GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today announced the new Z590 AORUS motherboards which support the 11th Gen Intel Core processors. The new motherboards feature up to 20-phase digital power VRM design and an improved Fins-Array II heatsink design. GIGABYTE's Z590 AORUS lineup is geared with the best power design and thermal management to optimize overclocking performance on the upcoming 11th Gen Intel Core processors. GIGABYTE Z590 AORUS motherboards adopt up to 10 layers PCB, on the high-end models, for better heat dissipation. Moreover, the use of Daisy Chain memory routing with an anti-interference design improves the memory overclocking, stability, and overall memory performance. Selected GIGABYTE Z590 AORUS motherboards offer feature-rich I/O with an integrated I/O shield as well as the newest Thermal Guard II design, Smart Fan 6 and much more. Performance, power management, thermals, audio, GIGABYTE Z590 AORUS motherboards check all the boxes for users seeking to take their computing firepower to the next level.
With PCIe 4.0 support, users can enjoy the high bandwidth, the ultra-high transfer speed, and improved CPU performance on Intel platform. GIGABYTE Z590 AORUS motherboards use PCIe 4.0 grade PCBs, PCIe slots, M.2 slots, and controllers for the highest bandwidth quality, which enabling speeds up to 7000 MB/s. Z590 AORUS motherboards equip up to three PCIe 4.0 M.2 slots with direct connection to the CPU for the highest bandwidth possible. RAID configurations are possible and they could provide access rate of more than 20000 MB/s. GIGABYTE's patent, Thermal Guard II, is a double sided heat dissipation solution that provides optimal cooling to the PCIe 4.0 M.2 SSD modules to prevent thermal throttling under high-speed operation.