IBM has announced the expansion of the their Cloud Security and Compliance Center, a suite of modernized cloud security and compliance solutions designed to help enterprises mitigate risk and protect data across their hybrid, multicloud environments and workloads. As clients look for ways to address new threats across the supply chain and manage evolving global regulations, the solution suite helps to support their resiliency, performance, security, and compliance needs while helping to minimize operational costs.

"IBM Cloud has a long history of working with clients in financial services and other highly regulated industries, especially when it comes to helping them to drive innovation while protecting their sensitive data," said Rohit Badlaney, General Manager, IBM Cloud Product and Industry Platform. "The expansion of the IBM Cloud Security and Compliance Center demonstrates our continued focus on industry-specific capabilities that help address real world business challenges for our clients. For example, clients have the ability to utilize the IBM Cloud Framework for Financial Services, which can help them address evolving rules, laws and regulations surrounding cloud risk. The new capabilities showcase our commitment to supporting clients on their hybrid cloud modernization journeys, designed for security, compliance, privacy, and trust at the forefront of our product roadmap."

With sequential IC sales declines beginning to moderate, the global semiconductor industry appears to be nearing the end of a downcycle and is expected to begin to recover in 2024, SEMI, in partnership with TechInsights, reported in the Semiconductor Manufacturing Monitor. In Q3 2023, electronics sales are projected to post healthy quarter-on-quarter growth of 10%, while memory IC sales are expected to log double-digit growth for the first time since the downturn started in Q3 2022. Logic IC sales are predicted to remain stable and improve as demand gradually recovers.

Headwinds will continue for the semiconductor manufacturing sector in the second half of the year, SEMI and TechInsights reported. Drawdowns of high inventory at integrated device manufacturer (IDM) and fabless companies will continue to suppress fab utilization rates to much lower levels than those in the first half of 2023. The weakness is projected to extend declines in capital equipment billings and silicon shipments for the rest of the year despite stable results in the first half of 2023.

The Council has today approved the regulation to strengthen Europe's semiconductor ecosystem, better known as the 'Chips Act'. This is the last step in the decision-making procedure. The Chips Act aims to create the conditions for the development of a European industrial base in the field of semiconductors, attract investment, promote research and innovation and prepare Europe for any future chip supply crisis. The programme should mobilise €43 billion in public and private investment (€3.3 billion from the EU budget), with the objective of doubling the EU's global market share in semiconductors, from 10% now to at least 20% by 2030.

With the Chips Act, Europe will be a frontrunner in the world semiconductors race. We can already see it in action: new production plants, new investments, new research projects. And in the long run, this will also contribute to the renaissance of our industry and the reduction of our foreign dependencies. - Héctor Gómez Hernández, Spanish Minister for Industry, Trade and Tourism

According to various news sources, CEOs from Intel, NVIDIA and Qualcomm have been holding meetings with representatives of the US government—with the topic of discussion reportedly being the escalation of semiconductor import restrictions placed on China. AMD was notably absent from Monday's proceedings, due to Dr. Lisa Su attending to business matters in Taiwan. Commerce Secretary Gina Raimondo, National Economic Council director Lael Brainard and National Security Council director Jake Sullivan were alleged to have met with industry leaders.

Chipmakers have expressed worry about new restrictions coming into effect within the next couple of week—the latest negotiations could have touched on some sort of provision for leading silicon manufacturers. The US government believes that by limiting China's access to cutting-edge technology, it will bolster national security interests—with the Chinese military not being able to develop competitive defense systems. The Semiconductor Industry Association stated on Monday that: "overly broad, ambiguous and at times unilateral restrictions risk diminishing the US semiconductor industry's competitiveness, disrupting supply chains, causing significant market uncertainty and prompting continued escalatory retaliation by China." Intel, NVIDIA and Qualcomm did not provide any comments to press outlets following the conclusion of their meetings with senior government officials. It is speculated that Qualcomm is set to lose the most trade following the implementation of stricter rules—Bloomberg proposes that 60% of the firm's business revenue comes from Chinese territories.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

Samsung Electronics today announced its new digital signage lineup at InfoComm 2023, North America's largest audiovisual trade show, taking place in Orlando, Florida from June 14 to 16. "Technology is a vital part of any business, and the innovative signage lineup we're showcasing at InfoComm empowers businesses across industries to grow," said Hoon Chung, Executive Vice President of Visual Display Business at Samsung Electronics. "The newest addition to The Wall lineup is especially exciting, making production faster and easier in TV, film and other creative industries."

Introducing The Wall for Virtual Production
At InfoComm, Samsung unveiled a new dedicated display, The Wall for Virtual Production (IVC Model), which will be available globally starting from today. Virtual production studios can use ultra-large LED walls to create virtual content, integrating them with real-time visual effects technology to reduce the time and cost of content production. The Wall for Virtual Production leads the market in the application of this technology. The Wall for Virtual Production's LED display features pixel pitch options of P1.68 and P2.1, dedicated studio frame rates (23.976, 29.97 and 59.94 Hz) and genlocking, which can synchronize the screen with a camera's video signal. The display also boasts a refresh rate of up to 12,288 Hz, a max brightness of 1,500nits, a 35,000:1 fixed contrast ratio (for P2.1) and up to 170-degree wide viewing angles. All these new features combine to enable an unprecedented level of picture quality for virtual content.

TrendForce reports a dramatic 21.2% QoQ decline in Q1 revenues for the DRAM industry, bringing total revenue down to US$9.663 billion. This significant dip represents the third consecutive quarter where revenues have fallen. A closer look reveals that increased shipment volumes were exclusive to Micron, with other suppliers noting a decrease. The ASP fell for all three major suppliers. An enduring oversupply issue, which has led to an ongoing slump in prices, is the chief culprit behind the decline. Nevertheless, the industry expects a gradual slowing in the rate of price decline following planned production cuts. TrendForce's Q2 forecast suggests a rise in shipments, but the ongoing price fall might limit potential revenue growth.

Each of the three major suppliers—Samsung, Micron, and SK hynix—reported a drop in quarterly revenue. Samsung saw a decline in both shipment volumes and ASP due to fewer orders for its newly launched devices, resulting in a QoQ decrease in revenue of 24.7%, amounting to about US$4.17 billion. Benefiting from its earlier financial reporting and the tail-end orders of the previous year, Micron climbed to the second position in 1Q23. Despite being the only supplier among the big three to record positive shipment growth, Micron couldn't avoid a minor 3.8% revenue decline, taking its total down to US$2.72 billion. SK hynix faced the steepest decline, with more than a 15% drop in both shipment volume and ASP, leading to a drastic 31.7% plunge in revenue, amounting to approximately USD$2.31 billion.

The bipartisan Protecting Circuit Boards and Substrates Act of 2023 introduced by Representatives Blake Moore (R-UT-1) and Anna Eshoo (D-CA-16) finishes the job the CHIPS Act began by incentivizing investment in the domestic printed circuit board (PCB) industry. This bill is a necessary follow-on to the CHIPS Act: without a trusted, reliable domestic source of PCBs and substrates, computer chips don't connect to end use electronic devices.

Domestic PCB production shrunk over the past 20 years, falling from 30% to barely 4% of the world's supply. Ninety percent of the world's supply now comes from Asia…56% in China alone.

The NAND memory industry is not in great shape at the moment, with the big three (Micron, Samsung, SK Hynix) having reported significant financial losses in this area recently. If you include Kioxia and Western Digital as part of this collective picture, a grand total of over $10 billion has been lost in the flash memory segment. According to DigiTimes Asia this week, Pua Khein-Seng - the chief executive officer of Phison Electronics Corporation - has warned that parts of the industry could collapse due to potential company bankruptcies.

Khein-Seng informed attendees at a press conference that forced NAND price cuts are not feasible in the current market environment, and that supply chains could be affected if related companies start to shutdown - due to operational losses. He expects 3D NAND manufacturers to cutback on output in order to soften the market, and unit price increases are also a possibility. Phison has experienced a drop in revenues for the first quarter of 2023, but the CEO insists that his company is not willing to cutback on research and development costs - 80% of its annual expense budget will be invested in future projects. Khein-Seng states that rival companies have reduced spending on R&D by 20%, yet Phison remains committed to its clients by providing cutting edge technology (for example the E26 SSD memory controller).

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $119.5 billion during the first quarter of 2023, a decrease of 8.7% compared to the fourth quarter of 2022 and 21.3% less than the first quarter of 2022. Sales for the month of March 2023 increased 0.3% compared to February 2023. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

"Semiconductor sales continued to slip during the first quarter of 2023 due to market cyclicality and macroeconomic headwinds, but month-to-month sales were up in March for the first time in nearly a year, providing optimism for a rebound in the months ahead," said John Neuffer, SIA president and CEO. Regionally, month-to-month sales increased in Europe (2.7%), Asia Pacific/All Other (2.6%), and China (1.2%), but decreased in Japan (-1.1%) and the Americas (-3.5%). Year-to-year sales decreased across all regions: Europe (-0.7%), Japan (-1.3%), the Americas (-16.4%), Asia Pacific/All Other (-22.2%), and China (-34.1%).

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.

According to TrendForce's latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts takes time as well. Hence, only some tier-2 and -3 foundries were able to immediately respond to the changes in their clients' demand. Also, among them, 8-inch wafer foundries made a more pronounced reduction in their capacity utilization rates. As for the remaining foundries, the downward corrections that they made to their capacity utilization rates did not become noticeable until 4Q22. Hence, in 4Q22, the quarterly total revenue of the global top 10 foundries registered a QoQ decline for the first time after 13 consecutive quarters of positive growth. The quarterly total revenue of the top 10 foundries came to US$33,530 million, reflecting a drop of 4.7% from 3Q22. Moving into 1Q23, TrendForce projects that the quarterly total revenue of the top 10 will show an even steeper drop on account of seasonality and the uncertain macroeconomic situation.

Today, Intel launched Intel Agilex 7 FPGAs with F-Tile, equipped with the fastest field-programmable gate array (FPGA) transceivers available on the market and designed to help customers address challenges across the most bandwidth-intensive areas of the data-centric world, including data centers and high-speed networks. Created with embedded, networking and cloud customers in mind, Intel's new F-Tile-enabled Agilex 7 FPGAs deliver flexible hardware solutions with industry-leading transceiver performance, delivering up to 116 gigabits per second (Gbps) and hardened 400 gigabit Ethernet (GbE) intellectual property (IP).

"Intel's Agilex 7 with F-Tile is loaded with transceivers that deliver more flexibility, bandwidth and data rate performance than any other FPGA on the market today. Together with Intel manufacturing and our supply chain resilience, we're delivering multiple industry-leading products and capabilities that our customers and the industry require to address a broad range of critical business needs," said Shannon Poulin, Intel corporate vice president and general manager of the Programmable Solutions Group.

TrendForce's recent analysis of the foundry market reveals that demand continues to slide for all types of mature and advanced nodes. The major IC design houses have cut wafer input for 1Q23 and will likely scale back further for 2Q23. Currently, foundries are expected to maintain a lower-than-ideal level of capacity utilization rate in the first two quarters of this year. Some nodes could experience a steeper demand drop in 2Q23 as there are still no signs of a significant rebound in wafer orders. Looking ahead to the second half of this year, orders will likely pick up for some components that underwent an inventory correction at an earlier time. However, the state of the global economy will remain the largest variable that affect demand, and the recovery of individual foundries' capacity utilization rates will not occur as quickly as expected. Taking these factors into account, TrendForce currently forecasts that global foundry revenue will drop by around 4% YoY for 2023. The projected decline for 2023 is more severe when compared with the one that was recorded for 2019.

According to TrendForce's research, the total revenue of the global top 10 foundries rose by 6% QoQ to US$35.21 billion for 3Q22 as the release of the new iPhone series during the second half of the year generated significant stock-up activities across Apple's supply chain. However, the global economy shows weak performances, and factors such as China's policy on containing COVID-19 outbreaks and high inflation continue to impact consumer confidence. As a result, peak-season demand in the second half of the year has been underwhelming, and inventory consumption is proceeding slower than anticipated. This situation has led to substantial downward corrections to foundry orders as well. For 4Q22, TrendForce forecasts that the total revenue of the global top 10 foundries will register a QoQ decline, thereby terminating the boom of the past two years—when there was an uninterrupted trend of QoQ revenue growth.

Regarding individual foundries' performances in 3Q22, the group of the top five was led by TSMC, followed by Samsung, UMC, GlobalFoundries, and SMIC. Their collective global market share (in revenue terms) came to 89.6%. Most foundries were directly impacted by clients slowing down their stock-up activities or significantly correcting down their orders. Only TSMC was able to make a notable gain due to Apple's strong stock-up demand for the SoCs deployed in this year's new iPhone models. TSMC saw its revenue rise by 11.1% QoQ to US$20.16 billion, and the corresponding market share expanded to 56.1%. The growth was mainly attributed to the ≤7 nm nodes, whose share in the foundry's revenue had kept climbing and reached 54% in the third quarter. Conversely, Samsung actually experienced a slight QoQ drop of 0.1% in foundry revenue even though it had also benefited from the component demand related to the new iPhone series. Partially impacted by the weakening of the Korean won, Samsung's market share fell to 15.5%.

ASUS today announced the opening of its first AI-enabled smart factory. The facility is powered by a variety of AIoT technologies, including a 3D Digital Twin system, an augmented reality (AR) platform, autonomous mobile robots (AMR) for in-factory logistics, as well as an AI-driven defect inspection system. All of this will help achieve ASUS Industry 4.0 goals, increasing manufacturing efficiency and improving ESG outcomes.

Albert Chang, ASUS Corporate Vice President and Co-Head of the AIoT Business Group, explained the importance of the new factory:
"In 2018, our Chairman Jonney Shih started ASUS on a new journey to become a company that transforms and evolves, trusts in radical truth and transparency, embraces idea meritocracy, and fosters collective wisdom. The opening of our first AI-enabled smart factory is a significant milestone in our company transformation and showcases our solid integrated capabilities, from software to hardware, that we offer to our clients and suppliers."

onsemi, a leader in intelligent power and sensing technologies, today celebrated the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech Republic. Multiple guests of honor attended the ribbon cutting ceremony led by Ministry of Industry and Trade Section Chief Zbyněk Pokorný, Governor of the Zlín Region Radim Holiš and City Mayor Jiří Pavlica as well as other local governmental dignitaries, signifying the importance of this event and manufacturing of semiconductors in the Czech Republic.

Starting in 2019, onsemi added SiC polished wafer and SiC epitaxy (EPI) wafer production to its existing silicon polished and epitaxy wafer and die manufacturing in Roznov. Having outgrown the original site, reconstruction of a new building began last year to further expand wafer and SiC EPI manufacturing. Over the next two years, this expansion will increase the site's SiC production capabilities by 16 times and create 200 jobs by the end of 2024. So far onsemi has invested more than $150 million in the Roznov site and plans to spend an additional $300 million through 2023. onsemi was recently awarded the Association for Foreign Investments (AFI) Prize for Significant Contribution in the Field of Investment for its SiC investments in the Czech Republic.

Committed to providing innovative embedded solutions, AAEON has introduced the RBX-I2000, its first autonomous robot controller. The RBX-I2000 utilizes hardware-integrated time synchronization to obtain a substantial improvement on existing outdoor autonomous mobile robot technology, being the first of its kind to do so.

Powering its sophisticated mechanism is the 11th Generation Intel Core i7/i5/i3/Celeron Processor SoC, which boasts 4 cores and 8 threads for accurate algorithmic processing. Such an advanced processing unit means the RBX-I2000 is equipped with the power necessary for hardware-based time synchronization, which is channeled via an I/O featuring four 1PPS and ToD output ports to improve sensor fusion on two connectors.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced the launch of its X1 controller based solid state drive (SSD) platform that delivers the industry's most advanced enterprise SSD solution. Engineered with Phison's technology to meet the evolving demands of faster and smarter global data-center infrastructures, the X1 SSD platform was designed in partnership with Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions. The X1 SSD customizable platform offers more computing with less energy consumption. With a cost-effective solution that eliminates bottlenecks and improves quality of service, the X1 offers more than a 30 percent increase in data reads than existing market competitors for the same power used.

"We combined Seagate's proprietary data management and customer integration capabilities with Phison's cutting-edge technology to create highly customized SSDs that meet the ever-evolving needs of the enterprise storage market," said Sai Varanasi, senior vice president of product and business marketing at Seagate Technology. "Seagate is excited to partner with Phison on developing advanced SSD technology to provide the industry with increased density, higher performance and power efficiency for all mass capacity storage providers."

According to TrendForce, market conditions in 1H22 were chaotic and there was disparate demand for chips of varying functionality. Given the global development of electronic devices and power systems, overall demand for power management ICs (PMIC) is still relatively good. PMICs are used in consumer electronics, communications, computing, industrial control, automotive and other fields. In 2H22, supply and demand gradually diverged and demand for automotive Switching Regulators, Multi Channel PMICs was strongest.

According to TrendForce, there are various specifications and types of PMICs, including Linear Regulators, etc. Even usage scenario dependent products such as Battery Charging & Management, Voltage References, and USB Power Delivery ICs all fall into this category.

Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report. Fab equipment investment in 2023 is expected to remain strong.

"The global semiconductor equipment industry remains on track to cross the $100 billion threshold for the first time as shown in our latest update of the World Fab Forecast,"said Ajit Manocha, president and CEO of SEMI. "This historic milestone puts an exclamation point on the current run of unprecedented industry growth."

Ayar Labs, the leader in chip-to-chip optical connectivity, today announced that the company has secured $130 million in additional financing led by Boardman Bay Capital Management to drive the commercialization of its breakthrough optical I/O solution. Hewlett Packard Enterprise (HPE) and NVIDIA entered this investment round, joining existing strategic investors Applied Ventures LLC, GlobalFoundries, Intel Capital, and Lockheed Martin Ventures. Other new strategic and financial investors participating in the round include Agave SPV, Atreides Capital, Berkeley Frontier Fund, IAG Capital Partners, Infinitum Capital, Nautilus Venture Partners, and Tyche Partners. They join existing investors such as BlueSky Capital, Founders Fund, Playground Global, and TechU Venture Partners.

"As a successful technology-focused crossover fund operating for over a decade, Ayar Labs represents our largest private investment to date," said Will Graves, Chief Investment Officer at Boardman Bay Capital Management. "We believe that silicon photonics-based optical interconnects in the data center and telecommunications markets represent a massive new opportunity and that Ayar Labs is the leader in this emerging space with proven technology, a fantastic team, and the right ecosystem partners and strategy."

As industries compete to capitalize on the abundance of data generated by intelligent, connected devices, implementation of an intelligent data strategy has become even more critical. Edge computing has played an instrumental role to address this demand, but the edge itself has continued to evolve with the ever-growing need for even more demanding, real-time computing. Rugged edge computing enables applications that require real-time, low latency data processing and storage to function reliably in volatile environments that are not friendly to regular systems.

Trends and technologies such as Industry 4.0, AIoT, and 5G are driving the need for improved intelligence at the rugged edge. Businesses and organizations want more computing power at the edge because of the benefits it provides to their operations. NVM Express (NVMe) is an essential enabling technology for rugged edge computing, reducing latency and accelerating data processing to the point where connected devices can operate anywhere to perform machine learning, artificial intelligence, and inference computing. Real-time data access and analytics are turning rugged edge computing into a competitive necessity across all sectors and industries.

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.