Akasa, a leading provider of cooling and thermal solutions for the global electronics industry, has released new variants of their classic CPU coolers, updated for the Alder Lake processors (LGA 1700 mounting system). The three coolers are designed for unlocked desktop CPUs (AK-CC6606BP01), F-Series desktop CPUs (AK-CC6603EP01), and T-Series desktop CPUs (AK-CC6601EP01). These coolers will work at the TDP set by Intel, and will follow the official thermal and mechanical design guide, improving heat dissipation from the Alder Lake processors.

The 12th generation of Intel Core processors will be using the LGA1700 mounting system, launching with a host of technological advances. Intel's new hybrid core design allows for efficient data processing, with the introduction of Performance and Efficiency cores (P-cores and E-cores respectively). P-cores are dedicated to the faster processing tasks, whilst E-cores have been built to work through background processes, therefore increasing the multitasking capabilities of the CPU. Due to the new sizes of these cores, the shape of the CPU's integrated heatspreader (IHS) has changed to accommodate this, with its rectangular dimensions of 37.5 mm x 45 mm.

MSI is updating its MAG CoreLiquid-R line of all-in-one liquid CPU coolers from 2020 with the new V2 series. Available in its standard black, and now, the new all-white color trim. These coolers are every bit identical to the original CoreLiquid-R series from 2020, except out-of-the-box support for Intel Socket LGA1700. The White trim covers the water-block, the Nylon sleeves of the tubing, the fan-frames, and the radiator. A characteristic feature of the CoreLiquid-R is the integration of pump with the radiator instead of the water-block; leaving it relatively lightweight. The ARGB-illuminated top of the water-block rotates, letting you reorient the MSI Gaming logo.

Thermalright today introduced the AXP120-X67, a premium low-profile, top-flow CPU cooler, with a height of 67 mm with the fan in place. The cooler features a "C-type" aluminium fin-stack heatsink, in which heat is drawn from the C1100-grade nickel-plated copper base, and conveyed to the fin-stack via six 6 mm-thick heat-pipes of the same material. The fin-stack is arranged along the plane of the motherboard, and is ventilated by a 15 mm-thick 120 mm fan in a top-flow fashion.

The included 120 mm Thermalright TL-C12015 fan comes with 15 mm thickness, features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 59 CFM of airflow, at a static pressure of 1.36 mm H₂O, and 26.1 dBA maximum noise output. The cooler measures 120 mm x 123.5 mm x 67 mm (WxDxH), weighing 490 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Cougar today introduced the Forza 50, a slim yet premium tower-type CPU cooler. Designed with a height of 155 mm, the cooler features a dense aluminium fin-stack to which heat is fed by four 6 mm-thick copper heat pipes that make direct contact with the CPU at the base. This is ventilated by a high-speed Cougar MHP-120 fan which features hydro-dynamic bearing, turns at speeds of up to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at up to 31.68 dBA of noise output, and 4.24 mm H₂O static pressure. With its fan in place, the Cougar Forza 50 measures about 135 mm x 155 mm x 75 mm (WxHxD), weighing 792 g. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

Thermalright today introduced the Macho MAXX, its latest single-tower type CPU coolers. The Macho line of tower-type coolers see Thermalright's designers choose a single large aluminium fin-stack over a "D-type" dual fin-stack approach. With its fan in place, the cooler measures 140 mm x 124 mm x 158 mm (WxDxH), weighing 780 g.

The design of the Macho MAXX involves a nickel-plated C1100-grade copper base, from which six 6 mm-thick copper heat pipes emerge, conveying heat across the large stack of 31 fins, which is ventilated by a 140 mm TL-D14 fan. This fan turns at speeds of up to 1,500 RPM, pushing up to 77.8 CFM of airflow, at up to 2.09 mm H₂O static pressure, and up to 25.6 dBA noise output. It features a fluid-dynamic bearing. Among the CPU socket types supported are LGA1700, LGA1200, and AM4. The company didn't reveal pricing.

ZALMAN today launched the Alpha line of all-in-one liquid CPU coolers. Available in three variants based on radiator size—Alpha 36 (360 mm x 120 mm), Alpha 28 (280 mm x 140 mm), and Alpha 24 (240 mm x 120 mm), each with sub-variants based on color—white and black; the main sell with the Alpha series is an innovation with the pump-block design.

ZALMAN designed the pump to feature three independent coolant flow paths for the inflow and outflow, which works to prevent pump overload. Its designers claim this also improves cooling performance by reducing residual fluid in the pump-chamber. The heat-dissipation base is made of copper, with a large micro-fin lattice, with 0.15 mm fins. The pump-block features an in-built fan-controller that manages the radiator fans based on cooling needs. The pump-block also features a dome-shaped ARGB-illuminated top that freely moves around, so you can orient the ZALMAN logo whichever way you want.

Akasa, has announced they will be releasing an updated set of CPU coolers compatible with Intel's newest mounting system, LGA1700. The new line of coolers will follow Intel's official thermal and mechanical design guide and improves heat dissipation from the Alder Lake processors.

The 12th generation of Intel Core processors will be using this LGA1700 mounting system, launching with a host of technological advances. Intel's new hybrid core design allows for efficient data processing, with the introduction of Performance and Efficiency cores (P-cores and E-cores respectively). P-cores are dedicated to the faster processing tasks, whilst Ecores have been built to work through background processes, therefore increasing the multitasking capabilities of the CPU. Due to the new sizes of these cores, the shape of the CPU's integrated heatspreader (IHS) has changed to accommodate this, with its rectangular dimensions of 37.5 mm x 45 mm.

Thermalright today introduced the TA120 EX Mini White, one of the company's more compact tower-type CPU coolers. The cooler is designed with a height of 135 mm, even though it uses a 120 mm fan for ventilation. It features a conventional tower type design, in which five 6 mm-thick copper heat pipes make indirect contact with the CPU at the base (nickel-plated C1100-grade copper with mirror finish), pushing heat through the fin-stack, which is ventilated by a TL-D12 PRO-W fan. It features a fluid-dynamic bearing, and turns at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, with 2.1 mm H₂O static pressure, and 29.6 dBA noise output. Among the CPU socket types supported include LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

The retail version of MSI MEG Z690 GODLIKE, the company's flagship Socket LGA1700 motherboard, will include an all-in-one liquid CPU cooler, and DDR5 memory sticks. Snapped at a PC retailer, the front-face of the retail box of the motherboard reads that the contents include an MSI MEG CoreLiquid S360 cooler, and Kingston FURY Beast DDR5 memory. The size and speed of the memory is not mentioned. What's also unknown at this point, is whether the board comes in retail packages that don't bundle the cooler or memory. Assuming the bundled memory is a 32 GB (2x 16 GB) kit of decent specs, such as DDR5-6000, this motherboard could easily command a four-figure price, with speculative prices averaging $1,500.Update Jan 17th: MSI has informed us, that the price for this bundle, consisting of the motherboard, 360 mm AIO, and 32 GB of DDR5 memory, will be around $2,099 in retail.

Scythe today introduced the Big Shuriken 3 Rev B top-flow CPU cooler. Essentially a revision of the Big Shuriken 3 from 2019, with the heatsink design being unchanged, the new Rev B comes with an updated fan, the new Kaze Flex II Slim 120 with a redesigned metal shroud, a small tube of the new Thermal Elixir 2 TIM, and out-of-the-box support for Intel Socket LGA1700.

The new included Kaze Flex II Slim is a 15 mm-thick 120 mm fan which takes in 4-pin PWM input, turns between 300 to 1,800 RPM, pushing between 8 to 48 CFM of airflow, at up to 1.360 mm H₂O static pressure. Its maximum noise output is rated at 27.8 dBA. The Thermal Elixir 2 TIM offers 3.5 W/mK conductivity, and is an aluminium-zinc based compound, with zero burn-in time needed.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the brand new B660GTN motherboard. BIOSTAR kicks off 2022 with a brand-new lineup of B660 chipset motherboards that support the latest 12th gen Intel processors. Designed in the Mini-ITX form factor, the new B660GTN is the smallest motherboard of the B660 series yet packing powerful specs even with its smaller size.

Focused on content creators, casual gaming, and content consumption, the new B660GTN motherboard from BIOSTAR carries all the bells and whistles for a Mini-ITX motherboard in 2022. Designed with BIOSTAR's signature motherboard design language, the B660GTN features Rock Zone RGB lighting controlled by Vivid LED DJ software providing unprecedented customization capability for users looking to theme their build to their tastes.

Thermalright today rolled out the Peerless Assassin 120 SE White ARGB, a variant of the Peerless Assassin 120 cooler that the company originally launched in April 2021. For the most part, the new aluminium dual fin-stack cooler is identical to the original, spare for a few changes. As a "white" trim, the cooler is completely whitewashed in a matte white coating that covers the aluminium fins, the nickel-plated and copper heat pipes. The included TL-C12CW-S ARGB fans are a white variant of the TL-C12C-S, come with white frames, frosty impellers, and ARGB illumination. The original's fans were either all-black or all-white. Thermalright also did away with the decorative top-plate for the two fin-stacks, lowering the Z-height of the cooler to 155 mm, compared to 157 mm on the original. Lastly, the new cooler comes with out-of-the-box support for Intel Socket LGA1700, besides AM4 and LGA1200. The company didn't reveal pricing.

ASRock, is proud to announce its latest H670, B660 and H610 motherboards. This comprehensive range of feature-filled motherboards is designed to bring great performance and practicality - including up to PCI-Express 5.0 - to PC builders, gamers and office users looking to partner with either just launched Intel 12th Generation Core 'non-K series' processors, or existing K-series processors (LGA1700).

ASRock offers SFF builders a full range of Mini-ITX motherboards featuring H670, B660, H610 chipsets. The fully-featured ASRock H670M-ITX/ax includes support for future PCI-Express 5.0 16x graphics cards, plus space for two PCI-Express Gen-4 M.2 NVMe SSDs. A powerful 8-phase Dr.MOS VRM design and up to DDR4 5000 MHz OC means ensures small form factor builds still offer maximum performance. Three types of connectivity include extreme performance Wi-Fi 6E (2x2), Dragon 2.5G LAN and Intel Gigabit Ethernet.

Intel today is announcing a slew of new client computing products to kick-start the 2022 International CES. The "Alder Lake" CPU architecture now reaches the biggest class of consumers—notebooks, as well as mainstream desktops. In the mobile space, the company is announcing 12th Gen Core-H processors in the 35 W to 45 W segments with up to 14 CPU cores (6 P-cores and 8 E-cores); and new Core-U in the 15-28 W and 9 W categories; with up to 10 CPU cores (2 P-cores and 8 E-cores), as it detailed in older presentations of the architecture. We also expect the company to flesh out its Socket LGA1700 Core desktop processor lineup with new models across all four brands, and possibly even the entry-level. We're also expecting big announcements to the company's notebook co-engineering initiative, EVO.18:01 UTC: Gregory Bryant takes center stage.

For a significant period, Intel's Next Unit of Computing (NUC) series has featured soldered processors on the PC's motherboard. However, according to the latest leaks from Twitter hardware leaker @9550pro, we have a potential Alder Lake-based NUC featuring desktop processor versions and a dedicated LGA1700 socket. As the leaked image shows, it looks like Intel's NUC 12 Extreme edition will feature an LGA1700 socket that features support for desktop-class of Alder Lake processors. If this leak is correct, we could see a compelling NUC solution filled with Intel-only processors, meaning an Alder Lake CPU and Arc Alchemist discrete graphics card.

There is room for PCIe expansion, which means that theoretically, you could connect any GPU to the mainboard. However, it is natural to assume that Intel could force their own GPU SKUs to launch this mini PC. We have to wait and see what Intel presents at tomorrow's CES 2022 event for more information.

Cougar today rolled out the Forza 85, a premium tower-type CPU cooler. The cooler features a conventional aluminium fin-stack tower-type design; but with a 85 mm-thick fin-stack, and high fin-density (50 fins). The heatsink is capped off with a brushed-aluminium top-plate. The design involves six 6 mm-thick nickel-plated copper heat pipes making indirect contact with the CPU at the mirror-finish nickel-plated copper base, conveying heat through the fin-stack, which is ventilated by a single 120 mm fan. The heatsink is capable of holding two fans (push-pull). It is offset slightly to one side, to create clearance for the memory slots.

The included Cougar Vortex MHP120 fan with this cooler turns at speeds ranging between 600 to 2,000 RPM, pushing up to 82.48 CFM of air-flow, at 4.24 mm H₂O air-pressure, and 31.68 dBA maximum noise output. The fan features hydro-dynamic bearing. Among the CPU socket types supported by the Cougar Forza 85, are LGA1700, AM4, and LGA1200. With the fan in place, the cooler measures 135 mm x 110 mm x 160 mm (WxDxH), and weighs 1.16 kg. The company didn't reveal pricing information.

Sapphire today entered the CPU cooling components market with the NITRO+ line of all-in-one, closed-loop, liquid CPU coolers. The series debuts with two variants based on radiator size, S360-A and S240-A (360 mm x 120 mm and 240 mm x 120 mm, respectively). The cooler uses 7th Gen Asetek pump-block technology, which integrates a thermal sensor within the pump-block, and onboard logic that accordingly adjusts pump speed. The block is studded with addressable RGB lighting, a 3D structure resembling a roll-cage, and a brushed aluminium accent.

The second Sapphire innovation with these coolers is the included set of fans for the aluminium radiator. Inspired from the fans found in Sapphire's NITRO+ series graphics cards, these double ball-bearing fans feature impellers with 13 densely packed blades that are webbed off at the edges, to guide all their airflow axially. ARGB LEDs are studded in the impeller hubs. The pump turns at speeds ranging between 800 to 2,800 RPM, while the fans turn between 450 to 2,500 RPM. Among the CPU socket types supported are LGA1700, AM4, and LGA1200. The company didn't reveal pricing.

Raijintek today introduced the Eleos 12 RBW, a tower-type CPU cooler designed with a large base that's optimized for Intel Socket LGA1700. Measuring 127 mm x 75 mm x 164 mm (WxDxH), and weighing 610 g, the cooler features a conventional tower-type design. Six 6 mm-thick nickel-plated copper heat-pipes make direct contact with the processor at the base, conveying heat through an aluminium fin-stack that's ventilated by a single 120 mm fan.

The included 120 mm fan takes in 4-pin PWM for its main function, and 3-pin addressable RGB for lighting. It features a hydraulic bearing that's rated for 40,000 hours. The fan spins at speeds between 800 to 1,800 RPM, pushing up to 75 CFM of airflow, and 2.3 mm H₂O static pressure, and up to 28 dBA maximum noise. Lighting elements include ARGB LED studded in the fan-hub, as well as the top-plate of the heatsink. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

AeroCool today introduced the Raven 4 ARGB, a tower-type CPU cooler that relies on a custom design 120 mm fan. The cooler uses a typical aluminium fin-stack heatsink design. Four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. This is ventilated by the 120 mm fan, with a unique frame design that guides airflow such that it envelopes the fin-stack along all sides.

The fan takes in a 4-pin PWM connection for its main function, and 3-pin ARGB for its lighting. The fan turns at speeds ranging between 900 to 1,800 RPM, pushing 24.1 to 58 CFM of airflow, with a noise output ranging between 18 to 27 dBA. The fan uses a hydraulic bearing rated for 60,000 hours. The cooler measures 125 mm x 80 mm x 135 mm (WxDxH). Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, and AM4.

Intel's next entry-level processor for the Socket LGA1700 platform is the Core i3-12100. Carved out of the "Alder Lake-S" H0 silicon, this processor features 4 "Golden Cove" performance cores with HyperThreading enabling 8 logical processors, and no E-cores. The processor ticks at 3.30 GHz, with 4.30 GHz Turbo Boost 2.0 frequency. Each of the four cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The i3-12100 gets a Gen12 Xe LP-based iGPU, while a variant of the processor, the i3-12100F, lacks integrated graphics. Intel is rating the processor base power value at 60 W, with 77 W maximum turbo power.

XFastest scored an i3-12100 engineering sample, and wasted no time in comparing it with the Ryzen 3 3300X. The i3-12100 was tested on an ASRock Z690 Steel Legend motherboard that has DDR4 memory slots. 16 GB of dual-channel DDR4-3600 memory and RTX 3060 Ti were used on both the Intel and AMD test-beds. A Ryzen 3 3100 was also used on the AMD side. Right off the bat, we see the i3-12100 take a significant lead over the AMD chips at PCMark, posting a roughly 15% performance lead. Cinebench R23 is another test where the little "Alder Lake" scores big, posting a roughly 26% performance lead in the multi-threaded test, and 27% in the single-threaded test. This is mainly because the 3300X is based on "Zen 2" while the i3-12100 uses the cutting-edge "Golden Cove" cores. AMD hasn't bothered with "Zen 3" based Ryzen 3 desktop processors in the retail market.

Here are some of the first pictures of the 12th Gen Intel Core "Alder Lake" desktop processor models that are expected to join the lineup in January 2022. Intel debuted the series with unlocked "K" and "KF" SKUs, with "locked" SKUs saved for next year. Pictured here are the Core i9-12900, the Core i5-12600, the i5-12500, and the i5-12400. The S-SPEC codes for these processors are SRL4E, SRL4F, SRL4G, and SRL4P, respectively. Our older article details their possible specifications. The lineup isn't limited to these models. Others include the Core i7-12700, and the "F" variants of many of these SKUs, which lack integrated graphics, allowing those with discrete graphics cards to save a little.

Besides these processors, Intel is expected to expand its motherboard chipset options. Currently, Z690 is the only chipset option for the LGA1700 socket. Upcoming chipset models are likely to include the H670, W680, B660, and perhaps even the H610. Intel could use platform I/O for segmentation of these chipsets, besides lack of CPU overclocking support. A big change with the 12th Gen desktop processor lineup concerns Core i5. While the i5-12600K and i5-12600KF feature 6 P-cores and 4 E-cores, the other Core i5 SKUs, including the i5-12600, lack E-cores. The source installed these processors to confirm that the i5-12600 is indeed based on the "H0" silicon and lacks E-cores.

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

With the Eisbaer LT240 & LT360 Aurora, Alphacool today presents new CPU "All-in-One" solutions based on the previously so successful Eisbaer LT series. Compared to the classic Alphacool Eisbaer LT AIO, the cooler and pump unit as well as the fans of the new Aurora version are now fully equipped with digital RGB LEDs. With the included controller, extensive lighting effects can be set, which provide unique and noble illumination.

As with all Eisbaer AIOs, Alphacool again uses the NexXxoS radiator with cooling fins, pre-chambers and cooling channels made of copper as well as the robust TPV hoses with quick-release couplings from the ENTERPRISE Solutions series. With the help of the quick couplings, it is possible to integrate other common water cooling products such as GPU coolers into the loop. The flat pump housing allows the AIO to be installed even in the smallest spaces. Alphacool's Eiszyklon Aurora LUX PRO is used as the fan, the DC-LT pump is replaced by Alphacool's quieter and more powerful DC-LT2 pump.

EK, is now offering an EK-AIO LGA1700 upgrade kit for the new Intel LGA1700 socket, accommodating Intel Alder Lake processors. In light of reusability initiatives, EK is offering future and pre-existing customers an option to reuse the EK-AIO line of closed-loop coolers for new/upcoming CPUs. The EK-AIO LGA1700 upgrade kit is designed to offer optimal coverage of the CPU's IHS for all EK-AIO models. It includes a metal backplate, a rubber gasket, screws, washers, and thermal paste.

The EK-AIO LGA1700 upgrade kit is available in EK Webshop for free (Shipping fees are covered by the customer) and is limited to one piece per order. There is no need for proof of purchase or an invoice for an EK-AIO. If any customer requires this upgrade kit for multiple PCs, please reach out directly to our customer support team. The upgrade kit will also be available on multiple marketplaces and with select Europe and APAC-based resellers in the following weeks.

CRYORIG has recently released preliminary details for their LGA 1700 socket cooler support program. The company is preparing five adapters for existing coolers that are not currently compatible with the new socket and hope to have these available for January 2022. CRYORIG will provide these adapter kits to eligible customers who have purchased a cooler from the company after January 1st 2021 and can provide proof of purchase of an Intel 12th generation Alder Lake processor. CRYORIG will also be selling the adapters for customers who purchased their cooler before December 31st 2020 with more information on the process to be released once the adapters have been finalized. The complete list of compatible coolers can be found below.