HXL/9550pro and HardwareLuxx's Andreas Schilling shared evidence of the ASUS PCIe Q-Release Slim—the manufacturer's latest ejection mechanism—causing damage to graphics card PCIe connectors. Recent feedback suggests that repeated usage can scrape or grind off material present on a card's interface. HXL gathered critiques from multiple sources (owners of Intel 800 and AMD 800 series boards), and linked a relevant Bilibili video. The footage presents a damaged GALAX RTX 4070 Ti HOF OC LAB model, following sixty quick release cycles—paired with a ROG Strix B850-A Gaming Wi-Fi S motherboard. Tony Wu, ASUS China's general manager, eventually weighed in on community discussions—stating that he will investigate this matter and report back with his findings.

Schilling expressed similar frustrations—his chosen platform is producing unwanted results: "I'm not happy with the solution either. We use the Strix X870E-E Gaming for testing the graphics cards. So I have had to remove graphics cards from the slot a few dozen times. This didn't always go smoothly and very often the (GeForce RTX 5090) card got stuck in the slot. First damage visible." Press outlets have picked up on the recent surge in Q-Release Slim user feedback—several publications have gathered additional examples of the new mechanism inflicting damage on a variety of graphics card models.

NVIDIA has unveiled a radical graphics card prototype that never reached production, offering insight into its design process. In a YouTube video called "Designing the Founders Edition | GeForce RTX 5090", NVIDIA showcases an unreleased design that would have occupied four PCIe slots, featuring a "three-thirds flow-through" cooling system with an unconventional three-fan stair-step configuration. NVIDIA ultimately rejected the quad-slot concept as impractical for most computer systems.
Engineers refined the cooling approach for the RTX 50-series, developing a more streamlined "two-thirds flow-through" design that maintains thermal performance while reducing the card's footprint to two PCIe slots.

Technical challenges emerged during development, particularly in connector design. The team struggled to create a ribbon cable supporting high-bandwidth UHBR20 DisplayPort 2.1b and HDMI 2.1b connections. Their solution involved infusing glass fibers into the cable, enabling support for three DisplayPort and one HDMI connector. Critical engineering focus was placed on the liquid metal thermal interface material. Extensive stress testing ensured reliability across various orientations, with particular attention to preventing oxidation. Given the electrically conductive nature of liquid metal, an air-tight seal around the GPU die became crucial to prevent potential hardware failure.

Montage Technology today announced the customer sampling of its PCIe 6.x/CXL 3.x Retimer -- M88RT61632, which is designed to enhance connectivity performance for demanding high-bandwidth applications such as AI and cloud computing. This milestone extends the company's PCIe product portfolio, building upon its successful PCIe 4.0 and PCIe 5.0/CXL 2.0 Retimer solutions.

The PCIe 6.x/CXL 3.x Retimer delivers excellent performance with data rates up to 64 GT/s, twice that of PCIe 5.0. Powered by Montage Technology's proprietary PAM4 SerDes IP, the chip achieves superior signal integrity with link budget up to 43dB while maintaining low latency. Its innovative DSP architecture effectively addresses PCIe 6.x system design challenges including crosstalk and signal reflection. In addition, the chip features advanced link training and enhanced telemetry, enabling comprehensive link monitoring and fault diagnostics for high-reliability AI cluster deployments.

Silicon Motion will expand its MonTitan lineup of SSD controllers—for datacenters and enterprise platforms—with the upcoming addition of a truly next-generation model. Wallace C. Kou (the company's founder and CEO) contributes to ChinaFlashMarket.com with a regular written column—his latest feature (posted on January 17) includes a short sentence dedicated to announcing his firm's new SM8466 design. This appears to be their first foray into PCIe 6.0-based interface territories—details are minimal (at this point in time), but the CEO divulged the very basics. Silicon Motion's engineering team is currently in the "development stage" with the SM8466 project—a: "4 nm PCIe Gen 6 SSD master chip."

It is not clear whether this next-gen PCIe 6.0 SSD controller will be heading to market anytime soon, but Kou's column mostly focused on current plans—likely signalling where priorities lie. Silicon Motion's "built-in PCIe Gen 5 SSD enterprise-level master chip" (SM8366) is in mass production—industry experts believe that the company's MonTitan PCIe 5.0 family has had a tough time keeping up with equivalent Phison products—in particular, the market leading PS5026-E26 (PCIe 5.0 x4) controller. The SM8366 could be potent enough to take the crown in higher-end enterprise segments, but the existence of a PCIe 6.0-based successor is bound to attract extra attention.

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Transcend Information Inc. (Transcend), a leading global manufacturer of memory storage solutions, introduces the ETD410T, a new U.2 enterprise solid-state drive (eSSD) designed for high-performance computing environments. Tailored to meet the stringent demands of enterprise users for ultra-fast data transfer and reliability, the ETD410T adopts the PCIe Gen 4 x4 high-speed interface and U.2 15 mm form factor, featuring a DRAM cache for exceptional performance and robust data protection. It is an ideal solution for data centers and enterprise applications.

Durable and Stable for High-Frequency Workloads
The Transcend ETD410T is a professional solution optimized for read-intensive workloads. Compliant with JESD219 standards, it offers a durability of up to 7,000 Program/Erase (P/E) cycles to withstand frequent use over long periods. With Quality of Service (QoS) consistently maintained between 99.9% and 99.99%, it delivers stable and reliable operation even in demanding enterprise environments, ensuring consistent and dependable data access.

Details of ASUS' next generation BTF 2.0 (BTF stands for Back to the Future) platform have appeared online, courtesy of Andreas Schilling from HardwareLuxx. The editor posted pictures from an ASUS presentation over at Bluesky that details one major change to the power connector design, which will make the BTF 2.0 graphics cards compatible with non BTF systems. This suggests that ASUS might consider offering more graphics cards with BTF 2.0 support, since they can be used in any system with the proposed changes.

As you may or may not know, the first generation BTF graphics cards ended up with a power connector at the rear, bottom edge of the graphics cards, placed somewhat behind the PCIe gold fingers. The cards also lacked any other power connectors, which made them exclusive for BTF builds. To solve this conundrum, ASUS moved its GC-HPWR PCB power connector up on the PCB, making sure it clears any motherboard components. However, instead of increasing the height of the motherboard BTF 2.0 connector, the company provides a small adapter that plugs in between the motherboard and graphics card, to make its new BTF 2.0 cards compatible with any system.

ASMedia Technology Inc., a leading provider of high-speed transmission interface ICs, showcased its latest innovations at CES 2025, focusing on USB4, Thunderbolt 4, and PCIe Gen 4 Switch technologies. These new technologies can be used in many different applications such as consumer electronics, AI, HPC, and industrial computing.

Key highlights include:

• PCIe Gen 4 Switch ASM58000 Series: This low-power, cost-effective solution offers high bandwidth (up to 16 Gbps per lane), ideal for servers, edge computing, NAS, surveillance storage, and industrial PCs. It excels in demanding applications like AI, ML, and HPC.
• USB4 ASM2464PDX with AI Enhancements: The USB4 device controller ASM2464PDX empowers PCs with enhanced AI capabilities. By leveraging USB4 and PCIe, it enables seamless external GPU connectivity for AI tasks, gaming, and content creation.
• Comprehensive USB4 Solutions: ASMedia demonstrated a complete range of USB4 solutions, including host, device, and peripheral controllers, ensuring optimal compatibility and backward compatibility with Thunderbolt 3/4 and legacy USB standards.

A South Korean online retailer has listed Huawei's eKitStore Extreme 200E M.2 NVMe SSD for sale at 47,500 Won ($32) for the 1 TB model. This marks Huawei's entry into consumer storage products after previously only manufacturing server SSDs. The PCIe 4.0 drive's specifications show read speeds of 7,400 MB/s and write speeds of 6,700 MB/s. Beyond confirming the use of QLC memory without a DRAM cache, Huawei has not disclosed the drive's internal components. Due to trade restrictions, both the controller and memory chips likely come from Chinese manufacturers, though specific suppliers remain unknown. Chinese makers have been recorded to use Silicon Motion's SSD controllers, but domestic controllers are also an option here.

Manufacturing costs for similar drives typically exceed $32, raising questions about the pricing strategy. The drive's components could match those used in other brands' SSDs, as multiple storage companies often use identical parts in their products. For NAND Flash, Huawei likely sourced its chips from YMTC, whose Xtacking 4.0 proves to be quite a success. The drive has appeared only at one retailer so far, and Huawei has not announced plans for sales in other regions. This price is notably lower than comparable PCIe 4.0 drives. Common retail prices for 1 TB PCIe 4.0 SSDs are typically more than double this amount. Whether this represents a temporary price or a long-term strategy remains unclear. Perhaps Huawei is operating at a net loss to gain some customers, with possible plans for more SSDs in the future, along with the PCIe 5.0 version.

Patriot Memory today announced the launch of the P400 V4, a high-performance PCIe Gen 4 x4 M.2 SSD that delivers exceptional speeds of up to 6,200 MB/s read and 5,200 MB/s write. This versatile storage solution is optimized for both PC and PlayStation 5 platforms, offering gamers and content creators unprecedented performance and reliability.

The P400 V4 leverages cutting-edge PCIe Gen 4 x4 NVMe technology to provide lightning-fast data transfer speeds while maintaining efficient power consumption. On the PlayStation 5, the drive achieves impressive sequential read speeds of up to 6,000 MB/s, ensuring quick load times and smooth gameplay across all gaming platforms.

Silicon Power (SP) is excited to announce the launch of its first M.2 PCIe 2230 E-Key SSD, the MEM3K0E, further solidifying its commitment to delivering innovative and versatile solutions for the growing demands of artificial intelligence (AI) and edge computing applications. With the introduction of this compact form factor, the company provides developers with more options to optimize system configurations while empowering next-generation AI technologies.

An Optimized Cache and Buffer Solution
Compliant to the PCIe 3.1 standard and NVMe 1.4 protocol, the MEM3K0E is specifically designed for devices equipped with E-Key slots, making it an ideal cache and buffer storage solution to complement M-Key slot primary drives. Its chief role is to maintain stable system performance by balancing the workload during resource-intensive tasks, which it achieves with features such as a thermal throttling function and built-in voltage detector. With storage capacity options of 64 GB, 128 GB, 256 GB, and 512 GB, the MEM3K0E offers scalability for various applications, ranging from compact embedded systems to high-performance computing environments.

SK hynix Inc. announced today that it has completed development of its high-capacity SSD product, PS1012 U.2, designed for AI data centers. As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61 TB product using this technology and introduced it to the market.

SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies. With the latest 5th generation (Gen 5) PCIe, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32 GT/s (Gig-transfers per second), with the sequential read performance of 13 GB/s (Gigabyte per second), which is twice that of previous generation products.

Framework, the company known for making consumer-friendly, repairable, upgradeable laptops, has officially announced the first expansion bay for the Framework 16, its AMD-powered gaming laptop. The new storage module, which slots into the Expansion Bay, has dual M.2 slots for up to 16 TB total additional storage for the Framework 16. Part of the idea behind the storage expansion seems to be turning what is essentially a gaming laptop into a capable workstation. Crucially, upgrading the storage with the expansion bay requires removing the discrete Radeon 7700s GPU, although the Framework 16 already has dual M.2 slots on the motherboard, so this expansion isn't really intended for gamers, anyway.

One of the major selling points for the Framework 16 was that it offered PCIe expansion via a modular interface, and this is Framework's first real foray into expanding that ecosystem for its largest laptop. In addition to the storage expansion, Framework also announced a new Mystery Box system for its US and Canada Outlets to offload spare parts, like returned modules and components that it doesn't want to relegate to the e-waste pile but also cannot financially justify sorting through and refurbishing. These Mystery Boxes each contain at least three items and come with a warning that reads "Note that these don't come with a warranty and are non-returnable, so only get it if you want random scrap to play with!"

Advantech, a leading provider of AIoT platforms and services, proudly unveils its latest AI acceleration modules: the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules deliver AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparable AI modules and GPU cards. Designed in standard M.2 and PCIe form factors, the EAI-1200 and EAI-3300 can be seamlessly integrated with diverse x86 and Arm-based platforms, enabling quick upgrades of existing systems and boards to incorporate AI capabilities. With these AI acceleration modules, developers can run inference efficiently on the Hailo-8 NPU while handling application processing primarily on the CPU, optimizing resource allocation. The modules are paired with user-friendly software toolkits, including the Edge AI SDK for seamless integration with HailoRT, the Dataflow Compiler for converting existing models, and TAPPAS, which offers pre-trained application examples. These features accelerate the development of edge-based vision AI applications.

EAI-1200 M.2 AI Module: Accelerating Development for Vision AI Security
The EAI-1200 is an M.2 AI module powered by a single Hailo-8 VPU, delivering up to 26 TOPS of computing performance while consuming approximately 5 watts of power. An optional heatsink supports operation in temperatures ranging from -40 to 65°C, ensuring easy integration. This cost-effective module is especially designed to bundle with Advantech's systems and boards, such as the ARK-1221L, AIR-150, and AFE-R770, enhancing AI applications including baggage screening, workforce safety, and autonomous mobile robots (AMR).

HighPoint Technologies, a leader in advanced PCIe Switch and RAID AIC, Adapter and Storage Enclosure solutions, has announced an extensive line of M.2 and E1.S RAID AICs engineered to accommodate high-performance GPU-centric workloads. Designed for enterprise and datacenter class computing environments, HighPoint NVMe RAID AICs deliver class-leading performance and unmatched scalability, enabling modern x86/AMD and Arm platforms to support 4 to 16 NVMe SSDs via a single PCIe Gen 4 or Gen 5 x16 slot. State-of-the-art PCIe Switching Architecture and flexible RAID technology enable administrators to custom tailor M.2 and E1.S storage configurations for a broad range of data-intensive applications, and seamlessly scale or expand existing storage configurations to meet the needs of evolving workflows.

Unprecedented Storage Density
HighPoint NVMe AICs have established a new milestone for M.2 NVMe storage. HighPoint's revolutionary Dual-Width AIC architecture enables a single PCIe Gen 4 or Gen 5 x16 slot to directly host up to 16 M.2 NVMe SSDs, and 128 TB of storage capacity, at speeds up to 28 GB/s; a truly unprecedented advancement in compact, single-device storage expansion solutions. State-of-the art PCIe switching technology and advanced cooling systems maximize transfer throughput and ensure M.2 configurations operate at peak efficiency by halting the performance sapping threat of thermal throttling in its tracks.

IBASE Technology Inc. (TPEx: 8050), a leading manufacturer of embedded computing solutions, introduces the IB996 Full-Size CPU Card, tailored to meet the demanding needs of industrial and embedded computing. Supporting 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors, this innovative solution adheres to the PICMG 1.3 standard and features the Intel Q670E chipset for robust performance and flexibility. It offers outstanding expandability and connectivity for applications in industrial automation, transportation, and medical systems.

The IB996 boasts seamless performance and compatibility, supporting up to 64 GB of DDR5 memory with dual DIMM slots and superior networking capability with two Intel 2.5G LAN ports. Integrated Intel Xe graphics allow for versatile display options, including DVI-I, LVDS, and DVI-D, making it suitable for a variety of visual data processing tasks. Additionally, it comes equipped with 8x USB 3.2, 5x SATA III, four COM, and two M.2 sockets (M-Key and E-Key), with the M.2 M-Key supporting PCIe for NVMe storage solutions, ensuring high-speed data transfer and optimal performance across Intel-based systems.

PNY announced the addition of the CS2150 M.2 NVMe PCIe Gen 5 x4 SSD to its lineup of solid-state drives. The CS2150 leads the way in advanced storage technology, utilizing the NVMe PCIe Gen 5 x4 interface to achieve exceptional data transfer speeds. With sequential read speeds reaching up to 10,300 MB/s and write speeds up to 8,600 MB/s, this groundbreaking solution elevates computing performance to new heights. Perfect for professionals, tech enthusiasts, content creators, and anyone demanding top-tier storage performance, the CS2150 sets a new standard for speed and efficiency.

Enhanced Gameplay with Microsoft DirectStorage
PNY's CS2150 SSD harnesses the power of Microsoft DirectStorage, a revolutionary Windows 11 feature that accelerates game load times and enhances image quality. Combined with the legendary PNY XLR8 Gaming DDR5 DRAM and a high-performance graphics card like the PNY GeForce RTX 4080 SUPER 16 GB XLR8 Gaming VERTO EPIC-X RGB Overclocked Triple Fan, you'll enjoy faster load times and smoother gameplay, giving you more time to spend immersed in the world of gaming.

Today, at Lattice Developers Conference 2024, Lattice Semiconductor expanded its edge to cloud FPGA innovation leadership with the launch of exciting new hardware and software solutions. The new Lattice Nexus 2 next-gen small FPGA platform and the first device family based on the platform, Lattice Certus -N2 general purpose FPGAs, offer advanced connectivity, optimized power and performance, and class-leading security. Lattice also announced new mid-range FPGA device capacity options - Lattice Avant 30 and Avant 50 - and new versions of Lattice design software tools and application-specific solution stacks to help accelerate customer time-to-market.

"At Lattice, we are proud to lead technological advancements in low power, small form factor FPGAs, ensuring our customers have the optimal devices, tools, and solutions to design groundbreaking applications that are power efficient, fast, and secure," said Esam Elashmawi, Chief Strategy and Marketing Officer, Lattice Semiconductor. "From the edge to the cloud across a variety of industries, FPGAs stand at the forefront of innovation, and we're committed to delivering versatile and robust small and mid-range FPGA solutions that enable our customers and partners to unlock their full potential."

Thanks to the discovery of VideoCardz, we get a glimpse of MAXSUN's latest Arc 580 GPU with not only a GPU but extra room for two additional M.2 SSDs. The PCIe connector on the Intel Arc B580 has x16 physical pins but runs at PCIe 4.0 x8 speeds. Intel verified it runs only x8 lanes instead of the full x16 slot, leaving x8 lanes unsued. However, MAXSUN thought of a clever way to put the leftover x8 lanes to good use by adding two PCIe x4 M.2 SSDs to thelatest triple-fan iCraft B580 SKU. Power delivery for the M.2 drives comes directly from the graphics card, which is made possible by the GPU's partial PCIe lane utilization. This configuration could prove particularly valuable for compact builds or systems with limited motherboard storage options.

Interestingly, the SSD pair appears to have its own thermal enclosure, which acts as a heatsink. Having constant airflow from the GPU's fans, the M.2 SSD configuration should be able to maximize the full bandwidth of the SSDs without thermals throttling the SSD read/write speeds. The design follows in the footsteps of AMD's Radeon Pro SSG, which introduced integrated storage in workstation cards with PCIe 3.0 M.2 slots. Back then, it was mainly a target for workstation users. However, MAXSUN has envisioned gamers unusually expanding their storage space now. The pricing of the card and availability date remains a mystery.

AEWIN is glad to launch our new member of AEWIN Network Expansion Modules, the NCT401. Built upon Intel XL710-BM1 LAN Controller and Intel X557-AT4 PHY, it provides quad port 10GbE RJ45 with two pairs of Gen 3 bypass. It is with AEWIN standard Expansion Module form factor of PCIe x8 connection. The front-access design makes NCT401 easy to maintain/service and it is compatible with various kinds of AEWIN existing Network Appliances providing great flexibility to tailor specific configurations for target workload effortlessly.

DPDK (Data Plane Development Kit) is supported to improve package forwarding for better efficiency. Along with implementing DPDK, Dynamic Device Personalization (DDP) enables programmable packet-processing pipeline which is optimized for specific workloads on demand. With these features, performance for network edge workloads can be enhanced which is perfect for solutions of Communications, Cloud and Networking.

d-Matrix today unveiled Corsair, an entirely new computing paradigm designed from the ground-up for the next era of AI inference in modern datacenters. Corsair leverages d-Matrix's innovative Digital In-Memory Compute architecture (DIMC), an industry first, to accelerate AI inference workloads with industry-leading real-time performance, energy efficiency, and cost savings as compared to GPUs and other alternatives.

The emergence of reasoning agents and interactive video generation represents the next level of AI capabilities. These leverage more inference computing power to enable models to "think" more and produce higher quality outputs. Corsair is the ideal inference compute solution with which enterprises can unlock new levels of automation and intelligence without compromising on performance, cost or power.

Q.ANT, the leading startup for photonic computing, today announced the launch of its first commercial product - a photonics-based Native Processing Unit (NPU) built on the company's compute architecture LENA - Light Empowered Native Arithmetics. The product is fully compatible with today's existing computing ecosystem as it comes on the industry-standard PCI-Express. The Q.ANT NPU executes complex, non-linear mathematics natively using light instead of electrons, promising to deliver at least 30 times greater energy efficiency and significant computational speed improvements over traditional CMOS technology. Designed for compute-intensive applications such as AI Inference, machine learning, and physics simulation, the Q.ANT NPU has been proven to solve real-world challenges, including number recognition for deep neural network inference (see the recent press release regarding Cloud Access to NPU).

"With our photonic chip technology now available on the standard PCIe interface, we're bringing the incredible power of photonics directly into real-world applications. For us, this is not just a processor—it's a statement of intent: Sustainability and performance can go hand in hand," said Dr. Michael Förtsch, CEO of Q.ANT. "For the first time, developers can create AI applications and explore the capabilities of photonic computing, particularly for complex, nonlinear calculations. For example, experts calculated that one GPT-4 query today uses 10 times more electricity than a regular internet search request. Our photonic computing chips offer the potential to reduce the energy consumption for that query by a factor of 30."

Since its introduction, the NVIDIA Hopper architecture has transformed the AI and high-performance computing (HPC) landscape, helping enterprises, researchers and developers tackle the world's most complex challenges with higher performance and greater energy efficiency. During the Supercomputing 2024 conference, NVIDIA announced the availability of the NVIDIA H200 NVL PCIe GPU - the latest addition to the Hopper family. H200 NVL is ideal for organizations with data centers looking for lower-power, air-cooled enterprise rack designs with flexible configurations to deliver acceleration for every AI and HPC workload, regardless of size.

According to a recent survey, roughly 70% of enterprise racks are 20kW and below and use air cooling. This makes PCIe GPUs essential, as they provide granularity of node deployment, whether using one, two, four or eight GPUs - enabling data centers to pack more computing power into smaller spaces. Companies can then use their existing racks and select the number of GPUs that best suits their needs. Enterprises can use H200 NVL to accelerate AI and HPC applications, while also improving energy efficiency through reduced power consumption. With a 1.5x memory increase and 1.2x bandwidth increase over NVIDIA H100 NVL, companies can use H200 NVL to fine-tune LLMs within a few hours and deliver up to 1.7x faster inference performance. For HPC workloads, performance is boosted up to 1.3x over H100 NVL and 2.5x over the NVIDIA Ampere architecture generation.

AEWIN is glad to introduce our latest storage adapter cards, RS110A and RS118A. Each card has two hot-swappable E1.S trays while RS110A in a Standard PCIe x8 FHHL form factor and RS118A is in AEWIN Expansion Module form factor. RS118A can be installed in current AEWIN platforms with AEWIN expansion module bays while RS110A is suitable for platforms with standard PCIe slots for flexible storage expansion. With RS110A and RS118A, two E1.S NVMe SSDs with Maximum 9.5 mm and 15 mm height can be applied to existing systems for excellent scalability.

Market researchers have reported that the E1.S form factor is projected to become the most widely adopted small form factor for enterprise SSDs of data center in the coming years. E1.S NVMe storage features better thermal management solutions and can utilize bigger power consumption of 20 W which can overcome the scaling issue that M.2 is having. In addition, E1.S storage has hot-swappable features to minimize downtime and perform easier maintenance for replacement or capacity upgrade of the servers.

Solidigm, a leading provider of innovative NAND flash memory solutions, announced today the introduction of the world's highest capacity PCIe solid-state drive (SSD): the 122 TB (terabyte) Solidigm D5-P5336 data center SSD. The D5-P5336 doubles the storage space of Solidigm's earlier 61.44 TB version of the drive and is the world's first SSD with unlimited Random Write endurance for five years—offering an ideal solution for AI and data-intensive workloads. Just how much storage is 122.88 TB? Roughly enough for 4K-quality copies of every movie theatrically released in the 1990s, 2.6 times over.

Data storage power, thermal and space constraints are accelerating as AI adoption increases. Power and space-efficient, the new 122 TB D5-P5336 delivers industry-leading storage efficiency from the core data center to the edge. Data center operators can deploy with confidence the 122 TB D5-P5336 from Solidigm, the proven QLC (quad-level cell) density leader with more than 100EB (exabytes) of QLC-based product shipped since 2018.