as 16 Tbps, allowing AMD to stick to narrower 256-bit wide GDDR6 memory interfaces even on its highest-end RX 6900 XT graphics cards. For CCDs, this could mean added cushioning for data transfers between the CPU cores and the centralized memory controllers located in the sIOD (server I/O die) or cIOD (client I/O die in case of Ryzen parts).

Today, AMD announced its continued momentum and collaboration with Microsoft Azure, who is offering the 3rd Gen AMD EPYC processor in the latest generation of Dasv5 and Easv5 Azure Virtual Machines (VMs). Azure is also introducing new confidential VMs, DCasv5 and ECasv5, which use the latest advanced security features available in 3rd Gen EPYC processors, including Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP).

The new Azure confidential VMs, DCasv5 and ECasv5, the first EPYC processor-based confidential VMs at Azure and the first confidential VMs to use SEV-SNP, will enable customers to have the data in their security focused applications encrypted in use, in transit and at rest. The updated Dasv5 VMs, optimized for general purpose workloads, and the Easv5 VMs, optimized for memory-based workloads, deliver better price-performance for most general purpose and memory intensive workloads compared to prior EPYC processor-based Microsoft Azure VMs.

AMD today announced the appointment of Senior Fellow and Server SoC (system on chip) Architect Kevin Lepak to AMD Corporate Fellow, in recognition of his critical role in the design of next-generation AMD EPYC processors. Lepak achieved an excellent record of overseeing the execution and delivery of leadership data center processors for AMD, including 2nd and 3rd Gen AMD EPYC CPUs and next generation AMD Instinct accelerators. As AMD Corporate Fellow, Lepak expands on his leadership in chip design to play a larger role in evolving AMD's processor and systems vision.

"Kevin's technical contributions made undeniable positive impact on AMD over many years," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "He played an instrumental role in solidifying the company's leadership in the data center and continues to work closely with customers to design future generations of high-performance AMD products. With his aptitude for innovation, execution and collaboration, Kevin epitomizes our high-performance culture."

AMD will host its Accelerated Data Center Premiere on November 8, 2021 at 11 a.m. ET, showcasing the company's upcoming innovations with AMD EPYC processors and AMD Instinct accelerators. The virtual event is slated to feature presentations from AMD President and CEO Dr. Lisa Su, Senior Vice President and General Manager, Data Center and Embedded Solutions Business Group Forrest Norrod, and Senior Vice President and General Manager, Server Business Unit Dan McNamara. The event will be accessible to the public at this page starting at 11 a.m. ET. A replay will be available and can be accessed after the conclusion of the livestream event.

Editor's Note: We expect AMD to announce several SKUs in its MI200-series "Aldebaran" compute accelerator family, along with a new line of EPYC "Milan-X" enterprise processors that leverage the new "Zen 3+" chiplet that comes with 64 MB 3D Vertical Cache memory on top of the 32 MB L3 cache.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a new server, GIGABYTE R282-Z9G, that gets around hardware and software RAID limitations that bottleneck RAID when used with NVMe SSDs. Continuing in the success of the R282 series, the new SKU was designed to house an all-in-one server solution that specifically targets high performance NVMe (Gen4) SSDs for RAID by incorporating the GRAID SupremeRAID solution into the R282-Z9G. This is the first GIGABYTE server to incorporate a GRAID Technology solution and has proven to be highly successful with Kioxia CM6-R SSDs.

More and more companies are using flash storage and doing so on a larger scale; however, there may be pitfalls when using RAID, such as limitations in computing performance or consuming a large amount of CPU resources. To solve these problems and to do so with a large amount of drives, the GRAID SupremeRAID works by installing a virtual NVMe controller on the OS while integrating a PCIe device for high performance. With this GIGABYTE solution over 100 GB/s of throughput is possible for workloads in HPC, 4K/8K video editing, high-frequency trading, online transaction processing, or database processing.

AMD today announced a goal to deliver a 30x increase in energy efficiency for AMD EPYC CPUs and AMD Instinct accelerators in Artificial Intelligence (AI) training and High Performance Computing (HPC) applications running on accelerated compute nodes by 2025.1 Accomplishing this ambitious goal will require AMD to increase the energy efficiency of a compute node at a rate that is more than 2.5x faster than the aggregate industry-wide improvement made during the last five years.

Accelerated compute nodes are the most powerful and advanced computing systems in the world used for scientific research and large-scale supercomputer simulations. They provide the computing capability used by scientists to achieve breakthroughs across many fields including material sciences, climate predictions, genomics, drug discovery and alternative energy. Accelerated nodes are also integral for training AI neural networks that are currently used for activities including speech recognition, language translation and expert recommendation systems, with similar promising uses over the coming decade. The 30x goal would save billions of kilowatt hours of electricity in 2025, reducing the power required for these systems to complete a single calculation by 97% over five years.

Chinese cooler manufacturer Cool Server have recently listed several upcoming coolers for the AMD Zen 4 AM5 & SP5 sockets. The manufacturer has listed 5 AM5 coolers, and 4 SP5 coolers all targeted towards the enterprise sector. The lineup includes several passive coolers which rely on case airflow while the others feature high-performance fans which can get quite noisy. The AM5 socket will be introduced with the next-generation Zen 4 Ryzen processors while the SP5 (LGA6096) socket has been prepared for the Zen 4 EPYC processors. The complete list of coolers can be found below.

Intel is slowly preparing to launch its 4th generation of Xeon Scalable processors, with it being the first arrival of the 10 nm designs to the server market. Codenamed Sapphire Rapids, these processors are expected to bring much-needed IPC and platform improvements so Intel can keep up with AMD's EPYC processors. Today, we are getting some first performance results as well as some information about a specific 20 core, 40 threaded Intel Xeon Sapphire Rapids SKU. In a leaked Geekbench 4 submission, the latest Xeon processor was tested and we get to see even more details about the processor.

Featuring 20 cores and 40 threads, the CPU has a base clock speed of 1.5 GHz. It features as much as 40 MB of L2 cache and 75 MB of L3 cache spread across the die. The system was tested on an Intel reference platform called VulcanCity, with this configuration carrying 32 GB of DDR5 memory. The reported results of the benchmarks that this processor went through are not very impressive. These numbers are easily beaten by AMD Ryzen 9 5950X, however, this is only an engineering sample with low clock speed and it could be possible that Geekbench is not optimized to run on this processor. You can check out some of the performance numbers below, and see the submitted results here.

The 128 GB per package memory size of AMD's upcoming Instinct MI200 HPC accelerator was confirmed, in a document released by Pawsey SuperComputing Centre, a Perth, Australia-based supercomputing firm that's popular with mineral prospecting companies located there. The company is currently working on Setonix, a 50-petaFLOP supercomputer being put together by HP Enterprise, which combines over 750 next-generation "Aldebaran" GPUs (referenced only as "AMD MI-Next GPUs"); and over 200,000 AMD EPYC "Milan" processor cores (the actual processor package count would be lower, and depend on the various core configs the builder is using).

The Pawsey document mentions 128 GB as the per-GPU memory. This corresponds with the rumored per-package memory of "Aldebaran." Recently imagined by Locuza_, an enthusiast who specializes in annotation of logic silicon dies, "Aldebaran" is a multi-chip module of two logic dies and eight HBM2E stacks. Each of the two logic dies, or chiplets, has 8,192 CDNA2 stream processors that add up to 16,384 on the package; and each of the two dies is wired to four HBM2E stacks over a 4096-bit memory bus. These are 128 Gbit (16 GB) stacks, so we have 64 GB memory per logic die, and 128 GB on the package. Find other drool worthy specs of the Pawsey Setonix in the screengrab below.

At this year's International Supercomputing 2021 digital event, AMD (NASDAQ: AMD) is showcasing momentum for its AMD EPYC processors and AMD Instinct accelerators across the High Performance Computing (HPC) industry. The company also outlined updates to the ROCm open software platform and introduced the AMD Instinct Education and Research (AIER) initiative. The latest Top500 list showcased the continued growth of AMD EPYC processors for HPC systems. AMD EPYC processors power nearly 5x more systems compared to the June 2020 list, and more than double the number of systems compared to November 2020. As well, AMD EPYC processors power half of the 58 new entries on the June 2021 list.

"High performance computing is critical to addressing the world's biggest and most important challenges," said Forrest Norrod, senior vice president and general manager, data center and embedded systems group, AMD. "With our AMD EPYC processor family and Instinct accelerators, AMD continues to be the partner of choice for HPC. We are committed to enabling the performance and capabilities needed to advance scientific discoveries, break the exascale barrier, and continue driving innovation."