A leaked Intel company document detailing the "go to market" (GTM) plan for its 13th Gen Core "Raptor Lake" desktop processors, reveals key dates associated with it. Intel will likely hold a launch event for the 13th Gen Core "Raptor Lake" processors on September 27, 2022 (when it's September 28 in Taiwan). This happens to be the same day AMD's Ryzen 7000 "Zen 4" processors go on sale. Pre-orders for these processors will open on October 13, 2022 (or October 14 in Taiwan). This is when you'll be able to order one online. October 20 is when the processors will be available to purchase off the shelf (October 21 in Taiwan). This document does not deal with review NDAs, so we'll have to guess that reviews go live somewhere between September 27 and October 13.

Built on the same Intel 7 process as "Alder Lake," "Raptor Lake" introduces an IPC increase with its "Raptor Cove" P-cores, and a doubling in the count of its "Gracemont" E-cores, along with increases in L2 cache sizes for both the P-cores and E-core clusters. The processor is said to be built on the same LGA1700 package as the 12th Gen, and compatible with Intel 600 series chipset motherboards with a UEFI firmware update. The processors launch alongside new Intel 700-series chipset motherboards that have out-of-the-box support for them.

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.

Akasa, a leading provider of fanless cases, have recently released two new examples, updated for the LGA1700 mounting size. The Galileo TU Plus and the Euler TX Plus have been designed for thin Mini-ITX motherboards, these cases can be used in a server rack (Galileo TU1 and TU3 have rack mounts included, A-ITX52-M1B and A-ITX54-M1B respectively) or can be hidden away for a clean, truly silent aesthetic.

With the newest release of Intel's 12th generation Alder Lake processors, the socket change to LGA1700 has led to an alteration in the heatsink's mounting mechanism. The Galileo TU Plus and Euler TX Plus are compatible with LGA1700, as well as LGA1200 and LGA1151 with the included mounting brackets. This ensures a tight connection between the processor and the thermal block, making the case an excellent heatsink for Intel processors from 6th generation up to the latest 12th generation.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, introduces the CVN B660I GAMING FROZEN and CVN B660I GAMING Mini-ITX motherboards as the latest addition to the CVN Series motherboards for the 12th generation Intel Core processors. The GAMING FROZEN motherboard features a white PCB from front to back, complemented with silver CVN cooling armor heatsinks.

The CVN B660I motherboards are perfect for small-form-factor PC enthusiasts seeking a compact powerhouse. The Mini-ITX motherboard sports an 8+1 Dr MOS power phase design and two DDR4 DIMM slots support up to 64 GB dual-channel capacity, and up to DDR4-4600 (OC) frequency. The motherboard features dual M.2 slots (PCIe 4.0 + PCIe 3.0), supporting up to two NVMe SSDs for storage.

Akasa, a leading provider of passive cooling solutions and fanless cases, have announced an update to their popular Maxwell Pro fanless case. The new Maxwell Pro Plus is now compatible with the LGA1700 socket from Intel, and some of their highest performing 12th generation processors with integrated graphics, including the Intel Core i9-12900.

High-end processors usually require a hefty cooler equipped with high-speed fans, but Akasa's Maxwell Pro plus fanless Mini-ITX case can tame the beast, all whilst producing nothing but silence. The Maxwell Pro can handle the newest 12th Generation of Intel Core processors up to 65 W TDP (including backwards compatibility for LGA 1200 and 115x sockets) and is the perfect pair for activities such as content creation and 4K video streaming. The high-performance fanless case can adequately maintain temperatures around 80°C under load and completes the tremendous trio of Plus cases in Akasa's new range. The Maxwell Pro Plus is compatible with latest 600 Series Mini-ITX motherboards such as ASUS's ROG STRIX Z690-I and B660-I, Gigabyte's Z690I/B660I Aorus Ultra, and MSI's MEG Z690I Unify.

Elitegroup Computer Systems (ECS), the global leading motherboard, Mini-PCs, Notebooks, mobile device, and smart city solutions provider, is proud to present the high performance, power efficiency, and multi-tasking mini PC - LIVA One H610. It's powerful, multi-functional, and adopts to support Intel 12th Gen Processors with LGA1700 Socket to fulfill daily computing purposes. It sports up to 64 GB DDR4 dual-channel memory technology and is expansion-friendly through the M.2 socket to meet all sorts of needs.

The LIVA one H610 supports up to three different outputs including HDMI, DisplayPort, and VGA, and reaches up to 4K high-quality resolution. It is a good fit for all-around scenarios like corporate offices, specific businesses, individual studios, homes, and so on due to its expandable and diversified possibilities. With TPM support, LIVA One H610 is ideal for small to mid-size businesses (SMBs),it helps keep PCs secure by offering hardware-level protection against malware and sophisticated cyberattacks.

Intel's 13th Gen Core i5 "Raptor Lake" desktop processor lineup could see the top Core i5-13600K and i5-13600KF feature a 6P+8E core-configuration (that's six performance cores and eight efficiency cores). Each of the six P-cores has HyperThreading enabled, making this a 14-core/20-thread processor. Each of the six "Raptor Cove" P-cores has 2 MB of dedicated L2 cache. The eight "Gracemont" E-cores are spread across two E-core clusters with four cores, each. Each cluster shares 4 MB of L2 cache among the four E-cores (increased from 2 MB per cluster on "Alder Lake"). The P-cores and E-cores share 24 MB of L3 cache, increased from 20 MB on the i5-12600K.

A qualification sample (QS) of the Core i5-13600K made its way to social media, where it was put through a bunch of synthetic tests. In CPU-Z Bench, the i5-13600K QS scores 830 points in single-thread, compared to 648 points of the Ryzen 9 5950X "Zen 3," and trails it in the multi-threaded tests, with 10031.8 points, compared to 11906 points for the Ryzen. The QS comes with a Processor Base Power (PBP) value of 125 W, same as that of the i5-12600K. "Raptor Lake" is backwards compatible with Intel 600-series chipset motherboards, although it launches alongside the Intel 700-series chipset. It shares the LGA1700 socket with 12th Gen "Alder Lake," and is built on the same Intel 7 node (10 nm Enhanced SuperFin) as its predecessor.

Intel's 13th Gen Core "Raptor Lake" is shaping up to be another leadership desktop processor lineup, with an engineering sample clocking significant increases in gaming minimum framerates over the preceding 12th Gen Core i9-12900K "Alder Lake." Extreme Player, a tech-blogger on Chinese video streaming site Bilibili, posted a comprehensive gaming performance review of an i9-13900K engineering sample covering eight games across three resolutions, comparing it with a retail i9-12900KF. The games include CS:GO, Final Fantasy IX: Endwalker, PUBG, Forza Horizon 5, Far Cry 6, Red Dead Redemption 2, Horizon Zero Dawn, and the synthetic benchmark 3DMark. Both processors were tested with a GeForce RTX 3090 Ti graphics card, 32 GB of DDR5-6400 memory, and a 1.5 kW power supply.

The i9-13900K ES is shown posting performance leads ranging wildly between 1% to 2% in the graphics tests of 3DMark, but an incredible 36% to 38% gain in the CPU-intensive tests of the suite. This is explained not just by increased per-core performance of both the P-cores and E-cores, but also the addition of 8 more E-cores. Although the same "Gracemont" E-cores are used in "Raptor Lake," the L2 cache size per E-core cluster has been doubled in size. Horizon Zero Dawn sees -0.7% to 10.98% increase in frame rates. There are some anomalous 70% frame-rate increases in RDR2, discounting which, we still see a 2-9% increase. FC6 posts modest 2.4% increases. Forza Horizon 5, PUBG, Monster Hunter Rise, and FF IX, each report significant increases in minimum framerates, well above 20%.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is constantly pushing limits to provide high- performance cooling solutions for all tech fans, PC builders, PC enthusiasts, and modders. This time, with no exception, introducing two all-new high-performance CPU water blocks, the Pacific W8 CPU Water Block with a full copper design and the Pacific W9 CPU Water Block with an acrylic design, are in stock for purchase now. Built with high-quality materials, the Pacific W8 and W9 CPU Water Blocks aim to suffice even the most demanding users seeking top-tier CPU water blocks.

Pacific W8 CPU Water Block features a copper top and base with anti-corrosive nickel plating; this provides a stunning mirror finishing and prevents material corruption while extending overall durability. On the other hand, the Pacific W9 CPU Water Block also has an anti-corrosive nickel plating copper base, but it comes with an acrylic top cover for a crystal clear inside view, allowing users to showcase colorful coolant passing through the Pacific W8 and the W9 CPU Water Blocks. Pacific W8 and W9 both feature a central inlet design with a jet plate in the middle of the water block, restricting the water flow for even coolant distribution through the optimized 0.2 mm micro-channels. By doing so, the copper plate can quickly transfer heat from the CPU into the coolant, ensuring better cooling efficiency and the best heat dissipation from the CPU.

MSI today introduced the MAG CoreLiquid B line of entry-level all-in-one liquid CPU coolers. Models in the lineup include the MAG CoreLiquid B120 and B240, with radiator sizes of 120 mm x 120 mm and 240 mm x 120 mm, respectively. These coolers feature a simple, puck-shaped water-block, with an illuminated MSI Gaming logo that can be rotated to suit the orientation of your setup. The pump is integrated with the radiator, and features a 6-pole motor. The included fans feature three fixed-color LEDs (one each of red, blue, and green), turn at speeds between 500 to 2,000 RPM, pushing 21.63 to 78.73 CFM airflow. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Axiomtek is pleased to introduce the MANO560, an industrial Mini-ITX motherboard featuring the LGA1700 socket for the latest 12th Gen Intel Core processor (codename: Alder Lake S) to boost the performance of AI and IoT applications.

The industrial Mini-ITX motherboard MANO560 is based on the new Intel H610 chipset and features scalable CPU options with the 12th Gen Intel Core i9/i7/i5/i3, Intel Pentium Gold or Intel Celeron processors. While the high performance is assisted by the two DDR4-3200 SO-DIMM with up to 64 GB of memory, it is equipped with one M.2 Key E 2230 for wireless module and one M.2 Key B in which the user can choose between the PCIe x2 signal, the USB 3.2 Gen1 for 3042/3052 5G module or SATA interface for 2242 SSD, making the embedded board much more flexible. Besides, it provides a full-size mini PCIe for wireless modules and a PCIe x16 for graphics cards.

EK, the premium liquid cooling gear manufacturer, is releasing the EK-Mana LiteBlock MAG Torpedo Z690 D-RGB - Plexi, an Intel LGA1700 socket-based LiteBlock that is engineered specifically for the MAG Z690 Torpedo motherboard from MSI. This kit of specially designed VRM heatsinks and the LiteBlock can upgrade the MAG Z690 Torpedo to a liquid-cooled motherboard, just like the EK X version of this product. The addressable D-RGB LED in the monoblock is compatible with MSI Mystic Lights RGB control and offers a full lighting customization experience for every single diode at any given time. This Mana LiteBlock is EK-Matrix 7 compatible.

This is a complete, all-in-one (CPU and motherboard) liquid cooling solution for Intel 12th gen Core series processors and is compatible with the LGA 1700 socketed MSI MAG Z690 Torpedo motherboard. This LiteBlock uses the latest generation of EK Velocity² cooling engine to ensure the best possible CPU cooling without reducing the flow to other components. This water block directly cools the Alder Lake CPU, the VRM heatsink, and, by proxy, the VRM components. The package includes two replacement heatsinks with thermal pads, replacing the factory-mounted VRM heatsink.

An engineering sample of a 13th Intel Core "Raptor Lake" Core i9 processor hit the web, courtesy of wxnod on Twitter, which confirms its 8P+16E core-configuration in a CPU-Z screenshot. Based on the same LGA1700 package as "Alder Lake," and backwards compatible with Intel 600-series chipset motherboards, besides new 700-series ones, "Raptor Lake" combines eight "Raptor Cove" performance cores (P-cores), with sixteen "Gracemont" efficiency cores (E-cores).

"Raptor Cove" features a generational IPC increase over the "Golden Cove" P-cores powering "Alder Lake," while the "Gracemont" E-cores, although identical to those on "Alder Lake," are expected to benefit from the doubling in L2 cache per cluster, from 2 MB to 4 MB. The ISA as detected by CPU-Z appears to be identical to that of "Alder Lake." The processor is a monolithic silicon chip built on the Intel 7 (10 nm Enhanced SuperFin) silicon fabrication process.

BIOSTAR today introduced the B660T-Silver, a Socket LGA1700 motherboard in the Mini-ITX form-factor, based on the Intel B660 chipset. The board wires a 12th Gen Core "Alder Lake" processor with DDR4 memory, and a PCI-Express 5.0 x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 9-phase CPU VRM. Up to 64 GB of dual-channel DDR4 memory is supported, at overclocked speeds of up to DDR4-5000.

Storage connectivity of the BIOSTAR B660T-Silver includes four SATA 6 Gbps ports, and two M.2-2280 slots with PCI-Express 4.0 x4 wiring, one of which is connected to the CPU, and the other from the B660 PCH. Network connectivity includes a 2.5 GbE port driven by a Realtek RTL8125B, and provision for WLAN connectivity, including 2x2 antenna coaxial jacks, and an M.2 E-key slot with PCI-Express 3.0 x1 and USB 2.0 wiring, so you drop in your own WLAN module. 6-channel HD audio driven by a premium Realtek ALC1220 CODEC makes for the rest of it. The company didn't reveal pricing.

Intel's next-generation desktop processor socket will be the LGA1851. Leaked documents point to the next-generation socket being of identical dimensions to the current LGA1700, despite the higher pin-count, which could indicate cooler compatibility between the two sockets, much in the same way as the LGA1200 retained cooler-compatibility with prior Intel sockets tracing all the way back to the LGA1156. The current LGA1700 will service only two generations of Intel Core, the 12th Generation "Alder Lake," and the next-gen "Raptor Lake" due for later this year. "Raptor Lake" will be Intel's last desktop processor built on a monolithic silicon, as the company transitions to multi-chip modules.

Intel Socket LGA1851 will debut with the 14th Gen Core "Meteor Lake" processors due for late-2023 or 2024; and will hold out until the 15th Gen "Arrow Lake." Since "Meteor Lake" is a 3D-stacked MCM with a base tile stacked below logic tiles; the company is making adjustments to the IHS thickness to end up with an identical package thickness to the LGA1700, which would be key to cooler-compatibility, besides the socket's physical dimensions. Intel probably added pin-count to the LGA1851 by eating into the "courtyard" (the central gap in the land-grid), because the company states that the pin-pitch hasn't changed from LGA1700.

Phanteks introduces 3 new chassis; the new Eclipse P500A matte white, Eclipse G360A, Eclipse G500A, a new LCD screen module for the Evolv Shift XT and LGA1700/AM5 support for the Glacier One MP AIO coolers. The Eclipse P500A is a premium mid-tower case that combines high airflow performance with style. It features the Ultra-fine Performance mesh front panel for optimal airflow with dust filtration. The P500A will now be available in Matte White and replaces the original white color option.

Launching on June 8th, the G360A will feature a new design front mesh panel with increased air intake thanks to the enlarged mesh surface area. The case will also support up to 400 mm long GPUs, a new removable fan bracket, and pre-equipped 3x PWM DRGB fans. The G360A will be available in Satin Black and Matte White color options. Following the G360A, the G500A will have new features that include a better innovative design to the front and top for easy fan/radiator installation with a new look for the front mesh panel. The G500A will be available at the end of the summer and have the option of Satin Black or Matte White colors.

EK, the leading premium liquid cooling gear manufacturer, announces new signature CPU water blocks - EK-Quantum Velocity² and EK-Quantum Magnitude Lignum edition. Lignum Line is inspired by Mr. Edvard König's love for woodwork and modern computer technologies and is named after the Latin translation of the word "wood." A perfect symbiosis of the oldest natural building material and contemporary high-end cooling solutions. An unparalleled example of how your PC can reflect your lifestyle. While EK Lignum and its wooden opulence can bring a feeling of comfort and warmth, from the technological standpoint, this symbiosis allows for the best-performing socket-specific water blocks - Velocity² and Magnitude.

Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of each specific CPU platform, is used to achieve low hydraulic flow restriction and high performance. The lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area.

Thermalright today introduced the AXP90-X53 Full Black, a premium top-flow air-based CPU cooler. The cooler is designed for a Z-height of 53 mm when fully assembled (including fan), making it fit for certain SFF/low-profile use-cases. Its design involves a mirror-finish nickel-plated C1100 copper base, from which four 6 mm-thick heat-pipes of the same material pass through, conveying heat through a stack of 54 dark-tinted aluminium fins.

The fin-stack is ventilated by a 15 mm-thick 92 mm fan. This fan takes in 4-pin PWM input, and features a double ball-bearing setup. It turns at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of airflow, at up to 22.4 dBA of noise output. Among the CPU socket types supported by the Thermalright AXP90-X53 Full Black are LGA1700, LGA1200, and AM4. With its fan in place, the cooler measures 94.5 mm x 95 mm x 53 mm (WxDxH), weighing 540 g. The company didn't reveal pricing.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new line of all-in-one RGB CPU coolers for performance-minded DIY enthusiasts: H100i RGB ELITE, H115i RGB ELITE, and H150i RGB ELITE Liquid CPU Coolers. Featuring wide compatibility with the latest Intel and AMD sockets - including LGA 1700 and AM5 - and first-class airflow thanks to their new CORSAIR AF ELITE Series cooling fans, RGB ELITE coolers deliver high-caliber cooling to keep your CPU temperatures down, even when the action is heating up.

AF ELITE Series fans also launch today as standalone offerings. Available in either black or white and in 120 mm or 140 mm sizes, AF ELITE fans take advantage of powerful CORSAIR AirGuide technology and ultra-quiet fluid dynamic bearings to deliver robust, concentrated airflow. For cooling that keeps your system performing at its best, take AF ELITE fans for a spin.

DeepCool, a global brand in designing and manufacturing high-performance computer components for enthusiasts worldwide, announces a highly compatible CPU air cooler that offers impressive heat dissipation power in a compact and efficient design. With a slim profile, the AK400 air cooler serves as a thermal solution that can easily fit into mainstream ATX/MATX system builds. the unique design of the matrix form fin-stack and the non-RGB cover top offers a special aesthetic value to particular users.

The DeepCool AK400 Performance CPU Cooler is highly compatible and offers impressive heat dissipation power of 220 W in a compact and efficient design. Four direct touch copper heat pipes quickly transfer heat away from the processor into a dense matrix fin array heat sink for effective cooling performance.

Tech innovator GELID Solutions unveils the latest high-performance CPU Cooler for AMD and Intel CPU. The Rev. 5 TRANQUILLO is a product of the GELID Solutions GAMER product line. The Rev. 5 TRANQUILLO is the latest iteration of the Award winning Tranquillo line of low noise CPU coolers and includes an Enhanced High-Class Black Electrophoretic Coating with an all black Silent Fan.

The 120 mm Silent Fan with Smart 4 Pin PWM which uses a constellation of the advanced Heat sink with 4 Heat pipes featuring the Heat pipe Direct Contact (HDC) Technology, delivers Best-in-Class performance. Compact size, lightweight design and seamless mounting, all ensure it's broad cross-platform compatibility and easy installation. Full support of TDP 150 W. The high-performance GC-Pro thermal compound and the all-in-one Mounting Kit for multiple CPU Socket: AM4, AM3+, AM3, AM2+, AM2, LGA1700, LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150, FM2+, FM2, FM1.

Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

ID-COOLING today announced IS-47S 47 mm height low profile CPU air cooler. At a total height including the fan of 47 mm, this cooler would be a good choice for your A4 cases. Designed with an overall dimension of 100x93x47mm, it has no conflict of the RAM or PCI-E slots. The heatsink is solid built with a pure copper base and 4 heatpipes and massive aluminium fins. The heatsink itself is measured at 35 mm height. Adding a powerful 12 mm PWM fan, this cooler is capable of handling processors with a maximum TDP of 95 W. In terms of mounting kit, two separate backplates are provided in the box for Intel and AMD respectively. The sockets list includes Intel LGA1700/1200/1151/1150/1155/1156 and AMD AM4.

The bundled thermal grease is named FROST X25, which has a thermal conductivity of 10.5 W/m-K.

Alphacool's CPU All-in-One solutions Eisbaer Aurora and Eisbaer LT Aurora are now available with the new NexXxoS HPE (High Performance Edition) 360mm radiator. What does HPE mean? The NexXxos HPE-30 radiator uses the same materials as the previous NexXxos models, but technically goes a step further. Due to the condensed internal construction, the number of water channels and copper fins could be increased. This means that a larger volume of water is in direct contact with the cooling fins and the heat transfer is enormously improved.

Due to the higher number of fin rows and their shortening, the cooling surface is also used much more efficiently. Comparison tests (test setup: ASUS Prime X299/Intel i9-10900X with 350 W waste heat) with the conventional NexXxos radiator have shown that a significant performance increase of 4.5K is possible when using the HPE radiator. At higher ambient temperatures and higher fan speeds, the performance gap to the normal NexXxoS radiators even increases progressively and reaches a possible performance increase of up to 6K. There has never been such a leap in performance in the past!