Kioxia Corporation, a world leader in memory solutions, today announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new line-up utilizes the company's BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512 GB to support the various requirements of evolving automotive applications that elevate driver experiences.

The storage requirement for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade 2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.

AMD (NASDAQ: AMD) today announced the completion of its acquisition of Xilinx in an all-stock transaction. The acquisition, originally announced on October 27, 2020, creates the industry's high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics and adaptive SoC products. AMD expects the acquisition to be accretive to non-GAAP margins, non-GAAP EPS and free cash flow generation in the first year.

"The acquisition of Xilinx brings together a highly complementary set of products, customers and markets combined with differentiated IP and world-class talent to create the industry's high-performance and adaptive computing leader," said AMD President and CEO Dr. Lisa Su. "Xilinx offers industry-leading FPGAs, adaptive SoCs, AI engines and software expertise that enable AMD to offer the strongest portfolio of high-performance and adaptive computing solutions in the industry and capture a larger share of the approximately $135 billion market opportunity we see across cloud, edge and intelligent devices."

congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs. From now on, engineers can dive right in and start to develop fully compliant designs by picking their appropriate Computer-on-Module, add a COM-HPC Server or COM-HPC Client evaluation carrier and appropriate cooling solution, install their application and run programming, debugging and test routines on this new high-performance embedded computing standard.

The congatec COM-HPC ecosystem is fully compliant to the entire range of new PICMG COM-HPC specifications, namely the COM-HPC Module Base Specification, the brand new Carrier Board Design Guide, the Embedded EEPROM specification and the Platform Management Interface specification. Supported by all leading embedded computing vendors, including congatec, this set of PICMG standards offers engineers the benefits of best in class design security.

Xiaomi today took another bold step in the exploration of future technology with its new bio-inspired quadruped robot - CyberDog. The launch of CyberDog is the culmination of Xiaomi's engineering prowess, condensed into an open source robot companion that developers can build upon.

CyberDog is Xiaomi's first foray into quadruped robotics for the open source community and developers worldwide. Robotics enthusiasts interested in CyberDog can compete or co-create with other like-minded Xiaomi Fans, together propelling the development and potential of quadruped robots.

The LattePanda Alpha, based on Intel Core m3-8100Y, is a Dual-Core 1.10 GHz CPU that bursts up to 3.40 GHz. Integrated Intel UHD Graphics 615 into the processor, the LattePanda Alpha delivers enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. All of this computing power dissipates only 8 W power, which is the perfect choice for users who need a small, portable, and light SBC for their powerful DIY handheld. And, given its incredibly small size, the LattePanda Alpha can be easily hidden, functioning as the secretly powerful brains behind users coolest project.

AMD's next generation Ryzen Embedded V3000 system-on-chips aren't simply "Cezanne" dies sitting on BGA packages, but rather based on a brand new silicon, according to Patrick Schur, a reliable source with leaks. The die will be built on the more advanced 6 nm silicon fabrication node, whilst still being based on the current "Zen 3" microarchitecture. There are several things that set it apart from the APU silicon of the current-generation, making it more relevant for the applications the Ryzen Embedded processor family is originally built for.

Built in the FP7r2 BGA package, the V3000 silicon features an 8-core/16-thread CPU based on the "Zen 3" microarchitecture. There are also an integrated GPU based on the RDNA2 graphics architecture, with up to 12 CUs, a dual-channel DDR5 memory interface, a 20-lane PCI-Express 4.0 root complex, with up to 8 lanes put out for PEG; two USB4 ports, and two 10 GbE PHYs. AMD could design at least three SKUs based on this silicon, spanning TDP bands of 15-30 W and 35-54 W.

Xilinx, Inc., the leader in adaptive computing, today announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world's only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

Lenovo announced today its all new portfolio of embedded computers for the edge during the Embedded World 2021 DIGITAL virtual exhibition. Building from the existing edge portfolio from Lenovo, the ThinkEdge devices - the new ThinkEdge SE30 and ThinkEdge SE50 - are small, rugged, and powerful enough to meet the demanding needs of enterprise data processing, security and scalability at the edge.

The new Lenovo ThinkEdge devices are powered by Intel technology and built for the data needs of tomorrow. The embedded edge computers are for customers who need faster processing power, better security, and scalability. With the right data securely on hand for when it matters, businesses can be more efficient, insightful and competitive.

Innodisk is proud to announce multiple new products coinciding with Embedded World 2021, to be held from 1 - 5 March 2021. As a leading global provider of industrial-grade flash, DRAM, and embedded peripherals, Innodisk strives to maintain its unrelenting pace of innovation in the face of the past year's pandemic challenges. Kicking off this year of the Ox on a high note, Innodisk is announcing new PCIe Gen 4 NVMe flash storage, DDR4-3200 DRAM, and CANbus & LAN modules.

Innodisk's NVMe flash storage series now supports the latest PCIe Gen 4 interface with a staggering 7.88 GB/s transfer rate—double the bandwidth of Gen 3—that simultaneously lowers overall power consumption, reducing the overheating issues of many PCIe SSDs. Smart temperature control through thermal throttling firmware technology is convenient for users to monitor temperature changes of SSDs at any time, and protect data with higher performance.

SAPPHIRE Technology continues to excel in embedded platform design by announcing a new series of embedded motherboards powered by the latest high-performance AMD Ryzen Embedded V2000 processor family built on 7 nm process technology, Zen 2 cores and high-performance AMD Radeon graphics. The SAPPHIRE V2000 BP-FP6 and FS-FP6 embedded motherboards support multiple independent displays in 4K resolution with a stable balance of low power consumption and exceptional performance for the embedded markets.

GIGABYTE is planning to update its BRIX line of min-PCs with new models powered by AMD's Ryzen 4000 series "Renoir" 8-core/16-thread processors, according to a ComputerBase.de article. It remains to be seen whether these mini-PCs use the 15 W "Renoir-U," 45 W "Renoir-H," or the more recent Ryzen Embedded V2000 chips. The company is readying two main variants based on body size—slim and tall, with the "tall" version featuring a 2.5-inch SATA drive bay in addition to M.2 slots, while the slim version makes do with just M.2 NVMe/SATA slots for internal storage. These BRIX boxes come with the latest networking connectivity, including 802.11ax Wi-Fi 6, and 2.5 GbE wired Ethernet. There could be as many as four display outputs, with GIGABYTE advertising support for up to four 4K displays. One of these could be USB-C. There's no word yet on pricing or availability.

AAEON, a leader in embedded solutions, announces up-coming products featuring the 11th Generation Intel Core processors (formerly Tiger Lake) and Intel Atom x6000E series processors, Intel Pentium and Celeron N and J series processors (formerly Elkhart Lake). These next generation solutions provide greater performance, flexibility and a host of Intel technologies to power computing at the edge.

The 11th Generation Intel Core processors, now the third generation of Intel's 10 nm microarchitecture, provide performance above the current industry standard 8th and 9th Generation processors. These processors also open up access to cutting edge technologies, featuring the Intel Iris Xe graphics (Gen 12), PCIe 4.0, Thunderbolt 4, USB4, DDR4 and LPDDR4x memory, and Deep Learning Boost on select SKUs.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the eBOX626-311-FL, its new slim-type fanless embedded system powered by the Intel Atom processor x5-E3940. The fanless embedded box PC was designed to operate reliably in industrial environments - with an IP40-rated enclosure, extended -40°C to +60°C support, and 3 Grms vibration resistance. To ensure system security, it utilizes the Trusted Platform Module (TPM) 1.2 function. The embedded box computer eBOX626-311-FL is well-suited for industrial controllers, intelligent robotic control, intelligent gateway systems, smart kiosks, visual inspection and data visualization.

"The eBOX626-311-FL is a highly-integrated platform with high performance, abundant I/O connectivity and high reliability. The fanless embedded box PC has a wide voltage input and supports an 11 ms interruption to prevent an unexpected power outage. The wide temperature settings and 3Grms vibration resistance along with IP40-rated rugged aluminium extrusion and steel case makes it solid and durable in harsh environments," said Annie Fu, product manager of Product PM Division at Axiomtek."

5G has been a trending topic in the recent times because of the big technological breakthrough and all the solutions that its major features will make a reality: Low latency, bigger bandwidth with higher frequency, and overall faster "real-time" connection.

With those features 5G will connect virtually everyone and everything together in a fast and reliable network through the air while protecting privacy and security issues, that will mean the era of real IoT: Smart cities and smart transportations; remote medical care and wirelessly connected Industrial devices, and high-quality video streaming, to say the least.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

UP Xtreme Smart Surveillance is an all-in-one security solution that's ready to deploy out of the box. Many developers and users of security solutions are looking for ways to get more out of their surveillance systems by deploying intelligent edge computing platforms. UP Xtreme, from AAEON's UP Board division, is being deployed along with technology from partners including Intel, Milestone and SAIMOS to bring Smart Surveillance to these customers with the UP Xtreme Smart Surveillance kit.

With the ever-increasing importance of on-site security, surveillance cameras are installed virtually everywhere, recording footage passively. Smart surveillance takes things to the next level by adding intelligent processing of data that's already being gathered to analyze traffic with heatmaps, monitor areas with virtual fences, or reacting to data in other ways to allow for automated control or alerting staff on premises. UP Xtreme Smart Surveillance provides all the technology needed to power these applications in one box, working as an AI-enabled NVR solution to proactively monitor video streams supporting up to 32 cameras simultaneously (Intel Core i7 model with Milestone XProtect Express+).

IBASE Technology Inc., a leading provider of industrial motherboard and rugged computing solutions, is pleased to announce its AMS210 high-performance embedded box PC. Designed for factory automation, machine vision, digital signage and a wide range of industrial IoT applications, the AMS210 can be outfitted with 9th/8th Gen Intel Core processors, up to 32 GB of DDR4 memory and two 2.5" disk drives with RAID 0/1.

The AMS210 has a straightforward design with front I/O accessibility, including four USB 3.1, four USB 2.0, three DisplayPorts, and a serial port to connect to a diverse set of peripheral devices, as well as four Gigabit LAN ports to handle high bandwidth data processing requirements. Two flexible expansion slots supporting a combination of PCI-E (x16), PCI-E (x4) and PCI interface are also conveniently located at the front for easy access. To achieve operational reliability in harsh industrial environments, it features an operating temperature range from 0°C to 55°C and vibration endurance of up to 3 g (with SSD).

AAEON, a leader in AI and edge computing solutions, announces the VPC-3350AI embedded PC featuring Intel Movidius Myriad X. Built for industrial and in-vehicle use, the VPC-3350AI provides faster and smoother AI processing compared to similar systems which rely on CPU performance alone.

The VPC-3350AI is based on a flexible platform powered by Intel Atom x5 E3940 (formerly Apollo Lake) paired with two Intel Movidius Myriad X VPU modules. Together, these modules provide the VPC-3350AI with processing speeds up to 210 FPS and 8 TOPs as a dedicated neural network accelerator (evaluated by GooLeNet). This configuration of two VPUs with processor allows the VPC-3350AI to support asynchronous processing of AI models, allowing for higher framerates and faster, smoother image processing for AI inferences.

AMD today announced revenue for the first quarter of 2020 of $1.79 billion, operating income of $177 million, net income of $162 million and diluted earnings per share of $0.14. On a non-GAAP* basis, operating income was $236 million, net income was $222 million and diluted earnings per share was $0.18.

"We executed well in the first quarter, navigating the challenging environment to deliver 40 percent year-over-year revenue growth and significant gross margin expansion driven by our Ryzen and EPYC processors," said Dr. Lisa Su, AMD president and CEO. "While we expect some uncertainty in the near-term demand environment, our financial foundation is solid and our strong product portfolio positions us well across a diverse set of resilient end markets. We remain focused on strong business execution while ensuring the safety of our employees and supporting our customers, partners and communities. Our strategy and long-term growth plans are unchanged."

Matrox today announced a collaboration with NVIDIA for the development of a new range of multi-display embedded graphics cards purpose-built for high-density video walls. Leveraging NVIDIA's industry-renowned GPU technology, Matrox will design graphics innovations powered by a custom-built Quadro embedded GPU to accelerate graphics-intensive video wall applications in commercial and 24/7 critical environments.

"Matrox is thrilled to work alongside NVIDIA, the leader in GPU computing, to bring to market a new standard of high-density video walls," said David Chiappini, executive vice president of research and development at Matrox. "This collaboration is yet another example of our commitment to expanding our video wall portfolio while customers continue to benefit from our graphics expertise, world-class engineering, dedicated technical support, and long product life cycles."

Global industrial and IoT computer hardware manufacturer, OnLogic, has teamed up with AMD to release a line of small form factor industrial computers powered by AMD Ryzen Embedded processors. Both the ultra-compact fanless ML100G-40, and actively-cooled MC510-40 are available for pre-order now and limited quantities are expected to begin shipping to customers in December.

Global industrial and IoT computer hardware manufacturer, OnLogic, has teamed up with AMD to release a line of small form factor industrial computers powered by AMD Ryzen Embedded processors. Both the ultra-compact fanless ML100G-40, and actively-cooled MC510-40 are available for pre-order now and limited quantities are expected to begin shipping to customers in December.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2019 of $1.80 billion, operating income of $186 million, net income of $120 million and diluted earnings per share of $0.11. On a non-GAAP(*) basis, operating income was $240 million, net income was $219 million and diluted earnings per share was $0.18.

"Our first full quarter of 7 nm Ryzen, Radeon and EPYC processor sales drove our highest quarterly revenue since 2005, our highest quarterly gross margin since 2012 and a significant increase in net income year-over-year," said Dr. Lisa Su, AMD president and CEO. "I am extremely pleased with our progress as we have the strongest product portfolio in our history, significant customer momentum and a leadership product roadmap for 2020 and beyond."

The AMD Embedded business provides SoCs and discrete GPUs that enable casino gaming companies to create immersive and beautiful graphics for the latest in casino gaming platforms, which are adopting the same high-quality motion graphics and experiences seen in modern consumer gaming devices. AMD Embedded provides casino and gaming customers a breadth of solutions to drive virtually any gaming system. The AMD Ryzen Embedded V1000 SoC brings CPU and GPU technology together in one package, providing the capability to run up to four 4K displays from one system. The AMD Ryzen Embedded R1000 SoC is a power efficient option while providing up to 4X better CPU and graphics performance per dollar than the competition.

Beyond SoCs, AMD also offers embedded GPUs to enable stunning, immersive visual experiences while supporting efficient thermal design power (TDP) profiles. AMD delivers three discrete GPU classes to customers with the AMD Embedded Radeon ultra-high-performance embedded GPUs, the AMD Embedded Radeon high-performance embedded GPUs and the AMD Embedded Radeon power-efficient embedded GPUs. These three classes enable a wide range of performance and power consumption, but most importantly offer features that the embedded industry demands including planned longevity, enhanced support and support for embedded operating systems.

At the Taiwan Embedded Forum, AMD announced the Ryzen embedded product family is growing with the new AMD Ryzen Embedded R1000 SoC. Building upon the success of the Ryzen Embedded V1000 SoC, the AMD Ryzen Embedded R1000 SoC provides embedded customers with dual core, quad-threaded performance, as well as the ability to run fanless, low power solutions for 4K displays; while providing leading-edge security features. The AMD Ryzen Embedded R1000 is perfect for applications in digital displays, high-performance edge computing, networking, thin clients and more.

Customers like Advantech, ASRock Industrial, IBASE, Netronome, Quixant and others are already working on Ryzen Embedded R1000-based products. As well, Atari© is using the high-performance Vega 3 graphics and 'Zen' CPU architecture in the AMD Ryzen Embedded R1000 SoC to power the upcoming Atari VCS game system.

Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company's BiCS FLASH 3D flash memory and a controller in a single package. The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices.

The company's Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade 2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB.