Global technology brand HONOR today unveiled the HONOR MagicBook Pro 16, a revolutionary AI-powered laptop which sets to redefine the traditional laptop landscape. Based on HONOR's platform-level AI capabilities and joint efforts with technology partners such as Microsoft, Intel and NVIDIA, HONOR is bringing PCs into the AI PC era, marking a significant milestone in computing, offering users an unparalleled AI experience and transforming their device interactions.

"At HONOR, our commitment lies in embracing open collaboration with industry partners to foster a flourishing ecosystem. We firmly believe in the transformative power of collaborative synergy, especially in the era of AI. By leveraging the collective expertise of top industry players, we are dedicated to crafting exceptional products and delivering unparalleled experiences to consumers worldwide," said George Zhao, CEO at HONOR.

Huawei's Ascend 910B AI GPU is reportedly in high demand in China—we last learned that NVIDIA's latest US sanction-busting H20 "Hopper" model is lined up as a main competitor, allegedly in terms of both pricing and performance. A recent Reuters report proposes that Huawei is reacting to native enterprise market trends by shifting its production priorities—in favor of Ascend product ranges, while demoting their Kirin smartphone chipset family. Generative AI industry experts believe that the likes of Alibaba and Tencent have rejected Team Green's latest batch of re-jigged AI chips (H20, L20 and L2)—tastes have gradually shifted to locally developed alternatives.

Huawei leadership is seemingly keen to seize these growth opportunities—their Ascend 910B is supposedly ideal for workloads "that require low-to-mind inferencing power." Reuters has spoken to three anonymous sources—all with insider knowledge of goings-on at a single facility that manufacturers Ascend AI chips and the Kirin smartphone SoCs. Two of the leakers claim that this unnamed fabrication location is facing many "production quality" challenges, namely output being "hamstrung by a low yield rate." The report claims that Huawei has pivoted by deprioritizing Kirin 9000S (7 nm) production, thus creating a knock-on effect for its premium Mate 60 smartphone range.

Semiconductor Manufacturing International Corp (SMIC) is preparing new semiconductor production lines at its Shanghai facilities according to a fresh Reuters report—China's largest contract chip maker is linked to next generation Huawei SoC designs, possibly 5 nm-based Kirin models. SMIC's newest Shanghai wafer fabrication site was an expensive endeavor—involving a $8.8 billion investment—but their flagship lines face a very challenging scenario with new phases of mass production. Huawei, a key customer, is expected to "upgrade" to a 5 nm process for new chip designs—their current flagship, Kirin 9000S, is based on a SMIC 7 nm node. Reuter's industry sources believe that the foundry's current stable of "U.S. and Dutch-made equipment" will be deployed to "produce 5-nanometer chips."

Revised trade rulings have prevented ASML shipping advanced DUV machinery to mainland China manufacturing sites—SMIC workers have reportedly already repurposed the existing inventory of lithography equipment for next-gen pursuits. Burn Lin (ex-TSMC), a renowned "chip guru," believes that it is possible to mass produce 5 nm product on slightly antiquated gear (previously used for 7 nm)—but the main caveats being increased expense and low yields. According to a DigiTimes Asia report, mass production of a 5 nm SoC on SMIC's existing DUV lithography would require four-fold patterning in a best case scenario.

NVIDIA's H800 AI GPU was rolled out last year to appease the Sanction Gods—but later on, the US Government deemed the cutdown "Hopper" part to be far too potent for Team Green's Chinese enterprise customers. Last October, newly amended export conditions banned sales of the H800, as well as the slightly older (plus similarly gimped) A800 "Ampere" GPU in the region. NVIDIA's engineering team returned to the drawing board, and developed a new range of compliantly weakened products. An exclusive Reuters report suggests that Team Green is taking pre-orders for a refreshed "Hopper" GPU—the latest China-specific flagship is called "HGX H20." NVIDIA web presences have not been updated with this new model, as well as Ada Lovelace-based L20 PCIe and L2 PCIe GPUs. Huawei's competing Ascend 910B is said to be slightly more performant in "some areas"—when compared to the H20—according to insiders within the distribution network.

The leakers reckon that NVIDIA's mainland distributors will be selling H20 models within a price range of $12,000 - $15,000—Huawei's locally developed Ascend 910B is priced at 120,000 RMB (~$16,900). One Reuters source stated that: "some distributors have started advertising the (NVIDIA H20) chips with a significant markup to the lower end of that range at about 110,000 yuan ($15,320). The report suggests that NVIDIA refused to comment on this situation. Another insider claimed that: "distributors are offering H20 servers, which are pre-configured with eight of the AI chips, for 1.4 million yuan. By comparison, servers that used eight of the H800 chips were sold at around 2 million yuan when they were launched a year ago." Small batches of H20 products are expected to reach important clients within the first quarter of 2024, followed by a wider release in Q2. It is believed that mass production will begin around Spring time.

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.

Huawei's subsidiary HiSilicon has made significant strides in the independent R&D of AI chips, launching the next-gen Ascend 910B. These chips are utilized not only in Huawei's public cloud infrastructure but also sold to other Chinese companies. This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers. Additionally, in August, Chinese company iFlytek, in partnership with Huawei, released the "Gemini Star Program," a hardware and software integrated device for exclusive enterprise LLMs, equipped with the Ascend 910B AI acceleration chip, according to TrendForce's research.

TrendForce conjectures that the next-generation Ascend 910B chip is likely manufactured using SMIC's N+2 process. However, the production faces two potential risks. Firstly, as Huawei recently focused on expanding its smartphone business, the N+2 process capacity at SMIC is almost entirely allocated to Huawei's smartphone products, potentially limiting future capacity for AI chips. Secondly, SMIC remains on the Entity List, possibly restricting access to advanced process equipment.

NVIDIA's most recent FY3Q24 financial reports reveal record-high revenue coming from its data center segment, driven by escalating demand for AI servers from major North American CSPs. However, TrendForce points out that recent US government sanctions targeting China have impacted NVIDIA's business in the region. Despite strong shipments of NVIDIA's high-end GPUs—and the rapid introduction of compliant products such as the H20, L20, and L2—Chinese cloud operators are still in the testing phase, making substantial revenue contributions to NVIDIA unlikely in Q4. Gradual shipments increases are expected from the first quarter of 2024.

The US ban continues to influence China's foundry market as Chinese CSPs' high-end AI server shipments potentially drop below 4% next year
TrendForce reports that North American CSPs like Microsoft, Google, and AWS will remain key drivers of high-end AI servers (including those with NVIDIA, AMD, or other high-end ASIC chips) from 2023 to 2024. Their estimated shipments are expected to be 24%, 18.6%, and 16.3%, respectively, for 2024. Chinese CSPs such as ByteDance, Baidu, Alibaba, and Tencent (BBAT) are projected to have a combined shipment share of approximately 6.3% in 2023. However, this could decrease to less than 4% in 2024, considering the current and potential future impacts of the ban.

The Chinese semiconductor industry is advancing, and interestingly, it is growing rapidly under sanctions, even with the blacklisting of companies by the US government. China's semiconductor industry is mainly represented by companies like Semiconductor Manufacturing International Corp (SMIC) and Huawei Technologies, who are leading the investment and progress in both chip manufacturing and chip design. According to the latest interview with Bloomberg, former TSMC Vice President Burn J. Lin said that the US government and its sanctions can not stop the advancement of Chinese semiconductor companies. Currently, Lin notes that SMIC and Huawei can use older machinery to produce more advanced chips.

Even so, SMIC could progress to 5 nm technology using existing equipment, particularly with scanners and other machinery from ASML. Development under sanctions would also force China to experiment with new materials and other chip packaging techniques that yield higher performance targets. SMIC has already developed a 7 nm semiconductor manufacturing node, which Huawei used for its latest Mate 60 Pro smartphone, based on Huawei's custom HiSilicon Kirin 9000S chip. Similarly, the transition is expected to happen to the 5 nm node as well, and it is only a matter of time before we see other nodes appear. "It is just not possible for the US to completely prevent China from improving its chip technology," noted Burn J. Lin.

Phytium, a Chinese semiconductor company that faced U.S. government sanctions from 2021, has introduced its latest data center processor, the 64-core Feiteng Tengyun S2500. Designed for cloud and high-performance computing applications, this processor features a large-capacity shared L3 cache, enhanced security capabilities for cloud servers, and improved memory subsystem reliability. The Feiteng Tengyun S2500 features 64 FTC661 cores developed by Phytium, which are based on Armv8 ISA. Reportedly, the CPU features 64 MB of L3 cache and 512 KB of L2 per core, bringing the total to 96 MB of processor cache. Compared to the previous generation line, the S2500 brings an L3 cache and TDP of 150 Watts, up from 90 Watts of previous generation.

This is Phytium's first new CPU in several years, raising questions about its production capacity and access to foundries, given its sanctions-related restrictions. It is currently unknown which foundry will manufacture the Feiteng Tengyun S2500, and we expect to hear more about it as (if) units get shipped. So far only display units have made appearance. Nonetheless, the company has continued its hardware development efforts and garnered interest in collaborating with Huawei to unify hardware and software ecosystems, which has yet to come to fruition.

Liu Qingfeng, the founder and chairman of Chinese AI firm iFlytek (or HKUST Xunfei according to ITHome) shared his opinions of incoming Huawei GPU technology at this year's Yabuli Entrepreneurs Forum. His team has been collaborating with key figures at the multinational technology corporation on a product that he reckons is just as capable as NVIDIA's very mature A100 tensor core accelerator. Liu referred to the model as a "compute GPU" which implies that this is an all-new product—Huawei has kept quiet on the AI hardware front since the 2019 launch of its Ascend 910 AI accelerator, so the iFlytek presentation has hinted about Huawei's ambitions to take on Team Green within the Chinese deep learning and artificial intelligence market sector.

The escalating challenges in acquiring high-performance x86 servers have prompted Chinese data center companies to accelerate the shift to Arm-based system-on-chips (SoCs). Investment banking firm Bernstein reports that approximately 40% of all Arm-powered servers globally are currently being used in China. While most servers operate on x86 processors from AMD and Intel, there's a growing preference for Arm-based SoCs, especially in the Chinese market. Several global tech giants, including AWS, Ampere, Google, Fujitsu, Microsoft, and Nvidia, have already adopted or developed Arm-powered SoCs. However, Arm-based SoCs are increasingly favorable for Chinese firms, given the difficulty in consistently sourcing Intel's Xeon or AMD's EPYC. Chinese companies like Alibaba, Huawei, and Phytium are pioneering the development of these Arm-based SoCs for client and data center processors.

However, the US government's restrictions present some challenges. Both Huawei and Phytium, blacklisted by the US, cannot access TSMC's cutting-edge process technologies, limiting their ability to produce competitive processors. Although Alibaba's T-Head can leverage TSMC's latest innovations, it can't license Arm's high-performance computing Neoverse V-series CPU cores due to various export control rules. Despite these challenges, many chip designers are considering alternatives such as RISC-V, an unrestricted, rapidly evolving open-source instruction set architecture (ISA) suitable for designing highly customized general-purpose cores for specific workloads. Still, with the backing of influential firms like AWS, Google, Nvidia, Microsoft, Qualcomm, and Samsung, the Armv8 and Armv9 instruction set architectures continue to hold an edge over RISC-V. These companies' support ensures that the software ecosystem remains compatible with their CPUs, which will likely continue to drive the adoption of Arm in the data center space.

Huawei announced they will launch a complete set of commercial 5.5G network equipment in 2024 at the 5G Advanced Forum during MWC Shanghai 2023. Huawei's Director and President of ICT Products & Solutions Yang Chaobin who made the announcement said the company intends for this launch to mark the beginning of the 5.5G era for the ICT industry.

5G deployment progressed rapidly over the past four years and is already yielding significant financial gains. Today, there are more than 260 commercial 5G networks worldwide, serving over 1.2 billion users, and there are already 115 million gigabit F5G users. With service models and content continuously evolving, breakthroughs in technologies like glasses-free 3D are creating unprecedented immersive experiences for users. However, these new services continue to require stronger 5G network capabilities. The industry has widely agreed that 5.5G will be a key milestone in 5G evolution, and that it is fast approaching.

US authorities have imposed a $300 million penalty on Seagate Technology Holdings plc, a market leader in data storage solutions, for an alleged violation of export controls. The US Commerce Department has investigated the California-based company's business dealings with Chinese hardware firm Huawei Technologies Co. Limited, specifically for the sale of hard disk drives to operations within mainland China. It has found that Seagate has broken the "foreign direct product (FDP) rule" that was established by the US Government back in 2020. Seagate is said to have sold approximately 7.4 million hard drive units to Huawei after the period in which the new rulings took effect - the total value of these shipments was estimated in the region of $1.1 billion.

The US government's serving of a civil penalty to Seagate appears to be part of a larger drive to prevent North American tech companies from selling advanced computer equipment to Chinese firms. Two other suppliers (not named) of storage solutions had agreed to the government imposed terms and ceased trade with Huawei in 2020. In contrast, Seagate has seemingly become a record breaking heretic according to a statement released yesterday by the Bureau of Industry (BIS) and Security: "This historic foreign direct product enforcement case and settlement represents the largest standalone administrative penalty in BIS history. Today's resolution also includes a multi-year audit requirement and a five-year suspended Denial Order. In August 2020, the Bureau of Industry and Security imposed controls over certain foreign-produced items related to Huawei. Despite this, in September 2020, Seagate announced it would continue to do business with Huawei. Seagate did so despite the fact that its only two competitors had stopped selling HDDs to Huawei, resulting in Seagate becoming Huawei's sole source provider of HDDs."

Amid the US sanctions, Chinese technology giant Huawei has reportedly developed tools to create processors with 14 nm and above lithography. According to Chinese media Yicai, Huawei and its semiconductor partners have teamed up to create replacement tools in place of US chip toolmakers like Cadence, Synopsys, and Mentor/Siemens. These three companies control all of the world's Electronic Design Automation (EDA) tools used for every step of chip design, from architecture to placement and routing to the final physical layout. Many steps need to be taken before making a tapeout of a physical chip, and Huawei's newly developed EDA tools will help the Chinese industry with US sanctions which crippled Huawei for a long time.

Having no access to US-made chipmaking tools, Huawei has invested substantial time into making these EDA tools. However, with competing EDA makers supporting lithography way below 14 nm, Huawei's job still needs to be completed. Chinese semiconductor factories are currently capable of 7 nm chip production, and Huawei itself is working on making a sub-7 nm EUV scanner to aid manufacturing goals and compete with the latest from TSMC and other. If Huawei can create EUV scanners that can achieve transistor sizes smaller than 7 nm, we expect to see their EDA tools keep pace as well. It is only a matter of time before they announce adaptation for smaller nodes.

NVIDIA's presence in high-performance computing has steadily increased, with various workloads benefiting from the company's AI and HPC accelerator GPUs. One of the important markets for the company is China, and export regulations are about to complicate NVIDIA's business dealing with the country. NVIDIA's major partners in the Asia Pacific region are Inspur and Huawei, which make servers powered by A100 and H100 GPU solutions. Amid the latest Biden Administration complications, the US is considering limiting more export of US-designed goods to Chinese entities. Back in 2019, the US blacklisted Huawei and restricted the sales of the latest GPU hardware to the company. Last week, the Biden Administration also blacklisted Inspur, the world's third-largest server maker.

In the Morgan Stanley conference, NVIDIA's Chief Financial Officer Colette Cress noted that: "Inspur is a partner for us, when we indicate a partner, they are helping us stand up computing for the end customers. As we work forward, we will probably be working with other partners, for them to stand-up compute within the Asia-Pac region or even other parts of the world. But again, our most important focus is focusing on the law and making sure that we follow export controls very closely. So in this case, we will look in terms of other partners to help us." This indicates that NVIDIA will lose millions of dollars in revenue due to the inability to sell its GPUs to partners like Inspur. As the company stated, complying with the export regulations is the most crucial focus.

Huawei, the Chinese technology giant, has reportedly filed patents that it is developing extreme ultraviolet (EUV) scanners for use in the manufacturing process of semiconductors. This news comes amid increasing tensions between Huawei and the US government, which has imposed a series of sanctions on the company in recent years. According to UDN, Huawei has filed a patent that covers the entire EUV scanner with a 13.5 nm EUV light source, mirrors, lithography for printing circuits, and proper system control. While filing a patent is not the same as creating an accurate EUV scanner, it could enable China to produce a class of chips below 7 nm and have a homegrown semiconductor production, despite the ever-increasing US sanctions.

The development of EUV scanners is a significant milestone for Huawei and the semiconductor industry. However, the company's progress in this area may be hindered by the US government's sanctions, which have limited Huawei's access to certain technologies and markets. It is important to note that Chinese SMIC wanted to develop EUV fabrication based on third-party EUV tools; however, those plans were scrapped as the Wassenaar agreement came into action and prohibited the sales of advanced tools to Chinese companies. Huawei's development could represent a new milestone for the entire Chinese industry.

According to TrendForce's latest research, global smartphone production totaled around 289 million units for 3Q22, showing a slight QoQ drop of 0.9% and a YoY drop of 11%. The smartphone market thus exhibited an extremely weak demand situation as the "iron law" of positive growth in the third quarter was broken after being in effect for years. The contraction of smartphone production during this year's peak season was mainly attributed to smartphone brands giving priority to consumption of channel inventory for whole devices and maintaining a fairly conservative production plan for 3Q22. Moreover, they had kept lowering their production targets due to strong global economic headwinds.

Regarding the performances of the major smartphone brands in 3Q22, Samsung posted around 64.2 million units in device production, showing a QoQ increase of just 3.9%. This was the result of the brand scaling back production since 2Q22 and maintaining a conservative outlook on the future market situation. Due to persistent inventory pressure, Samsung is expected to again post a QoQ decline for 4Q22. In the aspect of product development, Samsung has been the leader in foldable smartphones. This year, the global market share of foldable smartphones is estimated to reach 1.1%; and within this segment, Samsung is expected to hold a market share of almost 90%. As for 2023, the global market share of foldable smartphones is forecasted to climb to 1.5%, and Samsung is forecasted to retain a market share of almost 80% in the segment.

Worldwide tablet shipments were down 8.8% year over year in the third quarter of 2022 (3Q22), totaling 38.6 million units, according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. This was the fifth straight quarter of decline for the tablet market. Chromebook shipments also struggled in 3Q22, falling to 4.3 million units and a year-over-year decline of 34.4%. Both markets have now shifted from supply constrained industries to ones that are demand challenged as consumer and education spending has slowed in the face of economic uncertainties.

Chinese vendors continue to do well in emerging markets where there is low-end demand. Sanctions from many vendors also enabled Chinese vendors like Huawei to perform well in the Russian market. Meanwhile, the emergence of low-priced Chinese OEMs like Realme, Xiaomi, Oppo and others, has fueled strong competition in the lower range devices. However, these gains still couldn't offset the decline experienced by the main tablet vendors.

The HUAWEI MateBook X Pro is the company's latest flagship laptop. It is a comprehensive improvement over its predecessor in terms of aesthetic design, innovative technologies, and smart experiences. In a Super Device system, it connects and collaborates with other Huawei devices for a fresh smart office experience.

It comes equipped with the best touch display that Huawei has ever used on a laptop. The 14.2-inch Real Colour FullView Display features 3.1K resolution, 92.5% ultra-high screen-to-body ratio, and the mean ∆ E < 1 (typical value) in P3 and sRGB dual color gamut. As the world's first product certified by TÜV Rheinland for pro-level dual color gamut color accuracy, it delivers more true-to-life colors and it's unique wedge-shaped body weighs as little as 1.38 kg, merging a minimalist aesthetic with a comfortable grip.

Worldwide semiconductor revenue increased 25.1% in 2021 to total $583.5 billion, crossing the $500 billion threshold for the first time, according to preliminary results by Gartner, Inc.

"As the global economy bounced back in 2021, shortages appeared throughout the semiconductor supply chain, particularly in the automotive industry," said Andrew Norwood, research vice president at Gartner. "The resulting combination of strong demand as well as logistics and raw material price increases drove semiconductors' average selling price higher (ASP), contributing to overall revenue growth in 2021.

In recent years, government institutions have been funding the development of home-grown hardware that will power the government infrastructure. This trend was born out of a desire to design chips with no back doors implemented so that no foreign body could monitor the government's processes. Today, Russian company Baikal Electronics managed to boot up the Baikal-S processor with 48 cores based on Arm Instruction Set Architecture (ISA). The processor codenamed BE-S1000 manages to operate 48 cores at a 2.0 GHz base frequency, with a maximum boost of 2.5 GHz clock speed. All of that is achieved at the TDP of 120 Watts, making this design very efficient.

When it comes to some server configurations, the Baikal-S processor run in up to four sockets in a server board. It offers a home-grown RISC-V processor for safe boot and management, so the entire SoC is controlled by a custom design. Baikal Electronics provided some benchmark numbers, which you can see in the slides below. They cover SPEC2006 CPU Integer, Coremark, Whetstone, 7Zip, and HPLinkpack performance. Additionally, the company claims that Baikal-S is in line with Intel Xeon Gold 6148 Skylake design and AMD EPYC 7351 CPU based on Zen1 core. Compared to Huawei's Kunpeng 920, the Baikal-S design provides 0.86x performance.

China's technology reliance on 3rd party companies seems to be getting smaller. One of the leading technology companies in China, Huawei, has designed a laptop powered by a custom 5 nm Kirin SoC with DDR5 memory. Called the Dyna Cloud L420, Huawei has prepared this model for the Chinese market to provide a fully functional laptop that will get the job done, with no risk of the potential security backdoors implemented in the processor. Powered by a brand new Kirin 9006C SoC manufactured on TSMC's 5 nm process, it features eight unknown cores running at 3.1 GHz frequency. We assume that those are custom cores designed by Huawei. This SoC is accompanied by 8 GB of LPDDR5 memory, with 256 GB and 512 GB UFS 3.1 configurations storage options.

When it comes to the rest of the laptop, it rocks a 14-inch 2160x1440 display. I/O options are solid as well, as this machine has an HDMI video output, two USB-A, one USB-C, and Gigabit Ethernet using a mini-RJ45 port. Connectivity is provided by Wi-Fi 6 and Bluetooth 4.2. There is a 56 W/h battery that provides the juice to keep it running when it comes to the battery. And to complete all of that, this laptop officially only supports Huawei's proprietary Kirin OS (KOS) and Unity OS (UOS), with expected support for HarmonyOS in the future. Pricing and availability information is a mistery at the present date.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

Growth rates remained strong in the enterprise segment of the wireless local area networking (WLAN) market in the second quarter of 2021 (2Q21) as the market increased 22.4% on a year-over-year basis to $1.7 billion, according to the International Data Corporation (IDC) Worldwide Quarterly Wireless LAN Tracker. In the consumer segment of the WLAN market, revenues declined 5.7% in the quarter to $2.3 billion, giving the combined enterprise and consumer WLAN markets year-over-year growth of 4.6% in 2Q21.

The growth in the enterprise-class segment of the market builds on a strong first quarter of 2021 when revenues increased 24.6% year over year. For the first half of 2021, the market increased 23.5% compared to first two quarters of 2020. Compared to the second quarter of 2019, 2Q21 revenues increased 10.8%, indicating that demand in the enterprise WLAN is strong.

Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce's latest investigations. Global sales of large-sized TVs were brisk thanks to major sporting events such as the Tokyo Olympics and UEFA Euro 2020. Likewise, the proliferation of WFH and distance learning applications propelled the demand for IT products, while the automotive semiconductor and data center markets also showed upward trajectories. Taking into account the above factors, OSAT companies raised their quotes in response, resulting in a 26.4% YoY increase in the top 10 OSAT companies' revenue to US$7.88 billion for 2Q21.

TrendForce indicates that, in light of the ongoing global chip shortage and the growing production capacities of foundries/IDMs in the upstream semiconductor supply chain, OSAT companies gradually increased their CAPEX and expanded their fabs and equipment in order to meet the persistently growing client demand. However, the OSAT industry still faces an uncertain future in 2H21 due to the Delta variant's global surge and the health crisis taking place in Southeast Asia, home to a significant number of OSAT facilities.