VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA EPIA-M830 Mini-ITX board. Designed specifically to meet the needs of next generation kiosk, POI and POS applications, the VIA EPIA-M830 places the latest 64-bit, high performance VIA Nano E-Series processor in a streamlined, application specific Mini-ITX form factor board.

Kiosk and POS systems will soon support an incredible array of increasingly complex human-machine interactions that reach beyond traditional ticketing or retail scenarios. The VIA EPIA-M830 is designed to take the kiosk to this next phase, providing the backbone of devices that offer cashless purchasing and self service infrastructures in supermarkets and gas stations as well as more secure and interactive, multimedia-rich POI, lotto and gaming machines.

At Embedded Systems Conference today, AMD announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.

"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."

Numonyx B.V. introduced a set of innovative products today based on the new class of memory technology called phase change memory (PCM). The new devices deliver higher performance, endurance and simplicity for wired and wireless communications, consumer electronics, PCs, and other embedded applications.

The new embedded memory products blend many attributes associated with flash memory, as well as RAM and EEPROM, while delivering new capabilities in a single device. Introduced as the newly branded Numonyx Omneo PCM, today's new products promise up to 300 times faster write speeds and ten times more write endurance than today's flash memory.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Nano E-Series processor, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets.

The move to 64-bit software architecture is an essential transition for the future of the embedded industry. Forthcoming operating systems such as Windows Embedded Standard 7 will be able to leverage a 64-bit software eco system that provides up to double the amount of data a CPU can process per clock cycle. This translates in to greater ease in manipulating large data sets and an overall performance boost compared to non-native 64-bit architectures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its latest DIY PC kit, the VIA ARTiGO A1100, a sub-liter DIY PC kit for enthusiasts who want to taste the most extreme, ultra-compact desktop computing experience.

The VIA ARTiGO A1100 takes inspiration from Pico-ITX, cramming a range of features that include a 64-bit processor, HD video support, HDMI and VGA display connectivity, Gigabit networking, Wi-Fi Support and five USB ports, all into a PC chassis that fits snuggly into the palm of your hand.

Combining unprecedented security, performance and energy efficiency, Intel Corporation today launched the Intel Xeon Processor 5600 series. The new processors deliver two new security features -- Intel Advanced Encryption Standard New Instructions (Intel AES-NI), and Intel Trusted Execution Technology (Intel TXT) -- that enable faster encryption and decryption performance for more secure transactions and virtualized environments, providing data centers with a stronger foundation for cloud security.

These are also the first server and workstation chips based on the groundbreaking, new Intel 32nm logic technology, which uses Intel's second-generation high-k metal gate transistors to increase speed and decrease energy consumption. The Intel Xeon Processor 5600 series supports up to six cores per processor and delivers up to 60 percent greater performance than the 45nm Intel Xeon processor 5500 series. In addition, data centers can replace 15 single-core servers with a single new one, and achieve a return on their investment in as little as 5 months.

Intel releases its first storage-optimized Intel Atom processor-based platform for the growing home and small office/home office storage markets. New single- and dual-core chip options provide performance scalability and flexibility and run on Microsoft Windows Home Server and Linux operating systems. Leading storage vendors LaCie, LG Electronics, QNAP, Synology and Thecus plan products based on the new Intel Atom processor-based platform. Intel Atom processors also introduced for embedded applications are ideal for multiple market segments including print imaging, digital security surveillance and industrial.

The energy-efficient platform consists of the Intel Atom processor D410 single-core or D510 dual-core and the Intel 82801IR I/O Controller, and delivers the processing performance and input/output (I/O) connectivity required to meet the throughput demands of leading storage vendors such as LaCie, LG Electronics, QNAP, Synology and Thecus.

Home server and SOHO network-attached storage (NAS) devices based on the new Intel Atom processor- based platform act as centralized hubs that organize, manage, protect and share documents, photos, videos and music throughout the home and small office. This makes it possible to keep digital content safe and available anytime, anywhere.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA ART-3000, a complete, fanless and ruggedized embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications.

Available as a complete system including drives and memory, the fanless VIA ART-3000 combines a number of unique features including diskless booting, excellent vibration and shock resistance, dual Gigabit networking and dual LVDS video support. Ruthlessly low power consumption means the VIA ART-3000 can also support fanless configurations with no moving parts making it ideal for ultra stable, mission critical implementations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at Digital Signage Expo 2010, Feb. 24 - 25, Las Vegas. Join VIA at the Las Vegas Convention Center, Hall C1-2, Booth 1240 and experience the latest technologies for next-generation signage systems, including a demonstration of the forthcoming S3 Graphics Chrome 5400E x2; a dual GPU add-in-board aimed at advanced, multi-display digital signage applications.

The S3 Graphics 5400E x2 is a highly integrated and flexible video card that features dual graphics and multimedia processors. Boasting extreme hardware acceleration of the latest HD video codecs, the S3 Graphics 5400E x2 uses S3 Graphics' PanoChrome technology to provide up to four independent HD video streams at resolutions of 1080p on up to eight displays, employing a variety of display modes and configurations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.

Designed to deliver a simple modular approach to device design that precipitates greater miniaturization and portability, the Mobile-ITX-based VIA EPIA-T700 makes it easier than ever before to design and manufacture compact devices. With customized carrier boards connected using ultra low profile 3mm connectors, the VIA EPIA-T700 is in a class of its own.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA M'SERV S2100: a compact and versatile server system suitable for a range of applications for SOHO and SMB customers. Available to OEM customers, the VIA M'SERV S2100 is a mere 10.2" long by 4.7" high and provides up to four terabytes of storage in a stylish, compact, low power and low noise system.

The VIA M'SERV S2100 is the first product of its kind to offer the unique advantages of the high-performance, 64-bit VIA Nano processor. This makes the VIA M'SERV S2100 capable of addressing many traditional and next-generation server applications including sophisticated backup, cloud-intermediary service roles along with other storage oriented server applications such as NVR (Network Video Recorder) systems and Log servers.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P820, the first Pico-ITX form factor board to feature the high performance, 64-bit VIA Nano processor, bringing industry-leading digital multimedia performance and virtualization capabilities to the smallest of spaces with the VIA AMOS-3001 chassis system.

The choice of VIA Nano processor means that the VIA EPIA-P820 offers a range of advantages over competitor offerings, including full 64-bit software support, a high-performance superscalar architecture and full support of the latest virtualization technologies for next generation server and virtual machine applications. Paired with the VIA VX855 media system processor, the VIA EPIA-P820 is well equipped to handle smooth playback of the most demanding codecs at resolutions up to 1080p.

Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.

The new 64GB embedded device combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers. Toshiba offers a comprehensive line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.

Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

AMD announced immediate availability of a new enterprise-class embedded platform based on the Quad-Core AMD Opteron processor and new AMD SR5690/SP5100 server chipset. Seven AMD Opteron processors in three power bands, in conjunction with the new low-power chipset, allow high-end embedded vendors to enable increased performance-per-watt for edge-of-network systems such as telecom/datacom, storage, and security servers, and routers and switches.

This comprehensive platform offers:

• increased performance enabled for virtualized and multithreaded embedded applications;
• enhanced NEBS-friendly thermal specification;
• single source for design and tight technology integration support among CPUs, chipsets and GPUs;
• compatibility between processor generations and 5 year component longevity to support long-life designs;
• a high-performance, low power chipset with PCIe 2.0, HyperTransport 3 technology and advanced AMD Virtualization (AMD-V) technology and AMD-P power management features.

Intel Corporation today disclosed new information about next-generation Intel Xeon processors - codenamed "Jasper Forest" - for communications and storage applications, due in early 2010. With Jasper Forest, Intel engineers have, for the first time, integrated PCI Express (PCIe) in a dual-processing Xeon processor, which greatly facilitates dense storage and communications solutions such as IPTV, VoIP, NAS, SAN and wireless radio network controllers.

Jasper Forest maintains the outstanding performance of Intel architecture (Nehalem), while lowering system power consumption by 27 watts when compared to the Intel Xeon 5500 series processors. The dual-processing solution integrates two Jasper Forest processors with 16 PCIe Generation 2.0 lanes each and is paired with the Intel 3420 chipset platform controller hub. This integration of the I/O hub via PCIe enables significant power and space savings, resulting in one of the highest performance-per-watt Intel Xeon chips ever.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today announced the VIA EPIA-P720 Pico-ITX board, which takes advantage of the latest VIA VX855 media system processor to deliver stunningly smooth playback of the latest HD video formats for next-generation digital interactive devices.

"VIA continually strives to offer customers compelling product designs that open up new worlds of possibility," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.　"The VIA EPIA-P720 enables a new class of extremely compact embedded devices that can comfortably handle the most demanding video playback whilst remaining entirely fanless. No other compact platform currently offers these features in tandem."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest additions to the VIA AMOS series of universal chassis products; the VIA AMOS-1000 and VIA AMOS-2000 chassis are specially designed to work with VIA EPIA Mini-ITX and Nano-ITX boards and feature unique multi-story stackability.

VIA developed the VIA AMOS-1000 and VIA AMOS-2000 chassis to make complete system design as straightforward and expedient as possible. The guiding principle behind the VIA AMOS-1000 and VIA AMOS-2000 is the ability to add additional layers to the chassis, facilitating simple system expansion for optical drives, system storage and PCI or PCI Express AIBs.

AMD today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.

This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA N700-10EW Nano-ITX board, designed for industrial and embedded applications in environments with extreme temperatures. Guaranteed to maintain absolute stability at temperatures ranging from -20 degrees C to 70 degrees C, the fanless VIA EPIA N700-10EW can be employed in environments that traditionally inhibit x86 computing. These include specialized industrial applications where machinery can create intense operating temperatures, as well as extreme climate scenarios like desert, mountain and high altitude environments.

"By expanding our range of EPIA products to include extended temperature products, VIA is addressing the broader needs of our extensive customer base," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "Extreme thermal competency usually comes at a premium, the VIA EPIA N700-10EW will help to significantly lower that barrier."

AMD announced the ATI Radeon E4690 graphics processor unit (GPU) designed to enable a whole level of new reality for embedded graphics applications with more than triple the 3D graphics performance of prior AMD embedded products. Arcade system manufacturers will appreciate the long term support and lower cost of placing the GPU chip directly on the motherboard instead of a separate add-in graphics card. This product will enable digital signage manufacturers to decode and play multiple high-definition videos in hardware, offloading all the decoding from the CPU. Casino system manufacturers will be amazed by triple the graphics performance to help attract players while increasing overall entertainment value with incredibly realistic 3D graphics, plus two-monitor support.

Shuttle Inc. - the leading designer and manufacturer of small form factor (SFF) computers and accessories today announced the addition of its first VIA Nano-based models - XS29 and XS29F to the Embedded Slim series. Powered by the VIA Nano processors, the XS29 series ideally suit requirement of superb performance with great power efficiency. The XS29 series is geared at light PC users, Internet users, novices and office administrators.

"Consumers have long been looking for solutions that offer the best balance of compact, stylish design and functionality. It's even better with power efficient feature. Shuttle has dedicated to innovation following this concept and launched slim PCs in 2008 for the first time," said David Yu, chairman of Shuttle Inc. "This year, we reached a new milestone by rolling out the XS29 series and more embedded slim PCs which adapt VIA's processors of powerful performance and energy efficiency."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will be showing examples of its customized security solution service at Computex 2009, helping customers to employ a comprehensive and effective security infrastructure in all segments.

VIA Nano, VIA C7 and VIA Eden processor platforms are the only processors that currently offer a built-in Advanced Cryptographic Engine. In order to better help customers access this unique feature, VIA is now offering a comprehensive security solution service that can accurately meet the security needs of individual customers across a range of embedded segments.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNAND, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory improves the performance of high-end phones and other mobile consumer electronics when processing and storing large amounts of multimedia content such as videos, video games and TV broadcasts.

The 32 GB moviNAND is the first embedded memory card to use 32 Gigabit (Gb) NAND devices produced with 30nm-class process technology. The new Samsung card doubles the density of the previous generation of moviNAND that is now being produced with 16 Gb 40nm-class NAND chips.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announces the VIA VB8002 Mini-ITX board targeted at media server markets. The VIA VB8002 brings the superior performance efficiency of the VIA Nano processor to consumer-focused server products that require the right blend of power efficiency and raw processing performance.

The VIA VB8002 Mini-ITX board continues VIA's drive into compact, power-efficient multimedia server markets and is designed to meet the needs of consumers who not only want to securely store, manage and share their media libraries, but also stream high quality content in their homes.