Thermalright today rolled out the AXP90-X36 Black, a low-profile, top-flow CPU cooler. If you're having a sense of deja vu right now, it's probably because of the recent launch of the AXP90-X53 Black, a slightly taller cooler from the brand that looks similar. The numerals in the model names are key here. The "90" denotes fan diameter in mm, while the "36" denotes the cooler's height of just 36 mm. The older AXP90-X53 Black is 53 mm-tall.

The new AXP90-X36 Black uses essentially the same design, and an identical TL-9015B fan, but a slimmer heatsink. It still uses four 6 mm-thick nickel-plated copper heat pipes that make indirect contact through a copper base-plate; which twist into the fin-stack, and are ventilated by the 90 mm spinner, which turns at speeds of up to 2,700 RPM pushing up to 42.58 CFM of airflow, at noise levels as low as 22.4 dBA. The cooler measures 95 mm x 94.5 mm x 36 mm, weighing 230 g. CPU socket types supported are LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

Thermalright today updated its CPU cooler lineup with the new TA140 EX, a tower-type air CPU cooler. The cooler looks slender, but that's only because it's ventilated by a large 140 mm fan. Five 6 mm-thick nickel-plated copper heat pipes make contact with the processor through a mirror-finish base of nickel-plated C1100 copper, conveying heat through an aluminium fin-stack of 53 fins.

The included TL-D14X fan features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 95.5 CFM of airflow, at 2.25 mm H₂O static pressure, and 30.2 dBA maximum noise output. Among the CPU socket types supported by the Thermalright TA140 EX, are the LGA1200, LGA115x, LGA2066, and AM4. Measuring 145 mm x 72 mm x 158 mm (LxWxH, including fan); the cooler weighs 840 g. The company didn't reveal pricing.

Intel is likely preparing to launch its 10 nm "Tiger Lake" processor on the desktop platform. momomo_us discovered the existence of at least four new processor SKUs in Intel's ARK pages. At least one of these is marked as a desktop chip. What isn't clear, is whether these are Socket LGA1200 chips, like "Rocket Lake-S," or whether these are FC-BGA chips that have been adapted for specific desktop use-cases, such as NUCs. At the heart of these chips is the new 10 nm "Tiger Lake" 8-core/16-thread silicon, which packs 8 "Willow Cove" CPU cores, 24 MB of shared L3 cache, and a Gen12 Xe LP iGPU that has 32 EUs.

The common theme with the processor model numbering with these SKUs is the brand extension "B," next to model numbers we commonly associate with "Rocket Lake-S" SKUs. Another commonality is TDP. All four SKUs are marked as 65-Watt chips, including the part that has an unlocked multiplier. The lineup is led by the Core i9-11900KB, an 8-core/16-thread chip with Thermal Velocity Boost frequency of up to 5.30 GHz, and base frequency of 3.30 GHz. The Core i7-11700B lacks an unlocked multiplier, but interestingly features TVB, and retains the core-count and cache amount of the i9-11900KB. It is clocked at speeds of up to 5.30 GHz. The Core i5-11500B is a 6-core/12-thread part, with 12 MB of L3 cache, and the same 5.30 GHz boost, set via TVB. The Core i3-11100B is a 4-core/8-thread part with 8 MB L3 cache, and is likely based on the 4-core "Tiger Lake" die, with its iGPU cut down. The clocks remain the same. It remains to be seen how Intel markets these parts.

Thermaltake today unveiled the Floe RC 240 Snow Edition and Floe RC 360 Snow Edition all-in-one, closed-loop, liquid CPU+memory coolers. These provide liquid cooling to not just the processor, but also up to four memory modules. Addressable RGB LED illumination covers the pump+block, memory block, and the included 120 mm fans. As Snow Edition SKUs, these feature a white color scheme dominating most bits on the cooler, including the radiator fins. The memory block is compatible only with Thermaltake's own ToughRAM RC line of DDR4 memory modules, as it's designed to attach onto their heatspreaders. Each of the two fans spins between 500 to 1,500 RPM, pushing up to 59.28 CFM of airflow at 1.31 mm H₂O pressure, and noise output of 28.2 dBA. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066.

Intel has quietly let out details of its latest-generation Xeon W series workstation processors based on the 14 nm "Rocket Lake" silicon. These chips are built in the same Socket LGA1200 package as the 11th Gen Core desktop processors, but compatible with the W580 chipset. The lineup includes two 6-core/12-thread; and five 8-core/16-thread parts. Leading the pack is the Xeon W-1390P, with clock speeds of up to 5.30 GHz, followed by the W-1390, at 5.20 GHz. These two SKUs feature Thermal Velocity Boost, and are analogous with the 11th Gen Core i9 series.

Next up, are the Xeon W-1370P and W-1370, clocked at speeds of up to 5.20 GHz, and 5.10 GHz respectively, These parts lack Thermal Velocity Boost, and are comparable in many ways to the 11th Gen Core i7 SKUs. The slowest of these 8-core parts is the energy-efficient W-1390T, ticking at nominal clocks of just 1.50 GHz, with 4.90 GHz maximum boost, but a TDP of just 35 W. Among the other SKUs, the "P" SKUs have rated TDP of 125 W, while the non-P ones have 80 W. The 6-core/12-thread SKUs include the W-1350P and W-1350, clocked up to 5.10 GHz and 5.00 GHz, respectively. All Xeon W processors support up to 128 GB of dual-channel DDR4-3200 memory with ECC support.

Zalman today unveiled the CNPS10X Performa Black, a tower-type CPU cooler with a design focus on low noise. The cooler includes a unique 135 mm fan by Zalman that has a webbed impeller that guides all its airflow axially. Spinning between 700 to 1,500 RPM, with a maximum airflow of 75.16 CFM, the EBR bearing fan has a maximum noise output of just 27 dBA. The aluminium fin-stack heatsink uses four 8 mm-thick heat-pipes that make direct contact with the CPU at the base. Zalman claims that the cooler is capable of handling thermal loads of up to 180 W. With its fan in place, it measures 135 mm x 95 mm x 155 mm (WxDxH), weighing 860 g. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

AAEON, an industry leader in embedded solutions, announces the GENE-CML5 3.5" subcompact board featuring the 10th Generation Intel Core processors (formerly Comet Lake). The GENE-CML5 brings the latest in computing technology and flexibility, enabling developers to deploy their next generation industrial and AI Edge applications.

The GENE-CML5 brings the LGA1200 socket 10th Generation Intel Core i3/i5/i7 processors, as well as Intel Pentium and Celeron processors to the 3.5" subcompact form factor. Supporting processors up to 4.4 GHz CPU frequency, the GENE-CML5 leverages the socket-type chipset to allow developers and end users to easily maintain, scale, and upgrade the platform to suit their processing requirements. Combined with 64 GB DDR4 memory, the GENE-CML5 delivers fast processing speeds on par with desktop systems. Additionally, the chipset allows the compact board to take advantage of Intel vPro and Intel Active Management Technology (iAMT), enabling remote system monitoring and management.

Antec is readying the new Mercury V2 line of all-in-one liquid CPU coolers, succeeding the original Mercury RGB series from 2018. The Mercury V2 comes with an updated pump-block design based, both internally, and aesthetically. Also updated, are the included 120 mm fans, which come with a 800-1,600 RPM speed range, 72 CFM air-flow per fan, and ARGB lighting. Unlike the original Mercury series, the new Mercury V2 debuts with 240 mm and 360 mm size variants, only. Among the CPU socket types supported are AM4, LGA1200, and LGA2066.

Thermalright is on a roll with its streak of recent CPU cooler launches, the latest of which, is the TA 120 EX. Positioned a notch above its TRUE Spirit 120 series, the TA 120 EX is characterized by a dense aluminium fin stack with 52 fins packed with a gap of 1.6 mm, compared to 48 fins on the TRUE Spirit 120. The cooler is slightly larger and heavier, too. Heat drawn through a mirror-finish copper base, is conveyed to the fin stack through five 6 mm-thick copper heat pipes.

A Thermalright TL-C12 PRO-G fan comes included with the cooler. This 120 mm spinner features a fluid-dynamic bearing, spins at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, at 2.1 mm H₂O static pressure, and a maximum noise output of up to 29.6 dBA. With its fan in place, the TA 120 EX measures 124 mm x 70 mm x 154 mm (WxDxH), weighing 680 g. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

Thermalright today rolled out the AXP90-X47, a low-profile CPU cooler meant for compact Mini-ITX builds where Z-height is at a premium. The top-flow cooler offers a height of just 47 mm with its fan in place, and is meant for Socket AM4, LGA1200, and LGA115x platforms. The cooler should do fine as a stock fan-heatsink replacement, for running 10th Gen or 11th Gen Core processors at stock speeds.

The AXP90-X47 design consists of an aluminium fin-stack that's arranged along the plane of the motherboard, with 54 fins. Four 6 mm-thick nickel-plated copper heat-pipes make indirect contact with the CPU over mirror-finish base made of the same material, conveying heat to this fin-stack. An included 92 mm Thermalright TL-9015 fan ventilates the cooler. This 15 mm-thick fan features a 4-pin PWM input, and hydraulic bearing. It turns at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of air-flow at 1.33 mm H₂O static-pressure, and a noise output of 22.4 dBA at top speed. The cooler measures 92 mm x 92 mm x 47 mm (WxDxH, including fan); weighing 310 g. The company didn't reveal pricing.

Thermalright unveiled its new flagship air cooler, the Frost Commander 140. This massive "D-type" dual fin-stack cooler is designed for conventional tower-type builds. With a height of exactly 160 mm, the cooler might scrape the side-panel of most mid-tower cases. Two equal-sized stacks of 53 aluminium fins, each, are skewered by five 8 mm-thick nickel-plated copper heat pipes that make indirect contact with the CPU through a mirror-finished nickel-plated copper base. There are two fans included with the cooler, a smaller 120 mm fan pushes fresh air into the first fin-stack while a larger 140 mm fan between the two fin-stacks conveys this air through the second fin-stack. Mounting clips are included letting you mount up to three fans that are up to 140 mm in size.

The included 120 mm fan, TL-C12, turns at speeds of up to 1,850 RPM ±10%, pushing up to 82 CFM of air, at up to 2.10 mm H₂O static pressure, and up to 29.6 dBA noise output. The larger included 140 mm fan, a TL-D14X, does up to 1,800 RPM, up to 95.50 CFM airflow, 2.25 mm H₂O static pressure, and is as loud as 30.2 dBA at top speed. Both fans feature fluid-dynamic bearings. With its fans in place, the cooler measures 140 mm x 146 mm x 160 mm (WxDxH), weighing exactly 1.34 kg (1 kg heatsink + 340 g for the two fans). CPU sockets supported include AM4, LGA1200, LGA115x, and LGA2066. The company didn't put out thermal performance numbers, but could offer the Frost Commander 140 as an alternative to entry/mid all-in-one liquid CPU coolers. The company didn't reveal pricing.

Intel is reportedly giving final touches to the Xeon W-1300 line of enterprise processors targeting workstations, according to an ASRock CPU support list dug up by Komachi Ensaka. The processors are based on the same 14 nm "Rocket Lake" silicon as the company's 11th Gen Core desktop processors, and come in core counts of up to 8-core/16-thread. The lineup is expected to debut with five SKUs, three of which are 8-core/16-thread, and two 6-core/12-thread.

The lineup is led by the W-1370, with base frequency of 2.90 GHz, 16 MB of shared L3 cache, and 80 W TDP. Next up, is the slightly slower W-1390, clocked at 2.80 GHz, and 80 W TDP. The third 8-core part is the W-1390T, which is clocked at just 1.50 GHz (base), and comes with aggressive power-management that gives it a TDP rating of 35 W. The 6-core/12-thread W-1350P has the highest clock speeds, with a base frequency of 4.00 GHz, 12 MB of shared L3 cache, and 125 W TDP. The W-1350 is its slower sibling, clocked at 3.30 GHz, and 80 W TDP. The processors will be compatible with Intel Z490, W480, and H470 chipsets, besides their 500-series successors.

Thermalright today introduced the Silver Arrow ITX-R Rev A, a compact dual aluminium fin-stack CPU cooler with a low footprint, designed for maximum clearance around the CPU socket area, making it ideal for Mini-ITX tower gaming PC builds. A revision of the original Silver Arrow ITX-R from 2017, the new Rev A comes with a slightly smaller aluminium fins toward the bottoms of the fin-stacks, which reduce the heatsink's weight by 30 g, but improve clearance around the CPU socket. Thermalright also took the opportunity to update the included fan, which is now a TY-129B. This 130 mm spinner tuns between 600 to 1,500 RPM, compared to the 300-1,300 RPM range of the original TY-129 that the original Silver Arrow ITX-R comes with. The heatsink measures 155 mm x 103 mm x 147 mm (LxWxH), weighing 630 g. Thermalright claims that the cooler can handle thermal loads of up to 240 W. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

Thermalright today introduced the Venomous Plus, its latest tower-type CPU cooler and a re-take on the 10+ year old Venomous X. Designed to tackle thermal loads of up to 240 W, the Venomous Plus features a classic aluminium fin-stack design. Six 6 mm-thick nickel-plated copper heat pipes make indirect contact with the CPU at the mirror-finished base made of the same material; passing through the aluminium fin-stack that's ventilated by a TL-C12S 120 mm fan. The heatsink by itself measures 127 mm x 60 mm x 158 mm (WxDxH), weighing 660 g, and holding 51 fins. The fan adds about 25-27 mm in width.

The included TL-C12S fan is one of the key things setting this apart from the Venomous X. It's a modern unit that takes in 4-pin PWM for its main function, 3-pin ARGB for illumination, and features ARGB illumination through diodes studded in the impeller hub. The fan features fluid-dynamic bearing, turns up to 1,500 RPM (±10%), pushing up to 66.17 CFM of air-flow with static pressure of 1.53 mm H₂O; and has a maximum noise output of 25.6 dBA. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066.

Thermaltake today released to market the UX210 ARGB, a slim tower-type CPU cooler. Designed for thermal loads of up to 150 W, the cooler features a conventional-design aluminium fin-stack heatsink, ventilated by a 120 mm fan. Five 6 mm-thick nickel-plated copper heat pipes make contact with the CPU over a mirror-finish nickel-plated copper base; conveying heat through an aluminium fin-stack, which is ventilated by a fan.

The 120 mm fan included with the Thermaltake UX210 ARGB takes in 4-pin PWM for its main function, and 3-pin ARGB for its lighting. It features a 30,000-hour rated hydraulic bearing, spins between 600 to 2,000 RPM, pushing up to 72.3 CFM of air, with a static pressure of up to 2.31 mm H₂O, and a noise output of up to 34.3 dBA. With its fan in place, the cooler measures 136 mm x 74 mm x 153 mm (WxDxH). Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

AeroCool today introduced the Cylon 3H, a top-flow CPU cooler. The cooler features a "C-type" aluminium fin-stack design. Three 6 mm-thick copper heat pipes make direct contact with the CPU at the base, conveying heat through an aluminium fin-stack that's arranged along the plane of the motherboard, and ventilated by a 120 mm fan. This fan features an addressable RGB illumination through a silicone diffuser around the bore of the impeller. AeroCool claims that the cooler can handle thermal loads of up to 125 W.

The included 120 mm fan of the Cylon 3H features a 60,000-hour rated hydraulic bearing, takes in 4-pin PWM for its main function, and 3-pin ARGB for the illumination, turns between 600 to 1,800 RPM; pushing up to 60.8 CFM of air-flow at 1.48 mm H₂O static pressure, at up to 24.3 dBA noise output. With its fan in place, the cooler measures 126 mm x 138 mm x 98 mm (WxDxH). Among the CPU socket types supported are AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Intel at a January 11, 2021 online media event (which we live-blogged here) revealed more information about its 11th Generation Core "Rocket Lake-S" desktop processor family. These chips succeed the 10th Gen Core "Comet Lake-S," and are built on the same Socket LGA1200 package, retaining backwards compatibility with Intel 400-series chipset motherboards with firmware updates; and native support with the upcoming Intel 500-series chipset motherboards. Intel in its media event confirmed that the top Core i9-11900K is an 8-core/16-thread processor, which will deliver the highest PC gaming performance possible when it comes out.

In its media event, Intel revealed a side-by-side comparison of the i9-11900K with a machine powered by the AMD Ryzen 9 5900X 12-core processor, where it's shown offering a mostly mid-single-digit-percentage performance lead over the AMD chip. In the "Metro Exodus" benchmark prominently highlighted in the Intel event, the i9-11900K is shown offering an average frame-rate of 156.54 FPS compared to 147.43 FPS of the 5900X (a 6.17% gain). VideoCardz tweeted a leaked Intel presentation slide with many more game test results where Intel compared the two chips. Intel's play with marketing "Rocket Lake-S" to gamers and PC enthusiasts will hence ride on the back of gaming performance leadership, and future-proofing against the new wave of productivity apps that leverage AI deep-learning, as "Rocket Lake-S" features DLBoost VNNI extensions that accelerate deep-learning neural-net building, training, and AI inference performance.

A number of upcoming Z590 ASUS motherboards have recently been pictured. The four upcoming motherboards include the ASUS ROG Maximus XIII Extreme Glacial, ASUS ROG Maximus XIII Hero, ASUS Prime Z590-A, and the ASUS TUF Z590-PLUS WIFI. These new motherboards feature an LGA1200 socket the same one found on existing Z490 boards and are targeted towards Intel's upcoming 11th generation processors. The new Rocket Lake-S processors will introduce support for PCIe 4.0 which should be fully supported on these new boards.

The Z590 MAXIMUS XIII EXTREME GLACIAL is a high-end premium motherboard with integrated monoblock from EK. The board is similar to the Z490 GUNDAM and comes in an E-ATX form factor. The 13th edition ASUS ROG Maximus XIII Hero includes dual EATX12V 8-pin power connectors an upgrade from the 8+4 pin configuration found on the Z490 series. These new motherboards are expected to be announced in the coming days during CES.

Dynatron earlier this week rolled out the L15, an all-in-one, closed-loop, liquid CPU cooler. This cooler features a radiator-mounted pump, so the CPU water-block is considerably slimmer for a cooler that's capable of handling thermal loads of up to 250 W. The 240 mm x 120 mm radiator comes with a pair of 120 mm dual ball-bearing PWM fans that can turn at speeds ranging between 600 to 2,400 RPM, pushing 23 to 92 CFM of air-flow, with noise output ranging between 16 to 38 dBA. The cooler supports the latest Intel LGA1200 and LGA115x sockets, and AMD AM3+ (or older) sockets, although the company does not mention AM4 support in its data-sheet. The company didn't reveal pricing.

DeepCool today updated its GAMMAXX line of all-in-one liquid closed-loop CPU coolers, with the new GAMMAXX L240 A-RGB and L360 A-RGB. These are functionally the same coolers as the GAMMAXX L-series, but with a handful updates, such as an ambient air pressure balancer, and new addressable-RGB LED lighting elements on the pump-block and the included 120 mm fans. Each of the included 120 mm A-RGB fans spins between 500 to 1,800 RPM, pushing up to 69.34 CFM of air-flow, at up to 2.42 mm H₂O static pressure, and up to 30 dBA noise output. The fans feature hydro-dynamic bearings. Among the CPU socket types supported include AM4, LGA1200, and LGA2066. The company didn't reveal pricing.

MSI in a customer service response that's been machine translated and tweeted by harukaze5719, revealed that Intel's 11th Gen Core "Rocket Lake-S" desktop processors arrive "by the end of March." This is the first confirmation from someone in the know that "Rocket Lake-S" won't arrive before the very end of Q1-2021, and that one should realistically expect availability only from Q2.

The same CS response also confirms backwards compatibility of the processors with existing Socket LGA1200 motherboards based on the Intel 400-series chipset. It mentions that MSI will release UEFI firmware updates that enable "Rocket Lake-S" compatibility starting with boards based on the top Intel Z490 chipset, followed by other 400-series models. Intel is expected to unveil its 11th Gen Core "Rocket Lake-S" desktop processor and compatible 500-series chipset platform in mid-January, as part of a virtual event on the sidelines of the 2021 International CES (a virtual show).

Intel's 11th Generation Core "Rocket Lake-S" desktop processor family could be formally unveiled in just a few weeks from now, with HotHardware reporting a 2021 International CES unveiling (virtual event), for both the processors and their companion Intel 500-series chipset motherboards. This would put the unveiling around mid-January for the virtual launch event.

Availability is a different story, with the report predicting that while the Intel 500-series chipset motherboards will be available from mid-January, the processors won't arrive until March. Older reports predicted a market availability of these processors to almost miss Q1, and spill over into Q2 (April-June). Since "Rocket Lake-S" is based on the current LGA1200 package, the Intel 500-series chipset motherboards are expected to support existing 10th Gen Core "Comet Lake-S" processors, along with out-of-the-box support for the 11th Gen.

Intel today commenced the process of discontinuation of the "Avengers Edition" SKUs of its 10th Generation Core "Comet Lake-S" desktop processors, through a product change notification (PCN). The said PCN #117894-00 mentions December 16, 2020 as a common date for all four key discontinuation milestones in the product's lifecycle, namely Product Discontinuation Support commencement, Last Product Discontinuance Order (the last opportunity for distributors to place orders from Intel for), the date for these orders to become non-cancelable and non-returnable; and the date for the last order to ship. Normally, the latter two milestones are spaced 6 months and 12 months apart from the date of the product discontinuation PCN. To put this in simpler terms—and unless the PCN doesn't have a typo with its dates—Intel is expeditiously discontinuing its 10th Gen Core "Comet Lake-S" desktop processors, marking them EOL (end of life).

ID Cooling has announced their latest Mega Coolers, a new moniker and lineup that announces the coolers' compatibility with the latest, greatest, highest performance, and most power-hungry CPUs. The coolers are designed to accompany CPUs with TDPs up to 280 W. ID Cooling said these new mega coolers in the SE-207-series, which are basically tower coolers in design, will be hitting market just in time to address AMD's new-generation enthusiast grade Ryzen 5000-series 'Vermeer' and Intel's upcoming 11th Generation Core 'Rocket Lake' processors.

There are two separate coolers in the family; the SE-207-XT Black is aimed at AMD's Ryzen processors as well as Intel CPUs in LGA1200/115x/20xx form-factors; if you need some more cooling oomph, however, the SE-207-TRX Black is aimed at AMD's Ryzen Threadripper processor in TR4 packaging. Both coolers offer the same 280 W TDP dissipation capabilities, and are built in a twin-tower design with twin fans (700 RPM ~ 1800 RPM, up to 76.16 CFM air pressure, up to 35.2 dBA). In the case of the Threadripper-loving SE-207-TRX, a copper baseplate with direct-touch heatpipe technology removes heat from your CPU and passes it through the large, black, dual fin-stack arrays which are then cooled by two 120 mm fans. The E-207-XT Black, on the other hand, makes do with a solid copper baseplate absent of that same direct touch technology.

In addition to the Neon 122 tower-type air CPU cooler, Super Flower announced the Neon 240 and Neon 360 all-in-one, closed-loop, liquid CPU coolers. Unless we're mistaken, these CLCs appear to be DeepCool-sourced, looking at the design of their pump-blocks. As their names suggest, the two are differentited with radiator sizes, with the Neon 240 featuring a 240 mm x 120 mm radiator, and the Neon 360 featuring 360 mm x 120 mm.

The pump-block features a copper cold-plate, a latest-gen dual-chamber pump, Nylon sleeved tubing, and aluminium-fin radiators that, depending on the variant, are ventilated by two or three included 120 mm fans. Each of these hydraulic bearing fans spin between 800 to 1,800 RPM, pushing 46 CFM of air, with up to 29.7 dBA maximum noise output. The fans, along with the ornament on top of the pump-block, feature addressable RGB illumination. The Neon 240 supports AM4, LGA1200, LGA115x, and LGA2066 sockets, while the Neon 360 also includes support for TR4 and sTRX4 in addition to those. The coolers include an RGB controller with an RF remote control. The company didn't reveal pricing.