VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today's HD-intensive, commercial multimedia-centric devices.

The VIA EPIA-M850 is targeted at OEM and ODM manufacturers of commercial multimedia embedded devices. Featuring a 64-bit, high performance VIA Nano E-Series processor and the VIA VX900 unified all-in-one media system processor, the VIA EPIA-M850 delivers a highly optimized platform that boasts comprehensive HD video performance, HD audio and HDMI support in a compact, power-efficient package.

SanDisk Corporation, the global leader in flash memory cards, today announced the first product in a new category of embedded solid state drives (SSD) that are smaller than a postage stamp and offer higher capacities and performance than existing storage solutions. The SanDisk integrated SSD (iSSD), the first high-capacity product within this new category, is designed for use in fast-growing mobile computing platforms such as tablet PCs and ultra-thin notebooks.

Computing platforms are responding to consumer demand for highly portable, ultra-thin, anywhere-anytime access to the Internet and their favorite content. The SanDisk iSSD drive is the first flash SSD device to support the industry standard SATA interface in a small BGA (Ball Grid Array) package that can be soldered onto any motherboard, and that is fast enough for use with advanced operating systems in next-generation mobile computing platforms.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it latest Mini-ITX board, the VIA EPIA-M840, designed for a range of embedded device designs including advanced industrial and factory management applications.

The VIA EPIA-M840 packs the latest 64-bit VIA Nano E-Series processor, dual Gigabit LAN, eight COM ports and support for two dual channel 24-bit LVDS displays, creating the ideal backbone for a range of embedded applications including intelligent industrial automation applications that integrate remote network access, network management and other advanced application management scenarios.

MSI, a well-known personal computer system and components designer and manufacturer, today released its new AMD Opteron 4000 Series processor-based server motherboards: MS-91F7 and MS-96D7.

MSI lines up with AMD's strategy and has developed 2P and 1P AMD Opteron 4000 Series platform (formerly code-named: "San Marino") server board in CEB and ATX form factors respectively, and plans to bring the server motherboards to market soon. MSI's 2P volume AMD Opteron-based server board, MS-91F7, can be configured with 3 options: desired PCIe lanes between SR5650 and SR5670, MUX selector of one x16 PCIe Gen2 slot or two x8 PCIe Gen2 slots, and dual layout of Aspeed BMC controller of AST1100 or AST2050.

Toshiba America Electronic Components, Inc.(TAEC) and its parent company Toshiba Corporation today announced the launch of a 128-gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest e-MMC standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Samples will be available in September, and mass production will start in the fourth quarter (October to December) of 2010.

The new 128GB embedded device integrates sixteen 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology and a dedicated controller into a small package 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EITX-3001, its latest Em-ITX form factor board and the ideal solution for a range of durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications.

Combining the latest VIA Nano E-Series processor and the VIA VX855 media system processor, the VIA EITX-3001 offers a full featured I/O specification on a specially developed slim-line board. Fanless devices based on the VIA EITX-3001 can enjoy absolute stability within a wide temperature range in a low profile system of less than 35mm high.

ASUS displayed its latest creation, the Eee Pad. This 12 inch tablet has sports uncanny resemblance to the Apple iPad, except that it's x86 powered, and uses Windows 7, with ASUS' own visually-appealing UI. It can run any Windows application that its hardware allows, which includes Intel Core 2 Duo CULV, and Intel graphics. The UI takes advantage of the multi-touch screen and related abilities of the Windows 7 Home Premium OS it comes bundled with. Other known details include a web-camera, and a battery that is rated to last 10 hours on a full charge. ASUS will also introduce a slightly smaller 10 inch tablet which uses Windows 7 Embedded Compact, a new variant of the OS designed for devices such as these. The two will be out in Q1 2011.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA EPIA-M830 Mini-ITX board. Designed specifically to meet the needs of next generation kiosk, POI and POS applications, the VIA EPIA-M830 places the latest 64-bit, high performance VIA Nano E-Series processor in a streamlined, application specific Mini-ITX form factor board.

Kiosk and POS systems will soon support an incredible array of increasingly complex human-machine interactions that reach beyond traditional ticketing or retail scenarios. The VIA EPIA-M830 is designed to take the kiosk to this next phase, providing the backbone of devices that offer cashless purchasing and self service infrastructures in supermarkets and gas stations as well as more secure and interactive, multimedia-rich POI, lotto and gaming machines.

At Embedded Systems Conference today, AMD announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.

"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."

Numonyx B.V. introduced a set of innovative products today based on the new class of memory technology called phase change memory (PCM). The new devices deliver higher performance, endurance and simplicity for wired and wireless communications, consumer electronics, PCs, and other embedded applications.

The new embedded memory products blend many attributes associated with flash memory, as well as RAM and EEPROM, while delivering new capabilities in a single device. Introduced as the newly branded Numonyx Omneo PCM, today's new products promise up to 300 times faster write speeds and ten times more write endurance than today's flash memory.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Nano E-Series processor, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets.

The move to 64-bit software architecture is an essential transition for the future of the embedded industry. Forthcoming operating systems such as Windows Embedded Standard 7 will be able to leverage a 64-bit software eco system that provides up to double the amount of data a CPU can process per clock cycle. This translates in to greater ease in manipulating large data sets and an overall performance boost compared to non-native 64-bit architectures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its latest DIY PC kit, the VIA ARTiGO A1100, a sub-liter DIY PC kit for enthusiasts who want to taste the most extreme, ultra-compact desktop computing experience.

The VIA ARTiGO A1100 takes inspiration from Pico-ITX, cramming a range of features that include a 64-bit processor, HD video support, HDMI and VGA display connectivity, Gigabit networking, Wi-Fi Support and five USB ports, all into a PC chassis that fits snuggly into the palm of your hand.

Combining unprecedented security, performance and energy efficiency, Intel Corporation today launched the Intel Xeon Processor 5600 series. The new processors deliver two new security features -- Intel Advanced Encryption Standard New Instructions (Intel AES-NI), and Intel Trusted Execution Technology (Intel TXT) -- that enable faster encryption and decryption performance for more secure transactions and virtualized environments, providing data centers with a stronger foundation for cloud security.

These are also the first server and workstation chips based on the groundbreaking, new Intel 32nm logic technology, which uses Intel's second-generation high-k metal gate transistors to increase speed and decrease energy consumption. The Intel Xeon Processor 5600 series supports up to six cores per processor and delivers up to 60 percent greater performance than the 45nm Intel Xeon processor 5500 series. In addition, data centers can replace 15 single-core servers with a single new one, and achieve a return on their investment in as little as 5 months.

Intel releases its first storage-optimized Intel Atom processor-based platform for the growing home and small office/home office storage markets. New single- and dual-core chip options provide performance scalability and flexibility and run on Microsoft Windows Home Server and Linux operating systems. Leading storage vendors LaCie, LG Electronics, QNAP, Synology and Thecus plan products based on the new Intel Atom processor-based platform. Intel Atom processors also introduced for embedded applications are ideal for multiple market segments including print imaging, digital security surveillance and industrial.

The energy-efficient platform consists of the Intel Atom processor D410 single-core or D510 dual-core and the Intel 82801IR I/O Controller, and delivers the processing performance and input/output (I/O) connectivity required to meet the throughput demands of leading storage vendors such as LaCie, LG Electronics, QNAP, Synology and Thecus.

Home server and SOHO network-attached storage (NAS) devices based on the new Intel Atom processor- based platform act as centralized hubs that organize, manage, protect and share documents, photos, videos and music throughout the home and small office. This makes it possible to keep digital content safe and available anytime, anywhere.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA ART-3000, a complete, fanless and ruggedized embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications.

Available as a complete system including drives and memory, the fanless VIA ART-3000 combines a number of unique features including diskless booting, excellent vibration and shock resistance, dual Gigabit networking and dual LVDS video support. Ruthlessly low power consumption means the VIA ART-3000 can also support fanless configurations with no moving parts making it ideal for ultra stable, mission critical implementations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at Digital Signage Expo 2010, Feb. 24 - 25, Las Vegas. Join VIA at the Las Vegas Convention Center, Hall C1-2, Booth 1240 and experience the latest technologies for next-generation signage systems, including a demonstration of the forthcoming S3 Graphics Chrome 5400E x2; a dual GPU add-in-board aimed at advanced, multi-display digital signage applications.

The S3 Graphics 5400E x2 is a highly integrated and flexible video card that features dual graphics and multimedia processors. Boasting extreme hardware acceleration of the latest HD video codecs, the S3 Graphics 5400E x2 uses S3 Graphics' PanoChrome technology to provide up to four independent HD video streams at resolutions of 1080p on up to eight displays, employing a variety of display modes and configurations.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.

Designed to deliver a simple modular approach to device design that precipitates greater miniaturization and portability, the Mobile-ITX-based VIA EPIA-T700 makes it easier than ever before to design and manufacture compact devices. With customized carrier boards connected using ultra low profile 3mm connectors, the VIA EPIA-T700 is in a class of its own.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA M'SERV S2100: a compact and versatile server system suitable for a range of applications for SOHO and SMB customers. Available to OEM customers, the VIA M'SERV S2100 is a mere 10.2" long by 4.7" high and provides up to four terabytes of storage in a stylish, compact, low power and low noise system.

The VIA M'SERV S2100 is the first product of its kind to offer the unique advantages of the high-performance, 64-bit VIA Nano processor. This makes the VIA M'SERV S2100 capable of addressing many traditional and next-generation server applications including sophisticated backup, cloud-intermediary service roles along with other storage oriented server applications such as NVR (Network Video Recorder) systems and Log servers.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P820, the first Pico-ITX form factor board to feature the high performance, 64-bit VIA Nano processor, bringing industry-leading digital multimedia performance and virtualization capabilities to the smallest of spaces with the VIA AMOS-3001 chassis system.

The choice of VIA Nano processor means that the VIA EPIA-P820 offers a range of advantages over competitor offerings, including full 64-bit software support, a high-performance superscalar architecture and full support of the latest virtualization technologies for next generation server and virtual machine applications. Paired with the VIA VX855 media system processor, the VIA EPIA-P820 is well equipped to handle smooth playback of the most demanding codecs at resolutions up to 1080p.

Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.

The new 64GB embedded device combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers. Toshiba offers a comprehensive line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.

Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

AMD announced immediate availability of a new enterprise-class embedded platform based on the Quad-Core AMD Opteron processor and new AMD SR5690/SP5100 server chipset. Seven AMD Opteron processors in three power bands, in conjunction with the new low-power chipset, allow high-end embedded vendors to enable increased performance-per-watt for edge-of-network systems such as telecom/datacom, storage, and security servers, and routers and switches.

This comprehensive platform offers:

• increased performance enabled for virtualized and multithreaded embedded applications;
• enhanced NEBS-friendly thermal specification;
• single source for design and tight technology integration support among CPUs, chipsets and GPUs;
• compatibility between processor generations and 5 year component longevity to support long-life designs;
• a high-performance, low power chipset with PCIe 2.0, HyperTransport 3 technology and advanced AMD Virtualization (AMD-V) technology and AMD-P power management features.

Intel Corporation today disclosed new information about next-generation Intel Xeon processors - codenamed "Jasper Forest" - for communications and storage applications, due in early 2010. With Jasper Forest, Intel engineers have, for the first time, integrated PCI Express (PCIe) in a dual-processing Xeon processor, which greatly facilitates dense storage and communications solutions such as IPTV, VoIP, NAS, SAN and wireless radio network controllers.

Jasper Forest maintains the outstanding performance of Intel architecture (Nehalem), while lowering system power consumption by 27 watts when compared to the Intel Xeon 5500 series processors. The dual-processing solution integrates two Jasper Forest processors with 16 PCIe Generation 2.0 lanes each and is paired with the Intel 3420 chipset platform controller hub. This integration of the I/O hub via PCIe enables significant power and space savings, resulting in one of the highest performance-per-watt Intel Xeon chips ever.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today announced the VIA EPIA-P720 Pico-ITX board, which takes advantage of the latest VIA VX855 media system processor to deliver stunningly smooth playback of the latest HD video formats for next-generation digital interactive devices.

"VIA continually strives to offer customers compelling product designs that open up new worlds of possibility," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.　"The VIA EPIA-P720 enables a new class of extremely compact embedded devices that can comfortably handle the most demanding video playback whilst remaining entirely fanless. No other compact platform currently offers these features in tandem."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest additions to the VIA AMOS series of universal chassis products; the VIA AMOS-1000 and VIA AMOS-2000 chassis are specially designed to work with VIA EPIA Mini-ITX and Nano-ITX boards and feature unique multi-story stackability.

VIA developed the VIA AMOS-1000 and VIA AMOS-2000 chassis to make complete system design as straightforward and expedient as possible. The guiding principle behind the VIA AMOS-1000 and VIA AMOS-2000 is the ability to add additional layers to the chassis, facilitating simple system expansion for optical drives, system storage and PCI or PCI Express AIBs.