In what amounts to a surely shocking bit of news for the PC hardware industry, Intel has announced it has cancelled IDF17, and terminated the Intel Developer Forum program altogether. Intel had previously announced there would not be an IDF in China this year, but now the cancellation appears to have gone global and permanent. From the horse's mouth, if one were to consider Intel a horse (would it be a fast one? My mind wanders):

"Intel has evolved its event portfolio and decided to retire the IDF program moving forward. Thank you for nearly 20 great years with the Intel Developer Forum! Intel has a number of resources available on intel.com, including a Resource and Design Center with documentation, software, and tools for designers, engineers, and developers. As always, our customers, partners, and developers should reach out to their Intel representative with questions."

Intel plans to launch the first consumer SSD based on its new 3D Xpoint memory technology, a successor to NAND flash which promises exponential gains in performance and capacity, some time in 2016. The Intel-branded drive will be called Intel Optane, will come in modern form-factors such as M.2/NGFF, SATA-Express, PCI-Express (add-on card), and will take advantage of the new NVMe protocol.

Early prototypes of Optane demoed at IDF already offer up to 5.5 times the throughput of NAND flash-based DC P3700 series SSDs, and we're only talking about single-queue performance. Compared to the queue depth of just 32 commands for AHCI, NVMe offers command queue depth of a staggering 65,535 commands. Since Micron Technology is the co-developer of 3D Xpoint, it's likely that we'll also see Micron/Crucial branded drives based on this tech.

Intel announced its first 6th generation Core processors, codenamed "Skylake." Built on Intel's swanky new 14 nanometer silicon fab process, and in the new LGA1151 package, these processors bring DDR4 memory to the mainstream, and offer IPC improvements over the previous-generation Core "Haswell" and "Broadwell" processors. Making its debut at Gamescom, Intel is starting its lineup off with two chips that are predominantly targeted at the DIY gaming PC crowd, the Core i7-6700K and the Core i5-6600K quad-core processors. More models in the series will be launched towards the end of this month. The company also announced the Z170 Express chipset.

The Core i7-6700K features a nominal clock speed of 4.00 GHz, with a Turbo Boost frequency of 4.20 GHz. It features 8 MB of L3 cache, and HyperThreading. Its integrated Intel HD 530 graphics ticks at 350 MHz, with 1200 MHz Boost. The Core i5-6600K, on the other hand, features clock speeds of 3.50 GHz, with 3.90 GHz Turbo Boost. It features 6 MB of L3 cache, and lacks HyperThreading. It features the same integrated graphics solution as its bigger sibling. The TDP of both chips are rated at 91W. Both chips feature integrated memory controllers with support for DDR3L-1600 and DDR4-2133. The Core i7-6700K is priced around $350, and the i5-6600K around $243, in 1000-unit tray quantities. The retail packages of both chips will lack a stock cooling solution. The LGA1151 cooler mount will be identical to that of the outgoing LGA1150, so you shouldn't have any problems using your older cooler.

G.SKILL International Co., Ltd., the leading extreme performance memory manufacturer and designer, is excited to feature two extremely high end DDR4 memory at 3333MHz 32GB (4GBx8) and 3200MHz 32GB (8GBx4) during Intel Developer Forum 2014 (IDF 2014). Driven by the newest Intel i7-5960X CPU on the newest ASUS Rampage V Extreme X99 and X99-Deluxe motherboards, the Ripjaws 4 series DDR4 3333MHz 4GBx8 and 3200MHz 8GBx4 memory demonstrates the highest DDR4 speed available in 4GB and 8GB modules, respectively.

"It's very exciting to show the world what we can do with the new DDR4 memory standard for the latest Intel X99 platform. There is no doubt that breaking the 3000MHz memory barrier with ease is the next big thing in desktop performance, effectively doubling bandwidth throughput compared to the previous DDR3 memory standard," says Frank Hung, Product Marketing at G.SKILL.

OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid state drives (SSDs) for computing devices and systems, will unveil its latest storage solutions at the 2014 Intel Developer Forum (IDF), September 9-11 at Moscone West, San Francisco. New drives to be showcased include the upcoming Saber 1000 SATA III Series which is designed to deliver the best cost per GB for hyperscale data center customers, and the innovative Z-Drive 6000 2.5-inch PCIe 3.0 NVMe series that provides industry-leading IOPS per dollar.

OCZ has long been a major supplier to customers in the hyperscale and cloud markets, and the new Saber 1000 SATA III SSD was conceptualized and designed with key input from customers within this space to offer the best of both worlds with an enterprise-optimized feature-set, high capacity, and exceptional price point. Because these massive scalable infrastructures require premium yet practical storage, Saber 1000 is designed to be a more cost-effective solution than traditional enterprise-grade SSDs, effectively eliminating I/O bottlenecks and maximizing storage efficiency to meet the evolving demands of the fast growing hyperscale and cloud computing markets. Based off the proven OCZ Barefoot 3 platform which delivers superior and sustainable performance, Saber 1000 also provides enhanced data integrity with the addition of features like partial power fail protection and will also leverage the latest generation A19 NAND flash from Toshiba.

The USB Implementers Forum (USB-IF) today announced that it will exhibit and present the latest USB developments at Intel Developer Forum (IDF) in San Francisco, September 9-11. At IDF, the USB-IF will host a Technology Community, present technical sessions on the new USB Type-C connector, and host press briefings featuring new technology demonstrations.

As the computing industry landscape undergoes rapid transformation, Intel Corporation CEO Brian Krzanich today outlined the company's plans to build upon its nearly 30-year history in China, and collaborate with the growing technology ecosystem, particularly in Shenzhen, to accelerate new innovation and reshape the computing industry.

During his keynote, Krzanich discussed how Intel and the Shenzhen technology ecosystem can re-ignite growth - both locally and globally - and deliver differentiated computing products and experiences, spanning multiple market segments, operating systems and price points. Underscoring this point, he announced the establishment of an Intel Smart Device Innovation Center in Shenzhen and a US$100 million Intel Capital China Smart Device Innovation Fund.

As SSDs play catch-up with HDDs on the capacity front, the focus will shift to NAND flash memory designers increasing transistor densities using newer silicon fabrication technologies. In the absence of that, SSD designers will have to cram more number of NAND flash chips to achieve desired high capacities. That throws up two key issues with having too many chips in one place - heat and power. Intel is gearing up to deal with heat on its upcoming "Fultondale" and "Pleasantdale" SSDs for data-centers. Leaked company documents seen by VR-Zone reveal renders of what Intel expects the drives to look like.

Built in the 3.5-inch form-factor the drives are built almost entirely of chunky metal, with a retractable top lid, and its body. The body doubles up as heatsink, it features metal ridges which dissipate heat drawn from the NAND flash chips of the SSD to the air. Internally, the drive will feature at least two PCBs, one which holds the controller, cache RAM (if any), and some NAND flash chips; while the other holds NAND flash chips entirely. How hot can things get? According to the source, the drive could draw as much as 25W of power. That could amount to enough heat to warrant a passive heatsink. Intel is expected to unveil the two drives at IDF Beijing, slated for Q4-2014.

Fresco Logic, a global fabless semiconductor company that develops and markets advanced connectivity solutions, demonstrated SuperSpeed USB 10 Gbps (USB 3.1) data transfer on its hardware development platform at the Intel Developer Forum (IDF). This demonstration marks the first public showing of a working SuperSpeed USB 10 Gbps host and mass storage device transferring data. USB is the most successful standard in the history of computing, and in its newest revision, USB 3.1, the data transfer rate jumps to 10 Gb/s on a bi-directional link, more than double the effective bandwidth of the already fast SuperSpeed USB (USB 3.0) standard.

"The USB-IF is pleased to see Fresco Logic develop early implementations that showcase key features supported by the USB 3.1 specification," said Jeff Ravencraft, USB-IF President & COO. "The Fresco Logic demonstration shows a significant performance increase that devices and hosts will support based on the USB 3.1 specification, and the demo shows the value that this performance increase brings to consumers."

G.SKILL International Co. Ltd., the world's leading designer and manufacturer of extreme performance memory, proudly displays several engineering sample DDR4 modules at the Intel Developer Forum (IDF). The next generation of DDR memory is still under development, and G.SKILL is working to push the new technology to its limits in the future. G.SKILL also features a live demo of DDR3 3000MHz 32GB (8x4GB) with the Intel Core i7-4960X CPU and ASUS X79-Deluxe motherboard. Driving the new Ivy Bridge-E processor to new limits, G.SKILL looks forward to offer a wide range of high performance memory kits on the Intel X79 platform.A video presentation follows.

PROMISE Technology, Inc. announced today that they will be demonstrating at Intel's Developer Forum (IDF) the next generation Pegasus2 Series with Thunderbolt 2 Technology. PROMISE shipped the world's first storage solutions with the original Thunderbolt technology and continues its track-record as a leading innovator of storage solutions for the rich media space with the new Pegasus2 Series.

Thunderbolt technology is an enormous enabler for video with its exceptional performance and bandwidth, and Thunderbolt 2 further embraces the growing 4K applications in media and entertainment, mobility and computing. Running bi-directionally at 20 Gbps, double the bandwidth of Thunderbolt, Thunderbolt 2 is a breakthrough for video creators as it enables simultaneous 4K video file transfer and display. The advancement in bandwidth will enable professionals to edit and view live 4K streams while backing up the same file to a Pegasus2 system, all with the same cables and connectors as the previous generation.

From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today's opening session of the Intel Developer Forum. Krzanich laid out Intel's vision and described how Intel is addressing each dynamic market segment - such as accelerating Intel's progress in ultra-mobile devices - with new products over the next year and beyond, including a new, lower-power product family.

Krzanich said Intel plans to leave no segment untapped. "Innovation and industry transformation are happening more rapidly than ever before, which play to Intel's strengths. We have the manufacturing technology leadership and architectural tools in place to push further into lower power regimes. We plan to shape and lead in all areas of computing."Image courtesy of Engadget

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, announced today that the company's new generation DDR4 SDRAM modules will be on display at the Intel Developer Forum 2013 (IDF13), held this year in San Francisco. Targeting server and render farm applications, the new DDR4 modules show that ADATA is once again at the front of the pack in providing new high-performance solutions to the enterprise market.

DDR4 SDRAM stands for double data rate fourth generation synchronous dynamic random-access memory, and its most notable features are faster clock frequencies and data transfer rates as compared to DDR3, as well as low power consumption. Running at just 1.2 volts, these new modules are expected to achieve transfer rates of 3.2Gbps, at frequencies as high as 2133MHz, far outstripping the capabilities of previous generations of DRAM. In large scale server applications, the advantages of DDR4 will lead to lower costs and greatly improved overall system performance. The new DDR4 SDRAM modules will be showcased along with the company's other premium memory solutions at booth number 554 at IDF13.

Wilocity, a leading developer of 60 GHz multi-gigabit wireless chipsets, and DisplayLink, the leading provider of USB graphics technology, today announced the industry's first demonstration of WiGig-enabled 4K graphics and video. The demonstration features a Wilocity-powered WiGig integrated notebook and a WiGig docking station -- the latter also integrates the latest 4K capable chipset from DisplayLink -- connected to a 4K resolution monitor, which is more than four times higher resolution than 1080p full HD resolution.

The demonstration is being showcased September 10-12 at the Intel Developer Forum in San Francisco at the DisplayLink booth and in parallel at Wi-Fi Alliance industry events in Beijing, Seoul, Taiwan and Tokyo.

G.SKILL International Co. Ltd., the leading high-performance memory designer and manufacturer, announced to participate this year's Intel Developer Forum at San Francisco as part of Intel's memory community at booth no. 165, displaying maximum DDR3 memory frequency & capacity on the new Intel Core i7 processor family for socket LGA-2011 platform, also sharing plans for future technology such as DDR4. "As this is our first time attending IDF, we are very excited to show our high performance quad channel DDR3 memory and also announce our plans for DDR4," said Mark Yu, Technical Marketing at G.SKILL.

It could soon become possible to overclock the controller and NAND flash of your SSD, if Intel has its way. The company is set to demonstrate how to overclock Intel-branded SSDs using its Xtreme Tuning Utility (XTU), at IDF 2013, which goes underway this September. The item on Intel's IDF itinerary marked "AIOS001" deals with seminars on overclocking Intel's next-generation HEDT (high-end desktop) platforms. X-bit Labs believes Intel could talk about SSD overclocking during that session.

Options to tweak SSDs were discovered when poking around the code of an unreleased XTU version. XTU is a unified software utility by Intel, which lets you tweak CPU, memory, and system cooling on systems running Intel Desktop Boards. Among the things end-users should be able to tweak, apart from the controller clock-speed, are the NAND flash bus-speed. Taking away interface overheads and other round-offs, 560 MB/s appears to be the practical maximum bandwidth SATA 6 Gb/s SSDs have been able to achieve. It could always be handy getting your SSD a few dozen more MB/s sequential speeds at the expense of stability.

Intel's updated Atom family, part of the new Bay Trail-T platform, will arrive on September 11. The new Bay Trail-T lineup includes four quad-core chips and will be part of two different series of chips. The four chips include the Z3770D, Z3770D, Z3740 and Z3740D. Here, the 'D' suffix bearing chips will be able to drive a maximum display resolution of 1920 x 1200, while the non-'D' chips will be able to drive 2560 x 1600 resolution panels. Additionally, the 'D' chips have support for 10.6 GB/s memory bandwidth, which is a much higher 17.1 GB/s for the non-'D' chips. Clock speeds for the 3770 series will max out at 2.4 GHz, while the 3740 series will be limited to 1.8 GHz. The GPU department will be handled by Intel HD Graphics. Expect more details to surface at IDF later this year.

At the Intel Developer Forum (IDF) 2013 event held in Beijing last week, the company ran two separate seminars related to "Haswell," one related to the micro-architecture itself, and the other overclocking it. The company detailed improvements to the ways in which you can overclock these chips, without necessarily having to shell out dough for the base clock multiplier unlocked "-K" parts.

To begin with, tweaking Core "Haswell" processors will be similar to tweaking Core "Sandy Bridge-E" high-end desktop (HEDT) platform. Naturally then, overclocking "non-K" parts will be similar to overclocking the Core i7-3820. The chips ship with a base clock speed of 100 MHz. As with "Ivy Bridge," not just CPU cores, but also certain uncore components rely on this frequency. Also, as with "Ivy Bridge," overclockers will be given 5 to 7 percent headroom for tweaking this frequency, but it doesn't end there.

At the ongoing Intel Developer Forum (IDF) 2013 event in Beijing, Intel announced second-generation Thunderbolt specification. Pin and plug-compatible with existing Thunderbolt devices, the second-generation Thunderbolt doubles bandwidth over its predecessor, offering devices an enormous 20 Gb/s of bandwidth, four times that of USB 3.0 SuperSpeed. The bandwidth enables users the ability to transfer uncompressed 4K Ultra-HD video without causing display to lag.

To back the specification, Intel announced the "Falcon Ridge" line of Thunderbolt host controllers, mass production of which will commence by late-2013, going into 2014. In addition, the company launched two "Redwood Ridge" host controllers, DSL4510 and DSL4410. The two add DisplayPort 1.2 capability when connecting to native DP displays, improve power management, and reduce platform BOM cost.

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

It's traditional for AMD to camp outside an ongoing IDF event (at a nearby hotel suite), siphoning off a small portion of its visitors. In the backdrop of this year's IDF event in San Francisco, AMD showed off two of its upcoming flagship client processors, the socket FM2 A10-5800K "Trinity" APU, and socket AM3+ FX-8350 "Vishera" CPU. The two chips were shown running fully-loaded gaming PCs.

The FX-8350 was shown installed on a machine with ASUS Crosshair V Formula (-Z?) motherboard, liquid cooling, and Radeon HD 7970 graphics card. The chip was clocked at 5.00 GHz (4.80 GHz when the picture was taken), and running popular CPU-intensive benchmarks such as WPrime and Cinebench. The A10-5800K was shown running application demos, including a widget that displays real-time boost states of the processor and GPU cores.

At IDF 2012, Intel showed off an experimental SoC codenamed "Rosepoint," targeted at low power mobile consumer devices. Built on the 32 nm process, the tiny chip combines a full-featured dual-core Atom processor with a WiFi transceiver. This could eliminate the need for external transceivers on Atom-powered devices, reducing the platform's board footprint, and of course, power draw.

The current chip comes with its share of limitations. It supports just 2.4 GHz radio band. According to Intel's Justin Rattner, the chip should scale with Moore's Law, and future versions could have greater capabilities, including cellular data, and built-in antennae. Production versions of the chip aren't due for another two years, so it's safe to assume that Rosepoint is just a development milestone.

Ultrabooks, despite their formidable computing power compared to netbooks, inevitably trade some of it for lower thermal/power specifications. LucidLogix feels that Ultrabook users could gain graphics processing power on demand using external graphics cards, that work in tandem with its VirtuMVP GPU virtualization technology. At IDF, the company demonstrated an external graphics card that uses 10 Gb/s Thunderbolt interface to communicate with an Ultrabook.

Lucid's external graphics card is a Thunderbolt to PCI-Express enclosure, which runs an AMD Radeon HD 6700 series GPU. With the VirtuMVP layer running, the Ultrabook uses the graphics computing power of the external graphics card to render complex graphics onto its display, which is wired to the processor's integrated graphics core. Lucid's idea of on-demand graphics compute power allows Thunderbolt-equipped Ultrabooks of all shapes and sizes to lack a discrete GPU, which adds to the device's cost, and taps its limited power and thermal-control resources. At the moment, Lucid's external graphics cards are still in development, with no concrete release date in sight. The concept is solid.

Yesterday at the Intel Developer Forum 2012 in San Francisco the OCZ Technology Group (OCZ for short) provided a quick peek at its upcoming solid state drive named Vector. Coming in a 2.5-inch form factor, the Vector features a Barefoot 3 controller (designed by Indilinx from top to bottom, unlike the Barefoot 2 which has Marvell technology), 2x nm MLC NAND, and a SATA 6.0 Gbps interface. Unfortunately OCZ didn't say anything about the drive's performance.

The Vector is set to be released in Q4 in at least two capacities - 256 GB and 512 GB.

Seagate Technology announced today that they will be working with Intel Corporation to demonstrate new advancements in solid state hybrid drives (SSHD) at this year's Intel Developer Forum taking place September 11-13, 2012, at the Moscone West Convention Center in San Francisco. In the Advanced Technology Zone of the event, Intel will demonstrate Seagate's latest solid state hybrid drive design, accelerated with Intel Smart Response Technology, which run common office productivity applications almost on par with solid state drives.

Separately, an educational presentation titled "Ultrabook Responsiveness: Performance & Power End-Users Can Feel", will provide details on how SSHD technology combined with Intel Smart Response Technology will contribute to a powerful new combination of performance and capacity in the next generation Ultrabook devices. Solid state hybrid drives combine performance similar to a solid state drive with the large capacity of a hard disk drive in a single disk drive enclosure.