AeroCool today introduced the Raven 4 ARGB, a tower-type CPU cooler that relies on a custom design 120 mm fan. The cooler uses a typical aluminium fin-stack heatsink design. Four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. This is ventilated by the 120 mm fan, with a unique frame design that guides airflow such that it envelopes the fin-stack along all sides.

The fan takes in a 4-pin PWM connection for its main function, and 3-pin ARGB for its lighting. The fan turns at speeds ranging between 900 to 1,800 RPM, pushing 24.1 to 58 CFM of airflow, with a noise output ranging between 18 to 27 dBA. The fan uses a hydraulic bearing rated for 60,000 hours. The cooler measures 125 mm x 80 mm x 135 mm (WxDxH). Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4.

Intel's next entry-level processor for the Socket LGA1700 platform is the Core i3-12100. Carved out of the "Alder Lake-S" H0 silicon, this processor features 4 "Golden Cove" performance cores with HyperThreading enabling 8 logical processors, and no E-cores. The processor ticks at 3.30 GHz, with 4.30 GHz Turbo Boost 2.0 frequency. Each of the four cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The i3-12100 gets a Gen12 Xe LP-based iGPU, while a variant of the processor, the i3-12100F, lacks integrated graphics. Intel is rating the processor base power value at 60 W, with 77 W maximum turbo power.

XFastest scored an i3-12100 engineering sample, and wasted no time in comparing it with the Ryzen 3 3300X. The i3-12100 was tested on an ASRock Z690 Steel Legend motherboard that has DDR4 memory slots. 16 GB of dual-channel DDR4-3600 memory and RTX 3060 Ti were used on both the Intel and AMD test-beds. A Ryzen 3 3100 was also used on the AMD side. Right off the bat, we see the i3-12100 take a significant lead over the AMD chips at PCMark, posting a roughly 15% performance lead. Cinebench R23 is another test where the little "Alder Lake" scores big, posting a roughly 26% performance lead in the multi-threaded test, and 27% in the single-threaded test. This is mainly because the 3300X is based on "Zen 2" while the i3-12100 uses the cutting-edge "Golden Cove" cores. AMD hasn't bothered with "Zen 3" based Ryzen 3 desktop processors in the retail market.

Here are some of the first pictures of the 12th Gen Intel Core "Alder Lake" desktop processor models that are expected to join the lineup in January 2022. Intel debuted the series with unlocked "K" and "KF" SKUs, with "locked" SKUs saved for next year. Pictured here are the Core i9-12900, the Core i5-12600, the i5-12500, and the i5-12400. The S-SPEC codes for these processors are SRL4E, SRL4F, SRL4G, and SRL4P, respectively. Our older article details their possible specifications. The lineup isn't limited to these models. Others include the Core i7-12700, and the "F" variants of many of these SKUs, which lack integrated graphics, allowing those with discrete graphics cards to save a little.

Besides these processors, Intel is expected to expand its motherboard chipset options. Currently, Z690 is the only chipset option for the LGA1700 socket. Upcoming chipset models are likely to include the H670, W680, B660, and perhaps even the H610. Intel could use platform I/O for segmentation of these chipsets, besides lack of CPU overclocking support. A big change with the 12th Gen desktop processor lineup concerns Core i5. While the i5-12600K and i5-12600KF feature 6 P-cores and 4 E-cores, the other Core i5 SKUs, including the i5-12600, lack E-cores. The source installed these processors to confirm that the i5-12600 is indeed based on the "H0" silicon and lacks E-cores.

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

With the Eisbaer LT240 & LT360 Aurora, Alphacool today presents new CPU "All-in-One" solutions based on the previously so successful Eisbaer LT series. Compared to the classic Alphacool Eisbaer LT AIO, the cooler and pump unit as well as the fans of the new Aurora version are now fully equipped with digital RGB LEDs. With the included controller, extensive lighting effects can be set, which provide unique and noble illumination.

As with all Eisbaer AIOs, Alphacool again uses the NexXxoS radiator with cooling fins, pre-chambers and cooling channels made of copper as well as the robust TPV hoses with quick-release couplings from the ENTERPRISE Solutions series. With the help of the quick couplings, it is possible to integrate other common water cooling products such as GPU coolers into the loop. The flat pump housing allows the AIO to be installed even in the smallest spaces. Alphacool's Eiszyklon Aurora LUX PRO is used as the fan, the DC-LT pump is replaced by Alphacool's quieter and more powerful DC-LT2 pump.

EK, is now offering an EK-AIO LGA1700 upgrade kit for the new Intel LGA1700 socket, accommodating Intel Alder Lake processors. In light of reusability initiatives, EK is offering future and pre-existing customers an option to reuse the EK-AIO line of closed-loop coolers for new/upcoming CPUs. The EK-AIO LGA1700 upgrade kit is designed to offer optimal coverage of the CPU's IHS for all EK-AIO models. It includes a metal backplate, a rubber gasket, screws, washers, and thermal paste.

The EK-AIO LGA1700 upgrade kit is available in EK Webshop for free (Shipping fees are covered by the customer) and is limited to one piece per order. There is no need for proof of purchase or an invoice for an EK-AIO. If any customer requires this upgrade kit for multiple PCs, please reach out directly to our customer support team. The upgrade kit will also be available on multiple marketplaces and with select Europe and APAC-based resellers in the following weeks.

CRYORIG has recently released preliminary details for their LGA 1700 socket cooler support program. The company is preparing five adapters for existing coolers that are not currently compatible with the new socket and hope to have these available for January 2022. CRYORIG will provide these adapter kits to eligible customers who have purchased a cooler from the company after January 1st 2021 and can provide proof of purchase of an Intel 12th generation Alder Lake processor. CRYORIG will also be selling the adapters for customers who purchased their cooler before December 31st 2020 with more information on the process to be released once the adapters have been finalized. The complete list of compatible coolers can be found below.

Noctua today introduced new, LGA1700-specific revisions of its award-winning NH-L9i and NH-L9i chromax.black low-profile CPU coolers. The new NH-L9i-17xx and NH-L9i-17xx chromax.black are ideal for building ultra-compact HTPCs and Small Form Factor (SFF) systems using Intel's brand new 12th generation Core processors such as the Core i9-12900K, Core i7-12700K or Core i5-12600K. The new, optional NA-FD1 fan duct makes it possible to further improve the performance of the coolers by bridging the gap between the fan and perforated case panels in order to enable the coolers to draw in fresh air from the outside.

"We're very happy with the performance of the NH-L9i-17xx coolers on Intel's new LGA1700 CPUs", says Roland Mossig (Noctua CEO). "We have managed to dissipate up to around 160 W on the Core i9-12900K, pushing it to over 4.2 GHz, and up to 125 W on the Core i5-12600K running at 4.3 GHz. These are excellent results for such small coolers, making them fantastic options for highly compact Intel Z690 builds that pack a lot of processing power!"

Scythe's mounting upgrade kit (SCMK-1700) is ready for Intel's upcoming LGA1700 platform. The mounting upgrade kit allows Scythe users to upgrade their coolers to Intel's new LGA1700 socket. The kit will be available for purchase in mid-November in the US at an MSRP of USD 7.99, please order it from Scythe local distributors/resellers. In addition to the mounting upgrade kit, most current Scythe coolers will also include LGA1700 mounting materials soon. The full list of compatible coolers can be found below.

SilentiumPC, the European manufacturer of CPU coolers, Power Supply Units and PC cases, is proud to announce that its latest SilentiumPC cooling system, the Fera 5, is fully compatible with the new Intel platform and already includes an LGA1700 mounting system. Mounting systems enabling the use of legacy SilentiumPC coolers with the LGA1700 socket will be available in the near future.

LGA1700 is a new processor socket designed for 12th generation Intel Core systems. Compared to previous generations, as in the LGA115x and LGA1200, the new processors and socket are larger. Due to this, the spacing of the mounting holes has increased. The latest SilentiumPC cooling systems - the Fera 5, Fera 5 Dual and Fera 5 ARGB - are equipped with the appropriate mounting systems, so all current and future owners of the Fera 5 can conveniently mount their CPU cooler onto the vast majority of LGA1700 equipped motherboards - without the need for any additional parts. A similar set will also be included with all upcoming coolers.

Cooler Master announces today it will be providing mounting upgrades for Intel's Alder Lake LGA1700 release. Cooler Master will provide mounting kits for Intel's new 12th Generation Alder Lake LGA1700 CPUs, allowing customers to use existing coolers with the new platform. Additionally, Cooler Master's current coolers will soon include LGA1700 mounting hardware directly out of box.

The LGA1700 mounting kits will be provided for the majority of current coolers on market with the launch of LGA1700 CPUs and motherboards. The LGA1700 brackets will be available from Cooler Master's online store for North America and Europe regions and customers. Brackets will be available for North America customers on the online store.

Intel's 12th Gen Core "Alder Lake-S" silicon apparently comes in two variants based on core count. The first one is a larger variant with 8 P cores and 8 E cores, while the second variant is a visibly smaller die with only 6 P cores, no E cores. This was revealed by an MSI Insider video presentation where pictures of LGA1700 packages with the two die types were shown off.

MSI also confirmed die-sizes and dimensions of the two. The larger C0 die measures 10.5 mm x 20.5 mm, working out to 215.25 mm² area. The smaller H0 die measures 10.5 mm x 15.5 mm, and a die area of 162.75 mm². The H0 silicon completely lacks "Gracemont" E-core clusters, and physically features six "Golden Cove" P cores. It's possible that given the 3 MB L3 slice size on the larger C0 silicon, the smaller H0 silicon physically features 18 MB of shared L3 cache.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced all AIO liquid coolers lineup, including AORUS WATERFORCE series and AORUS WATERFORCE X series are attached with brackets for Socket LGA1700 to support the latest 12th gen Intel Core processors, which provides the optimal flexibility and compatibility in the market. Enhanced by the enlarged tube diameter and top quality components, these two cooler series fully support the latest 12th gen. Intel Core processors to pass Prime 95 non AVX stress test by Turbo Boost Technology. Users can enjoy gaming or working with stable performance without worries about throttling caused by the overheating on processors.

"With the launch of the latest Intel Z690 chipset and 12th generation Core processors, most of the existing liquid coolers in the market are unable to support it due to the socket change. GIGABYTE AORUS WATERFORCE and AORUS WATERFORCE X series took into account the structural changes of coming platform at the initial stage of development, and designed the visionary accessories with brackets for LGA 1700 which let users embrace the new platform easily without updating water cooling devices." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "GIGABYTE AORUS WATERFORCE and AORUS WATERFORCE X series AIO liquid coolers follow the praise of the previous generation AIO cooling, and keep the notable exclusive design with bunch of enhancements in response to users' feedback. In addition to the durability and high compatibility, they can pass the Prime 95 non AVX stress test with the 12th gen. Intel Core processor by Turbo Boost Technology which ensure users a stable use without any concerns."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the Z690 AORUS gaming motherboards which perfectly support the latest 12th Gen Intel Core processors. Featuring up to 20+1+2 phases digital power VRM design with each phase holding up to 105 amps and an improved Fins-Array III heatsink design, GIGABYTE's Z690 AORUS lineup is geared with the best power design and thermal management to unleash the extreme performance and optimized overclocking ability on the new generation multi-core K series Intel Core processors. The PCIe 5.0 PCBs, slots, and components are also implemented in GIGABYTE's Z690 AORUS motherboards for enhanced performance and stability. The exclusive SMD memory slots with metal shielding mask for anti- interference and the BIOS setting of DDR5 memory overclocking offer more stable signals to memory, which enable users to boost XMP and overclocking performance with stability. Select GIGABYTE Z690 AORUS motherboards offer feature-rich I/O with an integrated I/O shield as well as the newest Thermal Guard III design, Smart Fan 6 and much more. Performance, power management, thermals, audio, GIGABYTE Z690 AORUS motherboards check all the boxes for users seeking to take their computing firepower to the next level.

After the recent release of our EK-Quantum Velocity² water blocks that are specifically engineered for the new LGA 1700 CPU socket and Intel Alder Lake processors, we are also happy to announce that the original Velocity water block is also able to support this new platform. The cold plate is large enough to accommodate the larger CPU IHS found on LGA 1700 CPUs and the only required part is the LGA 1700 compatible backplate.

The backplate is available in the EK webshop, free of charge, and it will also be available free of charge at major partnering retailers for the end customers. The EK-Quantum Velocity Backplate - LGA1700 is limited to one piece per order, but if any customer requires this upgrade kit for multiple PCs, please reach out directly to our customer support team.

DeepCool, a global brand and manufacturer of computer hardware and peripherals for enthusiasts, today announced that it will provide free-of-charge mountings kits for Intel's upcoming LGA1700 platform, enabling customers to continue using their existing DeepCool CPU coolers on the new 12th generation Intel Core CPUs (Alder Lake S). Additionally, current and future DeepCool coolers will also include the new mounting hardware.

Intel's new CPU will follow a new hybrid architecture that will be more powerful than previous generations through the use of high-performing, efficient cores. This new architecture will have a direct impact on the appearance of the CPU, as Alder Lake features an additional 500 contacts compared to its predecessors (i.e., 1200 to 1700); as a result, the socket had to be greatly enlarged.

GIGABYTE's AERO line of motherboards and notebooks target creators who like to game. The company is ready with a premium motherboard based on the Intel Z690 chipset, the Z690 AERO D. This has to be the prettiest looking motherboard we've come across in a long time, and it appears to have the chops to match this beauty. The Socket LGA1700 motherboard uses large ridged-aluminium heatsinks over the chipset, M.2 NVMe slots, and a portion of the rear I/O shroud. Aluminium fin-stack heatsinks fed by heat-pipes, cool the CPU VRM. You get two PCI-Express 5.0 x16 slots (x8/x8 with both populated). As an AERO series product, the board is expected to be loaded with connectivity relevant to content creators, although the box is missing a Thunderbolt logo. We expect at least 20 Gbps USB 3.2x2 ports, and 10 GbE networking, Wi-Fi 6E.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new PRO generation of performance custom cooling CPU water blocks in the award-winning Hydro X Series: the XC5 RGB PRO and XC7 RGB PRO. Equipped with more than 110 high-efficiency micro-cooling fins and an innovative quad-split flow design, these new water blocks deliver extraordinary cooling paired with vibrant RGB lighting at the heart of your loop. With compatibility across the entire range of modern CPUs from Intel and AMD, including the upcoming Intel LGA 1700 socket, the Hydro X Series delivers the cooling you need to help your next stunning PC build run at its full potential.

Thanks to new precision-machined copper cold plates and a quad-split flow design with multiple inlet channels, the XC5 RGB PRO and XC7 RGB PRO achieve fantastic cooling performance, up to 4°C lower than their previous generation counterparts. Their durable construction with reinforced standard G1/4" threads will keep your CPU running at its best for years to come.

ARCTIC, one of the leading manufacturers of low-noise PC coolers and components, has added the powerful Liquid Freezer II 280 and Liquid Freezer 420 RGB and A-RGB models to its award-winning AIO range. The multi-compatible water coolers are also equipped for Intel's new Alder Lake CPUs with LGA1700 sockets. With the efficient PWM-controlled pump, featuring a VRM fan for additional cooling in the socket area, as well as the proven 140 mm P-fans, achieving high static pressure with very low noise, the ARCTIC Liquid Freezer II series clearly sets itself apart from other AIOs and offers plenty of overclocking flexibility.

A maintenance-free water circuit and the integrated cable management, which hides the PWM and RGB cables in the hose sleeves, plus a six-year manufacturer's warranty underline the high quality and complete the attractive price-performance ratio of the Liquid Freezer II range. The color-capable, effective LED lighting of the fans makes these high-performance coolers the ideal choice for gaming PCs. Optionally, the Liquid Freezer II 280 RGB and Liquid Freezer 420 RGB are also available in a bundle with Arctic's software-controlled RGB controller.

Corsair on Wednesday tweeted the first picture of its production Vengeance DDR5 memory modules. The picture reveals a simple, minimalist design, with a sheet-metal heatspreader design with some printed graphic, and the new Vengeance logo. Unlike the Vengeance DDR4 generation, there don't appear to be false "finnage" toward the top of the module. Since DDR5 will be coexisting with DDR4 to at least the next couple of years as Intel is getting its motherboard partners to come out with a substantive lineup of LGA1700 motherboards with DDR4 memory slots, Corsair made sure to mention "DDR5" right on the module. Corsair also revealed that it is developing the first Dominator-branded DDR5 memory, which will possibly come out with the first Intel 12th Gen Core processors.

BIOSTAR over the weekend teased two of its top Socket LGA1700 motherboards based on the Intel Z690 chipset, under the Valkyrie and Racing brands. The outline drawing does precious more than to highlight the combination of the VRM heatsink and rear I/O shroud for both models. Outlines in the background clearly highlight the lengthy LGA1700 socket, an elaborate CPU VRM setup that pulls power from two 8-pin EPS connectors, an unremarkable chipset heatsink that extends into a combi-heatsink covering the M.2 slots. BIOSTAR is expected to launch these two alongside the first wave of 12th Gen Core processors.

Phanteks today announced that it will be offering free mounting kits for Intel LGA1700 platform to existing Glacier One All-In-One Liquid CPU coolers' customers free of charge, allowing customers to use their current CPU/AIO coolers with the new 12th generation Intel Core CPUs.

The new LGA1700 mounting kit will be available free-of-charge via Phanteks' Customer Support once LGA 1700 motherboards are sold. Customers will need to send proof of purchase of Phanteks' Glacier One AIO Liquid Coolers and either an LGA1700 CPU or an LGA1700 motherboards will be required.

be quiet!, the German manufacturer for premium PC components, ensures that its CPU coolers remain compatible with the latest CPU sockets. Therefore, the company will be offering a free upgrade kit for the upcoming Intel LGA1700 socket. In the course of 2022, all compatible coolers will include the new mounting material by default.

By showing a proof of purchase of an Alder-Lake-S CPU or an LGA1700 mainboard as well as a compatible be quiet! cooler, customers will receive the conversion kit free of charge from be quiet!. An order form will be available on the be quiet! website at the launch of the new processor generation. In addition, there is the possibility to purchase the assembly kits for a small nominal fee.

The market launch of the Intel Alder Lake series is expected soon. Along with the new CPUs, Intel is also introducing the new LGA1700- socket with changed hole spacing on the motherboard as well as changes in CPU cooler mounting height. Starting in mid-October, ARCTIC will provide mounting kits for all Freezer 34 models, the entire Liquid Freezer II series, the Freezer 50 as well as Freezer i13 X and Freezer i13 X CO. Replacing the mounting parts will enable our customers to use their ARCTIC coolers with the new Intel processors. In the future, most of the current CPU coolers will be delivered with the mounting set for the Intel 1700 socket.

The mounting sets will be available in the ARCTIC web shop for a service fee of 5,99€, and customers will receive the set completely free of charge upon presentation of a corresponding processor purchase receipt. ARCTIC will soon launch a new CPU air cooler with Alder Lake compatibility from the factory - the i35 A-RGB. The launch of the new Intel cooler with addressable RGB is expected at the end of October.

Here's the first picture of Intel's upcoming mainstream desktop processor socket, the LGA1700, which was until now only seen in renders or technical drawings. The socket is characterized by a more rectangular contact pad than previous Intel sockets. The Socket H family (LGA115x and LGA1200) that ruled Intel MSDT sockets for over a decade, has a largely square pad. Intel's HEDT sockets such as the LGA1366, LGA2011 and LGA2066, on the other hand, had a rectangular pad, though not as pronounced (slender) as the LGA1700.

From the looks of it, the retention mechanism of the LGA1700 appears similar to that of Socket H and most other Intel LGA sockets (though dissimilar from the LGA2011/LGA2066). In its client desktop avatar, the LGA1700 has 100 unused pins. This is because the socket is physically identical to the LGA1800, which is speculated to be left for future generations of Intel processors with additional power or I/O pins. The Z-height of LGA1700 is lower than that of Socket H, which entails a major change in the retention module design of most aftermarket CPU cooling solutions.