Friday, April 22nd 2022
Thermalright Launches Bending Corrector Frame for Alder Lake Processors
Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.
Source:
Taobao (via VideoCardz)
60 Comments on Thermalright Launches Bending Corrector Frame for Alder Lake Processors
My fear is that long term these CPU's will warp and crack the solder between the die and the IHS, making them impossible to cool or outright impossible to even run at stock speeds over time
It wouldn't be such a big problem if there was no evidence of bending, or if the bending only occurred when using extreme mounting force that falls far outside of Intel's design specs - but this is apprently an issue that causes CPU warping over time, even when using the stock Intel air coolers because the damage is caused by the pressure of the LGA1700 retention socket itself, affecting every single LGA1700 build ever done.
If you're aware of the issue at all, theres two OEM choices for the retention mechanism and one of them is cheap shit that warps the CPU's, oh ye who laugh reacts based on a sample size of one
www.igorslab.de/en/bad-cooling-at-alder-lake-problems-at-socket-lga-1700-on-the-lane-among-all-remedies/3/
and her is my cpu
Imo it is pretty flat. and has been in and out of the socket a few times. I have tried the washer mod too, but thought temps were worse. I have never had a air cooler of any type on it, it has always had the EK supremacy classic block on it, with the EK backplate
Have to admit the frame is a great idea, and it's even surprisingly cheap. It might even act as an headspreader, helping to cool the CPU.
Although a steel version would be better in both regards. Maybe we will see something more solid from f.e. EKWB. :cool: The problem would be that "technically" it's not Intel who's accountable, but the board manufacturers. ;) It's a chain of incompetence, first of course the socket manufacturer who produced a too weak part & then QA team of the board manufacturers who didn't pick up the obvious problem. Pretty sure Intel also has a QA team who does compability checks, so you have 2 QA teams who failed here.
If they would now aknowledge that there is a problem, it would lead to RMA's with huge costs for the board manufacturers, so that's why Intel is denying that it's a thing, covering their backs. Absolute scummy behaviour. No s**t, Sherlock. :rolleyes: You need to check for bending when the CPU is installed (clamped down in the socket)! If you put the CPU out it will just flex back, because that's what most metals do once you release pressure. To make it visible use a flashlight & a very straight thing like a credit card. Once your mobo is installed it's hard to get an angle on it, but you could use your phone camera for it.
You could also slap tons of thermal paste on your CPU, scratch with a credit card horizontally over it & see how much TIM remains in the middle section.
there were some of the early tower coolers that required a backplate to prevent the socket from breaking and bending. Bad on Intel for shoving this off to other manufacturers, bad on Intel for throwing them under the bus.
At the same time bad of some premium board manufacturers for not addressing this with a stronger backplate or double clamp like this is providing.
Top of the cpu verses the the shape of the cpu cold plate if these don't fit well coolest to hottest core temp spread will be crazy off
If you're within 10c of this at max all core clocks you're doing pretty well.
How is your ADL CPU?
Back plates don't do as much as one would hope
It mostly helps spread stress on the four portions where the holes in the boards are
This does nothing for the back of the cpu socket and is what is flexing the most
So adding the op's front plate this will prevent the cpu block from pushing the cpu further back than the top of the plate.
I always wondered why intel board manufactures cheap out on ....z series boards by not installing a better cpu mount like x299 sockets have which has a built in back plate.
Is there any link to somewhere that actually sells these?
Just have to message on their website I guess.
Quit the arguing in the thread... take your BS to PMs.
This thing has absolutely nothing to do with keeping the processor in place. And the issue itself has very little to do with Intel specifically. It's more an issue of motherboard/backplane design insufficient for the clamping force of the retention mechanism. Intel can't possible be expected to machine specific IHS profiles based on how much each individual motherboard/backplane combination might allow the processor to bend ever so slightly.
Furthermore, if you watch Buildzoid's video, which originated the "washer mod", he stated that most people don't need to do the mod at all since most water blocks/heatsinks are manufactured with a slightly raised center to their cold plates to match the mounted processor's IHS. Because he had moved his water block between so many processors, and removed the liquid metal residue each time by lapping, his cold plate had become totally flat.
Thermalright Intel 12th Generation Lga1700,CPU Pressure Resistant Plate, Bending Corrector Frame Tools,LGA17XX BCF| | - AliExpress