ZOTAC Technology, a global manufacturer of innovation, is proud to expand its reach to the embedded computing market with the launch of ZBOX PRO. ZBOX PRO represents the emerging of ZOTAC's professional embedded solution that embodies high performance for commercial and industrial applications and differing business needs worldwide. The product line will make its debut appearance at Integrated Systems Europe (ISE) 2019.

ZBOX PRO re-engineers the functionality and small footprint of ZBOX Mini PCs to offer embedded product selections with more controlled tolerances. The series features a diverse range of industrial design and engineering from passive-cooled embedded computers, pint-sized display solutions to powerful workstation-class systems. Professional-grade hardware are integrated inside the durable chassis, with an array of connectivity, memory capacity and storage options provided. With up to 5 years of supply longevity, ZBOX PRO guarantees a long lifespan to provide stable and enduring service supporting your business.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.

"The 1 TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "What's more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market."

British PC maker Tranquil PC is making its comeback with three new fanless mini PCs based on AMD Ryzen Embedded SoCs. The three are part of the "mini multi display" series, and are its variants, named "Basic," "Advance," and "Advance+." The three feature Tranquil PC's latest octagonal fanless aluminium chassis measuring 180 mm x 157 mm x 54 mm. The body panels of the case double up as heatsink for the sub-25 Watt SoCs. Connectivity is common between the three. On the front-panel, you get two USB 3.0 ports, one of which is type-C; HDA audio jacks, and interestingly an RS232 serial COM port.

The rear panel gives you access to four DisplayPort 1.2 connectors, which can each drive a 4K UHD display; two additional type-A USB 3.0 ports, two 1 GbE interfaces, and hardpoints for the WLAN antennae (802.11ac + Bluetooth 4.1). SoC variant and storage is what differentiates the three. The Basic trim gives you a Ryzen Embedded V1202B (2-core/4-thread, up to 3.20 GHz) chip, 8 GB of DDR4 memory, and 256 GB of SSD storage. The Advance trim gets you the faster 4-core/8-thread Ryzen Embedded V1605B (up to 3.60 GHz); 16 GB of memory, and 256 GB SSD storage. The Advance+ trim steps that up with 32 GB of memory, and 1 TB of SSD storage. The company didn't reveal pricing.

Sapphire introduced the FS-FP5V, a mini-ITX (147.3 mm x 139.7 mm) SFF motherboard designed for AIO desktops, digital signage boxes, and compact desktops. At the heart of this board is an AMD Ryzen Embedded V1000 series FP5 SoC based on the 14 nm "Raven Ridge" silicon. Since this SoC also integrates a southbridge, the board is practically chipset-less. The Ryzen Embedded V1000 chip is configured with a 4-core/8-thread "Zen" CPU clocked at 2.00 GHz with 3.35 GHz boost, and 4 MB L3 cache. The iGPU is a Radeon Vega 11, which may look overkill, but is required to pull the four DisplayPort 1.4 outputs of this board (handy for digital-signage applications).

The Ryzen Embedded V1000 is wired to two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2933 memory. Storage connectivity includes an M.2-2280 slot with PCI-Express 3.0 x4 wiring, an M.2 E-key slot with x1 wiring for WLAN cards; and a SATA 6 Gbps port. Networking options include two 1 GbE interfaces. USB connectivity includes two USB 3.1 gen 1 ports at the rear-panel, and two USB 3.1 gen 1 ports (direct ports) at the front side of the board, one each of type-A and type-C. Stereo HD audio makes for the rest of it. The board draws power from either 2-pin DC (external) or 4-pin ATX.

Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced several new additions to its edge computing and network appliance portfolio based on the new Intel Xeon D-2100 SoC (System-on-a-Chip) processor.

Leveraging its deep expertise in server technology, Supermicro is bringing customers some of the first Intel Xeon D-2100 System-on-a-Chip (SoC) processor-based solutions. The company's X11SDV series motherboards offer infrastructure optimization by combining the performance and advanced intelligence of Intel Xeon processors into a dense, lower-power system-on-a-chip. Supermicro is introducing a wide range of new systems to the market including compact embedded systems, rackmount embedded systems, as well as multi-node MicroCloud and SuperBlade systems.

ADATA Technology, a leading manufacturer of highperformance DRAM modules, SSD and NAND based Flash products, is pleased to confirm participation in Embedded World 2018, which is the premiere embedded systems and industrial PC trade show in Europe. The event is scheduled for February 27th to March 1st 2018 and taking place in Nuremberg, Germany. ADATA is fielding its entire industrial-grade portfolio, covering SSDs, SD cards, and CFAST products that now use new-generation 3D NAND.

ADATA will showcase several PCIe M.2 2280 SSDs and DDR4 2666 DRAM modules, which feature extreme high speed, wide temperature tolerance and sustained reliability for industrial embedded applications, as well as for AI, AR, VR and video gaming. In addition, industrial box PCs, embedded cards, server motherboards, smart car infotainment, and casino gaming controls will be at the show. ADATA ex! pects Embedded World 2018 to be the most productive and exciting show yet after years of taking part in the event.

AMD today introduced two new product families - the AMD EPYC Embedded 3000 processor and AMD Ryzen Embedded V1000 processor - to enter a new age for high-performance embedded processors. AMD EPYC Embedded 3000 brings the power of "Zen" to a variety of new markets including networking, storage and edge computing devices, while AMD Ryzen Embedded V1000 targets medical imaging, industrial systems, digital gaming and thin clients. These new AMD Embedded processors deliver breakthrough performance, exceptional integration and on-chip security.

"Today we extend the high-performance x86 'Zen' architecture from PCs, laptops and the datacenter to networking, storage and industrial solutions with the AMD EPYC Embedded and AMD Ryzen Embedded product families, delivering transformative performance from the core to the edge," said Scott Aylor, corporate vice president and general manager, Datacenter and Embedded Solutions Business Group, AMD. "AMD EPYC Embedded 3000 raises the bar in performance for next-generation network functions virtualization, software-defined networking and networked storage applications. AMD Ryzen Embedded V1000 brings together the 'Zen' core architecture and 'Vega' graphics architecture to deliver brilliant graphics in a single chip that provides space and power savings for medical imaging, gaming and industrial systems. With these high-performance products, AMD is ushering in a new age for embedded processors."

Axiomtek, one of the world's leading design and manufacturing companies of innovative, high performance and reliable PC-based industrial computer products, is proud to announce the launch of the eBOX560-512-FL, an embedded system powered by Intel Core i5-7300U or Celeron 3965U processors. The ultra-compact computer is packed with features in its small IP40 aluminum and steel enclosure. It offers scalable computing performance; rich graphical capabilities that support dual independent display of up to 4K resolution; flexible communication options; and thoughtful design that offers versatility and values for Industrial Internet of Things use. The system is made for smart factory automation, digital signage and smart retail applications or any applications that require a good balance of a high performance industrial-grade computer and a good price point - with space-serving design and rich features.

The eBOX560-512-FL comes with many communications options such as four USB 3.0 ports, two RS-232/422/485 ports, two Gigabit Ethernet ports, one PCI Express Mini Card slot and two antenna. This tiny embedded PC offers two HDMI ports, a lockable 12 VDC power input with power protection feature and a user-friendly AT/ATX DIP switch for adjustments between automatic and manual operation control. The eBOX560-512-FL has 2.5" SATA HDD and one mSATA for data storage, and one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. It is compatible with Windows 10 IoT and supports Axiomtek's exclusive AXView 2.0 software for smart device monitoring and remote management for IoT applications. For flexible mounting options, this fanless rugged embedded platform is compatible with a wall mount, a VESA mount and a DIN-rail mount.

Transcend Information Inc., a leading manufacturer of storage and multimedia products, is proud to introduce the SSD430, an industrial-grade solid-state drive. Compatible with SATA III 6Gb/s specifications, the SSD430 delivers impressive transfer speeds of up to 560MB/s read and 490MB/s write. In addition to blazing speed, Transcend's SSD430 features excellent reliability and comes in a small, stylish case. The drive is loaded with low-density parity check (LDPC) error-correction code (ECC) and advanced protective technologies, making it an excellent choice for industrial needs.

The industrial-grade SSD430 solid-state drive is constructed of 3D MLC NAND flash chips. 3D engineering has increased SSD430's speeds to an incredible sequential 560MB/s read and 490MB/s write; the random transfer efficiency is also boosted to 310MB/s read and 350MB/s write. Low power consumption and high reliability are also hallmarks of 3D NAND. Transcend's SSD430 is manufactured for a long-term, stable operation for various types of data and application, and is suited for industrial PCs, automated machinery, and fanless industrial systems.

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today announced that it has extended its popular family of SATA 6 Gb/s FerriSSD Industrial BGA SSDs to support the latest 3D NAND with end-to-end data path protection, NANDXtend ECC, and IntelligentScan feature - delivering unsurpassed data reliability for embedded storage applications. The new FerriSSD products offer flexible data capacity options up to 256GB and feature proprietary data protection technologies that eliminate drive downtime and extend the service life of these SSDs. FerriSSD products offer customized solutions for various end-market demands and are optimized to meet the specific needs of the customer.

Toshiba America Electronic Components, Inc. (TAEC) has enhanced its lineup of managed NAND devices with the addition of new Embedded Multimedia Card (e-MMC) and Universal Flash Storage (UFS) embedded memory solutions. Featuring enhanced integrated controller technologies, the new 'Supreme+' e-MMC (JEDEC ver. 5.1) and UFS (JEDEC ver. 2.1) offerings deliver significant read and write speed improvements to demanding applications.

In contrast to raw NAND flash memory solutions, e-MMC and UFS devices integrate NAND flash memory and a controller chip in a single package. This saves space and relieves host processors of the burden of key memory management functions including bad block management, error correction, wear leveling, and garbage collection. As a result, e-MMC and UFS devices simplify design when compared to standalone memory ICs with a standard NAND flash interface.

AMD today released their earnings call for 3Q 2016, giving us some interesting tidbits in regards to their financial robustness. The balance of AMD's economics seems to be pending towards better execution, and, coeteris paribus, a much better outlook for the coming quarters, after the monumental missteps in the past that almost threw AMD under the proverbial bus. Reception for the results seems to be a tangled mess, however, with some sides claiming that AMD beat expectations, while others prefer to draw attention to AMD's 2% stock decline since the report was outed.

AMD posted revenue of $1,307 million, up 27% sequentially and 23% year-over-year. This revenue was distributed unevenly through AMD's divisions, though. "Computing and Graphics" segment revenue was $472 million, up 9% from Q2 2016, primarily due to increased GPU sales (where Polaris picked up the grunt of the work, being responsible for 50% of AMD's GPU revenue), offset by lower sales of client desktop processors and chipsets; whereas "Enterprise, Embedded and Semi-Custom" segment revenue was $835 million, up 41% sequentially, primarily due to record semi-custom SoC sales (such as those found in Microsoft's XBOX One and Sony's PS4 and upcoming PS4 Pro).

Intel introduced a trio of embedded CPUs for SFF desktops and industrial PCs (IPCs), based on its "Skylake-R" silicon. This variant of Skylake features the largest integrated GPU Intel ever made - the Intel Iris Pro 580. This IGP features 72 execution units (compared to 24 on, say, the i7-6700K), and relies on a 128 MB eDRAM L4 cache for fast frame-buffering operations. The IGP uses this tiny yet fast cache, in conjunction with its traditional UMA system memory share, as video memory. The "Skylake-R" package is a multi-chip module of the main die with four "Skylake" CPU cores and the 72-EU IGP, and a second die housing the L4 cache.

Among the three "Skylake-R" chips Intel launched are the Core i7-6785R, the Core i5-6685R, and the Core i5-6585R. The i7-6785R features HyperThreading enabling 8 logical CPUs, 8 MB of L3 cache, and 3.30 GHz nominal clock speed, with 3.90 GHz Turbo Boost. The i5-6685R and the Core i5-6585R lack HyperThreading, and feature just 6 MB of L3 cache; the former features clock speeds of 3.20 GHz nominal with 3.80 GHz Turbo Boost, while the latter offers 2.80 GHz nominal with 3.60 GHz Turbo Boost. All three feature iGPU clocks of 350 MHz nominal, with up to 1150 MHz boost. The 14 nm chips further feature TDP of 65W, and feature dual-channel memory controllers that support both DDR4 and DDR3L memory. Sold in the OEM channel, the i7-6785R, i5-6685R, and i5-6585R, are priced at US $370, $288, and $255, respectively, per-piece, and in 1000-unit tray quantities.

Toshiba today launched a new line-up of NAND flash memory products for embedded applications that are compatible with the widely used Serial Peripheral Interface (SPI). Wide ranging applications for the new "Serial Interface NAND" include such consumer applications as flat-screen TVs, printers and wearable devices, and industrial applications, including robots. Users can choose from a wide line-up of 12 products that offers three densities, 1Gbit, 2Gbit and 4Gbit; two packages, WSON[1] and SOP[2] and two power supply voltages. Samples shipment starts today and mass production is scheduled to begin with the 1Gbit products from December. Mass production of the remaining line-up will follow.

Compatibility with the widely used SPI, which can be controlled with just six pins, allows the new "Serial Interface NAND" to be used as SLC NAND flash memory, with a low pin count, small package and large capacity.

Innodisk, the service-driven flash and DRAM provider, announces higher capacity 16GB versions of its DDR4 embedded and server unbuffered DRAM series. These 2133MHz UDIMMs and SODIMMS now come in industry-leading 16GB capacities, allowing more memory to be installed within space constrained embedded systems, industrial PCs and servers. Offering higher performance with lower power consumption compared to DDR3, the new DRAM modules have ECC available for reliability, as well as industrial strength features from Innodisk such as 30µ" Gold Finger connectors, thermal sensors, and protective conformal coatings. The new 16GB modules make Innodisk's range of DDR4 products the most complete line of embedded and server DDR4 memory on the market.

"16GB is the highest capacity unbuffered DDR4 module available on the market," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We're proud that Innodisk is able to provide this memory capacity while bringing the performance and low power benefits of DDR4 to the embedded and server markets. In addition, we're bringing extra value to our industrial customers with Innodisk features like onboard thermal sensors and protective coatings.

Embedded systems and IPC major Giada is one of the first to openly exhibit a NUC (next unit of computing) compact desktop based on Intel's 6th generation Core "Skylake" processor. The i80 Ultra-Compact Mini PC by Giada features a "Skylake-U" dual-core processor, meant for Ultrabooks and NUCs; and tucks in four USB 3.0 ports, 802.11 ac WLAN, gigabit Ethernet (Intel controller), mini-DisplayPort, and HDMI 2.0, with just enough room for an mSATA SSD; in a compact chassis that measures 116.6 mm x 111 mm x 47.5 mm.

SanDisk Corporation, a global leader in flash storage solutions, today introduced the new SanDisk Z400s SSD, a cost effective solid-state drive (SSD) designed to replace hard-disk drives (HDDs) in computing platforms and embedded applications. PCs and embedded systems need consistent, reliable access to storage in order to meet business demands. The Z400s outperforms HDDs by 20x, while providing 5x the reliability with 20x lower average power consumption, all at a price point on par with HDDs. The SanDisk Z400s SSD joins the company's existing portfolio of flash-based solutions that are designed to deliver a delightful user experience and reliability at an affordable price point

"The Z400s represents a feat of engineering that addresses the needs of two distinct markets-PC OEM manufacturers and embedded application designers," said Rizwan Ahmed, senior director of product marketing, client platform solutions, SanDisk. "With a single architecture, SanDisk is able to provide OEMs with an affordable solution for displacing HDDs in today's cutting edge consumer devices, and help embedded application designers avoid overpaying for un-needed space-all while delivering the peak performance and high-reliability that only SSDs can supply."

As industrial applications increasingly require higher processing performance now than ever before, MSI released MS-98G5 industrial mainboard with superior processing and graphic capability in response. MS-98G5 is a Mini-ITX board based on Intel 4th Gen QM87/HM86 architecture that come support with BGA-type Haswell/Broadwell Mobile Core i7/i5/i3/Celeron Processor, multiple displays, 1 PCIe(x16), 8 USB 2.0 & 4 USB 3.0 ports, 5 COM ports, SATA 3.0 connector, and 2 mini-PCIe slots. The flexible and rich design along with the auto-switch DC 12/19V power inputs bring system integrators more possibilities of display deployment, I/O connection, and extra expansion.

MS-98G5 is also featured with its multiple displays with HDMI, DP, DVI-I, and LVDS outputs and the HD Graphics. The brilliant display capability and the high-performance Intel 4th Gen kernel make it an ideal solution for various industrial applications, such as HMI control, ATM, Kiosk, intelligent transportation system, medical, networking, and many more automation fields.

The Video Electronics Standards Association (VESA) today published the Embedded DisplayPort (eDP) Standard version 1.4a. Replacing eDP v1.4, published in February 2013, eDP 1.4a enables a higher video data transfer rate for increased panel resolution, greater color depth and higher refresh rates. It also incorporates the VESA Display Stream Compression (DSC) Standard v1.1, and includes a new segmented panel architecture that enables higher panel integration. These and other refinements were made to the eDP 1.4a standard to take advantage of higher GPU video performance and newer display technologies, while also enabling reduced system power and form factor.

The eDP v1.4a standard leverages the VESA DisplayPort (DP) Standard v1.3, published in September 2014, as a base specification. That standard's new higher HBR3 link rate, which operates at 8.1 Gbps per lane, is now also part of eDP v1.4a. With both HBR3 and the DSC v1.1 standard included, the latest eDP standard can support embedded panels with up to 8K resolution. For embedded display applications, DSC is most often used to decrease video interface data rate or wire count, as well as reduce display frame buffer size, thereby reducing system power usage to extend battery life. It also enables reductions in system complexity and form factor.

Marvell, a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment and in-home content delivery and Kinoma software enabling the "Smart Life and Smart Lifestyle," today announced the world's first DRAM-less NVMe (Non-Volatile Memory Express) solid state drive (SSD) controller for mass market mobile computing solutions with industry-leading NANDEdge low-density parity check (LDPC) technology supporting triple-level cell (TLC) and 3D NAND. Marvell's 88NV1140 and 88NV1120 enable small form factor SSD solutions with unparalleled performance for integration into low-z-height tablets, Chrome devices and the upcoming wave of new 2-in-1 hybrid/detachable mobile PC platforms.

"As mobile computing and cloud-based services become an integral part of our daily lives, fast, secure, reliable and cost effective storage solutions with a small form factor are the key to bringing the benefit of technology to the mass market. I believe our latest game-changing SSD controller will drive the fast deployment of a new wave of small form factor SSD solutions for the mass market mobile computing platforms," said Weili Dai, President and Co-Founder of Marvell. "I am very pleased to see Marvell's leadership and our long track record of invention and innovation including the world's first DRAM-less NVMe SSD controller and the industry's most advanced LDPC technology enabling the latest TLC and 3D NAND flash memory. I am very thankful for our global engineering teams who continuously raise the technology bar to move our industry forward faster."

Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMCTM embedded NAND flash memory products that are among the world's smallest.The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15 nm process technology and a controller to manage basic control functions for NAND applications into a single package.

Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow. By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller than comparable Toshiba products and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).

Acnodes Corp., a leading manufacturer of industrial and embedded computer platforms and technologies, today announced the launch of a new fanless embedded computer, FES8660. Based on the 3rd generation Core i7 / i5 / i3 or Celeron Processor and HM76 Express Chipset, it features a robust fanless design and is an ideal solution for video applications, digital signage, outdoor advertising, POS/kiosks and gaming. In addition, this application-ready rugged platform also targets a broad range of industrial computing applications such as embedded controller, factory automation and more.

The FES8660 includes a VGA out video interfaces, 4 COM ports, four Gigabit LAN ports, four USB 3.0 ports, and audio for administration and software input. Moreover, the FES8660 has two 204-pin DDR3 memory maximum up to 16 GB, one 2.5" SATA drive bay and CFast slot for solid state storage. The FES8660 provides good expansion capability by offering two PCI Express Mini card slots and two SIM card sockets allowing more efficient, seamless networking options. The onboard Core i7 / i5 / i3 or Celeron processor couples low power consumption with minimal cooling requirements, resulting in improved stability and longevity and allowing for completely fanless computer design.

SanDisk Corporation, a global leader in flash storage solutions, today announced the iNAND Standard embedded flash drive (EFD), an ideal storage solution for entry-level tablets and smartphones in China and other high-growth markets. The new 1Y nanometer 3-bit-per-cell (X3) NAND flash storage solution enables original equipment manufacturers (OEMs) to quickly introduce new, affordable tablets and smartphones with the reliable performance of SanDisk storage.

"China is the most dynamic smartphone and tablet market today, with state-of-the-art high-end smartphones and new powerful, but affordable, 'entry-level' devices," said Mr. Drew Henry, senior vice president and general manager, Mobile and Connected Solutions, SanDisk. "We leveraged our flash technology expertise to specifically design our new iNAND Standard for the high-volume China budget mobile device market. Because we work closely with mobile systems providers, it offers near plug-and-play capability that enables OEMs to rapidly introduce highly capable entry-level tablets and smartphones that are optimal for the China mass market."

Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, announces the eBOX635-881-FL, its new fanless embedded box computer utilizing 4th Generation Intel Core i7/i5/i3 and Intel Celeron processor with Intel H81 chipset.

The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.

Synology today introduced Embedded DataStation EDS14, a palm-sized, state-of-the-art NAS server combining durability with reliability, implementing Synology's advanced network storage solutions in a wide range of application scenarios. "Designed to survive extreme conditions and harsh environments, the EDS14 is vibration-resistant and complies with the industrial thermal endurance level from -20˚C to 50˚C," said Chad Chiang, product manager at Synology Inc. "Its drive-less design and the support for high-speed SDXC UHS-I SD storage and USB 3.0 further maximize system reliability with performance and capacity."

Synology EDS14 measures at 125 x 125 x 31mm, nearly 70% smaller than an ordinary 2-bay NAS server, and is particularly suitable for areas where space is a challenge. Despite the compact physical size, the EDS14 makes no compromise in reliability by engineering the dynamic cooling mechanisms to ensure CPU health in challenging thermal environments. Optimized for deployment in a variety of environments, the EDS14 can tolerate dynamic DC input voltage from 7 to 24V, is compatible with PoE splitters, and supports 3G/LTE. The EDS14 even comes with multiple mounting solutions, including DIN rail, and a schedulable DC output to power peripheral devices, making it a good fit for versatile deployment.