AMD is preparing to time the launch of its next-generation Radeon R9 300 series with that of Computex 2015, in early June. The company had earlier planned to launch some products that are essentially price-adjusted rebrands of existing ones, such as the R9 380 series (being rebrands of R9 290 series on a slightly improved silicon), and the R9 370 series (being based on the "Tonga" silicon); but has decided to launch the two along with its flagship R9 390 series, based on a brand new silicon, around the same time. AMD's answer to the GTX TITAN-X from NVIDIA, the R9 390X will feature around 4,096 stream processors based on the Graphics CoreNext 1.3 architecture, and will implement an HBM (high-bandwidth memory) interface, with bandwidths in excess of 600 GB/s.

AMD's upcoming Radeon R9 380X and R9 380 graphics cards, with which it wants to immediately address the GTX 980 and GTX 970, will be based on a "new" silicon codenamed "Grenada." Built on the 28 nm silicon fab process, Grenada will be a refined variant of "Hawaii," much in the same way as "Curacao" was of "Pitcairn," in the previous generation.

The Grenada silicon will have the same specs as Hawaii - 2,816 GCN stream processors, 176 TMUs, 64 ROPs, and a 512-bit wide GDDR5 memory interface, holding 4 GB memory. Refinements in the silicon over Hawaii could allow AMD to increase clock speeds, to outperform the GTX 980 and GTX 970. We don't expect the chip to be any more energy efficient at its final clocks, than Hawaii. AMD's design focus appears to be performance. AMD could save itself the embarrassment of a loud reference design cooler, by throwing the chip up for quiet custom-design cooling solutions from AIB (add-in board) partners from day-one.

In its an investor conference-call following its Q4-2014 and FY-2014 results, AMD stated that it will release new GPU and APU products starting Q2-2015, or only after March. "Going into the second quarter and the second half of the year with our new product launches, I think we feel very good about where we are positioned there," said Lisa Su, chief executive officer.

Q2-2015 will start off with the company's "Carrizo" line of all-in-one and notebook APUs. These chips will integrate the company's new "Excavator" CPU cores, with an integrated graphics core based on Graphics CoreNext 1.2 architecture (the same one AMD built its "Tonga" GPU on). Around the same time, AMD will launch new Opteron "Seattle" enterprise CPUs, which integrate up to eight ARM Cortex A-57 64-bit cores, targeting the ultra-dense server market. In Q2-2015, AMD will launch its latest Radeon Rx 300 series graphics processors. Its performance-segment part, the R9 380, will feature 4,096 GCN 1.2 cores, double that of its predecessor, and 4 GB of stacked HBM (high-bandwidth memory). Its mid-range chip, codenamed "Trinidad" will succeed "Curacao," and offer performance competitive to the $200-ish price-point.

AMD's next flagship single-GPU graphics card, codenamed "Fiji," could feature High-Bandwidth Memory (HBM). The technology allows for increased memory bandwidth using stacked DRAM, while reducing the pin-count of the GPU, needed to achieve that bandwidth, possibly reducing die-size and TDP. Despite this, "Fiji" could feature TDP hovering the 300W mark, because AMD will cram in all the pixel-crunching muscle it can, at the expense of efficiency from other components, such as memory. AMD is expected to launch new GPUs in 2015, despite slow progress from foundry partner TSMC to introduce newer silicon fabs; as the company's lineup is fast losing competitiveness to NVIDIA's GeForce "Maxwell" family.

AMD is reportedly working on a new single-GPU graphics card SKU to compete with the likes of GeForce GTX 780 Ti, and perhaps even take a swing at the GTX TITAN Black, since it's not too far ahead of the GTX 780 Ti at single-display gaming. The new SKU will be more than just a clock-speed bump, it will leverage HBM (high-bandwidth memory), a cutting-edge new technology that relies on stacking multiple DRAM dies with dedicated memory paths into a single package, cutting down on power-draw, thermals, and PCB real-estate.

The first kind of HBMs to hit the market are 8 Gbit 4Hi, which will interface with the GPU over a 128-bit wide path, which means there will be just four memory packages on the card (since the "Hawaii" silicon features a 512-bit wide memory bus), with improvements in the area of power-draw and heat output. The memory could be clocked higher, too. Sadly, memory bandwidth is not the prime-mover in VGA performance, and AMD will have to offer higher GPU clocks for the card to stand a chance against NVIDIA's high-end single-GPU offerings. As for the name this card would bear, we get a sense of deja vu about how NVIDIA launched the single-GPU GeForce 7950 GTX alongside the dual-GPU 7950 GX2, replacing the 7900 GTX. And so, it wouldn't surprise us if AMD named it Radeon R9 295X.