Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.

Biwin's new e-MMC SSDs are offered in capacities from 2 GB to 64 GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.

Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).

AMD today announced a collaboration with Green Hills Software, the largest independent vendor of embedded software, that brings its industry-leading INTEGRITY real-time operating system (RTOS) to the AMD Embedded G-Series Accelerated Processing Unit (APU) platform. The combination of INTEGRITY RTOS with the AMD Embedded G-Series APU creates a high performance, reliable and secure embedded computing solution or use across a range of applications including industrial control systems, consumer, networking, military/aerospace and medical.

The INTEGRITY RTOS offers support for multi-core x86 CPUs in the AMD Embedded G-Series APU with its v10.0.2 SMP release. The AMD Embedded G-Series APU offers an advanced, low-power, multi-core x86 CPU and a discrete-class DirectX 11-capable GPU on a single chip. This specific family of APUs was created expressly for the requirements of embedded systems, many of which require the precise, deterministic timing of an RTOS.

AMD today announced Rockwell Collins, a leader in innovative communications and avionics systems for the aerospace and defense industries, has selected the AMD Radeon E2400 embedded graphics processor for inclusion in its highly-intuitive, integrated flight deck solution, Pro Line Fusion. Chosen for its advanced 3D graphics rendering capabilities, the AMD Radeon E2400 helps generate realistic graphical models of the external aircraft environment to help improve awareness of terrain, obstacles and runways in low visibility conditions. With this technology, pilots can now have key information at their fingertips, enabling them to make informed decisions during every phase of flight.

"The rapid and accurate visualization of data and access to information are essential for professionals in the aerospace and defense industries," said Richard Jaenicke, director, Embedded Client Business, AMD. "The AMD Radeon E2400 was specifically designed to meet customers' demand for high-quality graphics with a stable, long-lasting supply, making it ideal for system designers such as Rockwell Collins."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Apacer will display our newest embedded offerings along with live booth demonstrations emphasizing Apacer's strengths in managing abrupt power failure in all of our products, please join us at booth #848 during the ESC DESIGN West 2012 exhibition in the San Jose McEnery Convention Center.

With an established background in providing reliable embedded memory solutions, Apacer looks forward in presenting our latest products including high capacity 2.5" SSDs with both SATA and PATA availability, high speed mSATA 6Gb/s and embedded flash cards.

RunCore, leading developer and brand manufacturer of high-end Solid State Drives (SSDs) and storage solutions, is once again taking part in and showcasing at the world's leading conference for the design and development of embedded systems, the ESC Silicon Valley (Electronics System Conference) in San Jose from Mar 26th to Mar 29th, 2012. RunCore will show SSD innovations ranging from consumer, enterprise to industrial solutions. The focus of RunCore's product line-up will be on most advanced SSD storage solutions that provide highest speeds and lowest power consumption with best data security/lifetime. These characteristics make them ideal components for highly advanced embedded system in almost any field of application.

As the miniaturization in computing is continuously progressing, this is also the case for storage demands. RunCore is addressing this demand with their Rugged SSD for Embedded Market - rSSD series - offering highly sophisticated small form factor SATAII SSD solutions for embedded systems. Dimensions of these rSSD are compressed dramatically by virtue of the 104-ball FBGA packaging when compared to conventional drives, while reducing power consumption to 670 mW and offering a wide range of operating temperatures from -40°C up to +85°C.

Intel's first Pentium processors based on the 22 nm "Ivy Bridge" silicon will arrive in Q4, 2012. One of the first models in the series, is the Pentium G2120. Specifications reveal that the chip will be quite generously designed as far as specifications go. To begin with, it is a dual-core processor, with a clock speed of 3.10 GHz. It lacks HyperThreading, so 2 logical CPUs is all that the OS will see; as well as Turbo Boost, so the clock speed won't normally scale beyond 3.10 GHz. Interestingly, the chip has 3 MB of L3 cache, on par with some Core i3 dual-core chips. The instruction-set has SIMD instructions up to SSE 4.2, but lacks AVX. Further, the PCI-Express root hub only supports PCI-Express 2.0, lacking PCI-Express 3.0 support. Its TDP is rated at 65W.

TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces the availability of the 4-Port 500Mbps Powerline AV Adapter with four integrated Gigabit ports, model TPL-405E.

New media center devices such as internet televisions, media players, network video recorders, receivers, and game consoles are now network ready-respective devices are capable of connecting to and streaming HD files directly from the Internet. TRENDnet's 4-Port 500Mbps Powerline AV Adapter connects up to four media center devices to the Internet simultaneously using existing electrical lines.

Over the past year, Microsoft has been discussing the vast possibilities offered by the emergence of a new category within the traditional embedded market - intelligent systems.

A critical component of Microsoft's enterprise strategy, intelligent systems enable an unprecedented flow of data with the power to transform industries such as retail, manufacturing and medicine, by connecting devices where data is generated through employees and customers to back-end systems and services where it is translated into strategic insight to inform business decisions.

Super Talent Technology, a leading manufacturer of NAND flash solutions, today announces two new Flash Disk Module (FDM) solutions for Industrial and Embedded applications.
Already known for their IDE, SATA and USB flash disk modules; Super Talent now introduces two new FDM solutions focused on increase performance, PCIe and USB 3.0 FDM modules. Designed for Industrial and Embedded applications, Super Talent's FDM solutions provide high speed data throughput and reliability.

The new USB 3.0 FDM features a 20-pin DIP configuration, now appearing on many new motherboards, and is available in capacities of 8GB to 32GB. These USB 3.0 FDMs mount vertically and measure 32.2mm(h) x 26.2mm(w) and 4mm(t) and can hit speeds of 85MB/s Reads and 40 MB/s Writes.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced it is working with key industry chipset vendors to help ensure a best-in-class user experience for mobile devices based on Microsoft Corp.'s upcoming Windows 8 operating system.

Companies such as Intel Corporation, Qualcomm Incorporated and Texas Instruments Incorporated (TI) are using SanDisk iNAND Extreme embedded flash memory with some of their top Windows 8 hardware development platforms. SanDisk is working with these companies to optimize its iNAND Extreme flash memory products with Windows 8-based tablet and mobile designs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

AOpen being a valued partner of Microsoft is working closely with the Windows Embedded team to show the benefits of the AOpen Digital Engine combined with WES 7.

At Embedded World, AOpen will demonstrate the latest AOpen Digital Engine DE67-HA that includes support for the Intel 2nd Generation Core Processor Family i3, i5 and i7. It is the strongest and most powerful AOpen Digital Engine to date. The system supports Intel Active Management Technology 7.0 to enable remote system management from a single location. AMT technology enables the system to be managed from for instance the UK while the systems are located at several locations in Europe. The system also allows to be connected to multiple displays while maintaining quality performance, thus eliminating the need to buy more media players than necessary and reducing implementation costs.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, will exhibit at Embedded World 2012 in Nuremberg, Germany on February 28 - March 1, 2012. Throughout the exhibition, Transcend will display a wide range of industrial-grade products from SSDs to memory modules, specifically designed for diverse industrial applications. Transcend's booth will be located in Hall 1, booth no. 216.

Participating at Embedded World again this year, Transcend is proud to display a more comprehensive and advanced industrial grade product portfolio, including SATA III 6Gb/s SSD, SLC SSD, mSATA and half-slim SSDs, flash modules, flash cards, and memory modules. Transcend will also set up professional on-site demonstrations, such as SSD lifespan monitoring and sudden power-off test, to highlight the ultimate stability and guaranteed reliable data transfer of Transcend SSDs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first quad core Mini-ITX boards featuring the latest VIA QuadCore E-Series processor. The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2 GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products.

The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. To meet the low power demands of the embedded market, the VIA QuadCore E-Series processor offers industry-leading energy efficiency, with the VIA QuadCore E-Series 1.2+ GHz processor delivering a thermal design power (TDP) of only 27.5 W. The distributed power of the VIA QuadCore E-Series processor makes it ideal for handling the most demanding HD video formats for immersive multi-display applications and environments.

Advantech,a global leader in the embedded computing market, is happy to announce the ARK-1120, an ultra-compact and price-competitive fanless embedded system powered by an Intel Atom N455 processor. Its compact size, affordable price, robust performance and support for both HDD and CompactFlash memory make the ARK-1120 attractive for a range of embedded usages.

This product is well-suited for applications that need a simple but dependable controller. ARK-1120 is ideal for thin client and factory automation applications with space limited or low-power-consumption designs.

Wyse Technology, the global leader in cloud client computing, today announced the newest member of its top-performing Z class thin client family with the availability of the Wyse Z90DE7 thin client. Built on an extended hardware platform that includes a PCI express (PCIe) expansion slot, this extremely secure, powerful new member of the Wyse Z class family is based on Microsoft Windows Embedded Standard 7. Like other Wyse Z90 family thin clients, the Z90DE7 combines the raw power of dual-core AMD G-series processors with Wyse's industry-leading firmware based on Windows Embedded Standard 7 optimized for thin client performance, security, and ease of use. In addition, the Z90DE7 adds an expandable hardware platform to deliver multimedia and advanced security applications with exceptional, uncompromised performance and quality.

Silicon Line GmbH, a leading provider of ultra-low power analog ICs, today announced that it has brought to market the SL82728 and SL82718 ICs targeted at notebooks, ultrabooks and tablets using the latest VESA based Embedded DisplayPort standard. The ICs are used to optically connect the graphics processor to the display and enable the replacement of traditional electrical connectors with optical connectors.

Strong consumer demand for high resolution retina type displays and 3D technology is driving the data rates inside mobile devices ever higher. These extremely high data rates not only generate significant EMI when traditional electrical cables are used to transport the data but also are reaching the limits of the practical capabilities of electrical cables.

ADLINK Technology, Inc., a leading global provider of trusted I/O platforms, announces the release of the new Matrix MXE-5300 series of rugged, quad core, fanless computers, based on the high performance 2nd Generation Intel Core i7/i5/i3 processor and QM67 chipset. The MXE-5300 is the ultimate Matrix fanless embedded computer, featuring top-of-the-line processor performance, outstanding wireless optimization capability, robust mechanical design, and Intel AMT 7.0 support. The MXE-5300's combined features make it an ideal choice for intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.

LucidLogix (Lucid) today announced GPU virtualization software designed to improve the response performance, visual quality and battery efficiency of mobile devices including smartphones, tablets, ultrabooks, notebooks and more.

Codenamed "XLR8", Lucid has taken the core technology behind its recently announced Virtu MVP software and applied it to single, embedded graphics processors like AMD Fusion, ARM Mali, Intel Ivy Bridge and NVIDIA Tegra.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced that the iNAND Ultra line of products will be the first of its embedded flash memory products to move to 19 nanometer (nm) manufacturing technology, the industry's most advanced chip making process.

TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces the availability of the 200 Mbps Powerline AV Adapter with Bonus Plug, model TPL-307E, and the 200Mbps Powerline AV Adapter Kit with Bonus Plug, model TPL-307E2K, which comes with two TPL-307E adapters. These high performance Powerline adapters network computers, televisions, and other devices using existing home or office electrical lines.

The TPL-307E replaces the bulkier TPL-304E series and features a compact product housing, built in electrical outlet, embedded power saving technology, and an advanced electrical noise filter which boosts performance by reducing background electrical signal interference.

HP today announced the HP Slate 2 Tablet PC with expanded touch capabilities, enhanced multitasking performance and embedded security, providing added flexibility to mobile business users. The company also announced a new notebook PC targeting business, education and government customers.

The HP Slate 2 Tablet PC provides instant deployment for business and vertical markets such as education, healthcare, government and retail, where jobs frequently take users away from a traditional desk. With a full-featured Microsoft Windows environment, the 1.5 pound HP Slate 2 Tablet PC provides professionals with the flexibility to create, edit and review content on one highly mobile and lightweight device.

Stealth.com Inc. (Stealth Computer), a leading ISO 9001 manufacturer of industrial rugged computers and peripherals has released the new model LPC-125LPFM, a rugged, small footprint, fanless computer for industrial, Mobile/In-Vehicle and Embedded applications.

The LPC-125LPFM is a breakthrough in small form factor computing. The rugged, diminutive size, noise free computer operates in wide temperature ranges and drawing less than 20 Watts of operational power. This energy efficient & versatile PC measures out at only, 4.6" x 6.1" x 2.0" (117mm x 155mm x 52mm) or slightly larger than a deck of playing cards. The Stealth Mini PC weighs in at a mere 1.2lbs or 0.54kg. The PC operates from 10-26V of DC power making it ideal for DC powered applications typically found in vehicle and mobile applications.