Montage Technology today announced the mass production of its I/O expansion device for the new-generation CPU platforms—the I/O Hub (IOH) chip M88IO3020. This product is specifically designed for Intel's Birch Stream platform, aiming to provide a highly integrated and flexible I/O expansion solution for applications such as cloud computing, big data, and enterprise storage.

Montage's IOH chip establishes connectivity with Intel's latest Granite Rapids processors via the PCIe bus, achieving a maximum bandwidth of 64 Gbps. The chip features configurable high-speed interfaces including PCIe, SATA, and USB to meet diverse application requirements.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

NVIDIA's problems with its latest flagship RTX 50 series "Blackwell" GPUs continue. First, it was melting power cables, then stability issues, and recently, the case of missing ROPs. Today, we got a confirmation that NVIDIA is investigating users experiencing significant stability problems, with reports of widespread black screen issues and system crashes since the launch of the dedicated 572 driver branch. Unlike owners of previous generation cards who can roll back to stable drivers, RTX 50 series users are particularly affected as no alternative drivers are available for their hardware. The problems span across the entire RTX 50 lineup, including the 5090, 5080, and newly announced 5070 Ti models. Users have reported issues ranging from display flickering to complete system failures, with some experiencing blue screen of death (BSOD) errors during normal operation.

The situation is especially problematic when using advanced features like DLSS 4 frame generation. NVIDIA staff member Manuel recently addressed these concerns on the GeForce Forums, confirming that the company is actively investigating the problems. Preliminary investigation suggests the issues might extend beyond driver software, potentially requiring VBIOS updates to resolve the stability problems fully. Some users have found temporary relief by reducing PCIe speeds below Gen 5 or lowering monitor refresh rates to 60 Hz, suggesting potential firmware-level compatibility issues. However, these workarounds are not guaranteed solutions for all affected users. The latest driver update (572.47), which added support for the RTX 5070 Ti, failed to address these critical stability issues, including only a single bug fix related to monitor wake-up from sleep mode. This has left many early adopters of the RTX 50 series frustrated with their premium hardware purchases.

Micron Technology, Inc., today announced the Micron 4600 PCIe Gen 5 NVMe SSD, an innovative client storage drive for OEMs that is designed to deliver exceptional performance and user experience for gamers, creators and professionals. Leveraging Micron G9 TLC NAND, the 4600 SSD is Micron's first Gen 5 client SSD and doubles the performance of its predecessor.

The Micron 4600 SSD showcases sequential read speeds of 14.5 GB/s and write speeds of 12.0 GB/s. These capabilities allow users to load a large language model (LLM) from the SSD to DRAM in less than one second, enhancing the user experience with AI PCs. For AI model loading times, the 4600 SSD reduces load times by up to 62% compared to Gen 4 performance SSDs ensuring rapid deployment of LLMs and other AI workloads. Additionally, the 4600 SSD provides up to 107% improved energy efficiency (MB/s per watt) compared to Gen 4 performance SSDs, enhancing battery life and overall system efficiency.

QNAP Systems, Inc., a leading innovator in computing, networking, and storage solutions, today officially launched the QDA-UMP4A adapter. This adapter allows users to install an M.2 PCIe NVMe SSD into a 2.5-inch U.2 (SFF-8639) PCIe NVMe SSD slot of a QNAP NAS.

QNAP Product Manager Andy Chuang stated: "The QDA-UMP4A is ideal for users who need versatile drive options for various scenarios, from enterprise applications to multimedia workloads. Users can boost data-heavy applications with QNAP's U.2 SSD-based flagship all-flash NAS models."

German overclocking specialist Der8auer has showcased a custom water block for NVIDIA's flagship RTX 5090 Founders Edition, achieving a remarkable 30-degree Celsius reduction in core GPU temperatures. The prototype copper cooling solution demonstrated peak operating temperatures of just 43.8°C, compared to the stock cooler's 73.8°C under identical testing conditions. The design features an all-copper construction with a substantial 14 mm-thick cold plate, engineered specifically for optimal thermal transfer from the GB202 die. While maintaining the dual-slot form factor of the original Founders Edition cooler, the water block incorporates multiple cooling channels beneath a transparent top panel that reveals the coolant flow.

Memory temperatures also significantly improved, dropping by 38 degrees Celsius below stock measurements. Despite its impressive thermal performance, the prototype faces several engineering challenges. The team was constrained by the graphics card's display output ribbon cable, which prevented a more compact design closer to the actual PCB dimensions. Additionally, the Founders Edition card's unique split PCIe finger design presented structural concerns that require additional reinforcement before any potential commercial release. Der8auer's prototype prioritizes function over aesthetics, omitting common features like RGB lighting in favor of raw cooling performance. The water block's industrial design reflects its proof-of-concept nature, though the transparent top panel offers practical utility for monitoring coolant flow. While no retail release timeline has been announced, Der8auer indicated that addressing the PCIe slot structural support issue remains a critical milestone before any commercial version could be considered.

NVIDIA's high-TDP flagship GPU, the GeForce RTX 5090, appears to cause additional headaches for users, not including the high power bill. According to a Reddit user, we now have the first documented case of a melted power connector on NVIDIA's flagship GeForce RTX 5090 Founders Edition, reigniting concerns over high-wattage GPU safety from the last generation. While playing Battlefield 5, Reddit user ivan6953 detected a burning odor and immediately shut down their system, only to discover severe damage to both the RTX 5090's 12V-2×6 connector and their ASUS ROG Loki SFX-L PSU. The user had employed a Moddiy 12VHPWR cable, marketed as ATX 3.0/PCIe 5.0-compliant and rated for RTX 5090's 600 watts of power. Despite claims of secure installation—audible clicks at both ends—the cable melted at 500-520 W load, charring connectors on the GPU and PSU.

Notably, the same cable had powered an RTX 4090 FE for two years without issue. NVIDIA's RTX 5090 FE ships with a redesigned adapter featuring a longer, more flexible cable and an angled connector to reduce strain in compact builds. NVIDIA asserts that no incidents have occurred with its bundled adapter, emphasizing compliance with the updated 12V-2×6 standard, which shortens sensing pins to prevent power flow if connections loosen. Hence, an older connector can not provide 100% secure usage despite the user thinking that the sensing pins are touching properly.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, has expanded its diverse portfolio of short-depth NAS products designed for edge storage. The new 1U short-depth rackmount 4-bay 2.5GbE NAS TS-h765eU features a shorter chassis depth and is perfect for small media cabinets and wall-mounted network racks in space-constrained office environments or industrial settings. The TS-h765eU is a long-term supply model till 2031, making it a reliable NAS choice for organizations planning long-term projects or multi-site deployments.

The TS-h765eU combines robust performance, multitasking capabilities, and great I/O expandability to meet diverse application requirements. It features the latest Intel Atom x7000C Series processor, supports built-in 8 GB DDR5 RAM, upgradable to 16 GB (In-Band ECC), has dual 2.5GbE ports, and provides four 3.5-inch SATA drive bays and three E1.S/M.2 PCIe NVMe slots for installing E1.S/M.2 2280 SSDs to enhance read/write performance or upgrading to 10GbE using E1.S interface network modules. Running the ZFS-based QuTS hero operating system, the TS-h765eU prioritizes data integrity, immutability with WORM protection, and powerful data reduction.

ASUS China has launched an extensive customer support program addressing potential graphics card damage linked to its PCIe Q-Release Slim mechanism. The initiative includes full motherboard replacements, compensation packages, and warranty coverage for affected customers. The compensation package encompasses a 200 RMB ($27) store credit and complete motherboard replacement for affected units across multiple product lines, including the Z790, B860, Z890, B850, and X870 series motherboards. Particularly, the affected motherboard lineup includes high-end models like the ROG Maximus Z890 Extreme and ROG Crosshair X870E Hero. The controversy centers on the mechanism's internal peg design, which reportedly can affect graphics card PCIe connectors during repeated installation and removal cycles.

ASUS China has confirmed the development of a revised Q-Release Slim design, though no specific timeline has been announced. Warranty coverage varies by graphics card manufacturer. ASUS and MSI have committed to priority repairs and free card replacements for both PCB wear and gold finger damage when repairs prove unsuccessful. However, Gigabyte and Colorful cards require evaluation at repair centers before determining coverage eligibility. This regional response contrasts sharply with ASUS's US position, which maintains that internal testing shows no correlation between the Q-Release Slim mechanism and graphics card damage. While ASUS continues to defend the mechanism's design integrity internationally, its comprehensive response in the Chinese market suggests a more cautious approach to potential hardware compatibility issues. We must wait and see if the worldwide ASUS position will change in the coming days and if the North American department issues any different response.

HXL/9550pro and HardwareLuxx's Andreas Schilling shared evidence of the ASUS PCIe Q-Release Slim—the manufacturer's latest ejection mechanism—causing damage to graphics card PCIe connectors. Recent feedback suggests that repeated usage can scrape or grind off material present on a card's interface. HXL gathered critiques from multiple sources (owners of Intel 800 and AMD 800 series boards), and linked a relevant Bilibili video. The footage presents a damaged GALAX RTX 4070 Ti HOF OC LAB model, following sixty quick release cycles—paired with a ROG Strix B850-A Gaming Wi-Fi S motherboard. Tony Wu, ASUS China's general manager, eventually weighed in on community discussions—stating that he will investigate this matter and report back with his findings.

Schilling expressed similar frustrations—his chosen platform is producing unwanted results: "I'm not happy with the solution either. We use the Strix X870E-E Gaming for testing the graphics cards. So I have had to remove graphics cards from the slot a few dozen times. This didn't always go smoothly and very often the (GeForce RTX 5090) card got stuck in the slot. First damage visible." Press outlets have picked up on the recent surge in Q-Release Slim user feedback—several publications have gathered additional examples of the new mechanism inflicting damage on a variety of graphics card models.

NVIDIA has unveiled a radical graphics card prototype that never reached production, offering insight into its design process. In a YouTube video called "Designing the Founders Edition | GeForce RTX 5090", NVIDIA showcases an unreleased design that would have occupied four PCIe slots, featuring a "three-thirds flow-through" cooling system with an unconventional three-fan stair-step configuration. NVIDIA ultimately rejected the quad-slot concept as impractical for most computer systems.
Engineers refined the cooling approach for the RTX 50-series, developing a more streamlined "two-thirds flow-through" design that maintains thermal performance while reducing the card's footprint to two PCIe slots.

Technical challenges emerged during development, particularly in connector design. The team struggled to create a ribbon cable supporting high-bandwidth UHBR20 DisplayPort 2.1b and HDMI 2.1b connections. Their solution involved infusing glass fibers into the cable, enabling support for three DisplayPort and one HDMI connector. Critical engineering focus was placed on the liquid metal thermal interface material. Extensive stress testing ensured reliability across various orientations, with particular attention to preventing oxidation. Given the electrically conductive nature of liquid metal, an air-tight seal around the GPU die became crucial to prevent potential hardware failure.

Montage Technology today announced the customer sampling of its PCIe 6.x/CXL 3.x Retimer -- M88RT61632, which is designed to enhance connectivity performance for demanding high-bandwidth applications such as AI and cloud computing. This milestone extends the company's PCIe product portfolio, building upon its successful PCIe 4.0 and PCIe 5.0/CXL 2.0 Retimer solutions.

The PCIe 6.x/CXL 3.x Retimer delivers excellent performance with data rates up to 64 GT/s, twice that of PCIe 5.0. Powered by Montage Technology's proprietary PAM4 SerDes IP, the chip achieves superior signal integrity with link budget up to 43dB while maintaining low latency. Its innovative DSP architecture effectively addresses PCIe 6.x system design challenges including crosstalk and signal reflection. In addition, the chip features advanced link training and enhanced telemetry, enabling comprehensive link monitoring and fault diagnostics for high-reliability AI cluster deployments.

Silicon Motion will expand its MonTitan lineup of SSD controllers—for datacenters and enterprise platforms—with the upcoming addition of a truly next-generation model. Wallace C. Kou (the company's founder and CEO) contributes to ChinaFlashMarket.com with a regular written column—his latest feature (posted on January 17) includes a short sentence dedicated to announcing his firm's new SM8466 design. This appears to be their first foray into PCIe 6.0-based interface territories—details are minimal (at this point in time), but the CEO divulged the very basics. Silicon Motion's engineering team is currently in the "development stage" with the SM8466 project—a: "4 nm PCIe Gen 6 SSD master chip."

It is not clear whether this next-gen PCIe 6.0 SSD controller will be heading to market anytime soon, but Kou's column mostly focused on current plans—likely signalling where priorities lie. Silicon Motion's "built-in PCIe Gen 5 SSD enterprise-level master chip" (SM8366) is in mass production—industry experts believe that the company's MonTitan PCIe 5.0 family has had a tough time keeping up with equivalent Phison products—in particular, the market leading PS5026-E26 (PCIe 5.0 x4) controller. The SM8366 could be potent enough to take the crown in higher-end enterprise segments, but the existence of a PCIe 6.0-based successor is bound to attract extra attention.

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Transcend Information Inc. (Transcend), a leading global manufacturer of memory storage solutions, introduces the ETD410T, a new U.2 enterprise solid-state drive (eSSD) designed for high-performance computing environments. Tailored to meet the stringent demands of enterprise users for ultra-fast data transfer and reliability, the ETD410T adopts the PCIe Gen 4 x4 high-speed interface and U.2 15 mm form factor, featuring a DRAM cache for exceptional performance and robust data protection. It is an ideal solution for data centers and enterprise applications.

Durable and Stable for High-Frequency Workloads
The Transcend ETD410T is a professional solution optimized for read-intensive workloads. Compliant with JESD219 standards, it offers a durability of up to 7,000 Program/Erase (P/E) cycles to withstand frequent use over long periods. With Quality of Service (QoS) consistently maintained between 99.9% and 99.99%, it delivers stable and reliable operation even in demanding enterprise environments, ensuring consistent and dependable data access.

Details of ASUS' next generation BTF 2.0 (BTF stands for Back to the Future) platform have appeared online, courtesy of Andreas Schilling from HardwareLuxx. The editor posted pictures from an ASUS presentation over at Bluesky that details one major change to the power connector design, which will make the BTF 2.0 graphics cards compatible with non BTF systems. This suggests that ASUS might consider offering more graphics cards with BTF 2.0 support, since they can be used in any system with the proposed changes.

As you may or may not know, the first generation BTF graphics cards ended up with a power connector at the rear, bottom edge of the graphics cards, placed somewhat behind the PCIe gold fingers. The cards also lacked any other power connectors, which made them exclusive for BTF builds. To solve this conundrum, ASUS moved its GC-HPWR PCB power connector up on the PCB, making sure it clears any motherboard components. However, instead of increasing the height of the motherboard BTF 2.0 connector, the company provides a small adapter that plugs in between the motherboard and graphics card, to make its new BTF 2.0 cards compatible with any system.

ASMedia Technology Inc., a leading provider of high-speed transmission interface ICs, showcased its latest innovations at CES 2025, focusing on USB4, Thunderbolt 4, and PCIe Gen 4 Switch technologies. These new technologies can be used in many different applications such as consumer electronics, AI, HPC, and industrial computing.

Key highlights include:

• PCIe Gen 4 Switch ASM58000 Series: This low-power, cost-effective solution offers high bandwidth (up to 16 Gbps per lane), ideal for servers, edge computing, NAS, surveillance storage, and industrial PCs. It excels in demanding applications like AI, ML, and HPC.
• USB4 ASM2464PDX with AI Enhancements: The USB4 device controller ASM2464PDX empowers PCs with enhanced AI capabilities. By leveraging USB4 and PCIe, it enables seamless external GPU connectivity for AI tasks, gaming, and content creation.
• Comprehensive USB4 Solutions: ASMedia demonstrated a complete range of USB4 solutions, including host, device, and peripheral controllers, ensuring optimal compatibility and backward compatibility with Thunderbolt 3/4 and legacy USB standards.

A South Korean online retailer has listed Huawei's eKitStore Extreme 200E M.2 NVMe SSD for sale at 47,500 Won ($32) for the 1 TB model. This marks Huawei's entry into consumer storage products after previously only manufacturing server SSDs. The PCIe 4.0 drive's specifications show read speeds of 7,400 MB/s and write speeds of 6,700 MB/s. Beyond confirming the use of QLC memory without a DRAM cache, Huawei has not disclosed the drive's internal components. Due to trade restrictions, both the controller and memory chips likely come from Chinese manufacturers, though specific suppliers remain unknown. Chinese makers have been recorded to use Silicon Motion's SSD controllers, but domestic controllers are also an option here.

Manufacturing costs for similar drives typically exceed $32, raising questions about the pricing strategy. The drive's components could match those used in other brands' SSDs, as multiple storage companies often use identical parts in their products. For NAND Flash, Huawei likely sourced its chips from YMTC, whose Xtacking 4.0 proves to be quite a success. The drive has appeared only at one retailer so far, and Huawei has not announced plans for sales in other regions. This price is notably lower than comparable PCIe 4.0 drives. Common retail prices for 1 TB PCIe 4.0 SSDs are typically more than double this amount. Whether this represents a temporary price or a long-term strategy remains unclear. Perhaps Huawei is operating at a net loss to gain some customers, with possible plans for more SSDs in the future, along with the PCIe 5.0 version.

Patriot Memory today announced the launch of the P400 V4, a high-performance PCIe Gen 4 x4 M.2 SSD that delivers exceptional speeds of up to 6,200 MB/s read and 5,200 MB/s write. This versatile storage solution is optimized for both PC and PlayStation 5 platforms, offering gamers and content creators unprecedented performance and reliability.

The P400 V4 leverages cutting-edge PCIe Gen 4 x4 NVMe technology to provide lightning-fast data transfer speeds while maintaining efficient power consumption. On the PlayStation 5, the drive achieves impressive sequential read speeds of up to 6,000 MB/s, ensuring quick load times and smooth gameplay across all gaming platforms.

Silicon Power (SP) is excited to announce the launch of its first M.2 PCIe 2230 E-Key SSD, the MEM3K0E, further solidifying its commitment to delivering innovative and versatile solutions for the growing demands of artificial intelligence (AI) and edge computing applications. With the introduction of this compact form factor, the company provides developers with more options to optimize system configurations while empowering next-generation AI technologies.

An Optimized Cache and Buffer Solution
Compliant to the PCIe 3.1 standard and NVMe 1.4 protocol, the MEM3K0E is specifically designed for devices equipped with E-Key slots, making it an ideal cache and buffer storage solution to complement M-Key slot primary drives. Its chief role is to maintain stable system performance by balancing the workload during resource-intensive tasks, which it achieves with features such as a thermal throttling function and built-in voltage detector. With storage capacity options of 64 GB, 128 GB, 256 GB, and 512 GB, the MEM3K0E offers scalability for various applications, ranging from compact embedded systems to high-performance computing environments.

SK hynix Inc. announced today that it has completed development of its high-capacity SSD product, PS1012 U.2, designed for AI data centers. As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61 TB product using this technology and introduced it to the market.

SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies. With the latest 5th generation (Gen 5) PCIe, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32 GT/s (Gig-transfers per second), with the sequential read performance of 13 GB/s (Gigabyte per second), which is twice that of previous generation products.

Framework, the company known for making consumer-friendly, repairable, upgradeable laptops, has officially announced the first expansion bay for the Framework 16, its AMD-powered gaming laptop. The new storage module, which slots into the Expansion Bay, has dual M.2 slots for up to 16 TB total additional storage for the Framework 16. Part of the idea behind the storage expansion seems to be turning what is essentially a gaming laptop into a capable workstation. Crucially, upgrading the storage with the expansion bay requires removing the discrete Radeon 7700s GPU, although the Framework 16 already has dual M.2 slots on the motherboard, so this expansion isn't really intended for gamers, anyway.

One of the major selling points for the Framework 16 was that it offered PCIe expansion via a modular interface, and this is Framework's first real foray into expanding that ecosystem for its largest laptop. In addition to the storage expansion, Framework also announced a new Mystery Box system for its US and Canada Outlets to offload spare parts, like returned modules and components that it doesn't want to relegate to the e-waste pile but also cannot financially justify sorting through and refurbishing. These Mystery Boxes each contain at least three items and come with a warning that reads "Note that these don't come with a warranty and are non-returnable, so only get it if you want random scrap to play with!"

Advantech, a leading provider of AIoT platforms and services, proudly unveils its latest AI acceleration modules: the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules deliver AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparable AI modules and GPU cards. Designed in standard M.2 and PCIe form factors, the EAI-1200 and EAI-3300 can be seamlessly integrated with diverse x86 and Arm-based platforms, enabling quick upgrades of existing systems and boards to incorporate AI capabilities. With these AI acceleration modules, developers can run inference efficiently on the Hailo-8 NPU while handling application processing primarily on the CPU, optimizing resource allocation. The modules are paired with user-friendly software toolkits, including the Edge AI SDK for seamless integration with HailoRT, the Dataflow Compiler for converting existing models, and TAPPAS, which offers pre-trained application examples. These features accelerate the development of edge-based vision AI applications.

EAI-1200 M.2 AI Module: Accelerating Development for Vision AI Security
The EAI-1200 is an M.2 AI module powered by a single Hailo-8 VPU, delivering up to 26 TOPS of computing performance while consuming approximately 5 watts of power. An optional heatsink supports operation in temperatures ranging from -40 to 65°C, ensuring easy integration. This cost-effective module is especially designed to bundle with Advantech's systems and boards, such as the ARK-1221L, AIR-150, and AFE-R770, enhancing AI applications including baggage screening, workforce safety, and autonomous mobile robots (AMR).

HighPoint Technologies, a leader in advanced PCIe Switch and RAID AIC, Adapter and Storage Enclosure solutions, has announced an extensive line of M.2 and E1.S RAID AICs engineered to accommodate high-performance GPU-centric workloads. Designed for enterprise and datacenter class computing environments, HighPoint NVMe RAID AICs deliver class-leading performance and unmatched scalability, enabling modern x86/AMD and Arm platforms to support 4 to 16 NVMe SSDs via a single PCIe Gen 4 or Gen 5 x16 slot. State-of-the-art PCIe Switching Architecture and flexible RAID technology enable administrators to custom tailor M.2 and E1.S storage configurations for a broad range of data-intensive applications, and seamlessly scale or expand existing storage configurations to meet the needs of evolving workflows.

Unprecedented Storage Density
HighPoint NVMe AICs have established a new milestone for M.2 NVMe storage. HighPoint's revolutionary Dual-Width AIC architecture enables a single PCIe Gen 4 or Gen 5 x16 slot to directly host up to 16 M.2 NVMe SSDs, and 128 TB of storage capacity, at speeds up to 28 GB/s; a truly unprecedented advancement in compact, single-device storage expansion solutions. State-of-the art PCIe switching technology and advanced cooling systems maximize transfer throughput and ensure M.2 configurations operate at peak efficiency by halting the performance sapping threat of thermal throttling in its tracks.

IBASE Technology Inc. (TPEx: 8050), a leading manufacturer of embedded computing solutions, introduces the IB996 Full-Size CPU Card, tailored to meet the demanding needs of industrial and embedded computing. Supporting 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors, this innovative solution adheres to the PICMG 1.3 standard and features the Intel Q670E chipset for robust performance and flexibility. It offers outstanding expandability and connectivity for applications in industrial automation, transportation, and medical systems.

The IB996 boasts seamless performance and compatibility, supporting up to 64 GB of DDR5 memory with dual DIMM slots and superior networking capability with two Intel 2.5G LAN ports. Integrated Intel Xe graphics allow for versatile display options, including DVI-I, LVDS, and DVI-D, making it suitable for a variety of visual data processing tasks. Additionally, it comes equipped with 8x USB 3.2, 5x SATA III, four COM, and two M.2 sockets (M-Key and E-Key), with the M.2 M-Key supporting PCIe for NVMe storage solutions, ensuring high-speed data transfer and optimal performance across Intel-based systems.