Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

Jonsbo rolls out two new Mini-ITX cases that squeeze a lot of features into just 4.54 liters. The N10 and NV10 models make the most of tight spaces, with each box measuring 205×205×108 mm. These small cases made of aluminium, take different paths to use space. The N10 caters to people who need lots of storage, with enough space for four 2.5-inch drives, kept cool by two 40x20 mm fans at the back running at 5000 RPM. Its counterpart, the NV10, swaps drive and back-fan room for graphics muscle fitting half-height dual-slot GPUs up to 190 mm long and offering PCIe 4.0 extension cable support.

The twins boast top-notch build quality combining 3.3 mm aluminium alloy with 1.0 mm steel plating. This results in a strong yet light frame, N10 weights 1.6 kg, while NV10 just 1.5 kg. Both cases can fit 1U Flex power supplies under 150 mm and CPU coolers up to 38 mm in height. Flexibility is a key selling point, as users can place both models upright or on their side to match different desk layouts. Even with their tiny sizes, these cases manage airflow well enough to handle their intended tasks, whether as small workstations or specialized setups.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, today announced its lineup of new NVIDIA GeForce RTX 50 Series graphics cards. The new iGame GeForce RTX 50 Series graphics cards feature the redesigned Vulcan, Neptune, Advanced, and Ultra W models - featuring improvements in aesthetics and cooling.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

ASRock announces a full line-up of motherboards using the AMD B850 chipset. New products include high-end Phantom Gaming series line up covering Mini-ITX to ATX form factor, mainstream Steel Legend which features white PCB design and also Pro RS series for budget friendly users.

Ready to Power Everything!
The new ASRock B850 motherboards are designed with 14+2+1 power phase, 8-layer PCBs enabling excellent memory overclocking and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. The boards also support the latest PCI-Express Gen-5 Graphics card and equipped with Blazing M.2 (Gen5x4) SSD ports.

Earlier today, ASUS uploaded a first sneak peek of several upcoming AMD AM5 motherboards—which we assume will feature the B850 and B840 chipsets—which according to the post on Facebook, will be launching within a couple of weeks. The boards will most likely be on display at CES, which kicks off on the 7th of January. The picture is obfuscated for obvious reasons, but what is clear is that there will be several different SKUs from all of ASUS' typical sub-brands such as TUF Gaming and ROG.

What we can also make out is that there will be at least one Mini-ITX board and one micro-ATX board, with the latter being the TUF Gaming branded board. We tried to clean up the picture a bit, but ASUS has managed to hide all details of possible models names and most of the text is kind of hard to make out. Nothing really sticks out in terms of features, although it's clear we'll end up seeing some higher-end B850 boards, judging by the fact that there are at least three ROG Strix SKUs coming. The question is if there's a market for these boards, considering the B850 chipset is pretty much the same as the B650E chipset, but with optional PCIe 5.0 support for the M.2 slots and no USB4, unlike its X870 counterpart.

Update Jan 1st: ASUS posted a picture of their upcoming mid-range Intel boards on Facebook as well, but as with the AMD boards, ASUS obfuscated the image, although not quite as badly this time around. For its Intel lineup, there's also a lower-end Prime board included, in addition to the TUF Gaming and ROG Strix boards. ASUS didn't reveal any launch window for the Intel boards.

Antec Inc., a global leader in high-performance computer components and accessories, is proud to announce the launch of the Antec Performance 1 M Aluminium ITX Gaming Case. This latest addition to Antec's chassis lineup combines compact design with cutting-edge modern style, delivering a jaw dropping ITX case that's perfect for modern, high-performance PCs.

Optimal airflow and aesthetics
Perforated panels keep your system cool with a refined modern touch. Engineered for quiet confidence and clean style.

Chinese OEM brand Erying presented its first AMD-based motherboard, the Alkiad B650 ITX D5. The overall design of the Erying Alkiad B650 ITX D5 sports a white PCB with black components and is equipped with an EPS 8-pin power connector alongside a 24-pin ATX connector. 5 V ARGB connectors are included for those who cannot live without a colorful build. The VRM is based on an 8+2+1 phase power delivery design and covered by a decent heatsink, more than enough for a budget AM5 65 W platform in a standard ITX 170 x 170 mm format.

The Alkiad B650 ITX D5 motherboard has 2 DDR5 DIMM memory slots, supports 6400+ (OC) MT/s, and Intel XMP 3.0 / AMD EXPO profiles. The Erying motherboard offers 1x PCIe 4.0 ×16 and 1x PCIe 4.0 ×4 M.2 slots, and 4x SATA III ports while the Realtek RTL8125BG provides 1x 2.5GbE RJ45 connectivity. The rear I/O panel offers 4x USB 2.0, 3x USB-A 5 Gbps and 1x USB-C 10 Gbps ports, 1x DP and 1x HDMI connectors and the usual audio combo (one S/PDIF and a pair of 3.5 mm). The motherboard comes before AMD's expected expansion of its Ryzen 9000 series "Granite Ridge" desktop processor family in Q1 2025 with new 65 W CPU models and the introduction of the AMD B850 chipset. There is no exact information yet regarding pricing and availability.

Jetway JPIC-ADN1 is a compact 2.5" Pico-ITX motherboard powered by the Intel Processor N97. It supports up to 32 GB of DDR5-4800 MHz memory, making it capable of handling demanding workloads. With its versatile I/O options, including 6x USB ports, 2x Serial ports, 1x B+M-Key M.2 slot, 1x E-Key M.2 slot, and 1x SATA3 port, the JPIC-ADN1 is ideal for a variety of applications, it's ready to handle even the most demanding tasks.

The JPIC-ADN1's compact design and efficient Alder Lake-N processor make it perfect for edge computing and IoT gateway applications. Its powerful processing and expansion capabilities enable seamless data processing, communication, and remote management in industrial IoT solutions.

ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new AmITX Mini-ITX motherboards, a range of compact form factor motherboards sporting the latest Intel technology for high-performance computing. The new AmITX series supports processor options ranging from low power consumption Intel N97 to high-performance 14/13/12th generation Intel Core i9/i7/i5/i3 and includes features such as PCIe 5.0 x16, 2.5 Gbe, DDR5, USB 3.2 Gen 2, and M.2 B/E/M Key to suit applications in smart city, smart manufacturing, and smart medicine.

The Mini-ITX motherboards in the AmITX series boast 2.5GbE LAN for ultra-fast data connectivity, USB 3.2 Gen 2 to connect with other devices, M.2 B/E/M Key slots for SSD, and wireless cards, and RS-232/422/485 to connect with machine components. The high-performance computing AmITX-RL-I supports 14/13/12th Gen Intel Core i9/i7/i5/i3 processors up to 65 W TDP, up to 64 GB of DDR5 4800 MHz memory, and has a PCIe 5.0 x16 slot for a GPU card. The low power consumption AmITX-ALN has an Intel N97 processor with 12 W ultra-low power, supports up to 32 GB of DDR4 3200 MHz memory, and has a PCIe 3.0 x1 slot.

In Win Development Inc. (InWin), a leading innovator in PC hardware has announced the F3 mini tower, which combines aesthetics and practicality for mini ITX and micro ATX builds. This compact enclosure supports the latest trend of motherboards featuring backside connections (ASUS BTF or MSI Project Zero), ensuring the cleanest-looking PC. The front panel consists of mesh windows to enhance cooling directly to the internal components. The F3 utilizes a minimalist approach with its stunning SECC steel and tempered glass materials but also simplifies assembly with a screw-free, unobtrusive design. Choose between black or white variants with wooden accents on the white edition.

Build Big. Stay Compact.
Motherboards with different backside connector placements will not be an issue within the InWin F3 since multi-orientation brackets are available on the motherboard tray. Four PCI-Express slots are available for graphics cards with extra-large heatsinks, supporting up to 340 mm long. The F3 is compatible with NVIDIA's new SFF-ready sizing guidelines to make component compatibility easier for DIY PC builders. The compact enclosure allows CPU heatsinks up to 160 mm tall or radiator support up to 240/280 mm on top for liquid cooling setups. ATX power supplies up to 160 mm long are installed behind the front panel as a space-saving design. The front I/O includes USB 3.2 Gen 2x2 Type-C, two additional USB 3.2 Gen 1 Type-A ports, and a 3.5 mm HD audio combo jack (CTIA).

Designed by Dan Hansen and engineered by Lian Li, the new DAN Case Wooden Edition takes everything great about the DAN Case A3 series, including the minimalist design and small form factor, and adds elegant wooden features to elevate any gaming set up.

Minimalist Exterior
The standout feature for the Lian Li DAN Case A3 is the front panel. While the current range hosts a solid plastic panel with a sleek geometric design, the new Wooden Edition swaps out the plastic for wooden slats over the fine mesh. This creates a touch of warmth to the minimalist case whilst keeping an optimized design for cooling.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the Shark X, a groundbreaking pre-built PC that redefines the boundaries between performance, design, and art. The Shark X delivers an exceptional computing experience while standing as a bold statement piece inspired by the ocean's mightiest and most efficient predator.

"The Shark X is not just a high-performance PC—it's a masterpiece that brings art and technology together, reflecting Cooler Master's commitment to innovative design and engineering," said Jimmy Sha, CEO of Cooler Master.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

Industry leader AAEON has expanded its RISC computing product portfolio with the release of the SRG-IMX8PL and PICO-IMX8PL, a Mini PC and 2.5" PICO-ITX board, respectively. Both products are powered by the NXP i.MX 8M Plus platform, featuring a quad-core Arm Cortex -A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.

Built to provide cost-efficient IoT Gateway solutions in rugged environments, the SRG-IMX8PL and PICO-IMX8PL both offer wide temperature ranges of -40°C to 80°C with the use of a fanless heatsink, a 9 V to 36 V power input range. The SRG-IMX8PL Mini PC also features enhanced shock, drop, and vibration resistance. Dual LAN ports with IEEE 1588 and TSN capabilities, alongside Wi-Fi and 4G module support via M.2 2230 E-Key and full-size mini card, provide each device with broad connectivity options for industrial IoT use. Additionally, both the PICO-IMX8PL and SRG-IMX8PL support a wide range of operating systems, including Debian 11, Android 13, Windows 10 IoT, and Yocto, as well as data communication protocols such as Modbus, MQTT, and OPC Unified Architecture (OPC UA).

Premier embedded computing provider AAEON (Stock Code: 6579), has announced the release of the PICO-MTU4, the smallest single-board computer to host the new Intel Core Ultra Processor platform. On the ultra-small 100 mm x 72 mm PICO-ITX form factor, the PICO-MTU4 leverages the disaggregated die design, hybrid CPU core architecture, and integrated VPU of the Intel Core Ultra series for a multi-thread performance increase of up to 24%, with a 50% reduction in SoC power consumption.
The board is available in SKUs featuring both Intel Core Ultra 7 and 5 Processors, all with a TDP of 15 W, maxing out at a total of 12 cores (2 P-cores, 8 E-cores, and a further 2 Low Power E-cores) and 14 threads of processing power.

Equipped with LPDDR5x, two LAN ports (2.5GbE and 1GbE), two USB 3.2 Gen 2 ports, and a variety of serial interfaces for industrial protocols like dual COM for RS-232/422/485, a 4-bit GPIO, and SMBus, AAEON have indicated the board will target the advanced industrial robotics market, with SCADA, MES, and system monitoring devices singled out as particularly suitable uses.

VIA Technologies, Inc., a leading innovator in the development of embedded platforms and systems, today announced the launch of three new high-performance edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.

"These new platforms represent a significant leap forward in edge AI technology," said Epan Wu, General Manager, VIA Intelligent Solutions. "With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications."

AAEON, a leading provider of compact embedded solutions, has announced two new additions to its RISC computing line: the PICO-AM62, a single board built on the PICO-ITX form factor, and the SRG-AM62, its RISC Gateway system counterpart. Both the PICO-AM62 and SRG-AM62 represent a new approach from AAEON's RISC Computing Division, powered by Texas Instruments AM62x Sitara Processors. These processors consist of a quad-core Arm Cortex -A53 CPU, single-core Arm Cortex -M4F MCU, and integrated GPU support.

The new product line stands out for its cost-efficiency and reliability. Both the PICO-AM62 single-board and the compact SRG-AM62 Gateway System are available in SKUs with a wide temperature tolerance of -40°C to 85°C and a power input range of 9 V to 36 V. The products are based on Texas Instruments processors, which are highly scalable and have a 20-year lifespan. This influenced AAEON's vendor choice and should attract customers looking for cost-effective, durable IoT solutions. The environmental ruggedness of both the PICO-AM62 and SRG-AM62 makes them well-suited for deployment in challenging environments, such as in-vehicle digital clusters or industrial applications.

A market research of AMD Socket AM5 motherboards sold in South Korea by Danawa, provide some interesting insights on how gamers approach the platform. This research is confined to Korea, but can be extrapolated to other similar markets. The research studies the chipset model, and form-factor of Socket AM5 motherboards sold in the market. The most interesting finding of the research is that the AMD B650 is by far the most popular chipset for the platform, dwarfing even the entry-level A620 chipset by a factor of 8. A staggering 80% of the Socket AM5 motherboards being sold are based on the B650.

It's important to note here, that this figure does not include the B650E, which is separately shown making up just 2% of the volumes. The B650 (non-E) has nearly all platform features, with motherboards based on the chipset providing at least one Gen 5 M.2 NVMe slot that doesn't eat into the lanes of the x16 PEG slot; and with the current generation of GPUs not featuring the PCIe Gen 5 host interface, customers seem more than happy with the Gen 4 x16 PEG slot provided by B650 motherboards. What's more, you get CPU overclocking and memory overclocking on this mid-range chipset, so it appeals to a very wide demographic. The B650E, on the other hand, provides a Gen 5 x16 PEG slot, and motherboards based on this chipset tend to offer premium I/O features, such as a high-end onboard audio solution, premium wireless networking, among others.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is proud to release The Tower 600 Mid Tower Chassis supporting ATX hidden-connector motherboards and The Tower 250 Mini Chassis designed for ITX motherboards. The Tower series is one of the most popular cases with a classic vertical case design. The additions allow The Tower series to accommodate a more diverse range of motherboards. Furthermore, both chassis have a distinctive octagonal appearance and can be placed horizontally with an additional Chassis Stand Kit, making your PC configuration a spotlight!

The Tower 600 Mid Tower Chassis
The Tower 600 Mid Tower Chassis is the largest model of The Tower series, ideal for enthusiasts pursuing powerful next-gen hardware and maximum cooling support. It is available in Black, Snow, Matcha Green, and Hydrangea Blue editions, perfectly fitting any scenario.

ALmordor is a Chinese case PC hardware maker focusing on providing sleek-looking aliminium PC cases. Coming from the name that stands for AL (aluminium) and Mordor (from J. R. R. Tolkien's fictional world), the ALmordor brand wants to be seen as an elegant and mysterious. On display, there were several interesting case builds like the SliverLining 160G ITX case, which serves as a dual-chamber ITX build capable of water cooling. Capable of supporting a 320 mm GPU and 240 mm water cooling radiator, the SilverLining 160G can hold an SFX PSU and an HDD attached next to it. Storage options include SSD expansion next to the motherboard.

Inside the G.Skill booth at Computex 2024, we spotted three new case models. The first case that draws attention is a prototype/concept, named Project Alpha it comes with unique shapes and ATX/BTX form factor conversion on the fly. The next two cases are Mid-towers, G351 and M5 Vision respectively, both supporting EATX, ATX, Micro-ATX, Mini-ITX motherboards and featuring large glass panels with a note about G351 wooden front connectors panel that make it look more stylish.

Alongside full support for water cooling systems (360 / 260 / 240 / 140 / 120), you can fit 9 fans on G.Skill G351 and a whooping 11 fans on M5 Vision. We cannot say for sure when and if the Project Alpha concept case will be available, the other two should arrive in stores later this year.More pictures follow.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, launches the SUP-01, a small tower case that revolutionizes the conventional layout of standard PCs. Engineered with three distinct airflow chambers, each dedicated to essential components—GPU, CPU's AIO, and motherboard. The SUP-01 positions the GPU at the center of the front panel on a fully adjustable bracket, and accommodates up to a 360 AIO behind the motherboard tray for enhanced cooling efficiency. A non-tinted tempered glass panel on the left side offers a clear view of the main chamber which supports up to regular ATX motherboards and ATX back-connect motherboards, and the PCIe riser bracket with built-in diffused LED strips. Additional LED strips decorate the top edge of the PSU chamber along both the left and front sides of the case. Available in black and white, the SUP-01 retails at an MSRP of $149.99.

The SUP-01, with its compact 45-liter enclosure, challenges traditional PC designs by offering a smaller footprint without compromising high-end hardware compatibility. By integrating only the core components, users can swiftly assemble a thermally efficient computer comparable to the LANCOOL 216. Placing the GPU in an upright position at the front of the case enables fresh air intake for optimal GPU performance. The adjustable bracket allows precise positioning of the GPU, both vertically and horizontally, maximizing airflow and aesthetics. The SUP-01 features LED strips along the front and left side of the case, along with an additional strip on the PCIe riser bracket. These strips can be conveniently controlled via the built-in Mode and Color buttons, offering six preset modes and eleven colors for customization.

The PICO-ITX, a compact embedded single-board computer (SBC) based on a 100 mm x 72 mm form factor, serves as a more space-efficient alternative motherboard, ensuring a broad range of interfaces on a more readily deployable board.

GIGAIPC's PICO-G350A (Yocto OS) / PICO-G350B (Android OS) are the first Pico-ITX boards to feature an ARM SoC, powered by MediaTek MT8365 Arm Quad-Core Cortex -A53, to provide incredible energy efficiency and outstanding low power consumption that demonstrates impressive performance. Featuring a ruggedized design, it operates reliably across a wide temperature range from 0 to 60°C. Designed with flexibility and rich on-board interfaces, including USB 2.0 (hot and USB OTG), Micro SD expansion slots, and M.2 2230 E-Key for AW-CB451NF-D wifi module support, this solution is tailored to accommodate various application scenarios, such as smart retail, self-service terminals, industrial automation, intelligent medical health, and digital media.