Intel's 13th Gen Core i5 "Raptor Lake" desktop processor lineup could see the top Core i5-13600K and i5-13600KF feature a 6P+8E core-configuration (that's six performance cores and eight efficiency cores). Each of the six P-cores has HyperThreading enabled, making this a 14-core/20-thread processor. Each of the six "Raptor Cove" P-cores has 2 MB of dedicated L2 cache. The eight "Gracemont" E-cores are spread across two E-core clusters with four cores, each. Each cluster shares 4 MB of L2 cache among the four E-cores (increased from 2 MB per cluster on "Alder Lake"). The P-cores and E-cores share 24 MB of L3 cache, increased from 20 MB on the i5-12600K.

A qualification sample (QS) of the Core i5-13600K made its way to social media, where it was put through a bunch of synthetic tests. In CPU-Z Bench, the i5-13600K QS scores 830 points in single-thread, compared to 648 points of the Ryzen 9 5950X "Zen 3," and trails it in the multi-threaded tests, with 10031.8 points, compared to 11906 points for the Ryzen. The QS comes with a Processor Base Power (PBP) value of 125 W, same as that of the i5-12600K. "Raptor Lake" is backwards compatible with Intel 600-series chipset motherboards, although it launches alongside the Intel 700-series chipset. It shares the LGA1700 socket with 12th Gen "Alder Lake," and is built on the same Intel 7 node (10 nm Enhanced SuperFin) as its predecessor.

Intel's 13th Gen Core "Raptor Lake" is shaping up to be another leadership desktop processor lineup, with an engineering sample clocking significant increases in gaming minimum framerates over the preceding 12th Gen Core i9-12900K "Alder Lake." Extreme Player, a tech-blogger on Chinese video streaming site Bilibili, posted a comprehensive gaming performance review of an i9-13900K engineering sample covering eight games across three resolutions, comparing it with a retail i9-12900KF. The games include CS:GO, Final Fantasy IX: Endwalker, PUBG, Forza Horizon 5, Far Cry 6, Red Dead Redemption 2, Horizon Zero Dawn, and the synthetic benchmark 3DMark. Both processors were tested with a GeForce RTX 3090 Ti graphics card, 32 GB of DDR5-6400 memory, and a 1.5 kW power supply.

The i9-13900K ES is shown posting performance leads ranging wildly between 1% to 2% in the graphics tests of 3DMark, but an incredible 36% to 38% gain in the CPU-intensive tests of the suite. This is explained not just by increased per-core performance of both the P-cores and E-cores, but also the addition of 8 more E-cores. Although the same "Gracemont" E-cores are used in "Raptor Lake," the L2 cache size per E-core cluster has been doubled in size. Horizon Zero Dawn sees -0.7% to 10.98% increase in frame rates. There are some anomalous 70% frame-rate increases in RDR2, discounting which, we still see a 2-9% increase. FC6 posts modest 2.4% increases. Forza Horizon 5, PUBG, Monster Hunter Rise, and FF IX, each report significant increases in minimum framerates, well above 20%.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is constantly pushing limits to provide high- performance cooling solutions for all tech fans, PC builders, PC enthusiasts, and modders. This time, with no exception, introducing two all-new high-performance CPU water blocks, the Pacific W8 CPU Water Block with a full copper design and the Pacific W9 CPU Water Block with an acrylic design, are in stock for purchase now. Built with high-quality materials, the Pacific W8 and W9 CPU Water Blocks aim to suffice even the most demanding users seeking top-tier CPU water blocks.

Pacific W8 CPU Water Block features a copper top and base with anti-corrosive nickel plating; this provides a stunning mirror finishing and prevents material corruption while extending overall durability. On the other hand, the Pacific W9 CPU Water Block also has an anti-corrosive nickel plating copper base, but it comes with an acrylic top cover for a crystal clear inside view, allowing users to showcase colorful coolant passing through the Pacific W8 and the W9 CPU Water Blocks. Pacific W8 and W9 both feature a central inlet design with a jet plate in the middle of the water block, restricting the water flow for even coolant distribution through the optimized 0.2 mm micro-channels. By doing so, the copper plate can quickly transfer heat from the CPU into the coolant, ensuring better cooling efficiency and the best heat dissipation from the CPU.

MSI today introduced the MAG CoreLiquid B line of entry-level all-in-one liquid CPU coolers. Models in the lineup include the MAG CoreLiquid B120 and B240, with radiator sizes of 120 mm x 120 mm and 240 mm x 120 mm, respectively. These coolers feature a simple, puck-shaped water-block, with an illuminated MSI Gaming logo that can be rotated to suit the orientation of your setup. The pump is integrated with the radiator, and features a 6-pole motor. The included fans feature three fixed-color LEDs (one each of red, blue, and green), turn at speeds between 500 to 2,000 RPM, pushing 21.63 to 78.73 CFM airflow. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Axiomtek is pleased to introduce the MANO560, an industrial Mini-ITX motherboard featuring the LGA1700 socket for the latest 12th Gen Intel Core processor (codename: Alder Lake S) to boost the performance of AI and IoT applications.

The industrial Mini-ITX motherboard MANO560 is based on the new Intel H610 chipset and features scalable CPU options with the 12th Gen Intel Core i9/i7/i5/i3, Intel Pentium Gold or Intel Celeron processors. While the high performance is assisted by the two DDR4-3200 SO-DIMM with up to 64 GB of memory, it is equipped with one M.2 Key E 2230 for wireless module and one M.2 Key B in which the user can choose between the PCIe x2 signal, the USB 3.2 Gen1 for 3042/3052 5G module or SATA interface for 2242 SSD, making the embedded board much more flexible. Besides, it provides a full-size mini PCIe for wireless modules and a PCIe x16 for graphics cards.

EK, the premium liquid cooling gear manufacturer, is releasing the EK-Mana LiteBlock MAG Torpedo Z690 D-RGB - Plexi, an Intel LGA1700 socket-based LiteBlock that is engineered specifically for the MAG Z690 Torpedo motherboard from MSI. This kit of specially designed VRM heatsinks and the LiteBlock can upgrade the MAG Z690 Torpedo to a liquid-cooled motherboard, just like the EK X version of this product. The addressable D-RGB LED in the monoblock is compatible with MSI Mystic Lights RGB control and offers a full lighting customization experience for every single diode at any given time. This Mana LiteBlock is EK-Matrix 7 compatible.

This is a complete, all-in-one (CPU and motherboard) liquid cooling solution for Intel 12th gen Core series processors and is compatible with the LGA 1700 socketed MSI MAG Z690 Torpedo motherboard. This LiteBlock uses the latest generation of EK Velocity² cooling engine to ensure the best possible CPU cooling without reducing the flow to other components. This water block directly cools the Alder Lake CPU, the VRM heatsink, and, by proxy, the VRM components. The package includes two replacement heatsinks with thermal pads, replacing the factory-mounted VRM heatsink.

An engineering sample of a 13th Intel Core "Raptor Lake" Core i9 processor hit the web, courtesy of wxnod on Twitter, which confirms its 8P+16E core-configuration in a CPU-Z screenshot. Based on the same LGA1700 package as "Alder Lake," and backwards compatible with Intel 600-series chipset motherboards, besides new 700-series ones, "Raptor Lake" combines eight "Raptor Cove" performance cores (P-cores), with sixteen "Gracemont" efficiency cores (E-cores).

"Raptor Cove" features a generational IPC increase over the "Golden Cove" P-cores powering "Alder Lake," while the "Gracemont" E-cores, although identical to those on "Alder Lake," are expected to benefit from the doubling in L2 cache per cluster, from 2 MB to 4 MB. The ISA as detected by CPU-Z appears to be identical to that of "Alder Lake." The processor is a monolithic silicon chip built on the Intel 7 (10 nm Enhanced SuperFin) silicon fabrication process.

BIOSTAR today introduced the B660T-Silver, a Socket LGA1700 motherboard in the Mini-ITX form-factor, based on the Intel B660 chipset. The board wires a 12th Gen Core "Alder Lake" processor with DDR4 memory, and a PCI-Express 5.0 x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 9-phase CPU VRM. Up to 64 GB of dual-channel DDR4 memory is supported, at overclocked speeds of up to DDR4-5000.

Storage connectivity of the BIOSTAR B660T-Silver includes four SATA 6 Gbps ports, and two M.2-2280 slots with PCI-Express 4.0 x4 wiring, one of which is connected to the CPU, and the other from the B660 PCH. Network connectivity includes a 2.5 GbE port driven by a Realtek RTL8125B, and provision for WLAN connectivity, including 2x2 antenna coaxial jacks, and an M.2 E-key slot with PCI-Express 3.0 x1 and USB 2.0 wiring, so you drop in your own WLAN module. 6-channel HD audio driven by a premium Realtek ALC1220 CODEC makes for the rest of it. The company didn't reveal pricing.

Intel's next-generation desktop processor socket will be the LGA1851. Leaked documents point to the next-generation socket being of identical dimensions to the current LGA1700, despite the higher pin-count, which could indicate cooler compatibility between the two sockets, much in the same way as the LGA1200 retained cooler-compatibility with prior Intel sockets tracing all the way back to the LGA1156. The current LGA1700 will service only two generations of Intel Core, the 12th Generation "Alder Lake," and the next-gen "Raptor Lake" due for later this year. "Raptor Lake" will be Intel's last desktop processor built on a monolithic silicon, as the company transitions to multi-chip modules.

Intel Socket LGA1851 will debut with the 14th Gen Core "Meteor Lake" processors due for late-2023 or 2024; and will hold out until the 15th Gen "Arrow Lake." Since "Meteor Lake" is a 3D-stacked MCM with a base tile stacked below logic tiles; the company is making adjustments to the IHS thickness to end up with an identical package thickness to the LGA1700, which would be key to cooler-compatibility, besides the socket's physical dimensions. Intel probably added pin-count to the LGA1851 by eating into the "courtyard" (the central gap in the land-grid), because the company states that the pin-pitch hasn't changed from LGA1700.

Phanteks introduces 3 new chassis; the new Eclipse P500A matte white, Eclipse G360A, Eclipse G500A, a new LCD screen module for the Evolv Shift XT and LGA1700/AM5 support for the Glacier One MP AIO coolers. The Eclipse P500A is a premium mid-tower case that combines high airflow performance with style. It features the Ultra-fine Performance mesh front panel for optimal airflow with dust filtration. The P500A will now be available in Matte White and replaces the original white color option.

Launching on June 8th, the G360A will feature a new design front mesh panel with increased air intake thanks to the enlarged mesh surface area. The case will also support up to 400 mm long GPUs, a new removable fan bracket, and pre-equipped 3x PWM DRGB fans. The G360A will be available in Satin Black and Matte White color options. Following the G360A, the G500A will have new features that include a better innovative design to the front and top for easy fan/radiator installation with a new look for the front mesh panel. The G500A will be available at the end of the summer and have the option of Satin Black or Matte White colors.

EK, the leading premium liquid cooling gear manufacturer, announces new signature CPU water blocks - EK-Quantum Velocity² and EK-Quantum Magnitude Lignum edition. Lignum Line is inspired by Mr. Edvard König's love for woodwork and modern computer technologies and is named after the Latin translation of the word "wood." A perfect symbiosis of the oldest natural building material and contemporary high-end cooling solutions. An unparalleled example of how your PC can reflect your lifestyle. While EK Lignum and its wooden opulence can bring a feeling of comfort and warmth, from the technological standpoint, this symbiosis allows for the best-performing socket-specific water blocks - Velocity² and Magnitude.

Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of each specific CPU platform, is used to achieve low hydraulic flow restriction and high performance. The lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area.

Thermalright today introduced the AXP90-X53 Full Black, a premium top-flow air-based CPU cooler. The cooler is designed for a Z-height of 53 mm when fully assembled (including fan), making it fit for certain SFF/low-profile use-cases. Its design involves a mirror-finish nickel-plated C1100 copper base, from which four 6 mm-thick heat-pipes of the same material pass through, conveying heat through a stack of 54 dark-tinted aluminium fins.

The fin-stack is ventilated by a 15 mm-thick 92 mm fan. This fan takes in 4-pin PWM input, and features a double ball-bearing setup. It turns at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of airflow, at up to 22.4 dBA of noise output. Among the CPU socket types supported by the Thermalright AXP90-X53 Full Black are LGA1700, LGA1200, and AM4. With its fan in place, the cooler measures 94.5 mm x 95 mm x 53 mm (WxDxH), weighing 540 g. The company didn't reveal pricing.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced a new line of all-in-one RGB CPU coolers for performance-minded DIY enthusiasts: H100i RGB ELITE, H115i RGB ELITE, and H150i RGB ELITE Liquid CPU Coolers. Featuring wide compatibility with the latest Intel and AMD sockets - including LGA 1700 and AM5 - and first-class airflow thanks to their new CORSAIR AF ELITE Series cooling fans, RGB ELITE coolers deliver high-caliber cooling to keep your CPU temperatures down, even when the action is heating up.

AF ELITE Series fans also launch today as standalone offerings. Available in either black or white and in 120 mm or 140 mm sizes, AF ELITE fans take advantage of powerful CORSAIR AirGuide technology and ultra-quiet fluid dynamic bearings to deliver robust, concentrated airflow. For cooling that keeps your system performing at its best, take AF ELITE fans for a spin.

DeepCool, a global brand in designing and manufacturing high-performance computer components for enthusiasts worldwide, announces a highly compatible CPU air cooler that offers impressive heat dissipation power in a compact and efficient design. With a slim profile, the AK400 air cooler serves as a thermal solution that can easily fit into mainstream ATX/MATX system builds. the unique design of the matrix form fin-stack and the non-RGB cover top offers a special aesthetic value to particular users.

The DeepCool AK400 Performance CPU Cooler is highly compatible and offers impressive heat dissipation power of 220 W in a compact and efficient design. Four direct touch copper heat pipes quickly transfer heat away from the processor into a dense matrix fin array heat sink for effective cooling performance.

Tech innovator GELID Solutions unveils the latest high-performance CPU Cooler for AMD and Intel CPU. The Rev. 5 TRANQUILLO is a product of the GELID Solutions GAMER product line. The Rev. 5 TRANQUILLO is the latest iteration of the Award winning Tranquillo line of low noise CPU coolers and includes an Enhanced High-Class Black Electrophoretic Coating with an all black Silent Fan.

The 120 mm Silent Fan with Smart 4 Pin PWM which uses a constellation of the advanced Heat sink with 4 Heat pipes featuring the Heat pipe Direct Contact (HDC) Technology, delivers Best-in-Class performance. Compact size, lightweight design and seamless mounting, all ensure it's broad cross-platform compatibility and easy installation. Full support of TDP 150 W. The high-performance GC-Pro thermal compound and the all-in-one Mounting Kit for multiple CPU Socket: AM4, AM3+, AM3, AM2+, AM2, LGA1700, LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150, FM2+, FM2, FM1.

Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

ID-COOLING today announced IS-47S 47 mm height low profile CPU air cooler. At a total height including the fan of 47 mm, this cooler would be a good choice for your A4 cases. Designed with an overall dimension of 100x93x47mm, it has no conflict of the RAM or PCI-E slots. The heatsink is solid built with a pure copper base and 4 heatpipes and massive aluminium fins. The heatsink itself is measured at 35 mm height. Adding a powerful 12 mm PWM fan, this cooler is capable of handling processors with a maximum TDP of 95 W. In terms of mounting kit, two separate backplates are provided in the box for Intel and AMD respectively. The sockets list includes Intel LGA1700/1200/1151/1150/1155/1156 and AMD AM4.

The bundled thermal grease is named FROST X25, which has a thermal conductivity of 10.5 W/m-K.

Alphacool's CPU All-in-One solutions Eisbaer Aurora and Eisbaer LT Aurora are now available with the new NexXxoS HPE (High Performance Edition) 360mm radiator. What does HPE mean? The NexXxos HPE-30 radiator uses the same materials as the previous NexXxos models, but technically goes a step further. Due to the condensed internal construction, the number of water channels and copper fins could be increased. This means that a larger volume of water is in direct contact with the cooling fins and the heat transfer is enormously improved.

Due to the higher number of fin rows and their shortening, the cooling surface is also used much more efficiently. Comparison tests (test setup: ASUS Prime X299/Intel i9-10900X with 350 W waste heat) with the conventional NexXxos radiator have shown that a significant performance increase of 4.5K is possible when using the HPE radiator. At higher ambient temperatures and higher fan speeds, the performance gap to the normal NexXxoS radiators even increases progressively and reaches a possible performance increase of up to 6K. There has never been such a leap in performance in the past!

EK, the Europe-based premium water cooling gear manufacturer, is proud to present its flagship CPU water block - EK-Quantum Magnitude, designed specifically for the LGA 1700 socket. It uses specific flow distribution, cold plate geometry, and mounting pressure tailored to the IHS of LGA 1700 Intel processors. Its unrivaled internal geometry creates a far greater heat transfer area with less restriction that leaves no stress on the rest of the custom loop liquid cooling system.

This block is specifically engineered for LGA1700 socket-based Intel Core CPUs of 12th generation Core architecture. EK-Quantum Magnitude is bearing the prestigious iF Design award for the bold and different approach to the CPU water block mounting mechanism. Differentiated from any mounting structure of a water block that is usually a black and mundane plate, the design accentuates an integrated X-shaped three-dimensional frame with premium finishes that firmly cradles the main body in place, while the screws are morphed into sophisticated design details.

Noctua today presented the all-new NH-D12L low-height dual tower CPU cooler and the corresponding NF-A12x25r round-frame 120 mm fan. At a height of only 145 mm (13 mm lower than Noctua's regular 120 mm models), it fits many 4U enclosures as well as narrower tower cases that have been previously limited to solutions with 92 mm fans. At the same time, its five heatpipe dual-tower design and state-of-the-art NF-A12x25r 120 mm fan allow it to achieve a level of efficiency that surpasses many full-height 120 mm models.

"So far, all our 120 mm class coolers were 158 mm high, but as of recent, more and more PC cases only support up to 150 or even 145 mm - this is where the NH-D12L steps in", explains Roland Mossig (Noctua CEO). "Simply lowering one of our existing models wasn't an option because a standard square 120 mm fan would cause lots of issues with motherboard heatsinks or shrouds. That's why we came up with this novel dual tower design and a round-frame version of the NF-A12x25 fan that can be installed at a very low position between the two towers - a winning combination that provides impressive results for this height class."

SilentiumPC, the European manufacturer of CPU coolers, power supplies, and PC cases, announces the newest version of its Spartan line of CPU coolers. This includes the Spartan 5 standard, the Spartan 5 MAX, and the Spartan 5 ARGB and MAX ARGB. This new lineup of CPU cooling systems was developed in cooperation with Synergy Cooling, and directly competes with more expensive mid-range coolers. The streamlined heatsink design and base, which consists of heatpipes in direct contact with the processor, is able to effectively cool even the latest processors, while maintaining low noise levels and an affordable price.

The Spartan 5 family uses a specially designed, heatsink-integrated version of the award-winning 120 mm Fluctus fan, ensuring both quiet operation and psychoacoustic optimization throughout the entire setup. It was designed primarily for system integrators and users looking for efficient and inexpensive cooling. Thanks to its uniform structure, it is not only extremely easy to install, but also much more resistant to mechanical damage that may occur during transport.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, introduces today the Alpine 17 and Alpine 17 CO, a pair of compact air coolers designed exclusively for the Intel LGA1700 socket. With the release of its newest Alpine coolers, ARCTIC presents an affordable option for users looking to cool their Alder Lake processors. The successors to the Alpine 12 series retain its classic radial heatsink design but are specifically built for the LGA1700 socket.

The cooler's Y-shaped fin ensures optimal heat distribution in the heatsink, while heat dissipation is significantly enhanced by the Alpine 17's large surface area and high airflow rate. With a low installation height of only 68.2 mm, the Alpine 17 and Alpine 17 CO are ideal choices for most all-in-one systems as well as small cases (Mini-ITX, µATX etc.).

Scythe releases today a revised version of the premium High-End CPU Cooler Fuma 2. Based on the classic Fuma 2 asymmetrical heatsink design, the award-winning twin tower cooler is now upgraded with two new Kaze Flex II fans. The new fans increase the airflow by speeding up to 1500 RPM and the rubber frame design guarantees grand noise reduction. For many Intel 12th Gen CPU users, the concern about the additional purchase of the LGA 1700 mounting kit can now rest assured. The Scythe H.P.M.S. IV mounting System now offers full Intel LGA 1700 support. The Scythe Fuma 2 Rev.B CPU cooler is now available in the US, Japan, Taiwan markets.

Chinese motherboard maker ONDA released the first Intel Socket LGA1700 motherboard that features both DDR4 and DDR5 memory support—something we learned quite early on that Intel either isn't allowing or is "discouraging" motherboard vendors to do. The ONDA H610M+ is based on the entry-level Intel H610 chipset, and is an otherwise basic-looking motherboard. The memory sub-system is interesting.

While the board supports both DDR5 and DDR4, there's only one of each slots, so you're limited to single-channel, and like every motherboard from the past that supported multiple memory types; you can't use the DDR5 and DDR4 slots at the same time. The board runs DDR4 at a maximum frequency of DDR4-3200, and the DDR5 slot at DDR5-4800 (max). That's not all, the board is quite possibly the only H610 chipset-based motherboard with a Gen 5 PCI-Express x16 slot (every other H610 board we've come across has Gen 4, to keep costs low). PCIe Gen 5 is allowed for the H610 platform. Another interesting bit is the M.2 E-key slot, so you can drop in a WLAN module. It's likely that this board will only be available in the Chinese market.