Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

SAPPHIRE Technology, in cooperation with Thinlabs, presents a unique computing solution that utilizes 802.3bt PoE++ (Power-over-Ethernet) technology - the Thinlabs PoE NUC. It allows for up to four ThinLabs HD displays to be fully powered over a single Ethernet cable. Utilizing this technology brings many advantages like eliminating the need for electrical outlets or simplifying power backups. At the heart of the Thinlabs PoE NUC lies a motherboard developed by SAPPHIRE, featuring the AMD Ryzen Embedded V2000 series processor. This AMD Ryzen processor, with efficient "Zen 2" x86 CPU and Radeon Graphics cores offers versatility, low power and high performance. The AMD Ryzen flagship model, V2718, features an 8-core / 16-thread CPU with 7 integrated Radeon Graphics Compute Units.

Advantages of Power-over-Ethernet
The Thinlabs NUC solutions is equipped with the advanced 802.3bt PoE++ (PoE++ Type 4) technology. This innovation enables seamless supply of up to 90 W of power through a standard Cat 6 Ethernet cable. This simplifies deployment significantly, eliminating the need for a certified electrician to install an electrical outlet wherever the PC and monitors are required. Instead, a single Ethernet cable up to 100 m in length can be used to provide data and power to the complete system. Such an approach also greatly reduces installation cost and cable clutter.

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

AMD (NASDAQ:AMD) today announced revenue for the first quarter of 2023 of $5.4 billion, gross margin of 44%, operating loss of $145 million, net loss of $139 million and diluted loss per share of $0.09. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $970 million and diluted earnings per share was $0.60.

"We executed very well in the first quarter as we delivered better than expected revenue and earnings in a mixed demand environment," said AMD Chair and CEO Dr. Lisa Su. "We launched multiple leadership products and made significant progress accelerating our AI roadmap and customer engagements in the quarter. Longer-term, we see significant growth opportunities as we successfully deliver our roadmaps, execute our strategic data center and embedded priorities and accelerate adoption of our AI portfolio."

AMD today announced the availability of its high-performance AMD Ryzen Embedded 5000 Series, a new solution for customers requiring power-efficient processors optimized for "always on" networking firewalls, network-attached storage systems and other security applications. The Ryzen Embedded 5000 Series rounds out the "Zen 3"-based AMD embedded processor portfolio which also includes the Ryzen Embedded V3000 and EPYC Embedded 7000 series families.

Built on 7 nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe Gen 4 connectivity, Ryzen Embedded 5000 Series processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. Ryzen Embedded 5000 Series processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65 W to 105 W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.

Rugged embedded computer brand—Cincoze, recently launched its latest addition to the Display Computing - CRYSTAL product line, the P1201 embedded computer series. The P1201 packs the improved computing performance of the Intel Elkhart Lake platform into a thin and light body (204.5 x 149 x 41.5 mm) with flexible expansion options. The highlight is the dual-purpose design sets the P1201 apart from other embedded computers. As standard, its ultra-thin design makes it well-suited for data collection and analysis in space-limited applications in machine equipment and control cabinets. Attach one of a range of display modules to the P1201 using Cincoze's exclusive CDS (Convertible Display System, Patent No. M482908) technology, and it becomes a panel PC suitable for HMI applications.

The P1201 uses the Elkhart Lake platform Intel Atom x6425E quad-core processor, delivering 1.7x the single-core performance and 1.5x the multi-core performance of the previous generation Apollo Lake processors. It also supports DDR4 memory up to 32 GB and 3200 MHz. The Intel UHD graphics chip ensures smooth graphics by doubling the processing performance of previous generations. Greatly improved computing performance shortens processing times, thereby increasing work efficiency.

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is showcasing its latest lineup of Intel 12th / Elkhart Lake motherboards and Barebone systems at the Embedded World 2023 exhibition, currently underway from March 14th to 16th in Nuremberg, Germany. As the largest international trade fair for embedded systems, the exhibition attracts professionals and enthusiasts from various industries worldwide. BIOSTAR's product lineup includes six industrial motherboards - BIH11-AHB, EIB7B-AXI, BIH61-IHP, BIH60-IHP, BICMA-IHP, and BIELK-IHT - equipped with advanced features such as high-performance processing, support for multiple displays, and various connectivity options. These motherboards are ideal for applications in digital signage, medical, transportation, and other industries.

In addition to the motherboards, BIOSTAR is also showcasing six barebone systems, including the MP-J4125, MP-J6412, MT-J6412, MT-J6412 PRO, MS-J6412, and MS-N3160. These systems offer powerful performance, efficient energy consumption, and compact design, making them suitable for home entertainment, office productivity, AI, edge computing, and many more versatile applications.

AMD today announced it is bringing world-class performance and energy efficiency to embedded systems with AMD EPYC Embedded 9004 Series processors. The new 4th generation EPYC Embedded processors powered by "Zen 4" architecture provide technology and features for embedded networking, security/firewall and storage systems in cloud and enterprise computing as well as industrial edge servers for the factory floor.

Built on the "Zen 4" 5 nm core, the processors combine speed and performance while helping reduce both overall system energy costs and TCO. The series is comprised of 10 processor models with performance options ranging from 16 to 96 cores, and a thermal design power (TDP) profile ranging from 200 W to 400 W. The performance and power scalability afforded with AMD EPYC Embedded 9004 Series processors make them an ideal fit for embedded system OEMs expanding their product portfolios across a range of performance and pricing options. The AMD EPYC Embedded 9004 Series processors also include enhanced security features to help minimize threats and maintain a secure compute environment from power-on to run time, making them well suited for applications with enterprise-class performance and security needs.

DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by the revolutionary AMD Ryzen Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor. Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

"By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su. "We have a positive outlook for future Industrial Pi innovations." Compared to its previous generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the PCSF51 delivers upgraded performance with double the max CPU core count, scalability up to four CPU cores and eight threads, and a 50% increase in CPU power. Graphics performance is boosted by 15% with up to eight graphic compute units. The design of the PCSF51 has also been enhanced from the previous GHF51, with an easier-to-use on board power/reset and HDMI, in addition to a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.

ASUS IoT, the global AIoT solution provider, today announced that it is delighted to be attending the Embedded World 2023 from March 14-16 in Nuremburg, Germany. On show will be the comprehensive ASUS IoT lineup of edge AI computers, industrial motherboards, COM Express (COMe) modules, Tinker-series single-board computers (SBCs), Mini PCs, market-ready solutions and AI solutions. This impressive portfolio of embedded and IoT offerings delivers ASUS IoT's leading hardware and software computing capabilities and services across diverse vertical markets.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

DFI, the global leader in embedded motherboards and industrial computers, has stepped into the electric vehicle (EV) market in recent years. Alongside VicOne, the automotive cybersecurity expert and the subsidiary of Trend Micro, they will demonstrate technologies related to vehicle software security application that enable more comprehensive network security protection for smart cities.

This year, to demonstrate the AI computing and vehicle-to-everything technology used in Connected Vehicles and Smart Poles, DFI has built an actual smart traffic intersection at the venue with road side units (RSU), digital signage, intelligent edge computers, onboard units (OBU), in-vehicle AI computers, and driver HMIs.

Axelera AI, the provider of world's most powerful and advanced solutions for AI at the Edge today announces a strategic partnership with Advantech. Combining Advantech's expertise in the embedded and industrial PCs and Axelera AI's disruptive edge AI technology, together they will bring the inference power of a data center to edge devices, enabling customers to process data in real-time, reducing latency while increasing efficiency.

At Embedded World Axelera AI will show its new products, available in a range of industry-standard form factors varying from M.2 modules to vision ready systems. The products combine powerful processing performance with Metis AIPU technology and the easy-to-use Voyager SDK software stack, just at a fraction of the cost and power consumption of today's available solutions.

The BeagleBoard.org Foundation today announces the global availability of BeaglePlay, the most adaptable open-source performance platform available. Built on our proven open source Linux approach, BeaglePlay has a feature set that includes built-in wired and wireless connectivity and ability to connect to a wide selection of sensor and prototyping systems with thousands of options, as well as interfaces and processing performance to support them.

Leveraging the Texas Instruments AM625 processor with quad 64-bit Arm Cortex -A53 cores, low-latency microcontroller subsystems, a dedicated Texas Instruments SimpleLink CC1352P7 sub-1 GHz and 2.4-GHz wireless MCU, and a Texas Instruments WiLink WL1807MOD Wi-Fi module, new and experienced users can use a wide variety of application libraries and examples from Linux, Zephyr, MicroPython and numerous other open source frameworks to add an endless array of sensors, actuators, indicators and new connectivity options.

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC branded mini PC product family called Chapel Rock. The ultracompact long life mini PC is built for several use cases, from embedded units like kiosks and vending machines, to edge devices like security systems and sensor arrays. Chapel Rock brings the same reliability and customizability as its predecessor, Chimney Rock, with upgrades like dual 2.5Gb Ethernet and the all-new 12th Gen Intel Architecture. Simply NUC is currently taking orders on Chapel Rock with units expected to ship by the end of March.

"Since launching our long life NUC product line, our customers have successfully leveraged these mini PCs for an array of applications where longer development cycles are required for validation and certifications," said Aaron Rowsell, Simply NUC CEO, "and we're thrilled to extend our long life NUC offering with Chapel Rock."

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

Many countries are facing serious energy shortages, and to counter this problem, many are already actively utilizing renewable energy, but they also urgently need the layout of the internet of energy (IoE) to harness this new power. IoE connects equipment, machines, and systems used in energy production, transmission, and consumption through sensors, controls, and software. IoE delivers power where and when it's needed through smart power storage and distribution, and enables forecasting through big data analysis and machine learning. The DV-1000 high-performance and essential rugged embedded computer in the Cincoze Rugged Computing - DIAMOND product line offers high-performance computing in a compact chassis with flexible expansion and industrial wide temperature support, making it the best choice for IoE applications.

Maximum efficiency for renewable energy requires a network for collecting, storing, and distributing energy power. The DV-1000 is compact, about the size of A5 paper (224 x 162 x 64 mm), making it easy to install in any small outdoor electrical cabinet. The DV-1000 supports a 9th/8th generation Intel Core i7/i5/i3 (Coffee Lake-R S series) processor and up to 32 GB of DDR4 2666 MHz memory, providing the high-efficiency computing power for the real-time processing and analysis of large amounts of data, and meeting the high computing requirements required for IoE.

Flex Logix Technologies, Inc., supplier of high performance and efficient edge AI inference accelerators and the leading supplier of eFPGA IP, today announced the InferX Hawk - a hardware and software-ready Mini-ITX x86 system designed to help customers quickly and easily customize, build and deploy edge and embedded AI systems. The InferX Hawk system includes the Flex Logix InferX X1 AI accelerator chip, AMD Ryzen Embedded R2314 SoC, InferX Runtime software, and the EasyVision platform running Linux or Windows to deliver an integrated low power, high-performance AI system.

The AMD Ryzen Embedded R2314 delivers performance per watt efficiency using "Zen+" core architecture and Radeon Graphics. With the Hawk Mini-ITX solution, customers can save over six months of hardware and software development time, additional system costs and power over NVIDIA and other solutions.

Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), introduces the D3723-R Mini-ITX industrial motherboard at embedded world 2022, based on the AMD Ryzen Embedded R2000 line, which was developed in Germany and will also be produced there in the future. Compared to V/R1000 APUs (Accelerated Processing Units) from AMD, it delivers higher performance. Besides the lower price, the new model also convinces with Windows 11 support and a long life cycle of seven years. Like all Kontron motherboards with the denomination D3xxx or K3xxx, the D3723-R is produced in Germany.

Thanks to AMD Radeon Vega Graphics, the solution is particularly suitable for embedded graphics applications such as professional casino gaming systems, medical displays, thin clients and industrial PCs as well as for kiosk, infotainment or digital signage systems. Compared to the previous model based on the R1000 and V1000 series, the R2000 shows similar features to the V1000 SKUs. These include 16 PCIe lanes, up to four display ports and scalability of the available APU SKUs (R2312, R2314, R2514 and R2544) from 12 to 54 W (TDP - Thermal Design Power). Windows 11 support and an attractive price/performance ratio clearly speak for the R2000.

KIOXIA America, Inc. today announced sampling of the industry's first XFM DEVICE Ver. 1.0-compliant removable PCIe standard attached, NVMe storage device: the XFMEXPRESS XT2. With a new form factor and connector, the XFM DEVICE Ver. 1.0 standard delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and a variety of embedded applications.

First introduced in August of 2019, and then presented as a proposal to the JEDEC Subcommittee for Electrical Specifications and Command Protocols, KIOXIA XFMEXPRESS XT2 is a new form factor for PCIe/NVMe specification devices. Featuring a powerful combination of small size, speed and serviceability, XFMEXPRESS technology was developed to enhance next-generation mobile and embedded applications. The XFMEXPRESS XT2 from KIOXIA is the first product to meet the specification of the new JEDEC standard.