At the 2023 International CES, Cooler Master showed off a unique all-in-one liquid closed-loop CPU cooler that features user-replaceable pump-block covers, the MasterLiquid Atmos. The top cover of the pump-block comes off, so you can replace it with something with a different shape or color. Examples of these covers include a frosty-white cover made of recycled plastic resin, or a tinted acrylic diffuser. Underneath is a white silicone diffuser for an ARGB lighting element. The lighting extends to the included Cooler Master Sickleflow ARGB fans.

The MasterLiquid Atmos model shown at CES was the ML360 Atmos, featuring a 360 mm x 120 mm radiator with a trio of Sickleflow ARGB fans. These fans come pre-installed on the radiator, to minimize packaging waste. The ML360 Atmos uses a dual-chamber pump-block, which features CM's Gen 2 ARGB lighting. The company didn't go into the technical details of the fan, but mentioned its top speed to be 2,400 RPM. The MasterLiquid Atmos series comes in two variants, 240 mm and 360 mm. Among the CPU socket types supported are LGA1700, LGA1200, AM5, and AM4.

The Cooler Master Hyper 212 series over the years has become synonymous with aftermarket CPU cooling, as possibly the most popular custom CPU cooler. The company modernized it over the years with new heatsink and fan technologies, and it's has undergone a major design- and tech overhaul with the new Hyper 212 Halo. It retains the conventional aluminium fin-stack (type-U) design, with four 6 mm-thick copper heatpipes making direct contact with the CPU at the base, conveying heat to an aluminium fin-stack heatsink that's been capped off with a die-cast aluminium top-plate. The included 120 mm Halo fan features rifle-bearings rated for over 160,000 hours, and features two sets of addressable-RGB LEDs—along the bore of the fan-frame, and the impeller hub. The fan turns at speeds ranging between 650 to 2,050 RPM, pushing up to 51.88 CFM of airflow at 2.89 mm H₂O static-pressure, and 27 dBA maximum noise output. As part of its design modernization, the Hyper 212 Halo gets support for the latest Sockets LGA1700 and AM5.

EK, the premium liquid cooling hardware manufacturer, is launching the Direct Die product series aimed at delidding and achieving the ultimate cooling of the LGA 1700 socket-based Intel CPUs from the 12th generation Alder Lake and 13th gen Raptor Lake families. Kitguru teamed up with EK to investigate the potential benefits of direct die cooling for Intel's Alder Lake CPUs to achieve the best possible thermal performance on a daily basis. After publishing the first video announcing this collaboration, EK was overwhelmed by the response from Kitguru's audience. In order to bring these products to market, EK reached out to Der8auer, a renowned expert in delidding and direct die applications.

EK has prepared a total of four products to start this Direct Die series: two CPU water blocks (one Limited Edition), a delidding tool, and an upgrade kit for existing EK-Quantum Vector² LGA1700 water blocks. So far, these products are aimed at Intel's LGA1700 socket and 12th and 13th-generation Intel Core CPUs. Delidding is the process of removing the integrated heatspreader (IHS) to reduce the distance between the CPU core die and the coldplate of the CPU cooler. Another benefit involves the removal of an entire layer of thermal transfer from the CPU die to the IHS. The delidding process enables a direct heat transfer from the CPU core to the water block. All this results in a significant reduction in overall thermals and less thermal difference between CPU cores. The procedure is typically performed by experienced enthusiasts because it involves a physical modification of the product that voids the CPU warranty. For a more in-depth explanation, please refer to this EK's blog post on delidding.

At the 2023 International CES, Cooler Master showed off two of its latest premium dual fin-stack (type-D) air CPU coolers, the MasterAir MA826 Stealth, and the Hyper 662 Halo. The MA826 Stealth is, unsurprisingly, the more upmarket of the two, and measures 162.2 mm x 150.6 mm x 165.6 mm (LxWxH). A nickel-plated copper base makes contact with the processor. From here eight 6 mm-thick composite-material "superconductive" heatpipes make their way to two aluminium fin-stacks, which are then ventilated by two Mobius series fans—a 120 mm "push" fan, and a 135 mm conveyor fan located between the two fin-stacks. The two stacks are capped off by a die-cast aluminium top-plate. Both fans feature loop dynamic bearings that are rated for over 200,000 hours operation.

The Hyper 662 Halo leads the company's immensely popular Hyper series that's synonymous with aftermarket CPU cooling. This cooler comes in all-white and all-black trims, and is visibly smaller than the MA826 Stealth. It features the same nickel-plated copper base, but with six heatpipes making their way to the two fin-stacks, and a pair of 120 mm fans handling the ventilation. The fans feature two ARGB LED zones (along the bore of the frame and inside the impeller hub), which is where the Holo name derives from. Both coolers support the latest CPU socket types, including LGA1700 and AM5.

Cooler Master is working with Intel to bring TEC cooling back to the PC mainstream under an Intel-designed standard. Back in the 2010s, the professional overclocking scene was pervaded with various sub-zero cooling methods including liquid-nitrogen or dry-ice evaporators, refrigerated cooling solutions, and an exotic technology called TEC (thermoelectric couple). A TEC based cooler relies on the Peltier Effect, where high-voltage is passed through a TEC plate that has a cool side, and a hot side. The cool side makes contact with the processor/GPU through a base-plate, whereas the hot side is cooled by a liquid-cooling loop. The net result would be that the cool side ends up considerably bringing down temperatures, sometimes even below 0°C. The only drawback for TEC solutions were the need for liquid cooling (for the hot side), and that the TEC mechanism itself is very power-hungry.

The new MasterLiquid ML360 Sub-Zero Evo AIO implements the Intel Cryo Cooling Technology specification that blends TEC technology with a user-friendly all-in-one, closed loop liquid cooling solution. The TEC contributes to the cooling by bringing down CPU temperatures to low-double digits, while the AIO CLC handles the hot-side of the TEC. This part of the cooler uses Cooler Master's most advanced pump-block, and a 360 mm x 120 mm radiator with a trio of the company's high static-pressure Mobius series fans. The cooler is designed for Intel Socket LGA1700. In the pictures below, you see the ML360 Sub-Zero Evo, with its four key components as per the Intel specification: the radiator, the condensation controller, the block (with the TEC), and the pump.

Wizmax by Micronics introduced a handful new CPU coolers and purpose-build heatsinks at the 2023 International CES. The CPU cooler lineup is led by the MA Frigate series. The MA4 Frigate, a thick single aluminium fin-stack tower-type cooler. Five 6 mm-thick copper heatpipes make direct contact with the CPU at the base, conveying heat through a thick aluminium fin-stack, which is ventilated by a custom-design 130 mm fan. With this fan in place, the cooler measures 132 mm x 95 mm x 156.4 mm (WxDxH), weighing 990 g. The fan turns at speeds of up to 1,500 RPM, pushing up to 71.7 CFM of airflow at 1.9 mm H₂O static-pressure. The MA4 Frigate is rated for handling thermal loads of up to 210 W.

The Wizmax MA6 Frigate is the larger sibling, with a type-D dual fin-stack design. Six 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a copper base, conveying heat to two fin-stacks, which are ventilated by a pair of 140 mm fans in push-pull arrangement. One-third of the fins in the two fin-stacks are made of copper, and the rest aluminium. Each of the two 140 mm fans turns at speeds of up to 1,500 RPM, pushing up to 83 CFM of airflow at 2.2 mm H₂O. With the fans in place, the cooler measures 146 mm x 165 mm x 165 mm (WxDxH), weighing 1.6 kg. The MA6 Frigate is rated for 250 W thermal loads. Both coolers support the latest CPU socket types, including AM5 and LGA1700.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce the brand new B760A-SILVER motherboard. Constructed around the Intel LGA1700 Socket, which supports both 12th and 13th-generation Intel processors, the B760A-SILVER motherboard is a jack of all trades, highly suitable for gamers and content creators who look for the most advanced features with a tolerable price tag.

Based on BIOSTAR's globally acclaimed RACING DNA, it offers efficient, reliable functionality typically found only on top-shelf motherboard offerings from market competitors. Signature RGB features, including the RGB ROCK ZONE, give any build a new level of depth and futuristic appeal that complements any color, style, or theme. The B760A-SILVER motherboard supports dual-channel DDR5 memory powered by advanced features like support for both AMD and Intel XMP RAM modules designed to facilitate unparalleled hardware acceleration and performance.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

Intel today expanded its 13th Gen Core "Raptor Lake" Socket LGA1700 desktop processor family with several new 65 W mainstream models. These include all the SKUs that lack an unlocked multiplier, aren't meant for CPU overclocking, and come with slightly lower frequencies and tighter power-management than the unlocked K-series SKUs the company debuted the series with in 2022. The retail packages of these processors include stock Intel fan-heatsinks similar to those the company includes with its 12th Gen "Alder Lake" 65 W processors.

The series is led by the Core i9-13900, an 8P+16E core processor with P-core base frequency of 2.00 GHz, P-core maximum boost frequency of 5.60 GHz, E-core base frequency of 1.50 GHz and 4.20 GHz; and the full 36 MB of L3 cache available on the silicon. The processor base power value is 65 W, and the maximum turbo power is 219 W. Intel lists the MSRP of these processors at $550, a variant without integrated graphics, the i9-13900F, can be had for $524. The Core i7-13700 positioned a notch below, is an 8P+8E processor, with a P-core boost frequency of up to 5.20 GHz, a slightly better 2.10 GHz E-core boost, 30 MB of L3 cache, and the same 219 W MTP value. The i7-13700 is priced at $384, and the iGPU-disabled.

Intel's 2023 roadmap for the desktop processor segment sees the company flesh out its 13th Gen Core "Raptor Lake" desktop family with 65 W (locked) SKUs, and the new i9-13900KS flagship; followed by a new lineup of processors under the "Raptor Lake Refresh" family, due for Q3-2023, with no mentions of a desktop "Meteor Lake" processor in the year. It turns out that "Raptor Lake Refresh" is being designed to fill in for these (i.e. there won't be any "Meteor Lake" desktop chips). This, according to OneRaichu, a reliable source with Intel leaks.

"Meteor Lake" is Intel's first client processor to fully incorporate the company's IDM 2.0 product development strategy of disintegrating the processor into multiple chiplets built on various foundry nodes based on design needs; and combining them onto a single package with a high-performance interconnect. "Meteor Lake" has just one problem and that is CPU core-counts, with rumors pointing to 6P+16E (6 performance cores + 16 efficiency cores) being the maximum core-count possible, something Intel probably feels won't be competitive in the desktop segment against AMD, which will probably have a lineup of "Zen 4" X3D processors out by Q3-2023, with up to 16 P-cores. The company will, however, give "Meteor Lake" a sizable launch in the various mobile segments.

Cougar introduced the Forza 50 Essential and Forza 85 Essential tower-type CPU coolers. The Forza 50 is the lighter and slimmer of the two, with a fin-stack thickness of 50 mm, while the Forza 85 Essential has an 85 mm-thick fin-stack, hence the names. The Forza 50 Essential uses a heatpipe direct-touch (HDT) base, and relies on four 6 mm-thick copper heatpipes to pull heat from the CPU, and convey it through the fin-stack, while the Forza 85 Essential has six of these for the job, but through a nickel-plated copper base-plate.

Both models include a Cougar NHP120 fan. This 120 mm spinner takes in 4-pin PWM input, spins at speeds of up to 2,000 RPM, pushing up to 84.48 CFM of airflow at 4.24 mm H₂O static-pressure, and up to 34.5 dBA noise output. The fans feature hydraulic bearings. With the fan in place, the Forza 50 Essential measures 135 mm x 75 mm x 155 mm (WxDxH) weighing 772 g, while the Forza 85 Essential measures 135 mm x 110 mm x 155 mm, weighing 1.13 kg. Among the CPU socket types supported by both are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

Intel as part of its development process with industry partners and OEMs, allegedly released technical documents in a bare URL that's worded to confirm that its next desktop processor socket will in fact be the LGA1851. We've had some idea since June 2021 that LGA1851 will succeed LGA1700, but this can be taken as a confirmation. Although with a higher pin-count, the LGA1851 package will be physically of an identical size to LGA1700, with mostly identical socket mechanism, so the new socket could maintain cooler compatibility with its predecessor. The additional 151 pins come from shrinking the "courtyard" (the region of the land grid in the center that lacks pins and instead has some electrical ancillaries).

The new Socket LGA1851 platform is expected to power Intel's "Meteor Lake-S" and "Arrow Lake-S" microarchitectures. Whether "Meteor Lake-S" gets the 14th Gen Core branding is a whole different question. Leaked benchmarks suggest that 2023 will be a rather slow year from Intel in the area of desktop processors, and that toward Q3-2023, the company will release the so-called "Raptor Lake Refresh" processors. These chips are likely built on the same LGA1700 package, and as we've seen from "Coffee Lake Refresh," could warrant a new generational branding to 14th Gen Core (as CFL Refresh formed the 9th Gen Core). Intel could increase clock-speeds, E-core counts, and other process/packaging-level innovations to segment these chips apart from existing 13th Gen Core "Raptor Lake." LGA1851 processors like "Meteor Lake" could debut chiplets for Intel, as these have their CPU cores, iGPU, memory-controllers, and uncore components, spread apart on chiplets built on various foundry nodes.

Thermalright today introduced the Assassin X 90 SE, a compact tower-type CPU cooler designed to replace the stock CPU cooling solution with something that's quieter at stock frequencies. The aluminium fin tower-type cooler features a typical design for its kind—four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at an aluminium base; with their ends passing through an aluminium fin-stack that's capped off by a die-case top-plate. This is then ventilated by an included Thermalright TL-G9B 92 mm PWM fan.

The defining feature is the cooler's height of just 118 mm. With its fan in place, the cooler measures 94 mm x 77 mm x 118 mm, weighing 445 g. The included 92 mm fan features fluid dynamic bearing, takes in 4-pin PWM input, turns at speeds of up to 2,400 RPM, pushing up to 43 CFM of airflow at 1.51 mm H₂O pressure, and has a noise output of 27.3 dBA. Among the CPU socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

MONTECH, an innovative PC components and peripherals brand, announces the Metal DT24 BASE and DT24 PREMIUM, dual tower CPU coolers equipped with 2x METAL 120 PWM fans. Featuring a 104-fin stack paired with 6 heat pipes of 6 mm diameter each, the METAL DT24 is compatible with the newest INTEL LGA 1700 and AMD AM5 socket with a rated TDP of 270 W. The DT24 PREMIUM includes an additional aluminium ARGB top cover. The included METAL 120PWM fans offer speeds of up to 1950 RPM and deliver up to 69CFM of airflow and 2.82 mm H2O of static pressure at a 26 dBA noise level. The METAL DT24 BASE is available at MSRP US$57.00, the METAL DT24 PREMIUM is available at MSRP USD $69, and the METAL 120 PWM is available at MSRP $9.90.

The dual-tower, dual-fan METAL DT24 CPU coolers are built from the ground up for high-performance cooling. The heatsink includes a total of 6x 6 mm thick heat pipes for quick and efficient heat transfer from the CPU. The dual-tower cooler has a massive 104-fin stack, which gives the METAL DT24 a surface area of 8553.23 cm² allowing the cooler to handle up to 270 W TDP. The METAL DT24 supports the latest Intel LGA1700 and AMD AM5 processors.

Axiomtek—a world-renowned leader relentlessly devoted to the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is pleased to introduce the MANO561, a high-performance thin Mini-ITX motherboard built with LGA1700 socket for the 12th generation Intel Core processors (codename: Alder Lake-S). Aside from superior compute performance, this low-profile embedded motherboard delivers high-speed connectivity with flexible I/O, impressive graphics in support of triple displays, and high reliability by 12 V-24 V wide-range DC power to bridge the next-gen AIoT applications.

Axiomtek's MANO561 is powered by the 12th generation Intel Core i9/i7/i5/i3, Intel Pentium Gold or Intel Celeron processors (up to 65 W) with the Intel H610 chipset. This embedded board has dual 260-pin DDR4-3200/2666/2400 SO-DIMM sockets with a total capacity of 64 GB. When it comes to display-related features, this motherboard along with Intel UHD graphics offers triple displays with two HDMI ports, one LVDS port, and one VGA port. Plus, it provides various wireless connectivity options which include 5G/4G/LTE connectivity with an M.2 Key B 2242/3042/3052 slot and seamless Wi-Fi connection with an M.2 Key E 2230 slot and a mini-PCIe slot. This motherboard also has a PCIe x16 slot for GPU, AI acceleration, and frame grabber card configurations.

Thermalright today introduced the Phantom Spirit 120 SE premium air-type CPU cooler. The cooler features a dual fin-stack (type-D) design. Seven 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a nickel-plated C1100 mirror-finish copper base, passing through two aluminium fin-stacks. Two 120 mm fans are included, which can be installed that one of them pushes fresh air through the first fin-stack, while the second one acts as a conveyor, and is located between the two fin-stacks (typical type-D cooler arrangement).

Each of the two included TL-C12B V2 fans takes in 4-pin PWM input, turn at speeds of up to 1,500 RPM, pushing up to 66.17 CFM of airflow, at 1.53 mm H₂O static pressure, and a maximum noise output of 25.6 dBA. The fans feature fluid dynamic bearings. With the fans installed, the Thermalright Phantom Spirit 120 SE measures 130 mm x 125 mm x 154 mm (LxWxH), weighing 1.03 kg. Among the CPU socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

Thermalright today rolled out the SI-100 White ARGB, a low-profile aluminium fin-stack CPU cooler. The cooler features a "C-type" design. An aluminium fin-stack is arranged along the plane of the motherboard, skewered by six 6 mm-thick copper heatpipes, which pull heat from a C1100 pure-copper base. The base and heatpipes are nickel-plated (the heatpipes additionally have the matte-white paintjob); while the aluminium fins are anodized.

The included 120 mm TL-E12W-S fan features addressable RGB lighting, takes in 4-pin PWM for its main function and 3-pin ARGB for the lighting. It turns at speeds of up to 2,000 RPM, pushing up to 72.37 CFM of airflow, at up to 2.87 mm H₂O pressure, and 27.7 dBA maximum noise output. It features a durable fluid-dynamic bearing. With the fan in place, the Thermalright SI-100 White ARGB measures 120 mm x 120 mm x 99.8 mm (WxDxH), weighing 640 g. Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Today, ARCTIC, a leading manufacturer of low-noise PC coolers and components, introduces the Alpine 17 LP, a new low-profile case cooler. The Alpine 17 LP relies on a slim and flat radial heat sink and a powerful fan. The installation height of the Alpine 17 LP is only 42.9 mm, making it ideal for small cases such as Mini-ITX cases and HTCPs.

The fan has a wide speed range of 300 to 3000 rpm and remains very quiet, even at higher speeds. The Alpine 17 LP also has the typical ARCTIC 4-pin PWM fan connector and can be easily connected and conveniently regulated via pulse width modulation. The cooler is mounted via push pins and therefore requires no additional tools. Thanks to the pre-applied MX-4 Thermal Paste, the entire assembly is quick and uncomplicated. ARCTIC gives the Alpine 17 LP the 6-year warranty typical for the manufacturer.

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock Z790 PG SONIC, an officially licensed motherboard featuring SEGA's Sonic the Hedgehog. A 16-bit spinning ring emblazons the rear IO cover, while on the rear side you'll even catch a glimpse of Sonic mid-run. The ASRock motherboard is co-launched to celebrate the release of SEGA's new Sonic Frontiers game.

"Designed to bring back epic memories of catching rings in Green Hill Zone, the motherboard echoes Sonic's lightning speed with its fast blue and silver shards and Sonic silhouette, besides the motherboard outlook is designed around the Sonic the Hedgehog theme, the ASRock Z790 PG SONIC also features a SONIC-inspired UEFI BIOS interface", Said Chris Lee, Vice President of ASRock motherboard & gaming monitor business unit.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces the brand new Z790 VALKYRIE motherboard, built to run the all-powerful Intel 13th gen raptor-lake processors. Designed on the base of Intel Z790 single-chip architecture, the Z790 VALKYRIE is the latest addition to BIOSTAR's top-of-the-line flagship motherboard range.

Carrying the latest technology in a sleek, highly refined platform, the stylish design of VALKYRIE exhuberates the pinnacle of BIOSTAR product design and technical prowess. Enter any battle with confidence backed by the unwavering performance and reliability of BIOSTAR's latest Z790 VALKYRIE motherboard. Built to support the latest DDR5 memory, Z790 VALKYRIE holds 4 DIMMs of high-speed DDR 5 memory up to 128Gb with boosted clock speeds exceeding 7200+(OC) MHz.

EK, the premium liquid cooling gear manufacturer, is happy to announce that the EK-Quantum Velocity² D-RGB—1700 water blocks are fully compatible with the newly released Raptor Lake Intel 13th Gen Core CPUs and the Z790 platform. Exactly one year ago, the EK-Quantum Velocity² water block launched and was the first EK product to feature EK-Matrix7 compatibility. Since then, it has won several design and performance awards.

These water blocks use a socket-specific cooling engine to ensure the best performance and optimal flow with low restrictions on every platform. Since the Z790 platform is based on the LGA1700 socket, the EK-Quantum Velocity² 1700 water blocks are fully compatible with the CPU socket and IHS geometry of Intel 13th Gen Core CPUs.

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will exhibit at Infocomm SEA 2022, the Professional Audio Visual event in Southeast Asia at Bangkok, Thailand, Booth no. Z12 from Nov. 2 to 4 to showcase the latest LEET gaming series, the comprehensive LIVA Mini PC family and the All-in-One PC to apply for wide range of applications.

ECS will first launch the new LEET Gaming series, LEET Gaming Motherboard Z790H7-A and LEET Gaming Barebone PC B660 during Infocomm SEA 2022. To offer users exceptional PC performance, LEET Z790H7-A designs with the next-generation technology to support the latest Intel 12th & 13th Gen Processors for LGA 1700 socket, dual channel DDR5 RAM up to 128 GB, PCIe 5.0 slot, 2.5 Gb LAN and the latest wireless networking. Besides, LEET Gaming series also provides a gaming PC system, LEET B660, for user to build their own PC more easily. LEET B660 includes a B660H7-M20 Motherboard supported by the Intel 12th Gen Processor for LGA1700 socket, an NVIDIA GeForce RTX 30 series Graphic Card or AMD Radeon RX 6000 series Graphic Card and a power supply up to 650-watt into a 26-liter system case.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency—is glad to introduce the IMB540, a superior industrial ATX motherboard featuring the LGA1700 socket for the 12th generation Intel Core i9/i7/i5/i3 processors (code name: Alder Lake-S). In addition to providing high computing performance, the IMB540 ATX motherboard features quad displays and dual GPU expansion, delivering intelligent workload optimization and highly scalable graphics for next-gen edge AIoT applications.

he Axiomtek's IMB540 is built with Intel R680E chipset and features ranging CPU options with the 12th generation Intel Core, Intel Pentium and Intel Celeron processors. In addition to this, it is equipped with four DDR4-3200 ECC/non-ECC un-buffered Long-DIMM slots with a total capacity of 128 GB. This motherboard has a total of five PCIe slots—two PCIe 4.0 x16 slots and three PCIe x4 slots—for GPU, AI acceleration, frame grabber, NIC, and motion control card configurations. The networking interfaces consist of a 2.5 GbE LAN port with time sensitive networking (TSN), a GbE LAN port, as well as a PCIe Mini Card slot with SIM slot for Wi-Fi/Bluetooth/LTE connectivity. Featuring Intel Iris Xe Graphics, the IMB540 supports up to four independent displays via HDMI, DVI-D, VGA, and DisplayPort.

AMD reportedly scaled down production of its Ryzen 7000 series desktop processors in response to bleak demand across the PC hardware industry. Wccftech claims to have read an internal company document calling for reduced supply to the channel as market response to the Ryzen 7000-series is weak. This comes hot on the heels of AMD revising its Q3-2022 forecast, trimming its guidance by a $1 billion drop in revenue, citing weak demand in the PC market. However, we are seeing no deviation from the launch pricing for Ryzen 7000-series SKUs or compatible Socket AM5 motherboards. The platform went on sale from late September, on the same day that Intel announced its competing 13th Gen Core "Raptor Lake" processors. The new Intel chips are expected to start selling from a little later this month.

Unlike 13th Gen Core processors, Ryzen 7000 series processors appear to be a victim of the platform—notwithstanding the high pricing of the processors, which start at $299 for the 6-core 7600X, buyers lack access to affordable motherboards, and have to contend with expensive DDR5 memory. Pricing of cheaper LGA1700 motherboards based on entry-level H610 and B660 chipsets with cost-effective DDR4 memory support have added depth to consumer choice, besides Intel's 12th Gen range starting from under $150.