Raijintek today introduced the Cyclops Lite line of all-in-one liquid CPU coolers. These come in black and white color trims, and in radiator size variants of 360 mm and 240 mm. These are characterized by a pump-block that features a propeller-like ornament that's illuminated by ARGB LEDs. You get two or three 120 mm fans depending on the variant, these come with easy daisy-chaining to minimize cable clutter around the radiator. The pump-block features a copper cold-plate, and a ceramic axis for the pump bearing, which is rated for 50,000 hours. The radiator channels are made of aluminium.

Each of the included Raijintek Ageras Xtreme 120 mm fan comes with hydraulic bearing, and takes in a 4-pin PWM connection for its main function. It turns at speeds ranging from 800 RPM to 2,200 RPM, pushing up to 67.38 CFM of airflow, at 2.57 mm H₂O static pressure, and a maximum noise output of 33 dBA. The fan bearing is rated for 40,000 hours. The proprietary daisy-chaining connection of these fans combine 4-pin PWM and 3-pin ARGB connections. Among the CPU socket types supported are AM5, AM4, LGA1851, LGA1700, and LGA1200/LGA115x. The company didn't release pricing information.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products - is pleased to introduce the MMB566, a high-performance micro ATX motherboard designed for demanding industrial and commercial applications. Powered by the 14th/13th/12th Gen Intel Core i9/i7/i5/i3 or Celeron processors with the Intel Q670E, R680E, or H610E chipset, the MMB566 delivers exceptional computing power and reliability. Designed for precision and durability, it excels in remote control and automated test equipment, ensuring accurate system monitoring and control. Its high processing power makes it ideal for data processing and analysis, while its robust design guarantees seamless operation in ATM applications. With versatile expandability and reliable performance, the MMB566 is a future-ready solution for industrial computing needs.

"Axiomtek's MMB566 is engineered to provide exceptional connectivity, flexibility, and long-term reliability for industrial and commercial applications," said Irene Su, Product Manager of the IDS Division at Axiomtek. "It features two 2.5GbE LAN ports, with optional 10GbE LAN ports available to meet customer-specific high-speed networking requirements. Designed for versatility, it offers a rich array of I/O options, including up to six SATA ports, six COM ports, and twelve USB ports, ensuring seamless integration with various peripheral devices. With support for TPM and Intel AMT, the MMB566 enhances security and remote management. Furthermore, its guaranteed 10-year supply makes it a reliable choice for embedded systems requiring long-term availability. Ultimately, with highly customizable service options, the MMB566 delivers optimized performance and long-term value across diverse applications."

The Liquid Freezer III Series is compatible with Intel's LGA1700 and LGA1851. However, since the hotspot of the LGA1851-CPUs is off-center, offset mounting can improve cooling performance. The Intel LGA1700/1851 Offset Contact Frame Mounting Set enables precise alignment and thus optimizes cooling performance for Intel Core Ultra CPUs.

Significant improvements for powerful Core Ultra CPUs
The new mounting set shows its strength particularly in the Core Ultra 9 285K. The offset mounting allows a significant reduction in temperature.

Intel has launched its first wave of Bartlett Lake processors, introducing hybrid-core models specifically designed for embedded systems, with pure performance-core (P-core) variants scheduled to follow later. The initial release, unveiled at CES, showcases the processors through congatec's new COM-HPC modules. The flagship Core 7 251E leads the embedded lineup with 24 cores (8P + 16E) and impressive clock speeds reaching 5.6 GHz boost. Intel claims this processor outperforms the i7-14700 by 6% in single-core and 8% in multi-core benchmarks, despite maintaining a modest 65 W TDP. The series also includes the Core 5 211E with 10 cores (6P + 4E) and the Core 3 201E featuring 4 P-cores. However, the more intriguing development lies ahead.

Earlier sources indicate that Intel plans to release pure P-core variants of Bartlett Lake in Q3 2025, targeting desktop users. These processors will introduce a more traditional approach by replacing E-core clusters with additional P-cores, resulting in configurations of up to 12 P-cores in the upcoming Core 9 series. The pure P-core models will maintain compatibility with existing LGA1700 motherboards, potentially offering an attractive upgrade path for current Intel platform users. The lineup is expected to include 8-core, 10-core, and 12-core variants under the Core 5, 7, and 9 brands respectively, with TDP options ranging from 45 W to 125 W. While the current embedded models focus on specialized applications like medical imaging and edge computing, the future P-core variants seem positioned to appeal to gamers. The processors are expected to utilize Raptor Cove cores, though rumors suggest Intel might consider backporting Lion Cove architecture to the platform.

Shuttle is expanding its range of Mini-PCs with the XPC Barebone DH770 from the "XPC slim" family. The 1.3-liter PC offers powerful hardware, extensive connection options and flexible customization options for a wide range of professional applications. With support for 12th, 13th and 14th generation Intel Core processors (LGA1700) and modern DDR5 technology, the DH770 is the ideal solution for applications that require high computing power and reliability.

Outstanding performance and flexibility
The Shuttle XPC Barebone DH770 is based on the Intel H770 chipset and is compatible with the latest Intel Core processors up to the Raptor Lake-S Refresh series. With support for up to 96 GB DDR5 RAM and storage options via M.2 PCIe Gen 4 and SATA, the mini PC offers impressive performance in a compact format. Thanks to the option of operating up to four independent 4K displays simultaneously, the DH770 is ideal for demanding graphical applications, digital signage and control systems.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products - is pleased to introduce the MMB541, a Micro ATX motherboard specifically optimized for high-performance AI, automation, and industrial applications. The MMB541 is powered by the LGA1700 socket 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3, Pentium or Celeron processors with Intel H610 chipset. With support for up to 125 W high-performance CPU, it delivers exceptional performance to handle demanding tasks with ease. The powerful industrial motherboard delivers advanced connectivity options with four USB 3.2 Gen 1 ports, four USB 2.0 ports, and three LAN ports. With support for PCIe x16 for GPU or accelerator cards and PCIe x4 for additional add-on cards, the MMB541 is ideal for AI workstations and factory automation setups, providing robust computational power and high-speed data processing.

"The MMB541 represents our commitment to innovation and high-quality industrial-grade solutions," said Wayne Chung, the product manager of the AIoT Team at Axiomtek. "With its cost-effective design, the MMB541 simplifies the development of custom AI and automation systems by providing ample I/O interfaces and expansion capabilities, making it easy to integrate GPU cards and other accelerators for enhanced performance. Engineered for versatility, this motherboard can handle applications ranging from AI workstations to complex automation tasks while ensuring the durability and stability needed for long-term industrial use. The MMB541 empowers our customers to build efficient, scalable solutions tailored to today's data-intensive environments."

Thermal Grizzly, a high-performance cooling solutions provider, unveils a new line-up of products specifically designed for Intel's LGA 1851 socket, the latest Intel Core Ultra 200 Arrow Lake CPUs. The product line consists of four new solutions tailored to the improvements of 15th generation CPUs, including a CPU contact frame, a direct die water block, a CPU delidding tool and a delidding heater. Today, three of these products are now officially launched and available for purchase on the Thermal Grizzly web shop and through its Partner Reseller Network.

Intel 1851 CPU Contact Frame V1
In addition to a new internal contour for the contact surface, the new Intel 1851 CPU Contact Frame V1 considers the position of the socket on the motherboard. The thermal hotspot has shifted with the Arrow Lake CPUs and is now located further north compared to its predecessor. With a slight shift of Socket 1851 compared to LGA1700, Intel has attempted to counter the hotspot shift. Thus, CPU coolers designed for Socket 1700 can also be used with Socket 1851. The shift in the socket makes previous contact frames for Socket 1700 incompatible with 1851, which is why Thermal Grizzly now offers the Intel 1851 Contact Frame V1.

Cryorig today introduced the Monster XX, a premium dual fin-stack (D-type) CPU cooler. The cooler's claim to fame is its thermal capacity of 300 W, rivaling 240 mm AIO CLCs. It measures 120 mm x 133 mm x 159 mm (WxDxH). Its design involves a copper base, from which ten 6 mm-thick copper heat pipes arranged in two rows emerge, and pass through the two aluminium fin-stacks, each with 86 fins. The heatsinks are ventilated by a pair of included 120 mm ARGB-illuminated fans, arranged in a push-pull configuration.

Each of the two included 120 mm fans turns at speeds ranging between 800 and 1,800 RPM, pushing up to 58.47 CFM of airflow at 1.35 mm H₂O of static-pressure, and up to 31.5 dBA of noise. The fan takes in 4-pin PWM for its main function, and 3-pin ARGB for lighting. Among the CPU socket types supported are the new LGA1851, LGA1700, AM5, AM4, and LGA1200/115x. The company didn't reveal pricing.

We are pleased to announce that all of our current coolers and All-in-One (AIO) liquid cooling systems, which are already compatible with the Intel LGA1700 socket, will also support the upcoming Intel LGA1851 socket without the need for any additional brackets or adjustments. LGA1700 compatible equals LGA1851 compatibility. Without the need for any additional brackets.The compatibility list follows.

Corsair announces broad compatibility across its extensive component ranges designed to realize the potential of the Intel Core Ultra series processors. Intel Core Ultra processors feature a new socket, LGA 1851, and Corsair is ready with a full lineup of compatible CPU coolers. All our CPU coolers compatible with the previous LGA1700 socket are compatible with the new LGA 1851 socket, from our A115 air cooler to our best-performance TITAN RX RGB series of AIO coolers. From our 120 mm single fan radiators to our class-leading 360 mm and 420 mm radiators, we have a solution for you no matter which Core Ultra processor you choose or what case you're using.

To unleash the performance of the new Core Ultra series processors, we have a wide range of DOMINATOR and VENGEANCE series DDR5 memory kits available. These cutting-edge kits are designed to deliver award-winning performance, with XMP certification providing easy overclocking and improved memory bandwidth. Whether you're a gamer, content creator, or professional, Corsair DDR5 memory is the premiere option for reliable high-speed DRAM. With speeds up to 8,200 MT/s and densities up to 128 GB per kit, you can choose from attractive and compact VENGEANCE modules to the aesthetically elite DOMINATOR TITANIUM with RGB lighting that can be controlled through our iCUE software.

Noctua today confirmed that all its CPU coolers and mounting-kits that support Intel LGA1700 also support the new LGA1851 socket of the upcoming Core Ultra desktop processors (Series 2), also known under the code name Arrow Lake-S. Mounting upgrade kits for older heatsink models that do not yet support LGA1700 and LGA1851 will be provided to customers free of charge.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Intel Core Ultra Series 2 processors and their new LGA1851 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support LGA1851 out of the box and don't require any updates, customers will be able to upgrade most older coolers at no additional cost, so even the very first Noctua coolers from 2005 can be used on the latest Intel processors!"

Intel will soon be releasing the new Arrow Lake processors on the LGA1851 socket. ARCTIC customers do not need to worry about incompatibility. All LGA1700 compatible ARCTIC coolers can be used without restriction for Intel's new LGA1851 socket. According to current information, the mechanical dimensions remain unchanged. Regardless, ARCTIC has assured customers since last year that all coolers purchased from October 23 onwards will support the new socket. ARCTIC customers can therefore switch to the new system without any worries and can always rely on the highest performance and maximum service.

Phanteks today launched the Polar ST line of air-type CPU coolers. These include the Polar ST4 (chrome) and the Polar ST5 (black). The aluminium fin-stack tower type fan-heatsinks. The Polar ST4 features four nickel plated copper heat pipes, and is rated for a maximum thermal load of 235 W, while the Polar ST5 has a more upmarket appearance with its black powder coating, and a die-cast metal top plate. The Polar ST5 has five nickel-plated copper heat pipes instead of four, which takes its thermal load value up to 255 W.

Both the Phanteks Polar ST4 and Polar ST5 include a 120 mm fan, specifically the Phanteks M25-120 PWM DRGB. As its name suggests, this is a conventional 25 mm-thick 120 mm fan with PWM control, and addressable RGB lighting control. Its ARGB LEDs are located in the impeller hub. The fan turns between 400 and 2,000 RPM, pushing up to 84.26 CFM of airflow, at up to 2.67 mm H₂O static pressure, and a maximum noise output of 35.7 dBA. Phanteks is including a thermal paste with 4.3 W/m-k thermal conductivity. Among the CPU socket types supported are LGA1851, LGA1700, LGA1200, AM5, and AM4. The company didn't reveal pricing.

Thermalright introduced the Royal Knight 120SE, a dual fin-stack CPU cooler with a design focus on clearance with the memory area of your motherboard. It does this by offsetting its two fin-stacks away from the memory area, with one of them being almost directly above the CPU base, and by using a slim 15 mm-thick intake fan. The heatsink measures 122 mm × 114 mm × 155 mm (DxWxH), with the intake fan adding another 15 mm depth. The cooler features a nickel-plated copper base, from which six 6 mm-thick copper heatpipes pass through, skewering the two aluminium fin-stacks on both ends.

The intake fan is a Thermalright TL-C12015B. This 15 mm-thick 120 mm spinner features a 2nd generation fluid dynamic bearing, turns at up to 1,800 RPM, pushing up to 59 CFM of airflow at 1.24 mm H₂O static pressure, and 26.1 dBA maximum noise. The second fan is meant to be installed between the two fin-stacks. It is a TL-C12B V2, a 120 mm fan of conventional 25 mm thickness, and featuring a fluid dynamic bearing. It turns at speeds of up to 1,500 RPM, pushing up to 66.17 CFM of airflow, at 1.53 mm H₂O static pressure, and 25.6 dBA maximum noise. Both fans lack any kind of lighting, and use a standard 4-pin PWM power input. Among the CPU socket types supported are LGA1851, LGA1700, AM5, and AM4. The company didn't reveal pricing.

Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.

Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base.

In a surprising development, Intel plans to extend the longevity of its Socket LGA1700 platform even as the newer LGA1851 platform led by the Core Ultra 200 "Arrow Lake" remains on track for a late-Q3/early-Q4 2024 debut. This, according to a sensational leak by Jaykihn. It plans to do this with a brand-new silicon for LGA1700, codenamed "Bartlett." This should particularly interest gamers for what's on offer. Imagine the "Raptor Lake-S" die, but with four additional P-cores replacing the four E-core clusters, making a 12-core pure P-core processor—that's "Bartlett." At this point we're not sure which P-core is in use—whether it's the current "Raptor Cove," or whether an attempt will be made by Intel to backport a variant of "Lion Cove" to LGA1700.

This wouldn't be the first pure P-core client processor from Intel after its pivot to heterogeneous multicore—the "Alder Lake" H0 die has six "Golden Cove" P-cores, and lacks any E-core clusters. Intel is planning to give launch an entire new "generation" of processor SKUs for LGA1700 which use the newer client processor nomenclature by Intel, which is Core 200-series, but without the "Ultra" brand extension. There will be SKUs in the Core 3, Core 5, Core 7, and Core 9 brand extensions. Some of these will be Hybrid, and based on the rehashed "Raptor Lake-S" 8P+16E silicon, and some "Alder Lake-S" 8P+8E; but "Bartlett" will be distinctly branded within the series, probably using a letter next to the numerical portion of the processor model number. There will not be any Core 3 series chips based on "Bartlett," but Core 5, Core 7, and Core 9.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

Noctua today released its long-awaited NH-D15 G2 next-gen flagship model CPU cooler and NF-A14x25r G2 round-frame 140 mm fans. Continuing the legacy of the iconic NH-D15 and its NF-A15 fans, the new G2 products come packed with Noctua's latest technologies and have been carefully refined in all respects to provide even better quiet cooling performance than their award-winning predecessors.

"Our G2 products have been years in the making, and it feels amazing to finally be able to offer the first of them to our customers", says Roland Mossig (Noctua CEO). "We faced various challenges in both design and manufacturing, but we've cut no corners and gone the extra mile to make sure that the G2's will be worthy successors to some of our most iconic models. When you have them in your hands, I'm confident that you'll be able to sense some of the dedication and perseverance that went into creating these fans and coolers."

Thermalright introduced the Burst Assassin 120 EVO DARK, a performance-segment air CPU cooler. The cooler relies on a conventional D-type aluminium fin-stack heatsink that's ventilated by a pair of fans in push-pull configuration. Its design involves a nickel-plated copper base from which six 6 mm-thick copper heat pipes draw heat, conveying it to an aluminium fin-stack. This 52 mm-thick fin-stack has fins with jagged edges to increase air turbulence, and heat dissipation. The stack is covered by a metal top-plate with a brushed aluminium finish. Ventilating the heatsink is a pair of 120 mm fans.

Unlike most other companies, Thermalright includes two different kinds of 120 mm fans. The first one is a Thermalright TL-C12B V2 meant to be installed in the "push" position, and the second one is a TL-C12RB V2 intended for the "pull" position. Both fans feature fluid dynamic bearings, 4-pin PWM inputs, and top speeds of 1,500 RPM; however the push fan offers 66.17 CFM of maximum airflow, while the pull fan does 58 CFM. The static pressure ratings of both fans are 1.58 mm H₂O, and both their maximum noise outputs are rated at 25.6 dBA. With the two fans in place, the Thermalright Burst Assassin 120 EVO DARK measures 124 mm x 156 mm x 102 mm (WxHxD). The company didn't mention weight. Among the CPU socket types supported are LGA1700, AM5, AM4, and LGA1200/115x.

ID-COOLING today announced the release of its newest product, the FX360 PRO 360 mm AIO liquid cooler, priced at just $60. Building on the success of the FROSTFLOW series, the FX360 PRO features a redesigned Gen 7 pump core, boasting a higher speed of 2800 RPM and an enhanced water flow range to provide further improved cooling performance.

The FX360 PRO is designed with a sleek, all-black aesthetic, instead of ARGB lighting for a more minimalist look, highlighted only by the CD pattern pump cover. The water block chamber has also been redesigned to maximize water flow efficiency. Included in the package are three TF-12025-PRO black fans, each equipped with short daisy chain cables for streamlined cable management. These cables can be discreetly connected and extended to the back of the tray, simplifying the installation process.

Following up on last week's launch of the ASTRIA 600 ARGB dual-stack CPU cooler, Thermaltake today introduced its single-stack siblings from the lineup, the ASTRIA 200 ARGB, and the ASTRIA 400 ARGB. The three coolers were unveiled by the company earlier this year at the 2024 CES. Both the 200 and 400 are single fin-stack tower-type CPU coolers. The 200 has a slightly smaller fin-stack, and uses four 6 mm-thick heatpipes, through a direct-touch base; while the 400 uses a slightly heavier fin-stack, six 6 mm-thick heatpipes, and a nickel-plated copper indirect touch base. Thermaltake rates the ASTRIA 200 ARGB for thermal loads of 210 W, while the ASTRIA 400 ARGB is rated at 230 W. Both coolers feature ARGB LED lighting in the form of a diffuser top-plate, and LEDs in the fan.

The ASTRIA 200 ARGB measures 124 mm x 93 mm x 160 mm (L x W x H), while the ASTRIA 400 ARGB measures 124 mm x 94 mm x 160 mm. Both coolers include an identical type of 120 mm fan, which takes in 4-pin PWM input, turns at speeds ranging between 500 and 1800 RPM, pushing up to 65 CFM of airflow, at 2.56 mm H₂O static pressure, and 26.8 dBA of maximum noise. The fan is rated for 40,000 hours. Among the CPU socket types supported by both coolers include LGA1700, the upcoming LGA1851, AM5, AM4, and LGA1200/115x.

Thermaltake today announced the ASTRIA 600 ARGB, a dual fin-stack type CPU cooler. The company had shown off the ASTRIA line of coolers earlier this year at the 2024 CES. The ASTRIA 600 leads the pack, being the heaviest model, with the most heat dissipation area from its dual-stack design. Its design involves a nickel-plated copper base, from which six 6 mm-thick copper heat pipes make their way through two aluminium fin-stacks with equal fin-pitch to each other. Both fin-stacks are capped by die-cast metal top-plates with ARGB lighting from 18 LEDs, each. Two 120 mm fans ventilate the fin-stacks.

Each of the two included 120 mm fans features a 40,000-hour rated bearing, and a 9-LED ARGB lighting that projects from the impeller hub. The fan takes in 4-pin PWM for its main function, turns at speeds ranging between 500 and 1,800 RPM, pushing up to 65 CFM of airflow, at 2.56 mm H₂O static pressure, and up to 26.8 dBA noise. Even with both fans in place, Thermaltake says you have clearance for 1.5x-tall memory modules (ones that have lighting or heatsink crowns). The cooler has a cooling capacity of 265 W, making it fit for any of the flagship desktop processors. Among the CPU socket types supported are LGA1700, upcoming LGA1851, LGA1200/LGA115x, AM5, and AM4. The cooler measures 124 mm x 137 mm x 160 mm (L x W x H). The company didn't reveal pricing.

DeepCool, a leader in innovative cooling solutions, proudly presents the ASSASSIN 4S, its next evolution in an already proven award winning air cooler that redefines elegance, performance, and ease of installation in the PC building market. The ASSASSIN 4S is a testament to sophistication, blending substantial thermal dissipation and silent operation with a sleek aesthetic. Boasting a simple yet refined design, the ASSASSIN 4S features seven heat pipes intricately routed through dual, black-coated fin towers, complemented by an improved 140 mm Fluid Dynamic Bearing (FDB) fan. This design not only enhances cooling performance but also ensures unobstructed RAM clearance, catering to the demands of modern high-powered processors.

Colorful unveiled the iGame B760M Ultra Z, a Socket LGA1700 motherboard in the Micro-ATX form-factor, with a distinctive white PCB, but that's hardly the story—this is Colorful's first motherboard with backside connectors, for more discretely cabled PC builds. The board doesn't use any marketing buzzwords such as "BTF" or "Project Zero," but has its onboard connectors aligned to support PC cases with motherboard tray cutouts for either of the two standards. The board draws power from a combination of 24-pin ATX and 4-pin ATX connectors (sufficient for Intel Performance Power Delivery profile). The processor is wired to a PCI-Express 5.0 x16 slot, and an M.2-2280 Gen 4 slot. Colorful used the region of the PCB next to the four DDR5 memory slots—where you'd normally have 24-pin and other connectors—to position an additional M.2 slot hidden behind a heatsink. There is yet another M.2 slot between the two PCIe slots.

The backside of the PCB has the board's power connectors, four SATA 6 Gbps ports, the USB- and HD audio headers, fan headers, and the front-panel headers. Networking connectivity include Wi-Fi 6E and 2.5 GbE. USB connectivity includes two 5 Gbps type-A USB 3.2 Gen 1 ports, a 10 Gbps type-C USB 3.2 Gen 2 port, and four USB 2.0 ports. There are two additional 5 Gbps ports via an internal header. HDMI and DisplayPort make up the display connectivity. The motherboard offers the USB BIOS Flashback feature. Available now in the Chinese market, the Colorful iGame B760M Ultra Z is priced at RMB ¥1,199 or (converts to USD $167).

GAMDIAS, a leading brand of premium PC gaming hardware and peripherals, has announced the launch of the BOREAS M2-51D Series and BOREAS E2-41D Series CPU air coolers. Every model features advanced copper heat pipes with direct contact technology, a thick base plate and one 120 mm high-performance hydraulic bearing PWM fan, and finished with a crystal-clear digital screen to integrate top cooling performance and display the temperature of your system's in real time.

The CPU cooler is made with upgraded heat pipes and fins as well a thick base plate to provide powerful and efficient cooling performance. Moreover, with the design of an all-black coating (BOREAS M2-51D and BOREAS E2-41D)/ all-white coating (BOREAS M2-51D WH and BOREAS E2-410 WH) and crowned with an LCD display top cover, it is a perfect choice for those who value aesthetics, performance and functionality.