ECS is working on the X79R-AX Stealth, a high-end socket LGA2011 motherboard that borrows a design concept from ASUS TUF Sabertooth series, on which the jury is still out - a shroud covering most of the non-critical areas of the motherboard, which ASUS refers to as "Thermal Armor." The X79R-AX Stealth uses a similar shroud, except it isn't as perforated on the surface, and instead uses vents along its edges for ventilation and connections.

The shroud appears to borrow its design from some of the earliest 5th generation (stealth) fighter aircraft, such as the F-117 Nighthawk. Only key components such as the CPU socket, expansion/memory slots, and power connectors protrude from cutouts in the shroud, most other connections such as on-board headers appear to be arranged perpendicularly, and open out along the edges of the board. Most other features of the board appear to be consistent with that of the X79R-AX Black Series. According to ECS, the board should be out very soon.

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").

Intel's next high-end desktop processor, the Core i7-3970X Extreme, arrives in Q4, 2012, according to a DonanimHaber report. The i7-3970X is expected to ship with clock speeds of 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package. Its feature-set is consistent with that of the Core i7-3960X, with 15 MB shared L3 cache, HyperThreading, and unlocked base-clock multiplier. In all likelihood, the i7-3970X could displace the i7-3960X from its price-point.

Even as GIGABYTE is shedding its signature blue PCB color scheme for higher-end motherboards, leaving it to entry-thru-mid range products, Prolimatech is giving its flagship CPU cooler, the Megahalems Rev. B, a cool-blue finish in its new variant. This is almost exactly the same shade of blue as the one Gigabyte uses on its motherboards (refer to the third picture below). Most of the cooler's 88 stainless steel fins are blue, with the top fins on each of the two stacks retaining a chrome finish. The six 6 mm-thick heat pipes passing through them are made of nickel-plated copper, while most metal parts of the retention modules are colored black. The cooler otherwise retains the same specifications of the Megahalems Rev. B, including support for the latest CPU socket types, such as LGA2011. Prolimatech could charge a tiny premium over the original's US $70 price-tag.

After a brief sighting at Computex 2012, we come across the Aeolus Big Frost dual-tower CPU cooler again. This time, the cooler appears polished and ready for market launch. The cooler is a simplified version of DeepCool's Assassin, retaining its dual aluminum fin tower design. The design consists of two symmetric aluminum fin stacks, through which six 6 mm-thick copper heat pipes pass, drawing heat from a copper CPU base. The fin-stack is then ventilated by two 120 mm fans in push-pull configuration.

The heatsink measures 126 x 136 x 159 mm, weighing 1,109 g (including fans). The fan pushing "fresh" air through the first fin stack is configured to spin at speeds of up to 1,300 RPM, with noise levels as high as 22.6 dBA, while the fan pulling air and conveying it to the second fin stack spins at speeds ranging in 900-1,500 RPM, with 21.4 to 32.1 dBA noise levels. The Big Frost supports a full range of CPU socket types available in the market today, including Intel LGA2011, LGA1155/LGA1156, LGA1366, LGA775, AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. In China, the cooler is expected to sell for 200 RMB (US $32).

Akasa also unveiled the third entry into its Venom series of CPU coolers, the Venom Medusa. This launch comes exactly an year after that of the Venom Voodoo. In the picture below, the Venom Medusa is shown between the original Venom, and Venom Voodoo. The Venom Medusa is a large aluminum fin dual-tower heatsink, with two symmetrical aluminum fin stacks. It is designed keeping in mind the thermal loads of the new LGA2011 processors.

Its design consists of a large base from which eight nickel-plated copper heat pipes pass, making direct contact with the CPU, and passing through the two aluminum fin stacks at ends. The Venom Medusa ships with two fans, a Viper 120 mm fan pushes fresh air through the first aluminum fin stack, while a larger 140 mm fan conveys air from the first stack to the second. There is provision for a third 120 mm fan, which pulls air from the second stack, for exhaust. The Venom Medusa supports nearly every modern CPU socket type, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3, and FM2/FM1.

A star attraction at the motherboard section of ASUS booth was its ZEUS Dual-GPU X79 concept motherboard. We got a chance to talk at lengths with people at ASUS about the exhibit, and learned a few details beyond what we already know. To begin with, ASUS is likely using a pair of "Southern Islands" family discrete mobile GPUs, not desktop ones. Further, it's likely that the GPUs are 28 nm "Pitcairn" based. The two GPUs are installed in CrossFire configuration. The next big detail is that the design focus on [evidently] isn't the integrated dual-GPU, but to demonstrate the first Thunderbolt-equipped X79 motherboard. The ZEUS has not one, but two Thunderbolt ports. The third (and most depressing) detail is that it's "highly unlikely" that the ZEUS will ever make it to the market. Think of it as yet another tradeshow concept by a big company. Perhaps ASUS doesn't want the ZEUS to end up like the ROG GSurf-365, its first off-beat ROG motherboard, which went beyond the show-floor but didn't have market-success.

GELID Solutions showed off its newest Gamer series Black Edition CPU Cooler (doesn't carry a GX## model number). The cooler's design consists of a dark aluminum fin dual-tower design à la NH-D14, Corator DS, etc., and uses no less than seven heat pipes (3x 8 mm-thick and 4x 6 mm-thick) to transport heat from the base to the aluminum fin stacks. In the space between the two fin-stacks, a standard-size 120 mm (25 mm-thick) fan pulls air through the first stack, and pushes it through the second one. Pushing in fresh-air through the first stack is care of a slim 120 mm (15 mm-thick) fan. The cooler will be designed to be compatible with all modern CPU socket types, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3/AM2+/AM2, and FM2/FM1.

Late last week, we came across teaser pictures of a certain new Big Bang series motherboard. Our source didn't reveal its name, but mentioned that we were close in guessing its name to be "ZPower", which we admitted we could go wrong with. It turns out that the new line is named "MPower", and includes not just a new socket LGA1155 motherboard, the Z77 MPower, but also a new LGA2011 one, the X79 MPower. The two are beefed-up versions of the Z77A-GD65 and X79A-GD65 (8D), respectively, with stronger CPU VRM, relaxed warranties that are overclocker-friendly, and a new black+yellow color-scheme, which is consistent with that of its Lightning series graphics cards (such as the R7970 Lightning).

GIGABYTE did not leave out the Sandy Bridge-E HEDT platform when designing its new Ultra Durable 5 line of motherboards, the company showed of two new socket LGA2011 parts, the X79S-UP5 WIFI, and the X79-UP4.

The X79-UP4 is designed to be a sub-$300 offering, being a notch above the X79-UD3 (and perhaps even the X79-UD5). It uses a 6+1 phase CPU VRM, which consists of high-current ferrite core chokes, and PowIRstage IR3550 driver-MOSFETs. GIGABYTE added eight DDR3 DIMM slots, four on either side of the socket, supporting up to 64 GB of quad-channel DDR3 memory. Expansion slots include four PCI-Express 3.0 x16 (x16/x8/x16/x8), two PCI-Express 2.0 x1, and one legacy PCI. The X79-UP4 otherwise has a similar connectivity load-out as the X79-UD3.

GIGABYTE recently rolled out the 6PXSV3, a workstation motherboard designed for Xeon E5-1600/2600 processors in the LGA2011 package. Based on the Intel C604 chipset, the motherboard is designed to provide essential modern and legacy connectivity to workstations in mission-critical environments. The LGA2011 socket is powered by a 6-phase VRM with CPL-made chokes, and IR-made FETs and VRM controller. It is wired to eight DIMM slots, which support up to 256 GB (RDIMM) and 64 GB (UDIMM) of quad-channel DDR3-1600 MHz memory.

There are just the three expansion slots, two PCI-Express 3.0 x16, and one open-ended PCI-Express 2.0 x4. The remainder of the processor and chipset's PCI-Express lane budgets are allocated PCI-Express DMI-assist, which helps drive the mini SAS with 4 x SAS ports (3Gb/s), apart from four SATA 3 Gb/s, and two SATA 6 Gb/s ports. An ASPEED 2300 provides display output (resolutions up to 1920x1200 supported), and remote management (iKVM, IPMI 2.0). There are two gigbit Ethernet interfaces, driven by Intel 82574L chips, a third management port is also available. The GA-6PXSV3 will be available shortly.

Intel unveiled its third socket LGA2011 Desktop Board driven by its X79 Express chipset, the DX79SR. This model is positioned a notch above the DX79SI, and a couple of notches above the DX79TO. It was first unsuspectingly revealed to the world not by Intel, but NVIDIA, in its GeForce GTX 690 press-shots. The DX79SR covers up a few design shortfalls of the DX79SI. It adds two additional SATA 6 Gb/s ports, driven by a Marvell SE9128 2-port controller, and two additional USB 3.0 ports on the rear panel. The total of four USB 3.0 ports on the rear panel are driven by an unknown 4-port USB 3.0 controller.

Apart from the two onboard connectivity additions, Intel will also include a USB add-on module which packs 802.11 b/g/n WLAN and Bluetooth 3.0 interfaces. The package of the board itself will be beefed up a little, with the inclusion of a stylish mouse pad and a thermal probe. To accommodate these features, Intel made a few subtle changes to the board layout, the first and second PCI-Express x16 slots no longer have switches between them, and some capacitors appear changed. With all these, Intel believes it has a shot at capturing the US $299 price-point, which gives it a nice spread from the $249 DX79SI and the $199 DX79TO.

Barebones mini PCs expert Shuttle Computer launched its first barebones featuring Intel Z77 Express chipset, ready for 3rd generation "Ivy Bridge" Core processors in the LGA1155 package, while retaining support for every LGA1155 "Sandy Bridge" processor launched till date. Shuttle also launched an Intel X79-based mini PC barebone, which supports Core i7 "Sandy Bridge-E" processors.

Called the SZ77R5, the Z77 barebone features four DDR3 DIMM slots supporting 32 GB of dual-channel DDR3-1600 MHz memory, expansion slots that include one PCI-Express 3.0 x16, one PCI-Express 2.0 x4 and one mPCIe; two SATA 6 Gb/s, two SATA 3 Gb/s ports, one eSATA 3 Gb/s, and one mSATA; four USB 3.0 ports, gigabit Ethernet, and 8-channel HD audio. Its chassis features two 5.25" and one 3.5" drive bays, front-panel that includes two of the four USB 3.0 ports, a USB 2.0 port with "fast charging" (high current), and front-panel HD audio. To power the machine, a 500W 80 Plus-compliant PSU is included. The SZ77R5 measures 332 x 216 x 198 mm (WxDxH). It will be priced around 32,800 JPY (US $404).

ASRock is readying its second Fatal1ty-branded socket LGA2011 motherboard, the X79 Fatal1ty Champion. The company's first LGA2011 Fatal1ty motherboard is the X79 Fatal1ty Professional, which was launched in February. The new X79 Fatal1ty Champion will be launched on April 27. Those familiar with Creative Sound Blaster Fatal1ty line of sound cards will note Fatal1ty Champion as being a more feature-rich version of Fatal1ty Professional. In this case, the X79 Fatal1ty Champion is based on a completely new PCB, with the design idea of more expansion, and the latest Creative Sound Core3D audio solution.

The X79 Fatal1ty Champion features eight DDR3 DIMM slots (X79 Fatal1ty Professional has four), and a PCIe-only expansion slot layout. The LGA2011 socket is powered by a 12-phase DigiPower VRM, similar to the one on the Professional. The VRM heatsink is assisted by two other secondary heatsinks, to which heat is conveyed by a heat-pipe. One of these is connected to the PCH heatsink. Power is drawn by 24-pin ATX, 8-pin EPS, and one 4-pin Molex (angled, optional). The board features consolidated voltage measurement points, which are socketed to hold your multimeter's leads in place. The board will be augmented by a feature-rich UEFI BIOS setup program, and ASRock-exclusive features such as XFastLAN, XFastUSB, and XFastRAM will be included.

be quiet!, market leader for PC power supplies in Germany for six straight years, announced today their brand new CPU cooler series Dark Rock 2. Consisting of two new products, this new generation now offers better cooling performance thanks to the use of new 135 mm SilentWings fans.

After be quiet!'s entry into the cooling market in 2010 which, based on the quick acceptance into the market and positive reviews, was a success for consumers and the press, be quiet! now introduces the newest offerings within the Dark Rock family: Dark Rock 2 and Dark Rock Pro 2.

First unveiled this January, Reeven's extreme-cooling pot (model: RECC-01) launched in various markets. In Japan, it is being marketed by Scythe. Measuring 70 x 70 x 160 mm (WxDxH), and weighing 900 g, the RECC-01 is a liquid nitrogen or dry-ice evaporator. Aluminum makes up most of its body, while nickel-plated copper makes up its base. Its base dissipation surface has 18 circular pits. An AEROFLEX polymer insulation sleeve is included. Also included are a retention module supporting Intel sockets LGA2011, LGA1155/LGA1156, LGA1366 and LGA775; and AMD sockets FM1/AM3+/AM3/AM2+/AM2; and a thermal probe port. It is priced at 19,980 JPY (US $242).

GIGABYTE arrived late to the UEFI party, sticking to AwardBIOS workaround like HybridEFI, but when it did, it did with a bang. The company launched its socket LGA2011 motherboard lineup with 3D BIOS, a firmware setup program that takes advantage of several GUI elements that are lacking in many of the competitors' graphical UEFI BIOS setup programs. GIGABYTE launched a newer version of its 3D BIOS setup program, which features a more polished, function-oriented user-interface.

To begin with, the true-color 3D image of the motherboard is replaced by a single solid-color 3D render of the board, so the focus of the user is on components that can be configured, rather than useless visual details. Like with the older version, configurable components on the 3D render can be clicked, to pop-up relevant config pages. The 3D render can be "viewed" from different angles, bringing into perspective the various configurable components.

Japanese cooling expert Scythe announcing a new revision of the Top-Flow CPU cooler Grand Kama Cross. New Rev. B of the x-shaped cooler comes with reliable quality and performance for the same price as prior version. Main improvement is the compatibility to the new enthusiast socket LGA2011 from Intel. Furthermore Socket compatibility list includes latest Intel socket LGA1155, LGA1156, LGA775, LGA1366 as well as AMD socket 754, 939, 940, AM2, AM2+, AM3, AM3+ and FM1.

Well-proven Top-Flow design of grand Kama Cross Rev. B utilizes the created airflow to additionally cool surrounding components on the motherboard. Curved aluminum fin structure deflects the airflow, which has a positive influence on temperatures of Voltage regulator modules, chipset and RAM. Efficient airflow is achieved by the pre-assembled 140 mm axial fan. Scythe Slip Stream 140 PWM fan comes with PWN support and allows stepless fan speed adjustments from 500 to 1.300 RPM.

Users of systems running Core i7 processors in the LGA2011 package and X79 chipset motherboards will find that their GeForce GTX 680 will not run at PCI-Express 3.0 x16 mode, using launch drivers. This is because NVIDIA decided against implementing Gen 3.0 support for the new GPU on X79/SNB-E systems, at the very last moment. Pre-launch drivers, including the driver that ships on discs with the graphics cards, will let the GPU run at Gen 3.0 mode on some X79/SNB-E systems, however the post-launch stable drivers (such as GeForce 301.10 WHQL), won't.

The specifications page of GeForce GTX 680 on GeForce.com has been updated to mention this:

GeForce GTX 680 supports PCI Express 3.0. The Intel X79/SNB-E PCI Express 2.0 platform is only currently supported up to 5GT/s (PCIE 2.0) bus speeds even though some motherboard manufacturers have enabled higher 8GT/s speeds.

Sources in the PC motherboard industry we spoke with, confirmed this change. PCI-Express 3.0 x16, for now, might only run on upcoming "Ivy Bridge" Core systems, running on motherboards with PCI-Express 3.0 compliant components. NVIDIA could be working to fix the issue.

Update 3/23, 21:56
NVIDIA courteously responded to our article, with a statement. Here's the statement verbatim:

While X79/SNB-E is a native Gen2 platform, some motherboard manufacturers have enabled Gen3 speeds. With our GTX 680 launch drivers, we will only be supporting Gen2 speeds on X79/SNB-E while we work on validating X79/SNB-E at these faster speeds. Native Gen3 chipsets (like Ivy Bridge) will still run at full Gen3 speeds with our launch drivers.

GeForce GTX 680 supports PCI Express 3.0. It operates properly within the SIG PCI Express Specification and has been validated on multiple upcoming PCI Express 3.0 platforms. Some motherboard manufacturers have released updated SBIOS to enable the Intel X79/SNB-E PCI Express 2.0 platform to run at up to 8GT/s bus speeds. NVIDIA is currently working to validate X79/SNB-E with GTX 680 at these speeds with the goal of enabling 8GT/s via a future software update. Until this validation is complete, the GTX 680 will operate at PCIE 2.0 speeds on X79/SNB-E-based motherboards with the latest web drivers.

This statement confirms our assertions made in the article. NVIDIA's statement on the GeForce.com product page originally formed the basis of this article, which we pasted verbatim, while preparing the article. Motherboard manufacturers have extensively marketed their LGA2011 products as natively supporting PCI-Express Gen 3.0 (8 GT/s). What's more, the datasheet of Intel Core i7 LGA2011 processors (refer 1.2.2) clearly mentions the PCI-Express root complex as supporting 8 GT/s. AMD Southern Islands GPUs have supported PCI-Express Gen 3.0 on LGA2011 platforms since day one.

Early adopters of LGA2011 "Sandy Bridge-E" platforms can take a breather, their rigs won't turn obsolete for a long time, according to an X-bit Labs report. "Ivy Bridge-E", a hypothetical successor of Sandy Bridge-E, which is an Ivy Bridge take on the LGA2011-HEDT platform won't take shape anytime soon, at least not till the second half of 2013. The likely explanation for this is the disturbance the delay in LGA1155 "Ivy Bridge" chips to the OEM channels caused to Intel's roadmaps.

Intel will be introducing its very first processors built on the 22 nm fab process, which make use of new semiconductor technologies such as space-optimized 3D-transistors. Swelling inventories of current-generation processors, coupled with fab issues caused the launches of Ivy Bridge to go off by several weeks, and this has taken a toll on the launch schedule of "Ivy Bridge-E". Instead, Intel could launch Core i7-3980X Extreme Edition a little later. This chip will be based on the existing Sandy Bridge-E silicon, it remains to be seen if the chip is a speed-bump over i7-3960X, or if Intel enables cores 7 and 8, and the remaining 5 MB L3 cache on the silicon, turning it to an eight-core Goliath.

ASUS made its workstation-grade Z9PE-D8 WS motherboard official. The board is built for 2P Xeon E5-2600 series processors in the LGA2011 package, is based on the Intel C606 "Patsburg" chipset, and is built in the 30.5 x 33 cm EEB form-factor. Each of the two sockets is wired to four DDR3 DIMM slots, supporting quad-channel memory, each. Up to 256 GB of registered DDR3 memory is supported.

Expansion slots include four PCI-Express 3.0 x16 (blue), two PCI-Express 3.0 x16 (electrical x8, top two black), and one PCI-Express 2.0 x16 (electrical x4, bottommost black). 4-way SLI and CrossFireX are supported. Storage connectivity includes six SATA 6 Gb/s (two from the PCH, four from two Marvell 9230 chips), and eight SATA 3 Gb/s (all from the PCH). An ASPEED ASMB6 provides basic display and iKVM functions. Realtek ALC898 provides 8-channel HD audio. There are two gigabit Ethernet interfaces, driven by Intel 82574L chips. The Z9PE-D8 WS from ASUS is priced around US $630.

At CeBIT, Gigabyte unveiled what many may have overlooked for bearing a strong resemblance to the GA-X79-UD5, the GA-X79S-UD5. This board is designed to be a 1P workstation-grade motherboard, probably with out of the box support for the latest Xeon processors in the LGA2011 package, apart from Core i7 ones. The upper-half of this board is nearly identical to that of the X79-UD5. The LGA2011 CPU is powered by a 14-phase VRM, wired to eight DDR3 DIMM slots (two on either sides), supporting quad-channel memory. There are minor differences (as far as the upper-half is concerned). Tantulum capacitors on the X79-UD5 are replaced with cylindrical solid-state ones on the X79S-UD5, the FrescoLogic-made USB 3.0 controller is replaced with a VLI-made one.

It's the lower half of the X79S-UD5, where all the action is. The expansion slot load-out consists of five long PCI-Express x16 slots. Among these, two are PCI-Express 3.0 x16 capable, one is PCI-Express 3.0 x8 capable (by taking 8 lanes from one of the two x16 links), and two appear to be PCI-Express 2.0 x4. Then there's a legacy PCI slot. The PCH heatsink is identical to the one on the X79-UD5, but what's under it is what counts. Although named "X79"S-UD5, the board is actually based on the Intel C606 "Patsburg", which is an enterprise-grade chipset for Intel's Sandy Bridge-EP platforms. Apart from six SATA ports (2x 6 Gb/s + 4x 3 Gb/s), the C606 PCH provides eight SAS (Serial-attached SCSI) ports, running at 3 Gb/s speeds. The rest of the connectivity is completely identical to that of the X79-UD5.

Enermax showed off the ELC-120, one of its first closed-loop (self-contained) CPU liquid coolers. While the cooler looks very similar to several other products in its class, Enermax claims to have dropped in some innovations of its own, such as a unique copper micro-channel base, which improves heat dissipation to the coolant, a powerful ceramic bearing pump for higher coolant flow, and Enermax' very own 120 mm Twister Bearing fan, that's silent, and comes with a very long life. The ELC-120 supports all current CPU socket types, Intel LGA775-thru-LGA2011, and AMD AM2-thru-FM1.

A serious player in the PC motherboard industry, the world's 3rd biggest (in terms of volumes) at that, ASRock is one brand that has accumulated the engineering potential to make anything. It's far from finished with its LGA2011 motherboard lineup, and made sure visitors at its CeBIT booth had their jaws on the floor. Enter, the ASRock X79 Extreme11. This motherboard is designed for not just extremely-overclocked PCs, but battlestations holding their own huge storage arrays. This monster is built in the EATX form-factor.

The LGA2011 socket is powered by a 16+2 phase DigiPower VRM, which draws power from two 8-pin EPS connectors. It is wired to eight DDR3 DIMM slots, supporting up to 64 GB of quad-channel DDR3 memory with speeds of over DDR3-2400 MHz by overclocking. The memory areas are powered by 4+4 phase VRM. Apart from the 24-pin ATX connector, and the two EPS connectors, the board also draws power from two 4-pin Molex connectors. The board makes use of Japanese-made solid-state capacitors almost throughout.

GUN'G'STAR of TeamRussia successfully achieved an overclocking record of 5.666 GHz for the quad-core Intel Core i7-3820 processor; a feat that validates the LGA2011 i7-3820 of being a generally good chip for overclocking, despite being "Limited Unlocked" (BClk multiplier being unlocked only to a few notches above its stock setting). GUN'G'STAR achieved a clock speed of 5,665.99 MHz using a BClk speed of 131.74 MHz, a multiplier value of 43x, and core voltage of 1.6V. The chip was assisted with GeIL-made DDR3-1600 memory sitting on all four channels, and ASUS Rampage IV Extreme motherboard. Only 2 out of 4 cores of the i7-3820 were enabled for the feat, HyperThreading was disabled. Extreme cooling was used. The CPU-Z validation can be accessed here.