At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

Plextor, one of the most iconic names in PC storage once known for high performance and quality, has announced it will cease operations. Parent company Kioxia has decided to retire the Plextor brand name for solid state drives (SSDs). Instead, it will market products under its Solid State Storage Technology Corporation (SSSTC) brand going forward. The move comes after Kioxia acquired Plextor and its parent company Lite-On's SSD business back in 2019. Since then, Plextor has struggled to keep pace with new storage technologies. With PCIe Gen 4 and PCIe Gen 5 SSD controllers coming to market, Plextor failed to adopt the new Phison and InnoGrit platforms, instead sticking with Marvell controllers, lagging behind at that time.

Now, SSSTC and Kioxia will strictly focus SSD sales on the enterprise, data center, and industrial segments rather than the consumer market. The Plextor website is already redirecting to SSSTC.com, which no longer lists any drives for client PCs. While current Plextor SSD owners will continue to receive warranty support and RMA services, no new Plextor drives are expected to be released. The company had a history stretching back over 30 years of making top-performing optical disk drives and SSDs. Similarly to OCZ after its acquisition by Toshiba, the Plextor name will now fade into history. But in the fast-moving storage business, companies live and die by their ability to adopt cutting-edge technologies. Hence, companies are always on the edge of their seats, trying to survive.

Neuchips, a leading AI Application-Specific Integrated Circuits (ASIC) solutions provider, will demo its revolutionary Raptor Gen AI accelerator chip (previously named N3000) and Evo PCIe accelerator card LLM solutions at CES 2024. Raptor, the new chip solution, enables enterprises to deploy large language models (LLMs) inference at a fraction of the cost of existing solutions.

"We are thrilled to unveil our Raptor chip and Evo card to the industry at CES 2024," said Ken Lau, CEO of Neuchips. "Neuchips' solutions represent a massive leap in price to performance for natural language processing. With Neuchips, any organisation can now access the power of LLMs for a wide range of AI applications."

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, today announced successful collaboration with Keysight Technologies, a market-leading design, emulation, and test solutions provider, demonstrating interoperability between Alphawave Semi's PCIe 6.0 64 GT/s Subsystem (PHY and Controller) Device and Keysight PCIe 6.0 64 GT/s Protocol Exerciser, negotiating a link to the maximum PCIe 6.0 data rate. Alphawave Semi, already on the PCI-SIG 5.0 Integrators list, is accelerating next-generation PCIe 6.0 Compliance Testing through this collaboration.

Alphawave Semi's leading-edge silicon implementation of the new PCIe 6.0 64 GT/s Flow Control Unit (FLIT)-based protocol enables higher data rates for hyperscale and data infrastructure applications. Keysight and Alphawave Semi achieved another milestone by successfully establishing a CXL 2.0 link setting the stage for future cache coherency in the datacenter.

Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link (CXL) memory operations in a real user environment with open-source software provider Red Hat, leading the expansion of its CXL ecosystem.

Due to the exponential growth of data throughput and memory requirements for emerging fields like generative AI, autonomous driving and in-memory databases (IMDBs), the demand for systems with greater memory bandwidth and capacity is also increasing. CXL is a unified interface standard that connects various processors, such as CPUs, GPUs and memory devices through a PCIe interface that can serve as a solution for limitations in existing systems in terms of speed, latency and expandability.

Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

Taiwanese power supply manufacturer FSP showcased upcoming products for 2023 and 2024. This included new power supply lineups with updated naming schemes - the entry-level VITA series, mid-range ADVAN series, and high-end MEGA and DAGGER series. The simplified naming clarifies the differentiation between affordable, mainstream, and premium offerings across wattages and efficiency certifications. Specific new PSU models include 1500+ Watts beasts for maxed-out systems, redundant server-class units ensuring uptime, and 80+ Titanium efficiency ratings for eco-conscious builds. Star of the show is FSP's flagship unit, which boasts a staggering 2500 Watts, 100% modular cabling, and cutting-edge 12V-2x6 PCIe Gen 5 graphics card power connectors.

Called the Cannon Pro, the 2500-watt power supply has four 12V-2x6 PCIe Gen 5 connectors to feed even the highest power-rated GPUs and the three 6+2-pin connectors. This new PSU is also rated for ATX 3.1 specifications, 80+ Platinum Specification, and the upgraded version of the 12VHPWR PCIe Gen 5 connector, supposedly overcoming all the issues, in the form of a 12V-2x6 PCIe Gen 5 connector. The PSU should be able to power four NVIDIA GeForce RTX 4090 GPUs simultaneously with its high capacity. Pricing and availability aren't specified, so we must wait for FSP to launch these products in 2024.

After years of delays, Chinese chipmaker Zhaoxin has finally launched its long-awaited KX-7000 series consumer CPUs, only one of its kind in China, based on the licensed x86-64 ISA. Zhaoxin claims the new 8-core processors based on "Century Avenue" uArch deliver double the performance of previous generations. Leveraging architectural improvements and 4X more cache, the KX-7000 represents essential progress for China's domestic semiconductor industry. While still likely lagging behind rival AMD and Intel chips in raw speed, the KX-7000 matches competitive specs in areas like DDR5 memory, PCIe 4.0, and USB4 support. For Chinese efforts to attain technological independence, closing feature gaps with foreign processors is just as crucial as boosting performance. Manufactured on a 16 nm process, the KX-7000 does not use the best silicon node available.

Other chip details include out-of-order execution (OoOE), 24 PCIe 4.0 lanes, a 32 MB pool of L3 cache and 4 MB L2 cache, a base frequency of 3.2 GHz, and a boost clock of 3.7 GHz. Interestingly, the CPU also has VT-x, BT-d 2.5, SSE4.2/AVX/AVX2 support, most likely also licensed from the x86 makers Intel and/or AMD. Ultimately, surpassing Western processors is secondary for China next to attaining self-reliance. Instructions like SM encryption catering to domestic data protection priorities underscore how the KX-7000 advances strategic autonomy goals. With its x86 architecture license giving software compatibility and now a vastly upgraded platform, the KX-7000 will raise China's chip capabilities even if it is still trailing rivals' speeds. Ongoing progress closing that performance gap could position Zhaoxin as a mainstream alternative for local PC builders and buyers.

AMD today announced the new Ryzen 8040 mobile processor series codenamed "Hawk Point." These chips are shipping to notebook manufacturers now, and the first notebooks powered by these should be available to consumers in Q1-2024. At the heart of this processor is a significantly faster neural processing unit (NPU), designed to accelerate AI applications that will become relevant next year, as Microsoft prepares to launch Windows 12, and software vendors make greater use of generative AI in consumer applications.

The Ryzen 8040 "Hawk Point" processor is almost identical in design and features to the Ryzen 7040 "Phoenix," except for a faster Ryzen AI NPU. While this is based on the same first-generation XDNA architecture, its NPU performance has been increased to 16 TOPS, compared to 10 TOPS of the NPU on the "Phoenix" silicon. AMD is taking a whole-of-silicon approach to AI acceleration, which includes not just the NPU, but also the "Zen 4" CPU cores that support the AVX-512 VNNI instruction set that's relevant to AI; and the iGPU based on the RDNA 3 graphics architecture, with each of its compute unit featuring two AI accelerators, components that make the SIMD cores crunch matrix math. The whole-of-silicon performance figures for "Phoenix" is 33 TOPS; while "Hawk Point" boasts of 39 TOPS. In benchmarks by AMD, "Hawk Point" is shown delivering a 40% improvement in vision models, and Llama 2, over the Ryzen 7040 "Phoenix" series.

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, and IT infrastructure, today announced the GIGABYTE G383-R80 for the AMD Instinct MI300A APU and two GIGABYTE G593 series servers for the AMD Instinct MI300X GPU and AMD EPYC 9004 Series processor. As a testament to the performance of AMD Instinct MI300 Series family of products, the El Capitan supercomputer at Lawrence Livermore National Laboratory uses the MI300A APU to power exascale computing. And these new GIGABYTE servers are the ideal platform to propel discoveries in HPC & AI at exascale.⁠

Marrying of a CPU & GPU: G383-R80
For incredible advancements in HPC there is the GIGABYTE G383-R80 that houses four LGA6096 sockets for MI300A APUs. This chip integrates a CPU that has twenty-four AMD Zen 4 cores with a powerful GPU built with AMD CDNA 3 GPU cores. And the chiplet design shares 128 GB of unified HBM3 memory for impressive performance for large AI models. The G383 server has lots of expansion slots for networking, storage, or other accelerators, with a total of twelve PCIe Gen 5 slots. And in the front of the chassis are eight 2.5" Gen 5 NVMe bays to handle heavy workloads such as real-time big data analytics and latency-sensitive workloads in finance and telecom. ⁠

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

QNAP Systems, Inc. today launched the new PCIe JBOD storage enclosures TL-Rx00PES-RP series, featuring PCIe Gen 3 x8, and providing up to 64 Gb/s data transfer speed. Users can expand existing NAS storage volumes to petabyte-class by connecting multiple TL-Rx00PES-RP series, without requiring RAID-rebuilding on the host NAS. The TL-Rx00PES-RP series supports SATA drives, allowing businesses to choose from a wide range of enterprise hard drives. This series is ideal for businesses who want to archive/back up virtualization applications, surveillance recordings, large data, and multimedia.

"Technological advancement usually comes at the cost of increased storage requirements. Organizations which handle particularly large data sets, such as research institutions and media production companies, require easy-to-scale solutions. QNAP presents the TL-Rx00PES-RP series as a petabyte-class storage solution for them. The TL-Rx00PES-RP series supports SATA drives, which are budget-friendly and available with large capacities," said Jerry Deng, Product Manager of QNAP.

T-FORCE, the gaming brand of the leading memory and storage provider Team Group Inc., continues to push the boundaries of product development. Today, T-FORCE is launching four new gaming SSDs, the T-FORCE G70, G70 PRO, G50, and G50 PRO, which all use the PCIe Gen 4x4 interface. The SSDs feature international manufacturer InnoGrit's controller, which provides outstanding stability.

The G70, G50, and their PRO variants are available in the M.2-2280 form factor and come with patented ultra-thin graphene heat sinks. The G70 PRO also comes with an aluminium alloy heatsink, giving users an additional cooling option. Since every SSD cooling module in this series is compatible with the PS5 SSD expansion slot, both PC and console gamers alike can enjoy the high performance of these brand-new PCIe 4.0 SSDs. The T-FORCE G70 and G70 PRO SSDs have read speeds of up to 7000 MB/s, while the G50 and G50 PRO SSDs can clock up to 5000 MB/s. The T-FORCE G70 and G50 SSDs support SLC cache technology, and their PRO variants support both DRAM and SLC caching, giving players options to fit their needs. All four M.2 2280 SSDs use controllers produced by international manufacturer InnoGrit, which provide excellent stability and peace of mind for gamers.

PNY announced the addition of the CS3150 M.2 NVMe PCIe Gen 5 x4 SSD with integrated heatsinks to its lineup of solid-state drives. The CS3150 is at the forefront of cutting-edge storage, leveraging the NVMe PCIe Gen 5 x4 interface to deliver unrivaled data transfer speeds. With sequential read/write speeds up to 12,000 MB/s and 11,000 MB/s respectively, this breakthrough technology catapults computing experiences to unprecedented levels, making it an ideal choice for professionals, enthusiasts, and anyone seeking the pinnacle of storage performance.

Innovative Heatsink
The CS3150 at launch will be available in 1 TB and 2 TB densities and will come integrated with one of three different dual-fan heatsinks - Black, White, or Black-RGB. These revolutionary heatsinks have an innovative design with not one but two ultra-quiet fans to maximize heat dissipation generated by highly intensive applications, prolonged workloads, and lightning-fast transfer speeds.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

Alibaba's T-Head unit, responsible for the design and development of in-house IC design, has announced the first domestic SSD controller based on the PCIe 5.0 specification standard. Called the Zhenyue 510, the SSD controller is aimed at enterprise SSD offerings. Interestingly, the Zhenyue 510 is powered by T-Head's custom Xuantie C910 cores based on RISC-V instruction set architecture (ISA). Supporting the PCIe 5.0 standard for interfacing, the SSD controller uses DDR5 memory as a cache buffer. Regarding the performance, there are no official figures yet, but the company claims to have 30% lower input/output latencies compared to competing offerings. T-Head claims the SSD has an IO processing capability of "3400 Kilo IOs per second, a data bandwidth of 14 Gbytes/s, and an extremely high energy efficiency of 420 Kilo IO per second for every Watt".

This is an essential step towards Chinese self-sufficiency as T-Head has designed various ICs for processing different tasks. Still, now Alibaba's chip design unit has a domestic design for storage as well. Claiming low latency figures, the Zhenyue 510 is suitable for enterprise workloads like big data analysis, as well as AI inference/training systems workloads. The development of Zhenyue 510 started in 1H 2021, and it took the company more than two years to complete the design and validation of the chip to prepare it for deployment. This is the second Chinese-made SSD controller after Yingren Technology (InnoGrit) announced their chip in September.

Lexar, a leading global brand of flash memory solutions, s excited to announce the NM790 with Heatsink M.2 2280 PCIe Gen 4×4 NVMe SSD. This product release builds upon the success of its predecessor, the NM790 (without heatsink) which claimed several awards, including Best High-Capacity SSD from PC Gamer, Best High-Capacity PCI Express 4.0 SSD from PC Mag, Best Dram-less SSD 2023 from Tom's Hardware, and more.

This new version of the NM790 is designed for PS5 and PC gaming rigs and delivers even more performance - 7400 MB/s sequential read, 6500 MB/s sequential write, with random read and write speeds of up to 1,100K IOPS. The addition of an integrated heatsink keeps things running smoothly even at full throttle, ensuring that systems stay cool and maintain speed, power efficiency, and thermal control for sustained high-performance on both PlayStation 5 and PCs.

Micron Technology, Inc. (Nasdaq: MU), today announced the availability of the Crucial T500 Gen 4 NVMe SSD as an expansion of its award-winning NVMe solid-state drive (SSD) portfolio. The Crucial T500 SSD is a best-in-class PCIe 4.0 NVMe drive, which leverages Micron's advanced 232-layer 3D NAND technology with industry-leading NAND I/O speeds of 2.4 gigabytes per second (GB/s) and is engineered to improve performance for console and PC gamers, photo and video editors and content creators. Available in two options, the T500 SSD with the heatsink is specifically designed for platforms like the PlayStation 5 (PS5) and PC gaming rigs, while the version without the heatsink fits well in laptops, desktops and workstations.

The T500 offers up to a 40% higher performance-to-power ratio, and speeds that are two times faster than the previous Gen 3 NVMe SSD offering. With lightning-fast sequential read and write speeds up to 7,400 MB/s and 7,000 MB/s respectively, Crucial T500 SSDs enable gamers to load games up to 16% faster, get quicker game texture renders and reduced CPU utilization with Microsoft DirectStorage. Likewise, it is easy to install and has up to 2 TB of storage - making it perfect for PS5 upgrades or UHD/8K+ videos. The T500 also delivers up to 42% faster performance in content creation applications, allowing users to run heavy workloads and render photos or videos faster.

Samsung Electronics today reported financial results for the third quarter ended September 30, 2023. Total consolidated revenue was KRW 67.40 trillion, a 12% increase from the previous quarter, mainly due to new smartphone releases and higher sales of premium display products. Operating profit rose sequentially to KRW 2.43 trillion based on strong sales of flagship models in mobile and strong demand for displays, as losses at the Device Solutions (DS) Division narrowed.

The Memory Business reduced losses sequentially as sales of high valued-added products and average selling prices somewhat increased. Earnings in system semiconductors were impacted by a delay in demand recovery for major applications, but the Foundry Business posted a new quarterly high for new backlog from design wins. The mobile panel business reported a significant increase in earnings on the back of new flagship model releases by major customers, while the large panel business narrowed losses in the quarter. The Device eXperience (DX) Division achieved solid results due to robust sales of premium smartphones and TVs. Revenue at the Networks Business declined in major overseas markets as mobile operators scaled back investments.

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of the ProMagix G480a and G480i - two GPU servers optimized for High Performance Computing and Artificial Intelligence. Powered by either dual AMD Epyc 4th Gen or dual 4th Gen Intel Scalable Xeon processors, these 4U form factor servers support up to eight dual slot PCIe Gen 5 GPUs to create incredible compute power designed specifically for the highest demand workflows including simulation, rendering, analytics, deep learning, AI, and more. Shipments begin immediately.

"By putting emphasis on scalability, functionality, and performance, we've created a line of server solutions that tie in the legacy of our high-end brand while also offering businesses alternative options for more specialized solutions for the highest demand workflows," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to introduce a whole new market to what we can do."

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the new QXG-10G2SF-X710 10GbE network expansion card. Equipped with the advanced Intel Ethernet Controller X710-BM2, this PCIe Gen 3 card (compatible with PCIe Gen 2) can be installed into a QNAP NAS or Windows /Linux PC, instantly augmenting connectivity with two high-speed 10GbE ports.

Featuring a low-noise fanless design, the QXG-10G2SF-X710 comes with two 10GbE SFP+ (10G/1G) network ports. Users can utilize SMB Multichannel or Port Trunking to combine bandwidth, providing up to 20 Gbps of data transfer potential, thereby accelerating large file sharing and intensive data transmission. The QXG-10G2SF-X710 also supports SR-IOV that enhances network resource allocation for VMware virtualization applications, reducing network bandwidth consumption and significantly lowering CPU usage for virtual machine servers (hypervisors).

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Jung-Bae Lee, President and Head of Memory Business of Samsung Electronics, the world's largest NAND memory supplier, has noted in the blog post that Samsung plans to develop its 9th Generation V-NAND memory with over 300 layers, aiming for mass production in 2024. Samsung's V-NAND uses a double-stack structure and is expected to have more active layers than its competitors' 3D NAND memory, such as SK Hynix's forthcoming 321-layer memory. The increase in layers allows Samsung to enhance storage density and performance in its future 3D NAND devices, focusing on input/output (I/O) speed. While the specific performance details of Samsung's 9th Generation V-NAND remain undisclosed, the memory is expected to be used in next-generation PCIe SSDs with the PCIe 5.0 standard.

Jung-Bae Lee has noted: "New structural and material innovations will be critical in the upcoming era of sub-10-nanometer (nm) DRAM and 1,000-layer vertical V-NAND. As such, we are developing 3D stacked structures and new materials for DRAM while increasing layer count, decreasing height, and minimizing cell interference for V-NAND." The 9th installment of V-NAND, scheduled for 2024, is utilizing 11 nm-class DRAM. Additionally, the blog post reassures the commitment to CXL Memory Modules (CMM), which will enable the composable infrastructure of next-generation systems, especially with high-capacity SSDs powered by V-NAND.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, is ready to usher in the era of Intel Core 14th gen processors with a complete lineup of Z790/Z690 series motherboards. Especially, From the flagship Z790 AORUS XTREME X to the versatile Z790 AORUS ELITE X, the X Gen series is engineered to optimize the performance of Intel Core 14th gen processors and drive DDR5 memory faster than ever.

The AORUS Z790 X Gen motherboards, equipped with cutting-edge technologies, deliver best-in-class DDR5 compatibility and leading performance, supporting up to DDR5 XMP-8266 and beyond. The most crucial technology for DDR5's leading performance is the newly introduced Back Drilling Technology, which enhances signal integrity, resulting in improved system performance and heightened reliability.