While Sapphire's LGA1150 motherboard lineup came across as a little lukewarm, the company more than made up for that with its fleet of motherboards that take advantage of AMD's newest A-series and E-series APUs and SoCs. First, there's the PGS A320M, a micro-ATX motherboard that ships with a FirePro A320 socket FM2 APU pre-installed. Largely identical to an A10-5800K, and based on the "Trinity" micro-architecture, the A320 features FirePro-branded professional graphics that's certified for most modern 3D productivity applications, and can give display output at resolutions as high as 4096 x 2160. The board features one each of DisplayPort 1.2, dual-link DVI-I, and D-Sub display outputs. Other features include eight SATA 6 Gb/s ports, four USB 3.0, gigabit Ethernet (Broadcom controller), and 8-channel HD audio.

Things get interesting with a contraption called IPC-FS1r2A75. This board comes in a proprietary IPC form-factor, features an FS1 rev 2.0 socket, which seats R-series APUs, an embedded AMD Radeon E6000 series GPU based on the Graphics CoreNext arhitecture, with its own dedicated GDDR5 memory on-package, and AMD A75 FCH chipset. The board offers six mini-DisplayPort and four HDMI outputs, two DDR3 SO-DIMM slots, an open-ended PCI-Express 2.0 x4 slot, four mPCIe slots (in stacks of two), five SATA 6 Gb/s ports, six USB 3.0 ports, two gigabit Ethernet connections, and 6-channel audio.

Introducing the Icy Dock ToughArmor MB991SK-B 2.5" SATA Mobile Rack solution for use in 3.5" device bays (Floppy bay). It is a smaller form factor device built specifically for systems with small real estate to work with. Using a heavy duty metal construction, it is capable to withstand the harshest enterprise type environments. The drive is fully secured by our proven technologies such as, the Eagle-Hook lock system and metal 2-segment safeguard key. Our full metal EZ Slide Mini Tray allows interchangeability of data between multiple systems with other ToughArmor products. Suggested applications in Medical & Military systems, Media servers, and IPCs, approved by Tier 1 companies.

The MB991SK-B is perfect for use in industrial PCs, SMB SFF servers, mobile DVR systems, or even home servers. These systems tend to use components that provide the needed features, in the smallest form factor available. The ability to house one SATA SSD or HDD in a single 3.5" bay makes it a valuable asset in specific applications such as, integration into an industrial imaging or medical device.

MSI proudly announced the release of its new EPIC embedded board?MS-98D1. The MS-98D1 is a compact EPIC size embedded board with Intel Atom Dual Core processor for low-power fanless solution. Featuring with dual core, fanless design, rich I/O, and wide input voltage of 9 to 36 VDC, the MS-98D1 is especially ideal for industrial applications that involve control and communications, or any industrial fields that require fanless embedded systems.

The dual Gigabit LAN built-in also benefit the target applications by providing broad-band communication capability that is required by many industrial fields. For some systems that need additional communication or I/O interfaces, the PCI-104 slot of MS-98D1 allows system integrators to stack more modules with no limits, offering more application possibilities with this small board. Moreover, 2 independent displays with VGA, DVI, and Dual LVDS outputs enable the MS-98D1 to be applied for remote monitoring and control systems as well.

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

Computex is Asia's largest high-tech event and will run from June 4th to to 8th, 2013 in Taipei, Taiwan and BIOSTAR will be showcasing their embedded/IPC solutions and graphics cards products as well as their line of Intel and AMD based motherboards in the Nangang Exhibition Hall at Booth M0402. The theme of their exhibition this year is their Hi-Fi Puro integrated products, including Intel's next generation Haswell based boards and their FM2 motherboards that support AMD's new Fusion "Richland" CPU. Continuing the tradition of their own in-house audio technology called "Puro Hi-Fi Technology"; Biostar is going to present the 2nd generation of this technology, called "Hi-Fi 3D".

Targeting audiophiles, HTPC enthusiasts and high-end gamers alike, Puro Hi-Fi features an integrated independent audio power design with a built-in amplifier. The technology utilizes audio components with an independent power delivery design for a significant reduction in electronic noise producing superb sound quality. The unique noise-blocking multi-layer PCB layout is conducive for an exceptionally clean signal. That design feature, together with a sampling rate of 192 kHz/24-bit, delivers high quality audio through an analog connection to your home theater system, multi-channel speakers or high-end headphones, allowing you to enjoy true high-definition 7.1-channel surround sound.

Nowadays, new products in the SSD market have mostly been upgraded to the more efficient and high-speed SATA interface solid-state drive. However, the majority of industrial computers (IPC) are still using the PATA interface (or IDE interface), which are now facing certain problems -- malfunctioning and bad tracks are beginning to emerge in the older technology and facilities.

To solve the problem, one of the most viable upgrade options at this stage in terms of data security and cost effectiveness would be the PATA interface solid-state drive with built-in security functions. In response to customer needs, Apacer launched this value-added PATA SSDs with Data Security benefit. These products come in two specifications - 2.5-inch, 44 pin AFD 257 and 1.8-inch 40 pin AFD 187. Both models come with three built-in data security functions - Full Erase, Destroy, and Write Protect to provide advanced and upgraded data security advantages.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.

Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -40°C up to 80°C, the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP.

2013 promises to be another year, with another new line of processors by Intel, and like every alternate year, the company will introduce a new client desktop CPU socket. With its 4th generation Core "Haswell" processor family, Intel will introduce a brand new CPU architecture that steps up IPC over current Core "Ivy Bridge," hence, Intel's Core desktop processor lineup will not ship with higher clock speeds, yet higher performance. The new chips will be built in the LGA1150 package, and will be accompanied by Intel's 8-series "Lynx Point" chipset.

By Q2-2013, Intel will have launched as many as 14 Core desktop CPU models, including six in the mainline, and eight power-optimized ones. Its nomenclature is somewhat similar to that of current Core "Ivy Bridge" lineup, except the 4000-series numbering. Leading the pack is the Core i7-4770K (unlocked) and i7-4770, clocked at 3.50 GHz with 3.90 GHz Turbo Boost, featuring eight threads with HyperThreading, 8 MB of L3 cache, Intel HD Graphics 4600 iGPU clocked up to 1250 MHz, with 84W TDP; followed by Core i5-4670K (unlocked) and i5-4670 clocked at 3.40 GHz with 3.80 GHz Turbo Boost, and 6 MB L3 cache. The Core i5-4570 and i5-4430 are clocked at 3.20 GHz (3.60 GHz Turbo) and 3.00 GHz (3.20 Turbo).

Samsung is reportedly taking interest in ARM's big.LITTLE technology - an SoC design in which high-performance Cortex-A15 cores are combined by low-power Cortex-A7 cores, and the two are made to trade places as the device's CPU, depending on the load. An SoC slated for 2013, which could probably feature in high-end smartphones and tablets, sees a combination of four each of A15 and A7 cores. The A15 cores are clocked at 1.80 GHz, and A7 at 1.20 GHz, with the former featuring higher IPC than the latter. A 2 MB last-level cache serves as town-square for data and instructions going to the various cores. The chip will be built on the 28 nm process.

Intel's 2011-launched Core i7 "Sandy Bridge-E" HEDT platform is based on a 32 nm silicon that's common with Xeon E5 series processors. While the silicon physically packs eight CPU cores and 20 MB last-level cache (LLC, or L3 cache), client Core i7 processors are configured with only a maximum of six cores, and up to 15 MB L3 cache. According to a MyDrivers.com report, the maximum core count won't change with next-generation 22 nm Ivy Bridge-E Core i7 processors.

Ivy Bridge-E will be an upscale of Ivy Bridge. Similar to Sandy Bridge-E, the silicon will feature up to eight cores and 20 MB L3 cache. In its Core i7 avatar, however, the chip will be configured with no more than six cores, and no more than 15 MB L3 cache. The new chip will introduce IPC improvements, PCI-Express Gen 3.0 certified root complex (one which NVIDIA will approve of), higher CPU core clock speeds, and support for faster memory.

IPC, digital signage, and panel PC maker Quanmax announced the QBOX Mini-1000 series of pocketable based on Intel x86 platform. Measuring just 130.11 x 83.06 x 19.2 mm (DxWxH), weighing 174 g, or roughly the size and weight of a portable hard drive, the QBOX Mini-10x0 is driven by an Intel Atom E640T embedded processor clocked at 1.00 GHz, with 512 KB cache, and 3.5W TDP; up to 1 GB of DDR2 memory; featuring D-Sub (QBOX Mini-1000) or HDMI (QBOX Mini-1010) display outputs, up to three USB 2.0 ports, stereo audio with line-in/mic, and mPCIe and mSATA slots for expansion. This pocket-sized PC is sufficiently powered to serve as a nettop.

MSI launch MS-9893 with the latest Intel Atom Platform. This is the multi-display outputs of mini-ITX form factor board with the latest 32nm process technology for the highest HD graphics quality, and offers lower power consumption and enhanced graphic and media performance.

MSI MS-9893 supports multi-display outputs, including single Channel 18/24 bit LVDS, VGA, one HDMI. It has great graphics performance and support for up to 1080P high definition video.MSI MS-9893 is equipped with single-channel DDR3 1066 MHz memory up to a maximum of 4 GB in 1 x 204 SO-DIMM slots. MS-9893 supports D2550(10W) / N2800(6.5W) two SKU, with VGA, HDMI, Video Output: LVDS/ Single CH 24bit by D2550 (LVDS/ Single CH 18bit by N2800). Power Input support, one ATX for D2550, and another is DC-in 12V for D2550 / N2800. I/O, and expansion connectivity, including 6* COM-ports(2 x Real, 4 x Internal), 6* USB2.0(4 x Real, 2 x Internal), and 8*GPIO(4 x GPI, 4 x GPO), one PCI slot and one Mini-PCIe slot could support the m-SATA/wireless function.

Known more for its VIA Nano and Intel Atom-powered fanless IPCs (industrial PCs), Habey is readying BIS-6763, a new IPC model that is driven by a robust Core i3 "Sandy Bridge" dual-core processor. Measuring 190 x 190 x 67 mm, the IPC is made of a metal chassis, a portion of which is ridged, to double up as a heatsink. Beneath it is a pair of cylindrical heat pipes that transport heat to the top panel (heatsink), which cool the Core i3-2367M processor (dual-core, 1.40 GHz, 3 MB L3, 17W TDP), and Intel HM65 Express PCH.

Sadly, the IPC does not take advantage of the processor's dual-channel DDR3 IMC, there's just the one DDR3 SO-DIMM slot, supporting up to 8 GB of DDR3-1333 MHz memory. For expansion, there are two mini-PCIe slots. The sole storage option is a 2.5-inch SATA 6 Gb/s SSD/HDD bay. Connectivity includes one serial RS232 interface, six USB 2.0, gigabit Ethernet, and Intel HD 3000 graphics that gives out an HDMI, and a D-Sub display output. With 2 GB of DDR3 memory included, the BIS-6763 is expected to be priced at US $499. A variant that's powered by Intel Celeron 857 (dual-core, 1.20 GHz, 2 MB L3, 17W TDP), is also expected to be available, at US $299.

Production of AMD's next-generation FX processor family, which are based on its "Piledriver" microarchitecture, will commence in Q3 2012, according to industry sources. Some of the first client processor models based on the "Vishera" silicon, will be the eight-core FX-8350, six-core FX-6300, and quad-core FX-4320. The three model names were earlier misinterpreted with an "x" prefix from a roadmap slide.

A few more details are known about these chips. For starters, the chips will be built on the existing AM3+ package, retaining compatibility with current AM3+ platforms. The chips will also retain dual-channel DDR3-1866 MHz integrated memory controllers, and Turbo Core 2.0. The main differences here, are increases in IPC (performance to clock-speed ratio), and the implementation of resonant clock mesh technology, which increases energy efficiency.

Green House Japan unveiled a new line of industrial SDHC cards that are designed to endure operating temperatures as high as 70°C, and as low as 0°C, which makes them fit to serve as removable storage media in IPCs and outdoor static cameras. The cards further pack ECC logic to prevent data corruption. The cards make use of SLC NAND flash, and come in capacities of 256 MB, 512 MB, 1 GB, 2 GB, 4 GB, and 8 GB. The 256 and 512 MB models provide transfer rates as high as 19 MB/s reads with 7 MB/s writes, while the other models provide speeds as high as 20 MB/s reads with 13 MB/s writes. Green House left pricing to the open markets.

J&W introduced a new fanless nettop and IPC, the M001. Driven by Intel "Cedar Trail" Atom D2550 or N2800 or N2600 processors, the M001 packs a nano-ITX system board. It has one vacant DDR3 SO-DIMM slot, supporting up to 4 GB of memory. For storage, there is one 2.5-inch SATA 3 Gb/s drive bay. Connectivity include 802.11 b/g/n, gigabit Ethernet, three USB 2.0 ports, SD/SDHC/MS/MS Pro/MMC card reader, HDMI and VGA display outputs, and RS232 serial (COM). The ridged metal body doubles up as a heatsink. Minus the antenna and stand, the system measures just 135 x 128 x 45 mm. Pricing and availability information is awaited.

Team Group Inc., a major NAND flash manufacturer in the world, presents the brand new iCF, SD industrial NAND flash cards, which feature not only highly efficient transmission speed, but also the complete compatibility with IPC and other embedded platform, also support multiple transmission modes and functions. In addition to unprecedented ultra high reading and writing speed, they provide guaranteed high durability and reliability for application programs crucial for IPC, medical equipment, military equipment, point of sales (POS) systems and game consoles.

Team Group understands the cries for industrial level memory cards in the demanding storage market, and in response comes up with the high performance and high volume industrial memory cards that meet wide temperature requirements. They read and write at 45/40MBpersec, and support for ECC dynamic and static wear leveling. The features of vibration resistance and low energy consumption provide excellent performance, compatibility and reliability for hand-held barcode scanners, POS terminals, wireless communication devices, embedded systems, medical computers, set-top boxes, monitoring system and hand-held GPS and other application devices requiring frequent data access.

Nearly a week after unveiling its first industrial-PC (IPC) motherboards, ASRock says it is vying for ODM orders from IPC makers. When well-marketed, IPC motherboards could substantially contribute to the company's revenue, since IPC motherboards have gross margins of at least 25%, higher than that of consumer PC motherboards.

ASRock targets motherboards for use in POS (point of sale) PCs, thin clients, kiosks, panel PCs, gaming PCs, signage and devices used in surveillance, information display and retail & hospitality, the company said. So far, the company scored orders from two ODMs, with shipments set to begin in Q2, 2012. ASRock aims to obtain ODM orders from IPC vendors such as Advantech, Adlink Technology and ICP Electronics, instead of competing with them for orders for system products, ASRock said. ASRock hopes that its IPC motherboard venture will benefit it starting 2013.