According to recently discovered shipping manifests, Intel is developing a new processor series codenamed "Wildcat Lake," potentially succeeding their entry-level "Intel Processor" lineup based on Alder Lake-N. The documents, revealed by x86deadandback, suggest a 2025 launch timeline for these chips targeting lightweight laptops and mini-PCs. The shipping records from October 30 mention CPU reball equipment compatible with BGA 1516 sockets, measuring 35 x 25 mm, indicating early validation testing is underway. These processors are expected to be manufactured using Intel's advanced 18A process technology, sharing the same manufacturing node as the upcoming Panther Lake series. Early technical specifications of Wildcat Lake point to a hybrid architecture combining next-generation "Cougar Cove" performance cores with "Darkmont" low-power efficiency (LPE) cores in a 2P+4LPE configuration.

This design appears to separate the core clusters, departing from traditional shared ring bus arrangements, similar to the approach taken in Intel's Lunar Lake and Arrow Lake processors. While Wildcat Lake's exact position in Intel's product stack remains unclear, it could serve as a modernized replacement for the what were Pentium and Celeron processor families. These chips traditionally power devices like Chromebooks, embedded systems, and home servers, with the new series potentially offering significant performance improvements for these market segments. The processor is expected to operate in the sub-double-digit TDP power envelope, positioning it below the more powerful Lunar Lake series. Graphics capabilities will likely be more modest than Lunar Lake's Xe2 architecture, aligning with its entry-level market positioning.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and IPC solutions, is pleased to introduce the MT-N97 industrial computer. The BIOSTAR MT-N97 industrial computer is a compact, fanless powerhouse designed to meet the high demands of modern industrial applications. Tailor-made for system integrators, AIOT development, automation, edge computing, human-machine interfaces (HMI), and digital signage, the MT-N97 combines robust performance with unwavering stability, providing a reliable foundation for critical operations across various sectors.

Equipped with advanced specs that make it an ideal choice for high-performance, industrial-grade applications, the MT-N97 draws power from an Intel Alder Lake N SOC Processor (Intel N97, 4core, up to 3.6 GHz, TDP 12 W). It combines efficient performance with low power consumption, enhancing reliability and cost-effectiveness for continuous operation. The MT-N97's fanless design ensures quiet, noiseless performance, making it suitable for environments where minimal disruption is critical.

At AAEON Technology, we recognize growing demand for secure and reliable industrial systems. In collaboration with Canonical, AAEON Technology validates Ubuntu Pro across our Intel-based industrial systems. Each unit comes with a preinstalled Ubuntu image, an Ubuntu Pro license sticker, and 10 years of Canonical-backed updates for ongoing security and maintenance. "This collaboration means our customers benefit from cutting-edge hardware paired with the secure, long-term support offered with Ubuntu Pro enabled. With ongoing updates, they're always protected, allowing them to focus on their core goals," said Victor Lai, Managing Director at AAEON.

Ubuntu Pro provides enterprise-level security, compliance, and long-term stability for industrial and edge applications. It meets strict regulatory standards while delivering high performance in demanding environments.

The MS-CF16 Pico-ITX SBC is powered by Intel Alder Lake-N/Amston Lake series processors, offering up to 16 GB of LPDDR5X memory for efficient, high-performance computing. It supports dual independent displays via HDMI and LVDS/eDP interfaces, and features multiple I/O options including 2.5 GbE/1GbE, USB 10 Gbps/5 Gbps and two M.2 slots for flexible connectivity. The board's ultra-compact 2.5" Pico-ITX form factor ensures easy integration into space-constrained environments.

As a quick follow-up to last week's "Arrow Lake-S" de-lidding by Madness727, we now have a line-up of a de-lidded Core Ultra 9 285K "Arrow Lake-S" processor placed next to a Core i9-14900K "Raptor Lake-S," and the Core i9-12900K "Alder Lake-S." The tile-based "Arrow Lake-S" is visibly larger than the two, despite being made on more advanced foundry nodes. Both the 8P+16E "Raptor Lake-S" and 8P+8E "Alder Lake-S" chips are built on the Intel 7 node (10 nm Enhanced SuperFin). The "Raptor Lake-S" monolithic chip comes with a die-area of 257 mm². The "Alder Lake-S" is physically smaller, at 215 mm². What sets the two apart isn't just the two additional E-core clusters on "Raptor Lake-S," but also larger caches—2 MB of L2 per P-core, increased form 1.25 MB/core, and 4 MB per E-core cluster, increased from 2 MB/cluster.

Thanks to high quality die-shots of the "Arrow Lake-S" by Madness727, we have our first die-area estimations by A Hollow Knight on Twitter. The LGA1851 fiberglass substrate has the same dimensions as the LGA1700 substrate. This is to ensure the socket retains cooler compatibility. Using geometrical measurements, the base tile of the "Arrow Lake-S" is estimated to be 300.9 mm² in area. The base-tile is a more suitable guideline for "die-area," since Intel uses filler tiles to ensure gaps in the arrangement of logic tiles are filled, and the chip aligns with the base-tile below. The base tile, built on an Intel 22 nm foundry node, serves like a silicon interposer, facilitating high-density microscopic wiring between the various logic tiles stacked on top, and an interface to the fiberglass substrate below.

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

We are excited to announce the launch of the MS-CF10 Mini-ITX motherboard, designed to deliver exceptional performance and versatility for a wide range of applications. Powered by the latest 14th/13th/12th Gen Intel Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors, including Core i9/i7/i5/i3, Pentium, and Celeron processors, the MS-CF10 is engineered to meet the demands of high-performance computing solutions.

Key Features:

• Advanced Processor Support: The MS-CF10 supports Intel 14th/13th/12th Gen Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors with R680E/Q670E/H610E chipsets, ensuring top-tier performance and efficiency.
• High-Speed Memory: Equipped with 2x DDR5 5200 MT/s ECC/non-ECC SODIMM slots, the motherboard supports up to 64 GB of memory, providing robust data handling capabilities.
• Multiple Display Outputs: Featuring quadruple independent displays with 2x DP, HDMI 2.0, and LVDS/eDP, the MS-CF10 is ideal for applications requiring multiple high-resolution screens.

MSI is excited to introduce the MS-C907, a robust and versatile embedded Box IPC designed to meet the demanding requirements of various industries. Beyond its suitability for the chemical industry, the MS-C907 is ideal for applications in factory automation, transportation, digital signage and retail.

Meeting the Needs of Multiple Industries
The MS-C907 offers robust performance, extensive connectivity, and durable design, making it an ideal solution for a wide range of industrial applications. Whether it's automating factory processes, powering digital signage, or managing smart building systems, the MS-C907 provides the reliability and efficiency needed for continuous operation.

Researchers from the University of California, San Diego, have unveiled a significant security vulnerability affecting Intel Raptor Lake and Alder Lake processors. The newly discovered flaw, dubbed "Indirector," exposes weaknesses in the Indirect Branch Predictor (IBP) and Branch Target Buffer (BTB), potentially allowing attackers to execute precise Branch Target Injection (BTI) attacks. The published study provides a detailed look into the intricate structures of the IBP and BTB within recent Intel processors, showcasing Spectre-style attach. For the first time, researchers have mapped out the size, structure, and precise functions governing index and tag hashing in these critical components. Particularly concerning is the discovery of previously unknown gaps in Intel's hardware defenses, including IBPB, IBRS, and STIBP. These findings suggest that even the latest security measures may be insufficient to protect against sophisticated attacks.

The research team developed a tool called "iBranch Locator," which can efficiently identify and manipulate specific branches within the IBP. This tool enables highly precise BTI attacks, potentially compromising security across various scenarios, including cross-process and cross-privilege environments. One of the most alarming implications of this vulnerability is its ability to bypass Address Space Layout Randomization (ASLR), a crucial security feature in modern operating systems. By exploiting the IBP and BTB, attackers could potentially break ASLR protections, exposing systems to a wide range of security threats. Experts recommend several mitigation strategies, including more aggressive use of Intel's IBPB (Indirect Branch Prediction Barrier) feature. However, the performance impact of this solution—up to 50% in some cases—makes it impractical for frequent domain transitions, such as those in browsers and sandboxes. In a statement for Tom's Hardware, Intel noted the following: "Intel reviewed the report submitted by academic researchers and determined previous mitigation guidance provided for issues such as IBRS, eIBRS and BHI are effective against this new research and no new mitigations or guidance is required."

Intel's first three generations of client processors implementing hybrid CPU cores, namely "Alder Lake," "Raptor Lake," and "Meteor Lake," have them arranged along a ringbus, sharing an L3 cache. This usually sees the larger P-cores to one region of the die, and the E-core clusters to the other region. From the perspective of the bidirectional ringbus, the ring-stops would follow the order: one half of the P-cores, one half of the E-core clusters, iGPU, the other half of E-cores, the other half of the P-cores, and the Uncore, as shown in the "Raptor Lake" die-shot, below. Intel plans to rearrange the P-cores and E-core clusters in "Arrow Lake-S."

With "Arrow Lake," Intel plans to disperse the E-core clusters between the P-cores. This would see a P-core followed by an E-core cluster, followed by two P-cores, and then another E-core cluster, then a lone P-core, and a repeat of this pattern. Kepler_L2 illustrated what "Raptor Lake" would have looked like, had Intel applied this arrangement on it. Dispersing the E-core clusters among the P-cores has two possible advantages. For one, the average latency between a P-core ring-stop and an E-core cluster ring-stop would reduce; and secondly, there will also be certain thermal advantages, particularly when gaming, as it reduces the concentration of heat in a region of the die.

Acemagic, a German mini-PC developer, has an interesting product booth at Computex 2024. We stopped by to take a look and found the exciting world of mini-PC solutions. Among the first products, we looked at the Z1A dual-screen laptop solution. Featuring two 14.1-inch 1080p IPS displays sitting side by side, the Z1A laptop is powered by Intel's Alder Lake Core i7-1265U or i7-1255U CPUs with Intel Iris Xe graphics. Weighting 1.8 kg, the laptop has a 4000 mAh battery and accommodates two M.2 2280 NVMe drives in combination with LPDDR4 memory left empty for users to install. The computer features WiFi 6 and BlueTooth 5.2 connectivity options and has an IO port selection that includes a USB 3.0, HDMI 2.0, and two USB Type-C connectors (one for data and one for charging and data).

Intel's CEO, Pat Gelsinger, has confirmed that the upcoming 18A process of the Panther Lake CPU generation is on schedule for a mid-2025 release, which aligns with the initial projection. This development marks a significant milestone in the company's ongoing efforts to integrate AI capabilities into its processors. The mid-2025 release date is expected to follow the debut of Intel's Arrow Lake process in late 2024 or early 2025, a release that holds the promise of significant advancements in AI computing. During Intel's Q1 2024 Quarterly Results, Gelsinger expressed confidence in the company's AI capabilities, stating that the Core Ultra platform currently delivers leadership AI performance and that the next-generation platforms, Lunar Lake and Arrow Lake, will launch later this year, tripling AI performance. He also mentioned that the Panther Lake generation, set to release in 2025, will grow AI performance up to an additional 2x.

The Panther Lake generation represents the culmination of three generations of work in a short time and is expected to continue Intel's iterative approach. This transition is marked by a shift from a hybrid architecture, a combination of different types of processors, to a disaggregated die, where different components of the processor are separated, as AI computing becomes increasingly prominent. This strategic move is aimed at optimizing AI performance and flexibility. This marks the third generation of the Intel Core Ultra series, following Ultra 100 (Meteor Lake), Ultra 200 (Arrow Lake), and Lunar Lake (200V). Intel's release strategy mirrors the pattern set by the Hybrid Architecture, with Alder Lake debuting in 2021, followed by Raptor Lake in 2022, and a refreshed Raptor Lake released last year to bridge the gap until LGA 1851 was ready. However, Intel's roadmap has seen adjustments in the past, such as the initial promise of an Arrow Lake release before the end of 2024, which was later retracted. The mid-2025 release of Panther Lake aligns with rumors of Arrow Lake's late 2024 or early 2025 debut, suggesting that the 18A process CPU generation could debut several months after Arrow Lake.

DFI, the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce two of the world's first Industrial MicroATX motherboards to support Intel Core 12th, 13th, and 14th (Alder Lake-S, Raptor Lake-S and Raptor Lake-S Refresh) Gen Processors. "With support for the latest Intel Core processors and features including dual GPU slots and dual 10GbE ports, RPS310 and ADS310 represent a significant leap forward in innovation for industrial and medical computing, empowering manufacturing and healthcare professionals to achieve new levels of efficiency," said Jarry Chang, General Manager of Products Center at DFI.

RPS310
Featuring dual PCIe x16 Gen 4 GPU slots, addresses key challenges for Factory Automation professionals working in Smart manufacturing field, enabling improved visualized data, complex imagery processing and quality monitoring in automated production lines. RPS310 is also perfect for medical professionals to analyze Medical imaging data with unprecedented image quality and efficiency, improving diagnosis accuracy on MRIs and CT Scanners and X-rays.

Intel has decided to discontinue its entire 13th Gen Raptor Lake lineup of overclockable "K-series" CPU SKUs. According to an official product change notice, the company will stop accepting orders for chips like the Core i9-13900KS, Core i9-13900K, Core i9-13900KF, Core i7-13700K, Core i7-13700KF, Core i5-13600K, and Core i5-13600KF after May 24th, 2024. Final shipments to vendors are targeted for June 28th. After those dates, availability of the unlocked Raptor Lake processors will rapidly diminish as the remaining inventory gets sold off, possibly at inflated prices due to shortages. This discontinuation comes just over a year after Raptor Lake's launch in late 2022, which delivered additional performance improvements over the previous Alder Lake generation.

Raptor Lake brought higher clocks, more cache, additional efficiency cores, and enough muscle to compete with AMD's Ryzen 7000 CPUs in many workloads. Interestingly, Intel has not yet discontinued Alder Lake, suggesting those 12th-generation chips may still be available for some time. While the death of the overclockable Raptor Lake K-series CPUs is unfortunate for enthusiasts, there is an upside—it paves the way for Intel's current generation Raptor Lake refresh, 14th generation Core processors, to clear inventory before the next-generation processors arrive. The 15th generation "Arrow Lake" Core Ultra 2 series of processors could be teased at the upcoming Computex event in June.

Rugged embedded computer brand—Cincoze has launched two new compact embedded computers in the Rugged Computing—DIAMOND product line. The DA-1200 is a palm-sized device suitable for most industries' basic applications and at a price point that has made it a popular choice among customers for many years. With this latest performance boost, it will likely remain a top choice. The DV-1100 supports the latest 13th/12th generation Intel Core CPUs, providing powerful performance in a streamlined configuration and maximizing cost-effectiveness. It is recommended for industrial sites with high-performance computing needs but limited installation space, such as smart manufacturing, machine vision, and railway computing.

The DA-1200 industrial embedded computer has a 12 W ultra-low power consumption Intel Alder Lake-N processor and supports 16 GB DDR5 4800 MHz memory. Equipped with two M.2 Key B slots (convertible to M.2 Key E with an adapter card), the DA-1200 can cover all wireless communication needs (5G, WIFI, GNSS, etc.) and caters to storage options such as 2.5" SSD, half-slim SSD, and M.2 SSD. The palm-sized DA-1200 is only 150 x 105 x 52.3 mm, packing the maximum application flexibility into a tiny package.

Panasonic Connect today announced the latest iterations of its TOUGHBOOK G2 and 33 detachable rugged tablets. The 10.1-inch G2mk2 and 12-inch 33mk3 deliver market-leading ruggedness, battery life, customisation, connectivity and performance that provide the modern mobile worker with a balanced solution, regardless of the task, application or environment.

Unrivalled performance for any application
Panasonic's TOUGHBOOK G2mk2 and 33mk3 devices feature market-leading performance, enhanced connectivity and increased modularity to adapt to different mobile worker requirements.

Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

According to Financial Times, a regional court in Düsseldorf, Germany, created a significant setback for Intel on Wednesday, issuing an injunction prohibiting sales of some of its processors due to allegations they infringe on a patent held by R2 Semiconductor. R2, a technology firm based in Palo Alto, California, accused Intel of violating its patent related to processor voltage regulation. The ruling applies to Intel's 10th, 11th, and 12th generation Core processors, known as Ice Lake, Tiger Lake, and Alder Lake, as well as its Ice Lake Xeon server SKUs. Newer processors generations (13th, 14th, etc.) don't infringe the patent. Even though Intel noted that it plans to appeal the decision, the ramifications could extend beyond the company itself. Industry experts warn the court order could lead to a sweeping ban on products containing the disputed Intel chips, including laptops and pre-built PCs from major manufacturers like HP and Dell. R2 has waged an ongoing legal fight across multiple jurisdictions to defend its intellectual property.

After initially filing suit against Intel in the United States, R2 shifted its efforts to Germany and other European countries after its patent was invalidated stateside. Intel strongly denied R2's patent infringement claims, alleging the company's entire business model relies on extracting legal settlements through serial litigation. Intel believes the injunction serves only R2's financial interests while harming consumers, businesses, and the economy. The two firms traded barbs in official statements about the case. R2's CEO, David Fisher, rebuffed Intel's characterization of his company, saying it has only targeted Intel for infringement of its clear IP rights. As the war of words continues, the practical impact of the German court's decision remains uncertain, pending Intel's appeal. However, the preliminary injunction demonstrates the massive financial consequences at stake in battles over technological patents.

A conglomerate of Japanese hardware outlets has tested Intel's latest batch of Raptor Lake Refresh desktop processors—their findings arrived in the form of a YouTube video (viewable below). The lowly Intel 300 CPU was sampled as part of PAD's lab tests—this 14th generation model serves as a natural successor to Team Blue's Pentium Gold G7400 processor. Pentium and Celeron brands were retired in the "essential product space" in 2022, along with the introduction of a replacement: simple "Intel Processor" in a light blue color scheme.

Expectations are not set very high for a two-core, 4-thread CPU in modern times—some news outlets believe that this an Alder Lake part (AKA a frequency tweaked Pentium Gold G7400), despite being launched alongside many Raptor Lake Refresh parts. The Intel 300 sports two Raptor Cove P-cores with hyper-threading capabilities—base performance is set at 3.9 GHz, with no provisions for boosting above that figure. The rest of its basic specs consist of a 46 W TDP and 6 MB of L3 cache (3 MB on each core). Team Blue's Core i3-14100 quad core CPU sits just above the 300 in the latest batch of 14th Gen—naturally, the former pulls ahead of the latter in synthetic benchmarks. PC Watch and Co. tests present a maximum 55% multi-core performance gap between the two lower end options, although the single-threaded difference was measured 13% (in Cinebench).

Intel is reportedly bringing Application Optimization (APO) to its 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors after all, PC Gamer reports. APO is currently restricted to 14th Gen Core i9 and Core i7 "Raptor Lake Refresh" processors, and the upcoming 14th Gen HX Core i9 and Core i7 mobile processors based on this silicon. An extension of the Dynamic Tuning Technology (DTT), APO is an application-specific scheduler optimization that makes hardware resources of Intel's Hybrid processors "correctly" available to the application. This requires Intel to study the application itself, and validate its optimization on a per-processor model basis (which is Intel's explanation as to why it isn't available across all its Hybrid processors). On optimized games—of which there are currently 7—APO is found to offer frame rate uplifts ranging between 10% to 16%. At this point we don't know exactly which other 12th and 13th Gen processors Intel plans to extend APO to, but it's likely only to the Unlocked K or KF SKUs, as PC Gamer notes.

AMD Socket AM4 users are in for a treat, as the company plans two more processor models in the Ryzen 5000X3D series, according to chi11eddog, a reliable source with AMD leaks. Although based on the older "Zen 3" microarchitecture, these chips feature 3D Vertical Cache technology, which helps shore up their gaming performance to levels comparable at least to 12th Gen Intel Core "Alder Lake," giving Socket AM4 platform users a cost-effective upgrade path to prolong their gaming PC builds that could be as old as 5 years now. If you recall, AMD has formally extended "Zen 3" and 3D V-cache support to all Socket AM4 chipset generations, including AMD 300-series.

Among the two new processor models are the Ryzen 7 5700X3D, and the Ryzen 5 5500X3D. The 5700X3D is an 8-core/16-thread processor with 100 MB of total cache (that's 512 KB of L2 cache per core, plus 96 MB of L3 cache); while the Ryzen 5 5500X3D is a 6-core/12-thread chip with 99 MB of total cache. What sets the 5700X3D and 5500X3D apart from the 5800X3D and 5600X3D are lower clock speeds, and possibly, lower TDP. Both chips come with a base frequency of 3.00 GHz, compared to the 3.30 GHz of the 5600X3D and 3.40 GHz of the 5800X3D. The 5700X3D boosts up to 4.10 GHz compared to the 4.50 GHz of the 5800X3D; while the 5500X3D boosts up to 4.00 GHz when compared to 4.40 GHz of the 5600X3D. Both the 5800X3D and 5600X3D have their TDP rated at 105 W, so it's possible that AMD is using lower TDP and PPT values for the 5700X3D and 5500X3D. There's no word on when the two new chips are coming out, although AMD continues to release updates to the Socket AM4 AGESA microcode, with the latest version ComboAM4v2 1.2.0.B being released as recently as September 2023.

Durabook, an innovator in purpose-built, rugged computing solutions, today announced the launch of the next-generation S15 Semi-Rugged Laptop equipped with the latest Intel 12th Gen Alder Lake platform. The combination of this powerful CPU, coupled with a comprehensive set of connectivity options, security support, and its capability for further expandability makes this semi-rugged laptop with its large screen the perfect support for professional field services personnel running ever more sophisticated applications in challenging conditions.

The laptop's 15.6" Full HD display may be the first thing to turn the head of a field service professional, but the CPU performance of the S15 Semi-Rugged Laptop with Intel Core i7 and i5 processors that are up to 206% faster than previously is an eye-opener. Looking past the handsome rugged exterior, at the Intel Iris Xe Graphics package, ultra-reliable connectivity, and the ability to operate as a workstation configured with up to three storage drives, this is the ideal rugged laptop for field services workers.

IBASE Technology Inc. (TPEx: 8050), a renowned provider in the design and manufacturing of embedded computing solutions, rolls out the low-power IB838 3.5" single board computer powered by Intel Core i3 N-series (formerly Alder Lake-N) processor. Combining robust computing performance with advanced features, it is positioned to meet diverse needs across multiple industries, including industrial automation and control, retail displays, transportation, and automotive applications.

Fortified with intelligent power handling and a 9 V~36 V DC input range, the IB838 ensures reliability and consistent operations in transportation applications that may encounter variable power conditions. Versatile connectivity makes it ideal for automation processes and data acquisition systems. The SBC offers Type-C, DP++, and eDP or LVDS display options, along with a rich set of I/O interfaces, including two Intel PCI-E 2.5G LAN ports, two USB 2.0 ports, and four USB 3.2 ports (1x Type-C + 3x Type-A).

Recently, Chinese customs at Gongbei Port, which connects Macau and Zhuhai, made a significant interception: 780 Intel processors that smugglers were attempting to sneak in. Smugglers in China are known for their innovative tactics to bypass customs. There are many ways that these smugglers try to avoid paying customs, and that is strapping these goods on themselves. In this latest incident, the smugglers chose a seemingly clever approach by stashing the processors within a cross-border bus's engine. But passing through metal detectors with such a hefty amount of metal is risky, and even creative disguises can't shield processors from keen-eyed detectors.

After examining its digital imagery, the Gongbei Port customs officials grew suspicious of the bus. A detailed engine inspection unveiled the smuggled goods: 780 Intel processors, cleverly hidden. The estimated value of the seized items is over one million yuan, approximately $137,341. Although the exact models of the confiscated chips are not entirely clear, they appear to be from the 12th Generation Alder Lake or 13th Generation Raptor Lake series. China's vast grey market for computer components is both a boon and a bane. While CPUs, GPUs, and SSDs are available at tempting prices, these deals often lack the manufacturer's warranty. So, while the initial savings might seem appealing, the absence of warranty poses risks that could offset those initial benefits in the long run.

Intel recently updated its website to highlight interposers used for testing upcoming chips before their actual product integration. A specific webpage now showcases components used by various tools, notably the "Gen5 VR," which stands for CPU Voltage Regulator in this context. The highlight of the update reveals at least four yet-to-be-announced products: Battlemage (BMG), Arrow Lake (ARL), and Lunar Lake (LNL), slated for launch in 2024. Particularly interesting are the two Battlemage interposers: BGA2362-BMG-X2 and BGA2727-BMG-X3. This hints that a Battlemage GPU could have more pins than Intel's current top-tier GPU from the Alchemist series, known as DG2, which features 2660 pins (BGA2660-DG2-512EU).

This unveiling could indicate Intel's plans to introduce two GPUs in its new series or potentially two different package sizes. Manufacturers often use consistent package sizes for multiple GPUs, granting flexibility to interchange processors with similar specifications and presenting a feasible production strategy. Another notable mention is the Arrow Lake-HX, intended for premium desktop/laptop hybrids.. While there was some buzz about the ARL-HX series before, this update provides clear confirmation from Intel. Lastly, the reveal includes an interposer for the Lunar Lake-M series (LNL-M), which is expected to be Intel's most energy-efficient line. Drawing parallels from the Alder Lake series, such chips were designed for tablets with power consumption between 5 to 7 watts.