It's a laptop, but it can be anything—the Lenovo Yoga Book 9i has the conventional shape of a clamshell notebook, except that there's a second touchscreen where you'd expect the keyboard an trackpad to be. You get a folio-type silicone keyboard with physical keys that provide tactile feedback, or you can pull up an on-screen keyboard on either screen and type with haptic feedback. As a Yoga product, the hinge turns 360°, and at 180° it can become a dual-screen setup. The possibilities are endless.

Under the hood is an Intel Core i7 U-series "Raptor Lake-U" 15 W 2P+8E SoC with 16 GB LPDDR5X memory; NVMe Gen 4 SSD, integrated Iris Xe graphics, and an 80 WHr battery. Each of the two 13.3-inch touchscreens has a 16:10 aspect-ratio and 1920 x 1200 resolution. Comms include Wi-Fi 6E, and Bluetooth 5.2 (a 5G modem would be incredible).

SK hynix has developed LPDDR5X (Low Power Double Data Rate 5X), the world's first-ever mobile DRAM with an integrated HKMG (High-K Metal Gate) process, which was just recently introduced to the market. The LPDDR5X boasts the industry's highest energy-efficiency as SK hynix succeeded in reducing power consumption by 25% compared to the previous generation and operates in the ultra-low voltage range of 1.01 V to 1.12 V set by the JEDEC (Joint Electron Device Engineering Council).
For the LPDDR, which is also called a mobile DRAM, having a low power consumption is its greatest asset, just as its standard name—LP (Low Power)—suggests. As power is limited in mobile devices, it's necessary to reduce power consumption as much as possible to extend the usage time.

This is why lowering power consumption is just as important as increasing operating speed. LPDDR5X was the first among mobile DRAMs to integrate the HKMG process and see improved performance and a reduction in power consumption, essentially killing two birds with one stone. As the power consumption of DRAM gets lowered by LPDDR5X, mobile devices can be used for a longer time with a single charge. The reduction in power consumption of such products can subsequently lead to a reduction in the power used by consumers, which is in line with the value of SK hynix's ESG-centered business management.

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its latest LPDDR5X DRAM with the industry's fastest speed of 8.5 gigabits per second (Gbps) was validated for use on Snapdragon mobile platforms. By optimizing a high-speed signal environment between application processor and memory, Samsung has surpassed the previous maximum speed of 7.5 Gbps achieved in March, reaffirming its leadership in the memory market.

As a global leader in the mobile DRAM market for more than a decade, Samsung has been driving mainstream adoption of high-end smartphones, enabling many more consumers to experience powerful computing performance on their mobile devices. Thanks to its low-power and high-performance characteristics, LPDDR DRAM is quickly becoming pervasive in modern computing systems, expanding beyond smartphones and into PCs, high-performance computing (HPC), servers and automobiles, where it has enjoyed robust growth in the last few years.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

This year's event, attended by more than 800 customers and partners, featured presentations from Samsung's Memory and System LSI business leaders—including Jung-bae Lee, President and Head of Memory Business; Yong-In Park, President and Head of System LSI Business; and Jaeheon Jeong, Executive Vice President and Head of Device Solutions (DS) Americas Office—on the company's latest advancements and its vision for the future.

ASUS Republic of Gamers (ROG) today premieres Dare to be Ultimate: Building a World-Leading Gaming Phone, the design story video that reveals the genesis of the new ROG Phone 6D series of gaming smartphones. The ROG Phone 6D and ROG Phone 6D Ultimate are powered by the latest flagship MediaTek Dimensity 9000+ 5G chipset. Clocking up to 3.2 GHz CPU speeds, and boasting up to 16 GB of LPDDR5X RAM and 512 GB ROM of storage, the Dimensity 9000+ chipset provides flagship 5G experiences, perfect for mobile gamers.

"The pursuit of the ultimate performance and gaming experience has always been central for the ROG Phone. With each iteration, we consistently strive to surpass ourselves, achieving the spirit of For Those Who Dare," said S.Y. Hsu, Co-CEO, ASUS. "We are thrilled that this first collaboration with MediaTek has achieved such stunning performance, and we will continue to strive for continuous performance improvements."

The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Handheld portable consoles now enable a new way for people to play PC games, with flexibility. More and more brands have entered this market with constant evolution of the devices. AOKZOE, an emerging gaming&tech company in Shanghai, has now announced the world's first AMD 6800U console AOKZOE A1. In addition to A1's superior performance, the design details and console features will also surprise you.

AOKZOE will be the first to bring the portable console with AMD Ryzen 7 6800U to mass production. The much anticipated 6800U powered console will surely bring advancement to the gaming experience. With the combination of AMD Ryzen 7 6800U, the Radeon 680M graphics, along with LPDDR5X memory, AOKZOE A1 is able to deliver Elden Ring at 60 FPS and Forza over 100FPS in the official video demo.

MediaTek today announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.20 GHz (compared to 3.05 GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that Qualcomm Technologies, Inc. has validated Samsung's 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on Qualcomm Technologies' Snapdragon mobile platforms.

Since developing the industry's first 14 nm-based LPDDR5X DRAM last November, Samsung has worked closely with Qualcomm Technologies to optimize its 7.5 gigabit-per-second (Gbps) LPDDR5X for use with Snapdragon mobile platforms. Delivering about 1.2 times faster speed than the 6.4 Gbps LPDDR5 deployed in today's premium smartphones, Samsung's LPDDR5X is expected to boost the performance of ultra-high-resolution video recording as well as AI features such as voice recognition, image recognition and natural language processing in next-generation smartphones. Furthermore, by adopting advanced circuit designs as well as dynamic voltage and frequency scaling (DVFS), LPDDR5X power consumption can be reduced by approximately 20%.

MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements from some of the world's biggest smartphone brands, including OPPO, vivo, Xiaomi and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year. The Dimensity 9000 - the world's first smartphone built on the ultra-efficient TMSC N4 (4 nm-class) production process - leads the industry in computing performance, gaming, imaging, multimedia and connectivity innovations.

"The Dimensity 9000 is a milestone for MediaTek, highlighting our rise to incredible with a true flagship 5G smartphone chip. This chip signals MediaTek and our Dimensity family has entered a new phase of innovation," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "The Dimensity 9000 is the most powerful and energy-efficient chip to date, delivering a number of industry firsts and a full suite of features for the most discerning tech enthusiasts."

Micron Technology, Inc. announced today that MediaTek Inc. has validated Micron's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market 1α (1-alpha) node. Designed for high-end and flagship smartphones, Micron's LPDDR5X allows the smartphone ecosystem to unlock the next wave of data-intensive applications powered by artificial intelligence (AI) and 5G innovation.

The market delivery and validation of Micron's industry-leading 1α-based LPDDR5X solidifies its product innovation and leadership in the mobile ecosystem, following industry-first launches for LPDDR5, 1α-based LPDDR4X, 176-layer NAND-based UFS 3.1 and uMCP5 solutions. This most recent milestone follows quickly on the heels of JEDEC's July release of the LPDDR5X extension to LPDDR5, created to offer higher bandwidth and memory speed for enhanced 5G communication and performance while still conserving power. Micron has validated samples supporting data rates up to 7.5 Gb/s, with samples supporting data rates up to 8.533 Gb/s to follow. Peak LPDDR5X speeds of 8.533 Gb/s deliver up to 33% faster performance than previous-generation LPDDR5.

"Innovating cutting-edge smartphone experiences requires memory technology built to address the massive bandwidth demands of the mobile market," said Raj Talluri, senior vice president and general manager of Micron's Mobile Business Unit. "Our collaboration with MediaTek to validate the world's most advanced mobile memory empowers the ecosystem to deliver the next wave of rich mobile features enhanced by 5G and AI."

A few years ago, MediaTek decided to leave the high-end mobile device SoC space as it decided to focus on the mid-range and entry level market, but as of today, that is no longer the case. The company has announced its new flagship Dimensity 9000 SoC and it packs all the latest cutting edge mobile SoC features you'd expect to see.

The Dimensity 9000 is based entirely on the new Arm v9 architecture and the chip itself is built in TSMC's 4 nm node, which gives MediaTek a lead on all its competitors, but Apple. As for the Arm cores in question, the main core is a Cortex-X2 at 3.05 GHz, which is accompanied by three Cortex-A710 cores at 2.85 GHz and four power efficient Cortex-A510 cores at 1.8 GHz. All of these new Arm cores were only announced at the end of May this year, so MediaTek has clearly been burning the midnight oil to get the Dimensity 9000 out before its competitors' new chips based on the Arm v9 architecture.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

"In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding," said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. "Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-5B, Low Power Double Data Rate 5 (LPDDR5). JESD209-5B includes both an update to the LPDDR5 standard that is focused on improving performance, power and flexibility, and a new LPDDR5X standard, which is an optional extension to LPDDR5.

Taken together, LPDDR5 and LPDDR5X are designed to significantly boost memory speed and efficiency for a variety of uses including mobile devices, such as 5G smartphones and artificial intelligence (AI) applications. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, JESD209-5B is available for download from the JEDEC website.