Intel has everything going its way when it comes to mobile computing, and the processors it sells that power notebooks and netbooks across every segment of the market. Intel uses the common classification of portable computers (consumer segment), using sizes and form-factors to differentiate mainstream notebooks, performance notebooks, ultra-thin notebooks, "larger" sub-notebooks (netbooks), and common entry-level netbooks. To cater to each of these, Intel made things easier by coming up with platforms (sets of processor and chipset combinations), a market approach both Intel and AMD have been using recently.

Starting with mainstream, and performance notebooks (traditionally above 14-inches in size, above US $1200 in price), Intel has the Calpella platform, that marks the entry of Nehalem architecture to the mobile scene. This is slated for 3Q 2009. Intel will simultaneously lower the prices of its current Montevina platform, to let inventories digest. Major hardware manufacturers are preparing their "launch-vehicles" for the Calpella platform, which will make it in time for Q3 2009.

According to industry observer DigiTimes, Intel would be giving its Montevina mobile computing platform an update, with the introduction of new processors and core logic (chipsets). The update, for the most part, revolves around the mid/high range products. Intel would be introducing Core 2 Duo models T9900 and P8800. The T9900 would be Intel's flagship mobile dual-core chip, with the P8800 leading the performance mainstream range.

Intel also plans new chipsets. The Intel GM47 Express would be the company's next high-end mobile chipset, and is slated for Q1, 2009. Intel will also launch GM43 and GS43 Express chipsets for entry-level notebook and small form-factor (SFF) PCs. In other news, it is also expected that the company gets ready to launch the GM55 (Mobile Ibex-Peak) chipset between July and August, 2009. GM55 would be Intel's Nehalem processor supportive chipset for the Auburndale dual-core and Clarksfield quad-core processors, with the platform itself being codenamed Calpella.

MSI has launched the GX620 a Centrino 2-based notebook with the company's exclusive Turbo Drive Engine technology to enhance the speed of CPU. The GX620 includes the new ECO Engine power saving technology to extend battery running time. The ECO quick launch touch sensor allows consumers to switch among five different modes including Gaming, Movie, Presentation, Office, and Turbo Battery.

GX620 features a 15.4-inch LCD display, NVIDIA GeForce 9600M GT 3D graphics card and MSI's exclusive vivid image enhancement technology. GX620 also features Digital/Analog 5.1 Channel headphone output and SPDIF connection. The GX620 features Intel Centrino 2 processor technology, including Core 2 Duo processor and PM45 Express chipset, to deliver mobile solutions and provide HD capabilities, wireless connectivity, and long battery life for Blu-ray movie playback, highlighted MSI.

Intel Corporation unveiled its Intel Centrino 2 Processor Technology products for laptops today, powered by five new Intel Core 2 Duo processors. Close to 250 innovative consumer and business notebook PC designs are on the way, including those equipped with the right combination of powerful processors, graphics and battery life to enjoy viewing stunning high definition videos and myriad other computer and Internet activities.

Intel also introduced the world's highest-performing dual-core mobile processor, the Intel Core 2 Extreme processor running at a brisk 3.06 GHz, as measured by SPECint*_rate_base2006, an industry benchmark.

Following the delayed introduction of the Intel Centrino 2 "Montevina" mobile computing platform, several manufacturers are preparing their line-ups on this platform. Among all, Samsung prepares three notebooks: the R510 "Aura", R710 "Eclipse", and two variants of the model Q210 and Q310 with 12.1 and 13.3 inch screen sizes respectively.

The R510 (first picture) will have a 15.4 inch screen, Intel Core 2 Duo T9400 processor at 2.53 GHz, integrated X4500 graphics, 4 GB of memory, DVD Writer, and 320GB HDD. It weighs about 2.3 kg.

The R710 (second picture) will feature a 17 inch screen, the same Core 2 Duo T9400 processor, and other features common to the R510 except that it features a NVIDIA GeForce 9600M 512 MB graphics processor.

And finally, the Q210 and Q310 have common looks and features albeit aforementioned screen-sizes. Features common to them include: Intel Core 2 Duo P8200 which runs at 2.26 GHz in the Q210 and 2.40 GHz in the Q310, 4 GB of RAM, NVIDIA GeForce 9200M 256 MB graphics processor.

Intel launches the Centrino 2 mobile plaform this Monday, the 14th. Centrino 2, codenamed Montevina is behind launch-schedule owing to issues detected in the integrated graphics controller. The chipset released will be that which supports discrete graphics controllers from ATI or NVIDIA.

Intel Centrino 2 for now is targeted towards the business-class and enterprise segments. The chipset supports DDR3 memory which brings in a certain level of energy efficiency with added performance. At the heart of it would be a 45nm processor based on the Penryn architecture. Initially dual-core processors, with quad-core based notebooks later. The wireless network controller supports the newer 802.11n and WiMAX standards. Security and management features come in through the vPro technology.

These 45nm dual-core processors are said to run at 25W, an efficiency increment over previous generation running at 35W.

Chip maker Intel will delay the introduction of its highly anticipated "Montevina" platform referred to as Centrino 2 due to technical and certification problems, the chipmaker said Tuesday. The initial rollout scheduled to take place after Computex and until July 14 is not going to happen. Instead, the release date has been pushed back by one month to August 2008. The problems behind this delay include the certification of the Wi-Fi wireless standard and technical issues with the Centrino 2 integrated graphics chipset, which is causing random failures. Because of that Intel will launch only the Centrino 2 CPUs and some of its chipsets on July 14th. The Centrino 2 processors will include the "T" and "X" (Extreme) models. Other parts of the new Montevina platform as well as the faulty chipsets will need to be rechecked, causing this delay to prolong to a month. "Initially what will be available on July 14 are the (Centrino 2) processors and some of the chipsets," Intel spokesperson Connie Brown said.

Intel is planning to rename its brand name for the upcoming notebook Montevina platform to Centrino 2 in order to clear up confusion for consumers, according to DigiTimes. Intel has used the brand name Centrino for four generations of its notebook platforms including Carmel, Sonoma, Napa and Santa Rosa. Although the technology and specifications have continued to improve, the unchanging brand name has left consumers unable to identify the differences, which has also lowered recognition in the market. The new marketing strategy should give consumers the feeling of a tangible upgrade and will hopefully spur demand for new laptops. Intel is set to launch the Centrino 2 platform in June this year at Computex Taipei 2008 along with six 45nm notebook CPUs, all with a 1066MHz FSB.

Intel plans to agrresively expand its shipments of notebook CPUs aiming to almost double its total of 2007 within the next few years, according to DigiTimes. Since Intel launched its Centrino platform in 2003, shipments have grown from 38 million notebook CPUs in the first year to 79 million in 2006. In 2007, shipments surpassed 100 million units, and in 2008, with the help of the Montevina platform, the company expects shipments to reach 123 million units. Over the next few years shipments are forecast to continue growing to hit 145 million, 169 million and 195 million units in 2009 to 2011, respectively. In 2008, Intel will also start supporting the WiMAX wireless technology in its Montivina platform, by launching several networking products: a Wi-Fi/WiMAX mixed wireless module 5350/5150 (3x3 AGN MC) codenamed Echo Peak, a Wi-Fi only module 5300/5100 (3x3 AGN MC/HMC) codenamed Shirley Peak, 82567LF Gigabit LAN codenamed Boazman and 82567LM Gigabit LAN for digital office applications. In addition, Montivina will adopt 2GB and 4GB versions of Intel's Turbo Memory technology.

Intel is planning to launch 15 45nm notebook CPUs for its upcoming Centrino platform, Montevina, which is currently scheduled to launch in May this year. Intel will launch seven CPUs with a typical package size of 35mm squared for notebooks. The CPUs include: Core 2 Extreme QX9300 with 12MB L2 cache and TDP of 45W, (the core frequency of this model has not yet been set), Core 2 Extreme X9100 with a core frequency of 3.06GHz, 6MB L2 cache and TDP of 44W, Core 2 Duo T9600 (2.8GHz, 6MB and 35W), T9400 (2.53GHz, 6MB and 35W), P9500 (2.53GHz, 6MB and 25W), P8600 (2.4GHz, 3MB and 25W), and P8400 (2.26GHz, 3MB and 25W). All the CPUs will support a 1066MHz FSB. The company will also launch eight CPUs with a package size of 22mm squared. These will include: SP9400 with a core frequency of 2.4GHz, 6MB L2 cache and TDP of 25W, SP9300 (2.26GHz, 6MB and 25W), SL9400 (1.86GHz, 6MB and 17W), SL9300 (1.6GHz, 6MB and 17W), SU9400 (1.4GHz, 3MB and 10W), SU9300 (1.2GHz, 3MB and 10W), U3300 (1.2GHz, 3MB and 5.5W), and Celeron 723 (1.2GHz, 1MB and 10W). The CPUs with a TDP less or equal to 10W will support FSB speeds up to 800MHz while the rest will support up to 1066MHz.

Intel has decided to extend the original naming scheme for the upcoming Montevina platform, by adding a P segment to CPUs targeting notebooks and an S class for small form factor PC processors. Intel originally had four segments for the July official Montevina launch: X for the extreme segment - CPUs that have a TDP over 40W, T for mobile high-performance at 20-39W, L for mobile high energy efficient at 12-19W, and U for mobile ultra-high energy efficient with a TDP less or equal to 11.9W. Now Intel will add a P segment for power-optimized energy-efficient high-performance processors with a TDP between 20-29W, which indicates that the original T segment will have its TDP range changed to between 30-39W. The company will also add an S class of CPUs, with a smaller package size, aimed at small form factor products. There will be three segments under the S class: SP, SL and SU with TDP ranging from 20-29W, 12-19W and smaller or equal to 11.9W, respectively. In addition, Intel plans to launch quad-core processors for its notebook platform in the third quarter of this year. The company will use the same Q code branding used in its desktop Core 2 Quad line-up.

Intel plans to lower power consumption of standard chips for laptops and introduce quad-core microprocessors for mobile computers next year. Along with the new mobile platform codenamed Montevina, Intel will also introduce a dual-core Penryn processor with a 25W and 35W TDP, which will add performance to thin-and-light notebooks without increasing their complexity or pricing. The new chips will be made using 45nm process technology and will emerge in Q2 2008.