At Computex 2024, Sparkle has unveiled its latest product aimed at streamers, the Streamer 4K60. This innovative PCIe video capture card is engineered to cater to the demands of high-quality video production. Sparkle has seamlessly integrated many advanced features into this remarkable device, ensuring that content creators and streamers can unleash their creativity without compromise. The Streamer 4K60 boasts the ability to capture ultra-high-definition video at a smooth 60 frames per second in 4K resolution or even 120 frames per second in 1080p resolution. Its dual HDMI input support facilitates video passthrough and enables users to explore the realms of Picture-in-Picture (PiP) and cooperative streaming functionalities. Furthermore, this cutting-edge device effortlessly combines HDR10 support, a robust metal cover design for durability, and comprehensive software compatibility with popular platforms like OBS and XSplit. For connection to the PC, it requires a PCIe 2.0 x1 connector. For video passthrough and video input, HDMI 2.1 is used. The card is priced at 299 USD and will be available in late July or early August.

We've seen a lot of motherboards with the power, SATA and USB connectors on the rear at Computex this year, but Chinese Maxsun decided to put the PCIe x16 slot on the back of its Mini-ITX MS-Terminator B760BKB D5 motherboard. This might seem like a crazy move, but with the right chassis, this means that the graphics card won't need a PCIe extension cable, while fitting in a compact chassis. It's also become increasingly hard to retain signal integrity over ribbon cables and with PCIe 5.0, it might be impossible. Another added benefit of this design is that the board also has a PCIe 3.0 x4 slot available for something like a 10 Gbps network card or just about anything else you'd want to plug into a compact PC.

The overall board specs don't really stick out from the crowd, as the Intel B760 chips is a somewhat limiting factor as well. In addition to the PCIe 5.0 x16 slot and the PCIe 3.0 x4 slot, the board also has a pair of PCIe 4.0 M.2 NVMe slots—one on each side of the PCB—and a slim SAS connector using an SFF-8654 connector. In addition to this, the board also has two DDR5 DIMM slots, four SATA ports, a 2.5 Gbps Ethernet port, a DP 1.2, an HDMI 2.0 port, a USB Type-C port of unknown speed and WiFi 6 and Bluetooth 5.2. The power design consists of a fairly basic 8+1+1 phase setup. We'd like to see this board design to become a standard, as it makes a lot of sense for the SFF market to allow for a better placement of the PCI x16 slot to allow for a more compact chassis without having to compromise on the choice of graphics card.

On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme "Embracing the Era of High-Capacity SSDs." The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen 4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more. The company offers reliable industrial-grade, automotive-grade, and enterprise-grade storage products, providing high-capacity solutions for global users.

High-Capacity SSDs
For SSDs, Mnemonic Electronic presented products in various form factors and interfaces, including PCIe M.2, PCIe BGA, SATA M.2, and SATA 2.5-inch. The Mnemonic MS90 8 TB SATA SSD supports the SATA interface with a speed of up to 6 Gb/s (Gen 3) and is backward compatible with Gen 1 and Gen 2. It also supports various SATA low-power states (Partial/Sleep/Device Sleep) and can be used for nearline HDD replacement, surveillance, and high-speed rail systems.

Marvell Technology, a leader in data infrastructure semiconductor solutions, today expanded its connectivity portfolio with the launch of the new Alaska P PCIe retimer product line built to scale data center compute fabrics inside accelerated servers, general-purpose servers, CXL systems and disaggregated infrastructure. The first two products, 8- and 16-lane PCIe Gen 6 retimers, connect AI accelerators, GPUs, CPUs and other components inside server systems.

Artificial intelligence (AI) and machine learning (ML) applications are driving data flows and connections inside server systems at significantly higher bandwidth, necessitating PCIe retimers to meet the required connection distances at faster speeds. PCIe is the industry standard for inside-server-system connections between AI accelerators, GPUs, CPUs and other server components. AI models are doubling their computation requirements every six months1 and are now the primary driver of the PCIe roadmap, with PCIe Gen 6 becoming a requirement.

Today, Lenovo launched the Lenovo ThinkPad P14s Gen 5 designed for professionals who need top-notch performance in a portable 14-inch chassis. Featuring a stunning 16:10 display, this mobile workstation is powered by AMD Ryzen PRO 8040 HS-Series processors. These processors are ultra-advanced and energy-efficient, making them perfect for use in thin and light mobile workstations. The AMD Ryzen PRO HS- Series processors also come with built-in Artificial Intelligence (AI) capabilities, including an integrated Neural Processing Unit (NPU) for optimized performance in AI workflows.

The Lenovo ThinkPad P14s Gen 5 is provided with independent software vendor (ISV) certifications and integrated AMD Radeon graphics, making it ideal for running applications like AutoCAD, Revit, and SOLIDWORKS with seamless performance. This mobile workstation is ideal for mobile power users, offering advanced ThinkShield security features and passes comprehensive MIL-SPEC testing for ultimate durability.

The rollout of SiPearl's much-anticipated Rhea processor for European supercomputers has been pushed back by a year to 2025, but the delay comes with a silver lining - a significant upgrade in core count and potential performance. Originally slated to arrive in 2024 with 72 cores, the homegrown high-performance chip will now pack 80 cores when it eventually launches. This decisive move by SiPearl and its partners is a strategic choice to ensure the utmost quality and capabilities for the flagship European processor. The additional 12 months will allow the engineering teams to further refine the chip's architecture, carry out extensive testing, and optimize software stacks to take full advantage of Rhea's computing power. Now called the Rhea1, the chip is a crucial component of the European Processor Initiative's mission to develop domestic high-performance computing technologies and reduce reliance on foreign processors. Supercomputer-scale simulations spanning climate science, drug discovery, energy research and more all require astonishing amounts of raw compute grunt.

By scaling up to 80 cores based on the latest Arm Neoverse V1, Rhea1 aims to go toe-to-toe with the world's most powerful processors optimized for supercomputing workloads. The SiPearl wants to utilize TSCM's N6 manufacturing process. The CPU will have 256-bit DDR5 memory connections, 104 PCIe 5.0 lanes, and four stacks of HBM2E memory. The roadmap shift also provides more time for the expansive European supercomputing ecosystem to prepare robust software stacks tailored for the upgraded Rhea silicon. Ensuring a smooth deployment with existing models and enabling future breakthroughs are top priorities. While the delay is a setback for SiPearl's launch schedule, the substantial upgrade could pay significant dividends for Europe's ambitions to join the elite ranks of worldwide supercomputer power. All eyes will be on Rhea's delivery in 2025, mainly from Europe's governments, which are funding the project.

Thanks to recent developments in the AI field, and following in the wake of the world's recovery from COVID-19, the transition of factories to partial or full automation proceeds with unstoppable momentum. And the best place to learn about the latest technologies that aim to make this transition as painless as possible is at Automate 2024. This is North America's largest robotics and automation event, and it will be held in Chicago, Illinois from May 6 to 9.

Automate attracts professionals from around the world, and Apacer is no exception. Apacer team will be on hand to discuss the latest technological developments created by our experienced R&D team. Many of these developments were specifically created to reduce the pain points commonly experienced by fully automated facilities. Take CoreSnapshot, for example. This backup and recovery technology can restore a crashed system to full operation in just a few seconds, reducing downtime and associated maintenance costs. Apacer recently updated CoreSnapshot, creating CoreRescue ASR and CoreRescue USR. The name of CoreRescue ASR refers to Auto Self Recovery. This technology will harness AI to learn the system booting process and analyze how long a boot should take. If this average boot time is significantly longer than usual, the system will trigger the self-recovery process and revert to an earlier, uncorrupted version of the drive's content. CoreRescue USR offers similar functionality, except the self-recovery process is triggered by connecting a small USB stick drive.

AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

Aetina, a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany. This groundbreaking product is a small form factor PCIe graphics card powered by the high-performance Intel Arc A380E GPU.

Unmatched Power in a Compact Design
The Aetina IA380E-QUFL delivers workstation-level performance packed into a low-profile, single-slot form factor. This innovative solution consumes only 50 W, making it ideal for space and power-constrained edge computing environments. Embedded system manufacturers and integrators can leverage the power of 4.096 TFLOPs peak FP32 performance delivered by the Intel Arc A380E GPU.

During the Vision 2024 event, Intel announced its latest Gaudi 3 AI accelerator, promising significant improvements over its predecessor. Intel claims the Gaudi 3 offers up to 70% improvement in training performance, 50% better inference, and 40% better efficiency than Nvidia's H100 processors. The new AI accelerator is presented as a PCIe Gen 5 dual-slot add-in card with a 600 W TDP or an OAM module with 900 W. The PCIe card has the same peak 1,835 TeraFLOPS of FP8 performance as the OAM module despite a 300 W lower TDP. The PCIe version works as a group of four per system, while the OAM HL-325L modules can be run in an eight-accelerator configuration per server. This likely will result in a lower sustained performance, given the lower TDP, but it confirms that the same silicon is used, just finetuned with a lower frequency. Built on TSMC's N5 5 nm node, the AI accelerator features 64 Tensor Cores, delivering double the FP8 and quadruple FP16 performance over the previous generation Gaudi 2.

The Gaudi 3 AI chip comes with 128 GB of HBM2E with 3.7 TB/s of bandwidth and 24 200 Gbps Ethernet NICs, with dual 400 Gbps NICs used for scale-out. All of that is laid out on 10 tiles that make up the Gaudi 3 accelerator, which you can see pictured below. There is 96 MB of SRAM split between two compute tiles, which acts as a low-level cache that bridges data communication between Tensor Cores and HBM memory. Intel also announced support for the new performance-boosting standardized MXFP4 data format and is developing an AI NIC ASIC for Ultra Ethernet Consortium-compliant networking. The Gaudi 3 supports clusters of up to 8192 cards, coming from 1024 nodes comprised of systems with eight accelerators. It is on track for volume production in Q3, offering a cost-effective alternative to NVIDIA accelerators with the additional promise of a more open ecosystem. More information and a deeper dive can be found in the Gaudi 3 Whitepaper.

AMD has introduced the Ryzen Embedded 8000 Series processors, the first AMD embedded devices to combine NPUs based on the AMD XDNA architecture with traditional CPU and GPU elements, optimized for workload versatility and adaptability targeting industrial AI applications. Embedded solution engineers and developers can harness the processing power and leadership features for a variety of industrial AI applications including machine vision, robotics, and industrial automation. AI is widely used in machine vision applications today to enhance quality control and inspection processes.

AI can also help robots make real-time, route-planning decisions and adapt to dynamic environments. In industrial automation, AI processing helps intelligent edge devices perform complex analysis and decision-making without relying on cloud connectivity. This allows for real-time monitoring, predictive maintenance, and autonomous control of industrial processes, enhancing operational efficiency and reducing downtime.

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

Other World Computing, the leading provider of computer hardware, accessories, and software that bring artistic expression and the digital world together for creative professionals and consumers of technology, today unveiled SoftRAID 8, a groundbreaking new software release that redefines RAID management for Mac and Windows environments.

Quickly accessing data with the right safeguards is a difficult balance. Whether it is enhancing multimedia production workflows, protecting critical business files, or ensuring uninterrupted access to valuable data, OWC's SoftRAID is the ideal solution to manage RAID arrays. SoftRAID implements the latest performance technology unleashing remarkable speeds on a RAID system. Simply connect the drive array, format the preferred RAID level, and experience the breakneck speeds first-hand. RAID management has never been this powerful and easy to use.

SK hynix unveiled a new consumer product based on its latest solid-state drive (SSD), PCB01, which boasts industry-leading performance levels at GPU Technology Conference (GTC) 2024. Hosted by NVIDIA in San Jose, California from March 18-21, GTC is one of the world's leading conferences for AI developers. Applied to on-device AI PCs, PCB01 is a PCIe fifth-generation SSD which recently had its performance and reliability verified by a major global customer. After completing product development in the first half of 2024, SK hynix plans to launch two versions of PCB01 by the end of the year which target both major technology companies and general consumers.

Optimized for AI PCs, Capable of Loading LLMs Within One Second
Offering the industry's highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 doubles the speed specifications of its previous generation. This enables the loading of LLMs required for AI learning and inference in less than one second. To make on-device AIs operational, PC manufacturers create a structure that stores an LLM in the PC's internal storage and quickly transfers the data to DRAMs for AI tasks. In this process, the PCB01 inside the PC efficiently supports the loading of LLMs. SK hynix expects these characteristics of its latest SSD to greatly increase the speed and quality of on-device AIs.

ScaleFlux, a leader in deploying computational storage at scale, today announced its commitment to integrating the Arm Cortex -R82 processor in its forthcoming line of enterprise Solid State Drive (SSD) controllers. The Cortex-R82, is the highest performance real-time processor from Arm and the first to implement the 64-bit Armv8-R AArch64 architecture, representing a significant advancement in processing power and efficiency for enterprise storage solutions.

ScaleFlux's adoption of the Cortex-R82 is a strategic move to leverage the processor's high performance and energy efficiency. This collaboration underscores ScaleFlux's dedication to delivering cutting-edge technology in its SSD controllers, enhancing data processing capabilities and efficiency for data center and AI infrastructure worldwide.

QNAP Systems, Inc. today launched the new PCIe JBOD storage enclosure TL-R2400PES-RP, featuring PCIe Gen 3 x8, and providing up to 64 Gb/s data transfer. Following the release of 12 and 16-bay models of the TL-Rx00PES-RP PCIe JBOD series, QNAP extends the series lineup by introducing the 24-bay 4U rackmount TL-R2400PES-RP model. Users can expand existing NAS storage volumes to petabyte-class by connecting multiple TL-Rx00PES-RP series JBODs, without requiring RAID-rebuilding on the host NAS. The TL-Rx00PES-RP series uses SATA drives, allowing businesses to choose from a wide range of enterprise hard drives. This series is ideal for businesses who want to archive/back up virtualization applications, surveillance recordings, multimedia, and other large data.

The TL-Rx00PES-RP series power on/off is linked with the host NAS, which helps reduce hardware management tasks for IT staff. Storage expansion cards QXP-3X8PES (PCIe Gen 3 x8) or the QXP-3X4PES (PCIe Gen 3 x4) are required for the NAS to scale up using TL-Rx00PES-RP series expansion enclosures.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

Cadence's digital and custom/analog flows are certified on the Intel 18A process technology. Cadence design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs. Customers can now begin using the production-ready Cadence design flows and design IP to achieve design goals and speed up time to market.

"Intel Foundry is very excited to expand our partnership with Cadence to enable key markets for the leading-edge Intel 18A process technology," said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. "We will leverage Cadence's world-class portfolio of IP, AI design technologies, and advanced packaging solutions to enable high-volume, high-performance, and power-efficient SoCs in Intel Foundry's most advanced process technology. Cadence is an indispensable partner supporting our IDM2.0 strategy and the Intel Foundry ecosystem."

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage, and gaming peripherals, proudly introduces the Viper PV553 M.2 2280 PCIe Gen 5 x4 SSD. This groundbreaking SSD is designed with the core idea of delivering next-gen performance, featuring an innovative active cooling system.

The PV553 introduces a revolutionary cooling solution as Patriot's first SSD with a blower fan design. Patriot Memory's cutting-edge advancements ensure active thermal dissipation, providing consistent cooling even during extended usage for intense gaming sessions. Crafted with premium materials and a slim 16.5 mm aluminium heat shield, the PV553 incorporates an embedded thermal sensor, guaranteeing unwavering high performance. With a 5-year warranty, this SSD exemplifies quality and reliability.

Nubis Communications, Inc., provider of low-latency high-density optical inter-connect (HDI/O), and Alphawave Semi (LN: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, today announced their upcoming demonstration of PCI Express 6.0 technology driving over an optical link at 64GT/s per lane. Data Center providers are exploring the use of PCIe over Optics to greatly expand the reach and flexibility of the interconnect for memory, CPUs, GPUs, and custom silicon accelerators to enable more scalable and energy-efficient clusters for Artificial Intelligence and Machine Learning (ML/AI) architectures.

Nubis Communications and Alphawave Semi will be showing a live demonstration in the Tektronix booth at DesignCon, the leading conference for advanced chip, board, and system design technologies. An Alphawave Semi PCIe Subsystem with PiCORE Controller IP and PipeCORE PHY will directly drive and receive PCIe 6.0 traffic through a Nubis XT1600 linear optical engine to demonstrate a PCIe 6.0 optical link at 64GT/s per fiber, with optical output waveform measured on a Tektronix sampling scope with a high-speed optical probe.

Back at Computex last year we got a look at the first USB4 add-in card, which was from MSI. Some six months later, ASUS has finally revealed its USB4 add-in card that simply goes by the name of USB4 PCIe Gen4 Card. The general design of the two cards appear to be more or less identical, at least in terms of outputs and inputs. As such, both cards feature two USB4 outputs and two DP 1.4 inputs for those that want to use the USB4 ports to connect to a display. Other inputs include a USB 2.0 header, a custom USB4 header for communication with the motherboard—similar to Thunderbolt add-in cards—and a 6-pin graphics card type power input. The card supports up to two monitors and three devices or one monitor and four devices when daisy chained.

ASUS has gone for a shroud on its card, so it's impossible to make out any real details, but based on the manual, ASUS has installed a heatsink on the ASM4242 USB4 host controller from ASMedia, albeit a smaller one than MSI. However, ASUS has only gone for 60 W USB Power Delivery compared to 100 W for the MSI card. If this makes any useful difference in a desktop PC is up for discussion though and would depend on specific use cases. On the other hand, ASUS allows for 60 W through both ports, whereas MSI only delivers 27 W through its secondary port. The card should work with any ASUS motherboard that has a TB/USB4 header. As ASUS has only just put up the product page, there's no word on pricing.

At CES, AMD didn't give away too many technical details of its upcoming Ryzen 8000G-series APUs, but details are starting to trickle out and it's not all good news. As has been known for some time, AMD is using two different chips to make the Ryzen 8000G APUs and they're known as the Phoenix 1 and Phoenix 2, where the Phoenix 2 parts feature Zen 4c cores, which are not present in the Phoenix 1 APUs. This in and of itself shouldn't be a huge issue, although the Zen 4c CPU cores can be slightly slower in some tasks based on testing of AMD's EPYC server parts.

However, PCGamesN noticed that Gigabyte has posted the full specs for the B650E Aorus Elite X AX Ice motherboard and it looks like there's a much bigger difference between the Phoenix 1 and Phoenix 2 based APUs. Namely, the Phoenix 2 APUs have fewer PCIe lanes and as such are limited to two PCIe 4.0 lanes for the secondary NVMe slot. As if this wasn't bad enough, the Phoenix 2 APUs only have four PCIe 4.0 lanes for add-in GPUs, whereas the Phoenix 1 APUs have eight. This is very likely to lead to reduced performance if a higher-end GPU is used with such an APU. Note that this will vary depending on the motherboard design, but many B650/B650E boards feature a similar design with regards to the PCIe lanes coming from the CPU socket. Luckily, it's easy to avoid this issue, as the Ryzen 5 8600G and the Ryzen 7 8700G are both Phoenix 1 designs, whereas the Ryzen 5 8500G is the only Phoenix 2 design available in retail, as the Ryzen 3 8300G is an OEM only part.

AVerMedia Technologies., a leader in digital audiovisual solutions, is pleased to announce the launch of its latest PCIe capture cards—the HDMI 2.1 Live Gamer 4K 2.1 (GC575) and Live Streamer ULTRA HD (GC571). These innovative devices cater to the diverse needs from sophisticated and entry-level streamers, complementing AVerMedia's line of capture card solutions and positioning AVerMedia as a pioneering force in the industry.

After the successful launch of the HDMI 2.1 Live Gamer ULTRA 2.1 (GC553G2), AVerMedia introduces the PCIe version, Live Gamer 4K 2.1, offering users a more expansive range of choices. Michael Kuo, President and CEO of AVerMedia, stated, "Whether you're seeking to play the latest 4K games, looking for HDMI 2.1 compatibility, or preferring PCIe connectivity, we've been continually expanding our capture card line to meet the needs of the streaming community."Editor's Note: Check out the TechPowerUp Reviews of the HDMI 2.1 Live Gamer 4K 2.1 (GC575) and Live Streamer ULTRA HD (GC571)

In addition to the new AIO coolers and PSUs, ENERMAX brought a full lineup of new PC cases to the CES 2024 show, including the new ENERPAZO lineup, the new EK98, and the SK30 V2 PC cases. The ENERPAZO lineup with the ENERPAZO EP33 mid-tower and the ENERPAZO EP23 mini-tower PC cases, and the EK98 mid-tower PC case, all come with built-in USB 3.2 Gen 1 and USB 3.2 Gen 2 Type C ports and reusable PCIe slots, as well as feature recognizable ENERMAX design with grill front and glass side panel.

The ENERPAZO EP33 supports up to an E-ATX motherboards, has support for a 420 mm AIO liquid CPU cooler and up to 11 fans, while the ENERPAZO EP23, as mini-tower PC case, supports up to a micro-ATX motherboard and a 360 mm AIO liquid CPU cooler and up to 8 fans. The EK98 supports up to a 360 mm AIO liquid CPU cooler and up to 9 fans, as well as comes with vertical GPU installation support with rotatable PCIe slots and pre-installed 4 ARGB PWM fans. ENERMAX also showcased the new SK30 V2 PC case mid-tower PC case which also comes with USB 3.2 Type-C ports, supports up to 360 mm AIO liquid CPU cooler ass well as comes with the same vertical GPU installation support and couple of pre-installed ARGB PWM fans.