Intel 10th Generation Core Desktop Series Presentation Leaked
Ahead of its launch, tech publication HD Tecnologia posted the press-deck of Intel's 10th generation Core "Comet Lake-S" desktop processor series, as its launch is imminent (30th April, according to the slides). Right upfront, we see Intel's new retail packaging for the flagship Core i9 parts. Gone is the large acrylic dodecahedron, and in its place is a conventional paperboard-looking cuboidal box with a large triangular cutout window (probably made of LDPE) on the front face, which reveals the processor inside.
The next slide reveals all that's new with the 10th generation Core processor family, starting with clock speeds of up to 5.30 GHz, the desktop debut of Intel's Thermal Velocity Boost technology, HyperThreading being enabled across the board (Core i9 thru Core i3), native support for DDR4-2933, new CPU- and memory-overclocking features, and new platform I/O through the 400-series chipset. Next up, we see overclocker-relevant new features. Apparently, these processors allow you to toggle HyperThreading on a per-core basis. Until now, you could toggle HTT only across all cores. Next up, is "overclocking" for the PCI-Express x16 link (PEG) and DMI chipset bus. There are improved V/F curve controls with this generation. Intel is preparing to announce updated XTU and Performance Maximizer utilities. There are some packaging-level refinements, too, such as a physically thinner die (Z-height), making way for a thicker IHS. The internal TIM is still solder. We now move on to the actual SKUs.
The next slide reveals all that's new with the 10th generation Core processor family, starting with clock speeds of up to 5.30 GHz, the desktop debut of Intel's Thermal Velocity Boost technology, HyperThreading being enabled across the board (Core i9 thru Core i3), native support for DDR4-2933, new CPU- and memory-overclocking features, and new platform I/O through the 400-series chipset. Next up, we see overclocker-relevant new features. Apparently, these processors allow you to toggle HyperThreading on a per-core basis. Until now, you could toggle HTT only across all cores. Next up, is "overclocking" for the PCI-Express x16 link (PEG) and DMI chipset bus. There are improved V/F curve controls with this generation. Intel is preparing to announce updated XTU and Performance Maximizer utilities. There are some packaging-level refinements, too, such as a physically thinner die (Z-height), making way for a thicker IHS. The internal TIM is still solder. We now move on to the actual SKUs.