BIOSTAR today introduced the B660T-Silver, a Socket LGA1700 motherboard in the Mini-ITX form-factor, based on the Intel B660 chipset. The board wires a 12th Gen Core "Alder Lake" processor with DDR4 memory, and a PCI-Express 5.0 x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 9-phase CPU VRM. Up to 64 GB of dual-channel DDR4 memory is supported, at overclocked speeds of up to DDR4-5000.

Storage connectivity of the BIOSTAR B660T-Silver includes four SATA 6 Gbps ports, and two M.2-2280 slots with PCI-Express 4.0 x4 wiring, one of which is connected to the CPU, and the other from the B660 PCH. Network connectivity includes a 2.5 GbE port driven by a Realtek RTL8125B, and provision for WLAN connectivity, including 2x2 antenna coaxial jacks, and an M.2 E-key slot with PCI-Express 3.0 x1 and USB 2.0 wiring, so you drop in your own WLAN module. 6-channel HD audio driven by a premium Realtek ALC1220 CODEC makes for the rest of it. The company didn't reveal pricing.

Intel's next-generation desktop processor socket will be the LGA1851. Leaked documents point to the next-generation socket being of identical dimensions to the current LGA1700, despite the higher pin-count, which could indicate cooler compatibility between the two sockets, much in the same way as the LGA1200 retained cooler-compatibility with prior Intel sockets tracing all the way back to the LGA1156. The current LGA1700 will service only two generations of Intel Core, the 12th Generation "Alder Lake," and the next-gen "Raptor Lake" due for later this year. "Raptor Lake" will be Intel's last desktop processor built on a monolithic silicon, as the company transitions to multi-chip modules.

Intel Socket LGA1851 will debut with the 14th Gen Core "Meteor Lake" processors due for late-2023 or 2024; and will hold out until the 15th Gen "Arrow Lake." Since "Meteor Lake" is a 3D-stacked MCM with a base tile stacked below logic tiles; the company is making adjustments to the IHS thickness to end up with an identical package thickness to the LGA1700, which would be key to cooler-compatibility, besides the socket's physical dimensions. Intel probably added pin-count to the LGA1851 by eating into the "courtyard" (the central gap in the land-grid), because the company states that the pin-pitch hasn't changed from LGA1700.

Phanteks introduces 3 new chassis; the new Eclipse P500A matte white, Eclipse G360A, Eclipse G500A, a new LCD screen module for the Evolv Shift XT and LGA1700/AM5 support for the Glacier One MP AIO coolers. The Eclipse P500A is a premium mid-tower case that combines high airflow performance with style. It features the Ultra-fine Performance mesh front panel for optimal airflow with dust filtration. The P500A will now be available in Matte White and replaces the original white color option.

Launching on June 8th, the G360A will feature a new design front mesh panel with increased air intake thanks to the enlarged mesh surface area. The case will also support up to 400 mm long GPUs, a new removable fan bracket, and pre-equipped 3x PWM DRGB fans. The G360A will be available in Satin Black and Matte White color options. Following the G360A, the G500A will have new features that include a better innovative design to the front and top for easy fan/radiator installation with a new look for the front mesh panel. The G500A will be available at the end of the summer and have the option of Satin Black or Matte White colors.

EK, the leading premium liquid cooling gear manufacturer, announces new signature CPU water blocks - EK-Quantum Velocity² and EK-Quantum Magnitude Lignum edition. Lignum Line is inspired by Mr. Edvard König's love for woodwork and modern computer technologies and is named after the Latin translation of the word "wood." A perfect symbiosis of the oldest natural building material and contemporary high-end cooling solutions. An unparalleled example of how your PC can reflect your lifestyle. While EK Lignum and its wooden opulence can bring a feeling of comfort and warmth, from the technological standpoint, this symbiosis allows for the best-performing socket-specific water blocks - Velocity² and Magnitude.

Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of each specific CPU platform, is used to achieve low hydraulic flow restriction and high performance. The lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area.

Thermalright today introduced the AXP90-X53 Full Black, a premium top-flow air-based CPU cooler. The cooler is designed for a Z-height of 53 mm when fully assembled (including fan), making it fit for certain SFF/low-profile use-cases. Its design involves a mirror-finish nickel-plated C1100 copper base, from which four 6 mm-thick heat-pipes of the same material pass through, conveying heat through a stack of 54 dark-tinted aluminium fins.

The fin-stack is ventilated by a 15 mm-thick 92 mm fan. This fan takes in 4-pin PWM input, and features a double ball-bearing setup. It turns at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of airflow, at up to 22.4 dBA of noise output. Among the CPU socket types supported by the Thermalright AXP90-X53 Full Black are LGA1700, LGA1200, and AM4. With its fan in place, the cooler measures 94.5 mm x 95 mm x 53 mm (WxDxH), weighing 540 g. The company didn't reveal pricing.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new line of all-in-one RGB CPU coolers for performance-minded DIY enthusiasts: H100i RGB ELITE, H115i RGB ELITE, and H150i RGB ELITE Liquid CPU Coolers. Featuring wide compatibility with the latest Intel and AMD sockets - including LGA 1700 and AM5 - and first-class airflow thanks to their new CORSAIR AF ELITE Series cooling fans, RGB ELITE coolers deliver high-caliber cooling to keep your CPU temperatures down, even when the action is heating up.

AF ELITE Series fans also launch today as standalone offerings. Available in either black or white and in 120 mm or 140 mm sizes, AF ELITE fans take advantage of powerful CORSAIR AirGuide technology and ultra-quiet fluid dynamic bearings to deliver robust, concentrated airflow. For cooling that keeps your system performing at its best, take AF ELITE fans for a spin.

DeepCool, a global brand in designing and manufacturing high-performance computer components for enthusiasts worldwide, announces a highly compatible CPU air cooler that offers impressive heat dissipation power in a compact and efficient design. With a slim profile, the AK400 air cooler serves as a thermal solution that can easily fit into mainstream ATX/MATX system builds. the unique design of the matrix form fin-stack and the non-RGB cover top offers a special aesthetic value to particular users.

The DeepCool AK400 Performance CPU Cooler is highly compatible and offers impressive heat dissipation power of 220 W in a compact and efficient design. Four direct touch copper heat pipes quickly transfer heat away from the processor into a dense matrix fin array heat sink for effective cooling performance.

Tech innovator GELID Solutions unveils the latest high-performance CPU Cooler for AMD and Intel CPU. The Rev. 5 TRANQUILLO is a product of the GELID Solutions GAMER product line. The Rev. 5 TRANQUILLO is the latest iteration of the Award winning Tranquillo line of low noise CPU coolers and includes an Enhanced High-Class Black Electrophoretic Coating with an all black Silent Fan.

The 120 mm Silent Fan with Smart 4 Pin PWM which uses a constellation of the advanced Heat sink with 4 Heat pipes featuring the Heat pipe Direct Contact (HDC) Technology, delivers Best-in-Class performance. Compact size, lightweight design and seamless mounting, all ensure it's broad cross-platform compatibility and easy installation. Full support of TDP 150 W. The high-performance GC-Pro thermal compound and the all-in-one Mounting Kit for multiple CPU Socket: AM4, AM3+, AM3, AM2+, AM2, LGA1700, LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150, FM2+, FM2, FM1.

Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

ID-COOLING today announced IS-47S 47 mm height low profile CPU air cooler. At a total height including the fan of 47 mm, this cooler would be a good choice for your A4 cases. Designed with an overall dimension of 100x93x47mm, it has no conflict of the RAM or PCI-E slots. The heatsink is solid built with a pure copper base and 4 heatpipes and massive aluminium fins. The heatsink itself is measured at 35 mm height. Adding a powerful 12 mm PWM fan, this cooler is capable of handling processors with a maximum TDP of 95 W. In terms of mounting kit, two separate backplates are provided in the box for Intel and AMD respectively. The sockets list includes Intel LGA1700/1200/1151/1150/1155/1156 and AMD AM4.

The bundled thermal grease is named FROST X25, which has a thermal conductivity of 10.5 W/m-K.

Alphacool's CPU All-in-One solutions Eisbaer Aurora and Eisbaer LT Aurora are now available with the new NexXxoS HPE (High Performance Edition) 360mm radiator. What does HPE mean? The NexXxos HPE-30 radiator uses the same materials as the previous NexXxos models, but technically goes a step further. Due to the condensed internal construction, the number of water channels and copper fins could be increased. This means that a larger volume of water is in direct contact with the cooling fins and the heat transfer is enormously improved.

Due to the higher number of fin rows and their shortening, the cooling surface is also used much more efficiently. Comparison tests (test setup: ASUS Prime X299/Intel i9-10900X with 350 W waste heat) with the conventional NexXxos radiator have shown that a significant performance increase of 4.5K is possible when using the HPE radiator. At higher ambient temperatures and higher fan speeds, the performance gap to the normal NexXxoS radiators even increases progressively and reaches a possible performance increase of up to 6K. There has never been such a leap in performance in the past!

EK, the Europe-based premium water cooling gear manufacturer, is proud to present its flagship CPU water block - EK-Quantum Magnitude, designed specifically for the LGA 1700 socket. It uses specific flow distribution, cold plate geometry, and mounting pressure tailored to the IHS of LGA 1700 Intel processors. Its unrivaled internal geometry creates a far greater heat transfer area with less restriction that leaves no stress on the rest of the custom loop liquid cooling system.

This block is specifically engineered for LGA1700 socket-based Intel Core CPUs of 12th generation Core architecture. EK-Quantum Magnitude is bearing the prestigious iF Design award for the bold and different approach to the CPU water block mounting mechanism. Differentiated from any mounting structure of a water block that is usually a black and mundane plate, the design accentuates an integrated X-shaped three-dimensional frame with premium finishes that firmly cradles the main body in place, while the screws are morphed into sophisticated design details.

Noctua today presented the all-new NH-D12L low-height dual tower CPU cooler and the corresponding NF-A12x25r round-frame 120 mm fan. At a height of only 145 mm (13 mm lower than Noctua's regular 120 mm models), it fits many 4U enclosures as well as narrower tower cases that have been previously limited to solutions with 92 mm fans. At the same time, its five heatpipe dual-tower design and state-of-the-art NF-A12x25r 120 mm fan allow it to achieve a level of efficiency that surpasses many full-height 120 mm models.

"So far, all our 120 mm class coolers were 158 mm high, but as of recent, more and more PC cases only support up to 150 or even 145 mm - this is where the NH-D12L steps in", explains Roland Mossig (Noctua CEO). "Simply lowering one of our existing models wasn't an option because a standard square 120 mm fan would cause lots of issues with motherboard heatsinks or shrouds. That's why we came up with this novel dual tower design and a round-frame version of the NF-A12x25 fan that can be installed at a very low position between the two towers - a winning combination that provides impressive results for this height class."

SilentiumPC, the European manufacturer of CPU coolers, power supplies, and PC cases, announces the newest version of its Spartan line of CPU coolers. This includes the Spartan 5 standard, the Spartan 5 MAX, and the Spartan 5 ARGB and MAX ARGB. This new lineup of CPU cooling systems was developed in cooperation with Synergy Cooling, and directly competes with more expensive mid-range coolers. The streamlined heatsink design and base, which consists of heatpipes in direct contact with the processor, is able to effectively cool even the latest processors, while maintaining low noise levels and an affordable price.

The Spartan 5 family uses a specially designed, heatsink-integrated version of the award-winning 120 mm Fluctus fan, ensuring both quiet operation and psychoacoustic optimization throughout the entire setup. It was designed primarily for system integrators and users looking for efficient and inexpensive cooling. Thanks to its uniform structure, it is not only extremely easy to install, but also much more resistant to mechanical damage that may occur during transport.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, introduces today the Alpine 17 and Alpine 17 CO, a pair of compact air coolers designed exclusively for the Intel LGA1700 socket. With the release of its newest Alpine coolers, ARCTIC presents an affordable option for users looking to cool their Alder Lake processors. The successors to the Alpine 12 series retain its classic radial heatsink design but are specifically built for the LGA1700 socket.

The cooler's Y-shaped fin ensures optimal heat distribution in the heatsink, while heat dissipation is significantly enhanced by the Alpine 17's large surface area and high airflow rate. With a low installation height of only 68.2 mm, the Alpine 17 and Alpine 17 CO are ideal choices for most all-in-one systems as well as small cases (Mini-ITX, µATX etc.).

Scythe releases today a revised version of the premium High-End CPU Cooler Fuma 2. Based on the classic Fuma 2 asymmetrical heatsink design, the award-winning twin tower cooler is now upgraded with two new Kaze Flex II fans. The new fans increase the airflow by speeding up to 1500 RPM and the rubber frame design guarantees grand noise reduction. For many Intel 12th Gen CPU users, the concern about the additional purchase of the LGA 1700 mounting kit can now rest assured. The Scythe H.P.M.S. IV mounting System now offers full Intel LGA 1700 support. The Scythe Fuma 2 Rev.B CPU cooler is now available in the US, Japan, Taiwan markets.

Chinese motherboard maker ONDA released the first Intel Socket LGA1700 motherboard that features both DDR4 and DDR5 memory support—something we learned quite early on that Intel either isn't allowing or is "discouraging" motherboard vendors to do. The ONDA H610M+ is based on the entry-level Intel H610 chipset, and is an otherwise basic-looking motherboard. The memory sub-system is interesting.

While the board supports both DDR5 and DDR4, there's only one of each slots, so you're limited to single-channel, and like every motherboard from the past that supported multiple memory types; you can't use the DDR5 and DDR4 slots at the same time. The board runs DDR4 at a maximum frequency of DDR4-3200, and the DDR5 slot at DDR5-4800 (max). That's not all, the board is quite possibly the only H610 chipset-based motherboard with a Gen 5 PCI-Express x16 slot (every other H610 board we've come across has Gen 4, to keep costs low). PCIe Gen 5 is allowed for the H610 platform. Another interesting bit is the M.2 E-key slot, so you can drop in a WLAN module. It's likely that this board will only be available in the Chinese market.

Intel debuted its Socket LGA1700 motherboard lineup with Z690, and later B660 and H610 chipset options, but the H670 seemed elusive. Motherboard vendors are slowly launching their H670-based offerings, and MSI joined the party with the MAG H670 Tomahawk WiFi DDR4. The board is very similar in design to the company's MAG B660 Tomahawk-series motherboards, but with a little more I/O, and a broader chipset bus. The key feature that sets the H670 apart from the B660 is the 8-lane DMI 4.0 chipset bus, compared to 4-lane DMI 4.0 on the B660.

Another key difference between the H670 Tomahawk and B660 Tomahawk is that the PCI-Express x16 slot is Gen 5 capable on the H670 board, but this is due to MSI's design choices. On paper, B660 platforms can have Gen 5 PEG slots. Yet another key differentiator between the H670 and B660 chipsets, is that the H670 puts out 12 PCIe Gen 4 downstream lanes, and MSI leveraged this to put out two chipset-attached M.2 NVMe slots with Gen 4 x4 wiring. Connectivity includes a 2.5 GbE wired networking interface driven by an Intel i225-V controller, an Intel AX200 WiFi 6 + Bluetooth 5.2 module; and 8-channel HD audio driven by the 12-year old Realtek ALC897 CODEC. The company didn't reveal pricing.

Jonsbo today unveiled the HX4170D, a low-profile, top-flow CPU cooler with a Z-height (including fan) of 45.3 mm. Four 6 mm-thick copper heat pipes pass through an indirect-copper base, conveying heat through an aluminium fin-stack that's ventilated by a compact 12.5 mm-thick 92 mm fan. The fan spins between 600 to 3,300 RPM, pushing up to 38.85 CFM of air-flow, at up to 28.4 dBA noise level. The fan features a hydraulic bearing.

There are two variants of the HX4170D. The standard White variant has an all-white heatsink, and its fan features addressable-RGB illumination. The All-Black variant has an opaque fan impeller, and lacks illumination. The cooler measures 95 mm x 95 mm x 45.3 mm (WxDxH), weighing 290 g. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

JONSBO today unveiled the HP400S, an ultra-low-profile, top-flow CPU cooler. With its fan in place, the cooler has a height of just 36 mm. Despite its compact dimensions, its designers claim that it is capable of handling thermal loads of up to 140 W. Its design involves four 6 mm-thick copper heat pipes making direct contact with the CPU at the base, twisting into a dense aluminium fin-stack with 40 fins, which are ventilated by a 90 mm fan. This 15 mm-tall 90 mm fan can turn at speeds of up to 3,000 RPM, pushing up to 48.3 CFM of airflow, and 3.24 mm H₂O static pressure, with a maximum noise output of 33 dBA. The cooler measures 103 mm x 92 mm x 36 mm, with a weight of 380 g. Among the CPU socket types supported are LGA1700, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Bitspower is known almost entirely for its DIY liquid-cooling products, but is looking to expand into the air-based cooling space. The company is ready with the Bitsport Phantom, a tower-type CPU air cooler. The cooler features a conventional tower-type design, in which four 6 mm-thick copper heat-pipes make direct contact with the CPU at the base, conveying heat through the fin-stack. The heat-pipes are capped at the ends, and the top-plate has a slick looking insert with the Bitspower logo in the center. The fin-stack is ventilated by a 120 mm addressable-RGB illuminated fan. The cooler supports the latest LGA1700 socket. Specs related to the fan and heatsink, as well as pricing and availability information, remains unknown.

Intel is allegedly advancing the launch of its 13th Gen Core "Raptor Lake-S" desktop processors to some time in Q3-2022, according to a report by Moore's Law is Dead. It was earlier believed to be a Q4 launch, much like "Alder Lake" was, in 2021. The report predicts the debut of "Raptor Lake" in the desktop segment in Q3-2022 (between July and September), with certain mobile SKUs expected toward the end of the year, in Q4. The Core "Raptor Lake-S" processor is built in the existing Socket LGA1700 package, and is being designed for compatibility with existing Intel 600-series chipset motherboards with a firmware update.

The "Raptor Lake-S" silicon is built on the existing Intel 7 (10 nm Enhanced SuperFin) node, and physically features eight "Raptor Cove" P-cores, along with sixteen "Gracemont" E-cores that are spread across four clusters. The chip has additional cache memory, too. Moore's Law is Dead predicts that the "Raptor Cove" P-core could introduce an IPC uplift in the region of 8 to 15 percent over the "Golden Cove" core, while the chip's overall multi-threaded performance could be anywhere between 30 to 40 percent over "Alder Lake-S," on account of not just increased IPC of the P-cores, but also eight additional E-cores.

Introducing the EVGA Z690 DARK K|NGP|N - The Motherboard Designed by and Used by Professional Overclockers. EVGA DARK motherboards blaze the trail for other boards to follow, and the Z690 DARK K|NGP|N is no exception. The ability to destroy world records is insignificant next to the power of a 21-phase VRM and a 10-layer PCB - capable of driving the most powerful 12th Gen Intel Core processors. With support for 64 GB of DDR5 memory at up to 6600 MHz+(OC), PCIe Gen5, and PCIe Gen4 M.2 NVMe SSDs, a new DARK age of overclocking will rise as quickly as new hardware becomes available. The Z690 DARK K|NGP|N is today's choice for the future of overclocking and gaming.

The new Jonsbo HX6240 joins a breed of thick aluminium fin-stack tower-type coolers, which rely on a thicker aluminium fin-stack, over a split dual fin-stack design. With its single 120 mm fan in place, the cooler measures 105 mm x 120 mm x 162 mm (DxWxH), weighing 1.035 kg. Its design involves a nickel-plated copper base that has a mirror-finish, from which six 6 mm-thick copper heat pipes emerge, transferring heat to the aluminium fin-stack, which is ventilated by a 120 mm fan.

The surface-area for heat-dissipation mentioned by Jonsbo, is 8,900 cm². The fan included with the Jonsbo HX6240 turns at speeds of up to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 45.56 dBA noise output. It features a fluid-dynamic bearing. An interesting design element of this cooler is its detachable top-plate, which uses magnets to stay in place, and is hence tool-free. Removing the top-plate, and slighly pushing down the fan, lets you reduce the height of the cooler by 5 mm. The HX6240 comes in two trims—black and white. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.