Intel is preparing to expand its NUC mini-PC product line into the rugged industrial PC and signage PC segments with the NUC 13 Rugged. These are characteried by an IP50 dust-resistant chassis that is fanless, and relies on an extruded aluminium body that doubles up as a heatsink. The PC has an operational ambient temperature range of 0°C to 50°C, making them fit for industrial PC (IPC), and digital signage use-cases.

The chassis has several features relevant to its specific form-factor that allow it to be deployed in the field over extended periods. The NUC 13 Rugged comes in three SoC options—Atom x7425E, x7211E, and N50, all three of which feature 6 W to 12 W TDP, and IPUs (infrastructure processing units). You also get a DDR5-4800 SO-DIMM slot, and connectivity that includes dual 2.5 GbE wired LAN, Wi-Fi 6E, 64 GB eMMC storage, an M.2-2280 NVMe slot, and provision for a 4G/5G MODEM. Intel is backing these with 3-year warranties, and assures market availability of 5 years (so companies planning large-scale deployments of these have a stable supply over that period).

Axelera AI, the provider of world's most powerful and advanced solutions for AI at the Edge today announces a strategic partnership with Advantech. Combining Advantech's expertise in the embedded and industrial PCs and Axelera AI's disruptive edge AI technology, together they will bring the inference power of a data center to edge devices, enabling customers to process data in real-time, reducing latency while increasing efficiency.

At Embedded World Axelera AI will show its new products, available in a range of industry-standard form factors varying from M.2 modules to vision ready systems. The products combine powerful processing performance with Metis AIPU technology and the easy-to-use Voyager SDK software stack, just at a fraction of the cost and power consumption of today's available solutions.

Today, Intel launched Intel Agilex 7 FPGAs with F-Tile, equipped with the fastest field-programmable gate array (FPGA) transceivers available on the market and designed to help customers address challenges across the most bandwidth-intensive areas of the data-centric world, including data centers and high-speed networks. Created with embedded, networking and cloud customers in mind, Intel's new F-Tile-enabled Agilex 7 FPGAs deliver flexible hardware solutions with industry-leading transceiver performance, delivering up to 116 gigabits per second (Gbps) and hardened 400 gigabit Ethernet (GbE) intellectual property (IP).

"Intel's Agilex 7 with F-Tile is loaded with transceivers that deliver more flexibility, bandwidth and data rate performance than any other FPGA on the market today. Together with Intel manufacturing and our supply chain resilience, we're delivering multiple industry-leading products and capabilities that our customers and the industry require to address a broad range of critical business needs," said Shannon Poulin, Intel corporate vice president and general manager of the Programmable Solutions Group.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

AAEON, a provider of elite embedded solutions, has expanded its line of fanless embedded box PCs powered by 12th Generation Intel Core /Celeron processors (formerly Alder Lake-P U15) with the release of the BOXER-6451-ADP. Boasting the smallest chassis of AAEON's trifecta of new box PCs utilizing the latest Intel technology, the BOXER-6451-ADP offers 10 cores and 12 threads of processing power in a compact 7.48" x 4.37" x 2.5" (190 mm x 111 mm x 63.5 mm) model. AAEON believe this will help to bring compact, flexible solutions such as smart kiosks and charging stations to market with ease.

Adding to the BOXER-6451-ADP's suitability to smaller deployment spaces is its innovative new heat dissipation framework, which has seen AAEON replace the tubular heat pipe typically used to conduct heat from a PC's CPU to its heatsink with a flattened pipe to both increase its conduction area and accelerate heat transfer. This enables the system to maintain thermal regulation during periods of high workloads.

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Today during the Six Five Summit, Intel unveiled its vision for the infrastructure processing unit (IPU), a programmable networking device designed to enable cloud and communication service providers to reduce overhead and free up performance for central processing units (CPUs). With an IPU, customers will better utilize resources with a secure, programmable, stable solution that enables them to balance processing and storage.

"The IPU is a new category of technologies and is one of the strategic pillars of our cloud strategy. It expands upon our SmartNIC capabilities and is designed to address the complexity and inefficiencies in the modern data center. At Intel, we are dedicated to creating solutions and innovating alongside our customer and partners—the IPU exemplifies this collaboration," said Guido Appenzeller, chief technology officer, Data Platforms Group, Intel.