Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has started volume production of its SATA interface NANDrive solid state drives (SSDs). The GLS85LS product family has the same pin-out across all capacities-2 GB, 4 GB, 8 GB, 16 GB, 32 GB and higher in the future-which simplifies system-level board design.

Measuring 14mm x 24mm x 1.95mm, in a 145 ball grid array (BGA), 1 mm ball pitch package, SATA NANDrive devices are one of the smallest SSDs, giving OEMs (original equipment manufacturers) flexibility when designing data storage into their embedded products. The BGA package can be soldered directly onto the motherboard-no extra connectors are needed-providing added stability to the SSD.

Today at Embedded Systems Conference East, AMD introduced the AMD Radeon E6460 discrete graphics processor as AMD's next generation entry-level embedded graphics processor, complementing the previously announced AMD Radeon E6760. With support for up to four simultaneous displays and more than double the 3D graphics performance of the ATI Radeon E2400 GPU1, the AMD Radeon E6460 GPU sets a new bar for features and performance in an entry-level embedded GPU. With five years of planned supply availability and with the graphics memory included in the same package, the AMD Radeon E6460 GPU delivers the longevity, small footprint, and ease of design demanded by embedded system designers.

"The AMD Radeon E6460 GPU provides the high value, small footprint, and long supply demanded by embedded customers," said Richard Jaenicke, director of Embedded Client Business for AMD. "With a footprint-compatible subset of the high-performance AMD E6760 GPU, the new AMD Radeon E6460 GPU enables broadly scalable graphics and multimedia performance in a single board design."

Micron Technology, Inc., today introduced the highest-density Serial Peripheral Interface (SPI) NOR memory available, launching 1 gigabit (Gb), 512 megabit (Mb) and 256Mb products in both 1.8V and 3V power supply voltages. Employing state-of-the-art 65nm process technology, the N25Q product family offers the highest-speed quad I/O in the industry and a full set of advanced features and small packages that improve overall system performance and time-to-market in networking, set-top boxes, automotive and a wide range of industrial, computing and consumer applications.

Extending the company's legacy of memory leadership, Micron's new SPI NOR product line balances customers' needs for cost-effective solutions at higher densities while ensuring compatibility among future chipsets. Micron's long-term commitment to customers in the embedded markets is reinforced by Micron's Product Longevity Program (PLP) - a 10-year commitment to provide stable memory architectures for customer designs. The new N25Q products will be offered as part of this program to provide design assurance for its PLP customers.

Intel Corporation today reported its fifth consecutive quarter of record revenue, with double-digit revenue growth across all business segments. On a Non-GAAP basis, revenue was $13.1 billion, operating income was $4.2 billion, net income was $3.2 billion, and EPS was 59 cents. On a GAAP basis, the company reported second-quarter revenue of $13.0 billion, operating income of $3.9 billion, net income of $3.0 billion, and EPS of 54 cents. The company generated approximately $4.0 billion in cash from operations, paid cash dividends of $961 million, and used $2.0 billion to repurchase 93 million shares of common stock.

"We achieved a significant new milestone in the second quarter, surpassing $13.0 billion in revenue for the first time," said Paul Otellini, Intel president and CEO. "Strong corporate demand for our most advanced technology, the surge of mobile devices and Internet traffic fueling data center growth, and the rapid rise of computing in emerging markets drove record results. Intel's 23 percent revenue growth in the first half and our increasing confidence in the second half of 2011 position us to grow annual revenue in the mid-20 percent range."

Apacer, the global leader in memory module, is making aggressive moves into the sector of value-added products by debuting today a new industrial SD card designed for embedded systems in harsh storage environments. Features include high reliability, high storage and resistance to extended temperatures. These advantages enable the new card to be widely applied to industrial, military, communication, surveillance, medical devices and car navigation, thereby satisfying the storage need of demanding industrial enterprises.

Compliant with Ver. 2.0 standard and SDHC Class 10 high-speed transmission standard as defined by the SD Association, the new SD card from Apacer also supports SD and SPI modes. By using the superbly reliable SLC chip, it not only delivers the features of anti-shock, anti-vibration and low power consumption, but also boasts resistance to extended temperatures (-40ºC to 85ºC). Available in capacities from 256 MB to 8 GB, the new SD card can substantially accelerate data transfer, due to its sequential read/write speed reaching up to 20/13 MB per second. It is also worth noting that the card's automatic standby and sleep modes help save power more effectively.

Intel's Smart Response technology is doing wonders to the low-cost SSD market. The technology lets low-capacity, usually low-cost SSDs to be used as caches for hard drives, improving the system's overall responsiveness. The technology makes these low-cost SSDs more of a component than a product (such as 2.5-inch SATA SSDs), and hence it makes sense to offer them in the mSATA form-factor. Intel made its headstart by launching the Intel 311 "Larson Creek" series 20 GB SSD that comes in both 2.5-inch SATA 3 Gb/s and mSATA form factors. While mSATA makes it easy to deploy the technology into notebooks, desktop motherboard vendors such as Gigabyte thought it would be nice to give their motherboards an mSATA slot.

Capitalizing on this very market is A-Data, with a couple of new low-cost mSATA SSDs in the ISFM series. First is the ISFM-XM13, an mSATA SSD driven by a SandForce SF-1200 series controller. Even with some of the controller's channels unoccupied (due to obvious lack of space to put NAND flash chips), this card doles out decent transfer rates of up to 250 MB/s read and 170 MB/s write. This card comes in capacities of 30 GB (32 GB with 2 GB overprovisioned) and 60 GB (64 GB with 4 GB overprovisioned). This card uses MLC NAND flash. Next up, is the ISFM-IXM01, that looks to be using a JMicron-made controller. The bigger difference here is the use of SLC NAND flash on one of its two variants, which traditionally offers higher rewrite cycles. The other variant uses MLC NAND flash. The SLC variant offers transfer rates of 90 MB/s read and 90 MB/s write, and comes in capacities of 2, 4, 8, and 16 GB. The MLC variant gives you 150 MB/s read, 120 MB/s write; and comes in capacities of 32, 64, and 128 GB.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

AMD today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 "Bobcat" CPU cores and a discreet class DirectX 11-capable GPU on a single die.

"We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement," said Buddy Broeker, director, Embedded Solutions, AMD. "System designers can now unleash their creativity without being constrained by heat or size issues."

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q1'11. We found that shipments during the first quarter of 2011 behaved according to past years with regard to seasonality, and was nominal on a year-to-year comparison for the quarter. The situation changed over the course of the year and Q4'10 did not conform to the normal seasonal cycle, but was down a bit compared to previous years, so the growth in Q1 was a welcomed change. Our forecast for the coming years has been modified since the last report, and is less aggressive on both desktops and notebooks.

Today at Embedded Systems Conference Silicon Valley 2011, AMD introduced the AMD Radeon E6760 embedded discrete graphics processor. Available now, the AMD Radeon E6760 GPU is the first of its kind to offer embedded system designers the combination of OpenCL support along with support for six independent displays.

"The AMD Radeon E6760 GPU provides customers with superior business economics through long lifecycle management and product stability," said Richard Jaenicke, director of Embedded Client Business for AMD. "Embedded system designers faced with power and density constraints now have a solution that delivers the advanced 3D graphics and multimedia features they require in this performance-driven market."

Netlist, Inc., a designer and manufacturer of high-performance memory subsystems, today announced the expansion of its Embedded Flash product portfolio with two new mSATA module additions to the SSD Flash product line. The mSATA mini SSD module offers storage capacity of up to 32GB with onboard 64MB DRAM cache. The mSATA slim SSD module offers storage capacities up to 128GB with onboard 64MB DRAM cache. Both products' smaller form-factor and SSD support for ultra-dense applications makes the mSATA mini and slim modules ideal for datacenter equipment and embedded systems.

"As datacenter equipment becomes increasingly compact, Netlist is tackling space limitations with an innovative Flash product portfolio," said Steve McClure, vice president of worldwide sales and marketing for Netlist. "With our new mSATA mini and mSATA slim SSDs, Netlist addresses the constrained space requirements by providing 2x to 5x the storage density of legacy form-factor solutions."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its VIA ART-5450 embedded box PC system, designed to offer embedded developers the ideal system platform for today's sophisticated logistics and fleet management applications.

Based on a uniquely compact, fanless and rugged design, the VIA ART-5450 offers a full feature set that includes a range of wireless 3G communications, dual display and advanced power management support, creating a flexible and stable platform for in-vehicle systems that control, monitor and manage commercial vehicles.

AMD today announced immediate availability of the new AMD Embedded G-Series processor, the world's first and only Accelerated Processing Unit (APU) for embedded systems. The AMD Embedded G-Series, based on AMD Fusion technology, delivers a complete, full-featured embedded platform and incorporates the new low-power, x86 CPU based on the "Bobcat" core with a world-class DirectX 11-capable GPU and parallel processing engine on a single piece of silicon.

"AMD's commitment is to ensure the game-changing technologies we develop for consumers and the enterprise are also available for the vast and growing embedded market," said Patrick Patla, corporate vice president and general manager, Server and Embedded Division, AMD. "Today, we have a record number of embedded launch partners. They are using the unique advancements of the AMD Embedded G-Series APU to develop a brand new generation of highly differentiated, energy-efficient, small form-factor embedded systems that can deliver the vivid visual experience expected in our always-connected world."

TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces from CES the integration of energy efficient GREENwifiT technology in TRENDnet wireless networking solutions, resulting in reduced power consumption of up to 50%.

TRENDnet was one of the first networking hardware brands to launch energy efficient networking technology to the market with the October, 2008 launch of GREENnetT technology. GREENnetT is a TRENDnet wired switch-based technology that determines and supplies the appropriate amount of electrical power to each hardwired switching port as required by the connected device, by the port, or by the length of the connected Ethernet cable. GREENwifiT is based on similar energy saving principals as those of GREENnetT technology.

With the debut of six products based on the Intel Atom processor, Intel Corporation is making it easier for customers to go-to-market with differentiated, custom-made designs. The company today announced the configurable Intel Atom processor E600C series, which features an Intel Atom E600 processor (formerly codenamed "Tunnel Creek") paired with an Altera Field Programmable Gate Array (FPGA) in a single package.

The new Intel Atom processor provides greater flexibility and faster time-to-market for customers, who can now more readily handle design changes without complicated hardware changes - helping to lower development costs. In addition, the new processor offers board space savings and better inventory control due to the single package, as well as a simplified manufacturing flow and single vendor support through Intel.

Knowing that every organization's computing needs are as diverse as the people they employ, Acer America Corp. is extending its professional all-in-one desktop line for the U.S. market. The newest model is the sleek Veriton Z410G boasting a brilliant high-def 21.5-inch display and full desktop performance. Acer also enhanced its value focused Veriton Z290G all-in-one model featuring an 18.5-inch display with a convenient touch panel and a more powerful Intel Atom processor.

Svelte and simple, the new silver and black Veriton Z410G and Veriton Z290G are attractive and easy to set up. The new all-in-ones include Windows 7 Professional and will be available via Acer's authorized resellers in October with prices beginning at just $599.

Panasonic Solutions Company, provider of collaboration, information-sharing and decision-support solutions for government and commercial enterprises, today announced the newest member of its Toughbook U1 ultra-mobile PC product family, the Toughbook U1 Ultra. All Toughbook U1 products combine the portability of a handheld computer, the benefits of a full Windows OS, the durability needed for enterprise applications and a suite of available integrated features. The new Toughbook U1 Ultra is equipped with a TransflectivePlus display for up to 6000 nit viewability in direct sunlight, 64GB solid state hard drive, 2GB of memory, an Intel Atom Processor (Z530 1.6Ghz) and Windows 7. The device is ideal for highly mobile jobs such as direct store delivery (DSD), eCitation and vegetation management in markets like supply chain management, public safety and utilities.

During keynote presentations today at the Intel Developer Forum, Intel Corporation executives outlined several software- and hardware-related efforts as the company intensifies its System-on-a-Chip (SoC) product plans based on the Intel Atom processor family.

Amid predictions of billions of additional Internet-connected devices going online, Renée James, senior vice president and general manager, Intel Software and Services Group, and Doug Davis, vice president and general manager, Embedded and Communications Group, discussed the expansion of these processors into high-growth areas including netbooks, tablets, CE, embedded, and smart phones.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today's HD-intensive, commercial multimedia-centric devices.

The VIA EPIA-M850 is targeted at OEM and ODM manufacturers of commercial multimedia embedded devices. Featuring a 64-bit, high performance VIA Nano E-Series processor and the VIA VX900 unified all-in-one media system processor, the VIA EPIA-M850 delivers a highly optimized platform that boasts comprehensive HD video performance, HD audio and HDMI support in a compact, power-efficient package.

SanDisk Corporation, the global leader in flash memory cards, today announced the first product in a new category of embedded solid state drives (SSD) that are smaller than a postage stamp and offer higher capacities and performance than existing storage solutions. The SanDisk integrated SSD (iSSD), the first high-capacity product within this new category, is designed for use in fast-growing mobile computing platforms such as tablet PCs and ultra-thin notebooks.

Computing platforms are responding to consumer demand for highly portable, ultra-thin, anywhere-anytime access to the Internet and their favorite content. The SanDisk iSSD drive is the first flash SSD device to support the industry standard SATA interface in a small BGA (Ball Grid Array) package that can be soldered onto any motherboard, and that is fast enough for use with advanced operating systems in next-generation mobile computing platforms.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it latest Mini-ITX board, the VIA EPIA-M840, designed for a range of embedded device designs including advanced industrial and factory management applications.

The VIA EPIA-M840 packs the latest 64-bit VIA Nano E-Series processor, dual Gigabit LAN, eight COM ports and support for two dual channel 24-bit LVDS displays, creating the ideal backbone for a range of embedded applications including intelligent industrial automation applications that integrate remote network access, network management and other advanced application management scenarios.

MSI, a well-known personal computer system and components designer and manufacturer, today released its new AMD Opteron 4000 Series processor-based server motherboards: MS-91F7 and MS-96D7.

MSI lines up with AMD's strategy and has developed 2P and 1P AMD Opteron 4000 Series platform (formerly code-named: "San Marino") server board in CEB and ATX form factors respectively, and plans to bring the server motherboards to market soon. MSI's 2P volume AMD Opteron-based server board, MS-91F7, can be configured with 3 options: desired PCIe lanes between SR5650 and SR5670, MUX selector of one x16 PCIe Gen2 slot or two x8 PCIe Gen2 slots, and dual layout of Aspeed BMC controller of AST1100 or AST2050.

Toshiba America Electronic Components, Inc.(TAEC) and its parent company Toshiba Corporation today announced the launch of a 128-gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest e-MMC standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Samples will be available in September, and mass production will start in the fourth quarter (October to December) of 2010.

The new 128GB embedded device integrates sixteen 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology and a dedicated controller into a small package 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EITX-3001, its latest Em-ITX form factor board and the ideal solution for a range of durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications.

Combining the latest VIA Nano E-Series processor and the VIA VX855 media system processor, the VIA EITX-3001 offers a full featured I/O specification on a specially developed slim-line board. Fanless devices based on the VIA EITX-3001 can enjoy absolute stability within a wide temperature range in a low profile system of less than 35mm high.

ASUS displayed its latest creation, the Eee Pad. This 12 inch tablet has sports uncanny resemblance to the Apple iPad, except that it's x86 powered, and uses Windows 7, with ASUS' own visually-appealing UI. It can run any Windows application that its hardware allows, which includes Intel Core 2 Duo CULV, and Intel graphics. The UI takes advantage of the multi-touch screen and related abilities of the Windows 7 Home Premium OS it comes bundled with. Other known details include a web-camera, and a battery that is rated to last 10 hours on a full charge. ASUS will also introduce a slightly smaller 10 inch tablet which uses Windows 7 Embedded Compact, a new variant of the OS designed for devices such as these. The two will be out in Q1 2011.