Intel's strategy against AMD's unexpected doubling in core-counts of its Ryzen Threadripper HEDT processors has been that of a headless chicken in a room painted Vantablack. It announced a 28-core processor that would require you to buy a new motherboard; and is frantically working on a 22-core processor for the existing LGA2066 platform. It's looking like AMD isn't in a mood to walk into Intel's core-count trap, and could hit Intel where it hurts the most - pricing. The top-dog 32-core part has already reared its head on German web-stores, seeking a little over 1,500€, just 500€ more than the price its previous-generation 16-core flagship, the Threadripper 1950X launched at. At 1,500€-ish, AMD could end up disrupting Intel's entire >10-core lineup that's priced between $1199 to $1999, currently occupied by 12-core, 14-core, 16-core, and 18-core SKUs.

AMD may not spare Intel's sub-$1000 Core X lineup, either. Prices of first-generation Ryzen Threadripper processors are seeing a dramatic drop, with the flagship Threadripper 1950X being priced under 650€. Prices of the 12-core Threadripper 1920X have slipped to just under 550€. The Core i9-7900X, meanwhile, continues to command a touch over 880€. The drop in prices of first-gen Threadrippers is likely retailers trying to clear out inventories to make room for 2nd generation Threadrippers. It could also be a prelude to AMD announcing more affordable 12-core and 16-core Threadrippers based on the 2nd generation "Zen+" architecture.

It's becoming clear that AMD is naming its 32-core flagship HEDT processor Ryzen Threadripper 2990X. The chip was even listed on a German online retailer for a little over 1,500€, which if it turns out to be true, could spell doom and gloom for Intel's Core X HEDT processor lineup, as it could demolish the price-performance equations of every Intel SKU priced 1,000€ and above.

Thai PC enthusiast Tum Apisak scored a screenshot of this chip lurking around on 3DMark database. The screenshot hints at the possible clock speeds of the 2990X, with a rather healthy nominal clocks of 3.00 GHz, with boost frequencies of 3.80 GHz. XFR 2.0 could automatically overclock the chip even beyond the boost frequency, if your cooling is up to the task. The screenshot also reveals that this database submission was made by someone testing the processor, as a prototype motherboard codenamed "Whitehaven OPS rev B CF4" is listed. AMD is expected to launch its 2nd generation Ryzen Threadripper HEDT processors, based on the 12 nm "Zen+" architecture, some time in Q3-2018.

First benchmarks and CPU-Z screenshots of AMD's upcoming Ryzen Threadripper 32-core monster have surfaced, courtesy of HKEPC. The on-time-for-launch (as AMD puts it) 12 nm "Pinnacle Ridge" processor has apparently been christened "Threadripper 2990X", which does make sense - should AMD be thinking of keeping the 2920X moniker for 12 cores and 1950X for 16-cores, then it follows a 20-core 2960X, a 24-core 2970X, a 28-core 2980X, and the aforementioned 32-core 2990X. whether AMD would want to offer such a tiered lineup of HEDT processors, however, is another matter entirely, and certainly open for discussion - too much of a good thing can actually happen, at least where ASP of the Threadripper portfolio is concerned.

On the CPU-Z screenshot, the 2990X is running at 3.4 GHz base with up to 4.0 GHz XFR, and carries a 250 W TDP - a believable and very impressive achievement, testament to the 12 nm process and the low leakage it apparently produces. The chip was then overclocked up to 4.2 GHz on all cores, which caused for some thermal throttling, since performance was lower than when the chip was clocked at just 4 GHz on all cores. Gains on this particular piece of silicon were reserved up to 4.12 GHz - the jump to 4.2 GHz must have required another bump in voltage that led to the aforementioned throttling. At 4.12 GHz, the chip scored 6,399 points in Cinebench - a remarkable achievement.

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. With frantic increases in core counts, the practicality of these chips to even the most hardcore enthusiast or productivity professional diminishes. The Computex 2018 demos reek of a pissing-contest between the x86 processor giants, with AMD having an upper hand.

The HEDT segment is intended to occupy the space between client desktops and serious scalar workstations. Intel is frantically putting together a new HEDT platform positioned above its current LGA2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA3647 socket (this chip + your X299 motherboard is no bueno). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. The company put up a live demo at the teaser of this unnamed processor, where it was running at 5.00 GHz, which led many to believe that the processor runs at that speed out of the box, at least at its maximum Turbo Boost state, if not nominal clock. Intel admitted to "Tom's Hardware," that it "forgot" to mention to the crowds that the chip was overclocked.

This Tuesday at its Computex presser, Intel unveiled an unnamed 28-core/56-thread HEDT (client-segment) processor that's capable of being bench-stable at 5.00 GHz. The chip is a client-segment implementation of the Skylake XCC (extreme core count) silicon, which features 30 Mesh Interconnect "tiles," of which 28 are cores and two integrated memory controllers. The XCC silicon features a 384-bit wide (6-channel) DDR4 memory interface, and it turns out that whatever SKU Intel is planning, will require a different motherboard from your X299 board that can handle up to 18 cores and 4-channel memory. It will require a client-segment variant of the LGA3647 enterprise socket from the Purley platform. One of the first of these is the ASUS Republic of Gamers (ROG) Dominus.

Clearly bigger than ATX, in being either E-ATX or SSI form-factor, this board draws power from two 24-pin ATX, two 8-pin EPS, and three 6-pin PCIe, and has a gargantuan 16-phase VRM with two fan-heatsink blocks. Six DDR4 DIMM slots flank the socket, three on either side, each with its dedicated 64-bit wide path to the socket. The XCC silicon features a 48-lane PCI-Express gen 3.0 root complex, and so the board could feature at least two PCI-Express 3.0 x16 capable of full bandwidth, among a boat load of PCIe based storage connectivity, and onboard devices.Update: This motherboard may have been a quick modification of the WS C621E SAGE, by removing one of its sockets, and modifying the rest of the board accordingly. Prototyping a board like that, for a company with ASUS' resources, would barely take 2-3 weeks by our estimate.

It was only a matter of time before Intel maxed out the "Skylake-X" silicon on the client segment, by bringing its "Skylake XCC" (extreme core count) 700 mm² die on a client-segment package, and here we are. Without taking model names, Intel made it clear that it's launching a new client-segment 28-core/56-thread processor. The company didn't specify the processor's package, and we're doubtful if it's LGA2066 for the simple reason that the Skylake XCC die has 6-channel memory interface. Nevertheless, this processor is clocked at 2.70 GHz (nominal), and without revealing Turbo speeds, Intel managed to overclock it bench-stable to 5.00 GHz, at which it scored 7,334 nT Cinebench points. This product will launch in Q4-2018.

Intel updated the ARK information page for its stealthily launched 10 nm production chip, the Core i3-8121U "Cannon Lake," to confirm that the chip supports the new AVX-512 instruction-set. This is the first "mainstream" client-segment processor by the company to feature the extremely advanced instruction-set that, if implemented properly on the software side, can double performance/Watt compared to tasks that can take advantage of AVX2.

The instruction-set made its debut with the Xeon Phi "Knights Landing" HPC processor, and made its client-segment debut with the Core X "Skylake X" HEDT processors. It remains to be seen if the implementation of AVX-512 on "Cannon Lake" is complete, or if some instructions found on HPC processors such as the Xeon Phi are omitted due to irrelevance to the client platform.

EK is releasing new dedicated EK-Supremacy sTR4 water blocks that are specifically designed for HEDT AMD Ryzen Threadripper processors. The cold plate covers the entire IHS of the AMD Ryzen Threadripper processor and the fin structure is fine-tuned for multi-die CPU cooling.

EK-Supremacy sTR4
The release of AMD X399 chipset based HEDT processors opened new opportunities and challenges for cooling solutions. EK was first on market with a liquid cooling solution, but now it's time to go for the pole-position. The primary goal in designing the new EK-Supremacy sTR4 water block was to cover the entire IHS of HEDT AMD Ryzen Threadripper processors and to optimize the fin structure according to the CPU die layout. A dense micro-fin structure that counts 91 grooves is split in half in the center so that the CPU dies are cooled more directly. The water block features a patent-pending technology called TDC (Targeted Die Cooling), which is a unique approach to cooling of multi-die processors in order to maximize the cooling performance of every single die by addressing them directly.

AMD today started the formal invitation procedure for the company's Computex 2018 presence, which should result in an updated state of affairs for the company as it aims to deliver its 2018 roadmap. You'd be forgiven to think AMD had exhausted its product portfolio for the year with its 12 nm Ryzen 2000 series, but the 2018 release schedule for AMD still counts some notable products.

Chief among these (for enthusiasts, at least) is the company's second generation Threadripper lineup, which will update the company's premium, many-core HEDT products to the current 12 nm process. However, the impact of AMD's Pro products shouldn't be underestimated - as tamer (in consumers' eyes - as they are compared to the screaming wildcat that is a 16-core CPU, these products usually carry higher margins for AMD - the company just also has to count on proper volume being there, which, if AMD's Zen architecture strength is anything to go by, really should keep gaining momentum. Of course, the real question on anyone's minds now regards AMD's RTG, and more precisely, what graphics technology advancements - and especially products - can be expected from the company. The 500 series (well, 400 series on steroids) is old in the tooth by now, and Vega is what it is. Here's hoping the Computex conference will bring some light to these matters. The Press Release follows.

EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer is announcing a dedicated EK-Annihilator EX/EP water block that is specifically developed for LGA 3647 (Socket P) Intel processors. The entire CPU block was designed from the ground up to fit the requirements of the new socket and to integrate multiple connectivity options for server rack requirements. With that said, the new server-grade CPU block is 1U chassis type compatible for use server and workstation type motherboards.

EK-Annihilator EX/EP
With Intel releasing the future generation of Skylake-based Xeon and Skylake-E HEDT CPUs with a larger LGA 3647 socket, came the need for a water block with a larger cold plate contact surface. The goal in designing of the new EK-Annihilator EX/EP CPU water block was to cover the entire IHS of Intel HEDT processors. An additional task was to make the new CPU block server ready with multiple connectivity options. The EK-Annihilator EX/EP water block features a total of 6 ports, which allow for versatile connectivity options. Two top ports are standard G1/4" threaded, while the side ports are G3/8" threaded.

Continuing with its trend of leaking AMD slides, Spanish website Informatica Cero has now published some purported company slides leading up to AMD's 2020 strategy. New information concerns the appearance of a new, value-oriented mobile APU in the form of "Dali" - let's hope performance on that is slightly more predictable than the particular style of the artist whose name it follows. Dali therefore joins AMD's "Renoir" APU and "Vermeer" CPUs (both expected in the 7 nm process) for AMD's 2020 roadmap. This is an interesting product, which AMD is likely positioning for tablets and ultraportables.

Another interesting tidbit is AMD's outlook for their Threadripper line of HEDT CPUs. The company is looking towards its 7 nm rendition of these powerhouse chips, codenamed "Castle Peak", to bring them, in a literal way, to that figurative peak. AMD compares Threadripper to a Monster Truck of computing, and is apparently hoping to introduce Castle Peak as early as 2019. AMD then plans to further refine these "process inflection point" products in a new generation to come right after, in 2020 (much like the company has done now with Zen and Zen+).

Hot on the heels of this morning's big AMD Ryzen 2000-series slide dump, comes a new roadmap slide that gives a larger overview of how AMD is addressing various client processor market segments. It begins with the mention of a 2nd generation Ryzen Threadripper series launch within 2018. These chips presumably, are multi-chip modules of the company's new 12 nm "Pinnacle Ridge" silicon, and will be compatible with existing AMD X399 chipset motherboards through BIOS updates. The "Pinnacle Ridge" silicon supports higher clock-speeds, has several microarchitecture refinements, and a few new overclocker-centric features.

The better news is that company seems to be updating its HEDT processor lineup every year; and that the current Threadripper series isn't a one-off halo product like its Athlon64 FX "QuadFX" 2P platform. With "Pinnacle Ridge" based Threadripper 2000-series MCMs slated for 2018; 2019 will see the launch of the new "Castle Peak" HEDT processor. It's not known if this is an MCM. The spiritual successor to "Pinnacle Ridge" is "Matisse." This is Zen 2 based, and will have significant changes to the core design, presenting AMD with an opportunity to review the way it arranges cores. "Picasso" succeeds "Raven Ridge" as the company's Zen 2-based APUs. "Picasso," along with "Matisse" and "Castle Peak" could see AMD implement GlobalFoundries' new 7 nm silicon fabrication process, given its 2019 timeline. 2020 will see their refined avatars - an unnamed "Next-Gen HEDT" chip, "Vermeer," and "Renoir," respectively.

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

ASRock formally launched the XE (extreme edition) variants of its X299 Taichi and X299 Professional Gaming i9 motherboards, denoted by the "XE" suffix in their model names. The boards are identical to the models they're derived from, but come with heavier CPU VRM heatsinks, increased voltage limits across several power domains, and are targeted at enthusiasts with Core i9-7980XE and i9-7960X HEDT processors. On both boards, the CPU VRM heatsinks have been extended from the main heatsink to a secondary heatsink over the rear I/O area, connected by a heat pipe, while getting rid of the rear I/O shroud. The two could sell at a slight premium over the models they're based on.

Swiftech introduced a limited-edition variant of its Apogee SKF series CPU water blocks, the Apogee SKF-TR4, which is designed for AMD Ryzen Threadripper HEDT processors. The blocks come with an elongation for better coverage of the large Ryzen Threadripper integrated heatspreader (IHS). The copper blocks are longer than the original SKF Heirloom series blocks, and feature more micro-fins, translating into 30 percent more surface-area for heat-dissipation to the coolant. The blocks also feature a coolant fitting positioning such that the inlets and outlets are directly above the two active dies of the Threadripper multi-chip module (MCM). The factory-fitted retention module only supports AMD socket TR4/SP3r2 motherboards. The block is priced at USD $107.95.

Overclocker extraordinaire Der8auer has been able to put Intel's flagship, HCC HEDT 7980XE CPU, through its paces under extreme cooling, which resulted in a veritable show of force from the blue giant. Intel's $1,979, 18-core, 36-thread CPU has cemented itself as the flagship consumer CPU of choice, surpassing AMD's 1950X Threadripper in all fields. And yes, we do mean single-core and multi-core benchmarks, but also power consumption figures.

With 18 cores in need of adequate cooling, every piece of real-estate that may serve as an heatsink of sorts comes at a premium; that is why thermal paste for this Intel processor was applied not only to the CPU die itself, but also to the entire PCB around it. Der8auer says that doing this allows heat to be better dissipated form the CPU die, allowing for up to 400 MHz increased clock-speeds under load. Direct contact with the die was also tried, and achieved by cutting off the central pat of the IHS, while keeping the edges of it as a way of better load balancing the weight of the cooler (in this case, an LN2 cooler) over the CPU's PCB, in order to avoid different amounts of pressure on the CPU pins. However, the extreme overclocker ended up not recommending that venue, for it didn't offer consistent success in their extreme cooling efforts.

Aqua Computer rolled out the cuplex kryos NEXT TR4, a variant of their cuplex kryos NEXT flagship CPU water block with support for AMD socket TR4, designed for Ryzen Threadripper HEDT processors. Available in all the variants the cuplex kryos NEXT normally comes in, we have options with a copper, nickel-plated copper, and even silver cold plate variants with POM acetal, acrylic, and metal tops. The blocks feature a dense copper micro-fin lattice with 200 μm spacing between fins, standard G 1/4 threading. These new blocks come with factory-fitted socket TR4 retention modules, and include a tube of Thermal Grizzly Kryonaut thermal compound. Available now, the exposed-copper cold plate variant is priced at 59.90€, and the nickel-plated copper variant at 64.90€ with other variants priced as can be seen on the Aqua Computer web shop. Aqua Computer also mentioned that given the lack of sales of the X399 platform, they are not looking into making a new design to match the larger CPU IHS at this time.

PC enthusiast Der8auer, with access to a Ryzen Threadripper processor, took it completely apart for science. It won't be the first time that a Threadripper HEDT processor was de-lidded (its integrated heatspreader removed), revealing that it has four "Zeppelin" 8-core dies, making it practically identical to AMD's 32-core Epyc processors; however, it's the first time that someone completely removed the dies from the package.

Ryzen Threadripper processors are built by completely disabling two out of four "Zeppelin" dies on an Epyc multi-chip module (MCM). Two diagonally opposite dies are disabled. The disabled dies can't be reenabled, at least not on an X399 chipset motherboard, as the Threadripper HEDT platform lacks DRAM, PCIe, and possibly even power wiring for the disabled dies.

Intel's upcoming Core i7-8700K six-core mainstream desktop processor was put through Cinebench R15, where it was seen trading blows with much higher high-end desktop (HEDT) processors, thanks to its core-count and relatively high clock speeds. Unlike HEDT processors, the i7-8700K doesn't carry a bulky uncore, keeping its TDP low at 95W, enabling high clock speeds. This reflects in its single-threaded performance, where it was significantly faster than older chips, some of which are even HEDT, but since the "Coffee Lake" architecture is essentially a refresh of the "Kaby Lake" architecture, the chip could lose out on single-threaded performance to the Core i7-7700K on account of slightly lower clock speeds.

The multi-threaded test is where the action is. Bolstered by two more cores, four more threads, and 4 MB more L3 cache, the i7-8700K is proportionately faster than the quad-core chips it succeeds, and is even faster than older 6-core HEDT chips thanks to higher clock speeds, and a newer micro-architecture. The i7-8700K features 6 cores, 12 threads enabled by HyperThreading, Intel's newest Turbo Boost Max 3.0 technology introduced with its Core X family, and 12 MB of L3 cache. It launches on the 5th of October, at an expected price of around USD $380, if not more.A video presentation by YouTuber Karl - MrTechQc, who tested the chip, follows

Overclocking poster-boy Der8auer has seemingly gotten his hands on some early samples of Intel's Skylake-X high core count (HCC)HEDT CPUs. The upcoming 12 to 18-core enthusiast-class CPUs are being launched on the same X299 platform on socket LGA 2066 that Intel has already launched 4 (Kaby Lake-X), 6, 8 and 10-core parts already, and are supposed to bring Intel towards a level playing field - and then some - with competitor AMD's Threadripper CPUs, which boast of up to 16 cores.

From this delidding process with Der8auer's own delidding tool, Delid-Die-Mate-X, seems to result a die that is much larger - as expected - than Intel's 10-core i9-7900X. At the same time, it seems that Intel is still opting, again, for not soldering its enthusiast-targeted CPUs, which would result in better temperatures and, potentially, overclocking potential. The fact that Der8auer managed to delid the i9-7920X and didn't recommend against doing it likely means that there is minimal risk of damaging your CPU while subjecting it to this process. This is something the renowned overclocker did do when he recommended that users shouldn't delid their Ryzen or Threadripper CPUs looking for better temperatures, since the fact that these were soldered would likely result in both catastrophic damage and a much diminished chance of operating temperatures improvement through the application of special purpose thermal compounds. The Facebook post from Der8auer with the delidded 7920X likely serves as an appetizer for an upcoming delid video on YouTube, as has been the overclocker's MO.

G.Skill today announced quad-channel kits of its AMD Ryzen-friendly Flare X series, targeted at Ryzen Threadripper HEDT builds. The new 4-module kits come in speeds of DDR4-2133, DDR4-2400, and DDR4-3200; in module densities of 8 GB and 16 GB, making up 32 GB and 64 GB quad-channel kits, respectively; and in color-based variants of black and red. The top-dog DDR4-3200 variant runs at its advertised speeds with timings of 14-14-14-34, and a module voltage of 1.35V. The modules are backed by lifetime warranties; and are typically priced double those of G.Skill's 2-module (dual-channel) Flare X series kits.

At its pre-launch media conference call for the Ryzen Threadripper 1900X, AMD mentioned that the chip has been carved out from the common 4-die EPYC MCM using a "4-0-4-0 diagonal configuration," which led to some confusion as to which cores/dies AMD disabled to carve out the $549 8-core HEDT processor. The company shed some light on this matter, responding to questions from TechPowerUp.

It turns out, that the Threadripper 1900X features an entire CCX (quad-core CPU complex) disabled per active die on the multi-chip module, so the CCX that's enabled has 8 MB of L3 cache; and access to the die's entire uncore resources, such as the dual-channel memory controller, PCIe root complex, etc. With two such active "Zeppelin" dies, the Threadripper 1900X ends up with 8 cores, 16 MB of L3 cache, a quad-channel memory interface, and 64 PCIe lanes.

In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

When AMD Ryzen Threadripper HEDT platform launched earlier this year, a shortcoming was its lack of NVMe RAID support. While you could build soft-RAID arrays using NVMe drives, you couldn't boot from them. AMD is addressing this, by adding support for NVMe RAID through a software update, scheduled for 25th September. This software update is in the form of both a driver update (including a lightweight F6-install driver), and a motherboard BIOS update, letting AMD X399 chipset motherboards boot from RAID 0, RAID 1, and RAID 10 arrays made up of up to ten NVMe drives. AMD confirmed that it has no plans to bring NVMe RAID support for the X370 or B350 platforms.