Friday, April 22nd 2022
Thermalright Launches Bending Corrector Frame for Alder Lake Processors
Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.
Source:
Taobao (via VideoCardz)
60 Comments on Thermalright Launches Bending Corrector Frame for Alder Lake Processors
but the price is actually O.K. - I'm surprised :)
even overclocked it stays below 70° (Tamb is around 20°C)
I'm experienced and I did an accurate mounting job, for sure, but it is working very well.
The only precautions I took was to NOT put the CPU in the socket before installing the backplate, in order to have more rigidity on the board.
I don't know if it helped.
And for 6 USD, i actually think this is a nice looking piece of CNC Aluminium.
I'm positively surprised.
why and when does my new cpu bend? can anyone please inform me why it would bend when it is in the original socket?
Given the low price I assumed it would only include the frame, so the screws would be reused from the stock ILM. Due to the increased number of pins and longer package length compared to 11th gen Intel processors, the retention mechanism (or ILM / Independent Loading Mechanism) is now applying a stronger force on the heat spreader (IHS) to make the CPU have good electrical contact with the pins in the socket.
Since it is an overall cheap design, this causes uneven pressure which slightly bends the IHS, causing less-than-optimal contact with the cooler, which is not a big issue under power limited scenarios (e.g. the Intel-specified 125W "base power") where temperatures aren't an issue in the first place, but it can be with overclocking or without power limits.
This can be easily observed by looking at how thermal paste spreads, here is an example:
Thermal paste collects in the middle = CPU height is lower there, i.e. it is bending.
Simple physics (or more like applied mechanics) tells us that something small and light like a CPU should have no issues when lying on such a large contact surface.
The fact that is does in intel's case speaks volumes.
Massive and heavy GPU are bound to bend under their own weight (not the scientific term but let's skip the fancy talk for argument's sake). Even a 6th grader can 'sense' that such a heavy GPU would have issues without proper structural design or support.
I'm using the thick EK backplate, but might have a look at one of these to use in combination.
However, currently I'm not using this washer mod. Every time I tried using them (I did many tests), for some reason motherboard VRM coil whine always increased to annoying levels. Without washers I get 4-5 °C higher temperatures under load without power limits (~200-210W package power), but minimal coil whine.
From this, my conclusion is that there probably are good technical reasons for the pressure used, and the Thermaltake frame might actually make things worse in some aspects like the washers did for me (I've even read about people reporting losing PCIe slot functionality or memory channels with them, although reversibly so—didn't happen to me).
The Thermaltake frame could potentially yield better results than the washers since it looks like it could be truly making pressure on the CPU more or less homogeneous, while the washers with the stock ILM only decrease it.